JP2013137960A - Semiconductor type light source of vehicle lamp, semiconductor type light source unit of vehicle lamp, and vehicle lamp - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently irradiate a light distribution pattern of a tail lamp and that of a stop lamp, respectively.SOLUTION: A vehicle lamp is provided with a substrate 3, five pieces of semiconductor light-emitting elements 40 to 44, control elements RS, RT, DS, DT, wiring elements 60 to 64, 601 to 641, 602 to 642, a surrounding wall member 18, and a sealing member 180. The five pieces of semiconductor light-emitting elements 40 to 44 are arranged in a straight line X-X. One semiconductor light-emitting element 40 of a stop lamp is arranged at a center O of the substrate. Two pieces of semiconductor light-emitting elements 41, 44 of the stop lamp are arranged at either end of the straight line on the substrate. Two pieces of semiconductor light-emitting elements 42, 43 of the tail lamp are respectively arranged between the one semiconductor light-emitting element 40 at the center O and the two pieces of semiconductor light-emitting elements 41, 44 at either end of the substrate. As a result, the light distribution pattern of the tail lamp and the light distribution pattern of the stop lamp can be efficiently irradiated, respectively.

Description

  The present invention relates to a semiconductor-type light source for a vehicular lamp. The present invention also relates to a semiconductor-type light source unit for a vehicle lamp. Furthermore, the present invention relates to a vehicular lamp using a semiconductor light source unit as a light source.

  This type of semiconductor-type light source is conventionally known (for example, Patent Document 1). Hereinafter, a conventional semiconductor light source will be described. A conventional semiconductor light source has a plurality of LED chips mounted on a substrate. That is, in the conventional semiconductor-type light source, six LED chips that are light sources of the stop lamp are arranged at equal intervals on a large concentric circle, and three LED chips that are light sources of the tail lamp are small concentric circles. It is arranged on the circle at equal intervals.

JP 2007-176219 A

  In such a semiconductor light source, it is important to efficiently irradiate the light distribution pattern of the stop lamp and the light distribution pattern of the tail lamp, respectively.

  The problem to be solved by the present invention is to efficiently irradiate the light distribution pattern of the stop lamp and the light distribution pattern of the tail lamp.

  The present invention (invention according to claim 1) includes a substrate having a mounting surface, a plurality of semiconductor light emitting elements mounted on the mounting surface of the substrate, a control element for controlling light emission of the semiconductor light emitting element, and a control element A wiring element that feeds power to the semiconductor light emitting element through the ring, a ring-shaped surrounding wall member that surrounds all of the plurality of semiconductor light emitting elements, a plurality of mounting surfaces of the substrate, and a plurality of recesses formed in the surrounding wall member A light-transmitting sealing member that seals the semiconductor light-emitting element, wherein the plurality of semiconductor light-emitting elements are arranged in a straight line, and are three semiconductor light-emitting elements that are light sources of a stop lamp, and a tail lamp Of the three semiconductor light emitting elements as the light source of the stop lamp, one semiconductor light emitting element is disposed at or near the center of the substrate, and the rest Two half of The body light emitting elements are respectively arranged at both ends on a straight line of the substrate, and the two semiconductor light emitting elements which are the light sources of the tail lamps are the one semiconductor light emitting element at the center and the two semiconductors at the both ends. It is characterized by being respectively arranged between the light emitting elements.

  According to the present invention (the invention according to claim 2), three semiconductor light emitting elements which are light sources of stop lamps are electrically connected in series, and two semiconductor light emitting elements which are light sources of a tail lamp are electrically connected in series. Are connected to each other.

  This invention (invention concerning Claim 3) is a semiconductor part of the vehicle lamp of Claim 1 or 2 attached to the socket part which combines an insulating member, a thermal radiation member, and an electric power feeding member, and a socket part. A light source.

  The present invention (the invention according to claim 4) includes a lamp housing and a lamp lens that define a lamp chamber, and a semiconductor-type light source unit for a vehicular lamp according to claim 3, wherein the socket portion is attached to the lamp housing. The semiconductor light source is disposed in the lamp chamber.

  The semiconductor-type light source of the vehicle lamp of this invention (invention according to claim 1) has five semiconductor light-emitting elements arranged in a straight line, and among the three semiconductor light-emitting elements that are light sources of a stop lamp, One semiconductor light emitting element is disposed at or near the center of the substrate, and the remaining two semiconductor light emitting elements are disposed at both ends of the substrate on a straight line. Therefore, the light distribution characteristic of the stop lamp shown in FIG. 5 (that is, the luminance is the highest luminance at the center (V-0 °, H-0 °) point, and the left and right (V-0 °, H-5). °) at 2nd place, upper and lower (V-5 °, H-0 °) points at 3rd place, and left and right (V-0 °, H-10 °) points at 4th place. The luminance is 5th in the vertical and horizontal (V-10 °, H-5 °) points and the vertical and horizontal (V-5 °, H-10 °) points. (5 °, H−20 °), the light intensity of the stop lamp, which is 6th in brightness, is substantially the same as the light distribution characteristic (long side) on the left and right.

  Further, the semiconductor type light source of the vehicle lamp of the present invention (the invention according to claim 1) has five semiconductor light emitting elements arranged in a straight line, and the two semiconductor light emitting elements that are light sources of the tail lamp are stopped. The light source of the lamp is disposed between one semiconductor light emitting element at the center and two semiconductor light emitting elements at both ends. For this reason, the light distribution characteristics of the tail lamp shown in FIG. 5 (that is, the luminance is the highest at the center (V-0 °, H-0 °) point, and the left and right (V-0 °, H-5 °). ) Point is the second highest luminance, the upper and lower (V-5 °, H-0 °) point is the third highest luminance, and the left and right (V-0 °, H-10 °) point is the fourth highest luminance. The brightness is 5th in the vertical and horizontal (V-10 °, H-5 °) points and the vertical and horizontal (V-5 °, H-10 °) points. (°, H−20 °), which is almost the same as the light distribution characteristic (long sideways) on the left and right of the tail lamp which is 6th brightness at the point.

  Thus, the semiconductor-type light source of the vehicular lamp of the present invention (the invention according to claim 1) uses the common optical system of the stop lamp and the tail lamp, and uses the light distribution pattern of the stop lamp and the light distribution pattern of the tail lamp. Can be irradiated efficiently.

  In the semiconductor type light source of the vehicle lamp according to the present invention (the invention according to claim 2), since three semiconductor light emitting elements which are light sources of the stop lamp are electrically connected in series, for example, idling stop, cell motor Even when the load of the power source (battery) of the vehicle suddenly changes during the activation of the vehicle, the activation of the air conditioner, etc., the rated voltage (see V3 in FIG. 7) or higher can be maintained. Thereby, even when the load of the power supply of the vehicle is suddenly changed, the light emission state of the three semiconductor light emitting elements which are the light sources of the stop lamp can be maintained. In particular, the present invention is most suitable for a semiconductor light source in which the supply current to three semiconductor light emitting elements that are light sources of a stop lamp is controlled by a resistor mounted on a substrate without being controlled by an electronic circuit.

  The semiconductor light source of the vehicular lamp according to the present invention (the invention according to claim 2) includes three semiconductor light emitting elements, which are light sources of a stop lamp, electrically connected in series, and a light source of a tail lamp. These two semiconductor light emitting elements are electrically connected in series. That is, in the semiconductor-type light source of the vehicular lamp according to the present invention (the invention according to claim 2), the three semiconductor light-emitting elements that are the light source of the stop lamp and the two semiconductor light-emitting elements that are the light source of the tail lamp are independent of each other. Configured. For this reason, the following effects can be achieved.

  That is, three semiconductor light-emitting elements that are light sources of stop lamps and two semiconductor light-emitting elements that are light sources of tail lamps are respectively connected to linear regions (I1 to I2 in FIG. In the region between V1 and V2. In addition, a resistance connected in series with a semiconductor light emitting element, as compared with a semiconductor light source in which a plurality of semiconductor light emitting elements as a light source of a stop lamp and a plurality of semiconductor light emitting elements as a light source of a tail lamp are combined. (Similarly, the trimming width) can be set narrow. Furthermore, since the ratio of the brightness of the tail lamp to the brightness of the stop lamp is 1:15 to 20 (Japan, Europe) or 1:40 (US), the light flux is not applied to the two semiconductor light emitting elements that are the light sources of the tail lamp. There is a margin (light flux tolerance). As a result, even if the stop lamp light distribution is optimally designed, the adjustment range of the tail lamp light distribution can be widened. That is, the arrangement of the three semiconductor light-emitting elements that are the light sources of the stop lamps and the arrangement of the two semiconductor light-emitting elements that are the light sources of the tail lamps are generally similar, so even if the light distribution of the stop lamps is optimally designed The light distribution of the tail lamp can be adjusted widely.

  The semiconductor light source unit for a vehicle lamp according to the present invention (the invention according to claim 3) can achieve the same effect as the semiconductor light source for the vehicle lamp according to the first or second aspect.

  The vehicle lamp of this invention (the invention according to claim 4) can achieve the same effect as the semiconductor light source unit of the vehicle lamp of claim 3.

1 shows an embodiment of a semiconductor-type light source of a vehicle lamp according to the present invention, an embodiment of a semiconductor-type light source unit of a vehicle lamp according to the present invention, and an embodiment of a vehicle lamp according to the present invention. 1 is a longitudinal sectional view showing a state in which a semiconductor light source unit is assembled to a vehicle lamp, that is, a vertical sectional view. FIG. 2 is a perspective view showing the semiconductor light source unit in a state in which the light source unit (semiconductor type light source) and the socket unit are assembled. FIG. 3 is a front view (seen in the direction of arrow III in FIG. 2) showing the semiconductor-type light source unit in a state where the light source part (semiconductor-type light source) and the socket part are assembled. FIG. 4 is an enlarged plan view showing the surrounding wall member, the five semiconductor light emitting elements, and the wiring elements (five conductive adhesives and five mounting pads). FIG. 5 is an explanatory diagram showing the light distribution characteristic of the stop lamp and the light distribution characteristic of the tail lamp. In FIG. 6, three semiconductor light emitting elements that are light sources of a stop lamp are electrically connected in series, and two semiconductor light emitting elements that are light sources of a tail lamp are electrically connected in series. It is an electric circuit diagram which shows a state. FIG. 7 is an explanatory diagram showing IV characteristics of the semiconductor light emitting device.

  Hereinafter, an embodiment (Example) of a semiconductor-type light source of a vehicle lamp according to the present invention, an embodiment (Example) of a semiconductor-type light source unit of a vehicle lamp according to the present invention, and a vehicle according to the present invention An embodiment (example) of a lamp will be described in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. In FIG. 5, reference sign “VU-VD” indicates vertical lines on the upper and lower sides of the screen. Reference sign “HL-HR” indicates horizontal lines on the left and right of the screen.

(Description of Configuration of Embodiment)
Hereinafter, the semiconductor-type light source of the vehicle lamp in this embodiment, the semiconductor-type light source unit of the vehicle lamp in this embodiment, and the configuration of the vehicle lamp in this embodiment will be described. In FIG. 1, reference numeral 100 denotes a vehicular lamp in this embodiment.

(Description of vehicle lamp 100)
The vehicle lamp 100 is a one-lamp tail / stop lamp in this example. That is, the vehicular lamp 100 uses a tail lamp function and a stop lamp function in combination with one lamp, that is, one lamp and one lamp. The vehicle lamps 100 are respectively provided on the left and right of the rear part of a vehicle (not shown). The vehicle lamp 100 may be combined with other lamp functions (not shown) such as a backup lamp function and a turn signal lamp function to constitute a rear combination lamp.

  As shown in FIG. 1, the vehicular lamp 100 includes a lamp housing 101, a lamp lens 102, and a reflector 103, and the semiconductor-type light source unit 1 of the vehicular lamp in this embodiment.

  The lamp housing 101 is made of, for example, a light impermeable member, for example, a resin member. The lamp housing 101 has a hollow shape in which one side is open and the other side is closed. A mounting hole 104 is provided in the closed portion of the lamp housing 101. The mounting hole 104 has a circular shape. A plurality of concave portions (not shown) and a plurality of stopper portions (not shown) are provided at substantially equal intervals on the edge of the mounting hole 104.

  The lamp lens 102 is made of, for example, a light transmissive member such as a transparent resin member or a glass member. The lamp lens 102 has a hollow shape in which one side is open and the other side is closed. The periphery of the opening of the lamp lens 102 and the periphery of the opening of the lamp housing 101 are fixed in a watertight manner. A lamp chamber 105 is defined by the lamp housing 101 and the lamp lens 102.

  The reflector 103 is a light distribution control unit that performs light distribution control so that the light emitted from the semiconductor light source unit 1 is collected at a focal point F (see FIG. 3). The reflector 103 is disposed in the lamp chamber 105 and is fixed to the lamp housing 101 or the like. The reflector 103 is made of, for example, a light impermeable member, such as a resin member or a metal member. The reflector 103 has a hollow shape in which one side is open and the other side is closed. A through hole 106 is provided in the closed portion of the reflector 103 so as to communicate with the mounting hole 104 of the lamp housing 101. A reflective surface 107 is provided on the inner surface of the reflector 103. The reflector 103 is made of a separate member from the lamp housing 101, but may be a reflector integrated with the lamp housing. In this case, a reflecting surface is provided on a part of the lamp housing to provide a reflector function.

(Description of the semiconductor light source unit 1)
As shown in FIGS. 1 to 3, the semiconductor-type light source unit 1 includes a light source unit 10 as a semiconductor-type light source, a socket unit 11, and a lens unit 12 as an optical component. The light source unit 10 is attached to one end (upper end) of the socket unit 11. The lens portion 12 is fixedly or detachably attached to one end portion of the socket portion 11. The light source unit 10 is covered with the cap-shaped or cover-shaped lens unit 12.

  As shown in FIG. 1, the semiconductor light source unit 1 is mounted on the vehicular lamp 100. That is, the socket part 11 is detachably attached to the lamp housing 101 via a packing (O-ring) 108. The light source unit 10 and the lens unit 12 are arranged in the lamp chamber 105 through the mounting hole 104 of the lamp housing 101 and the through hole 106 of the reflector 103 and on the reflecting surface 107 side of the reflector 103. Has been.

(Description of the light source unit 10)
2 to 4, the light source unit 10 includes a substrate 3 and a plurality of semiconductor light emitting elements (LED chips) 40, 41, 42, 43, 44 (hereinafter referred to as “40˜ 44 ”), resistors RS, RT and diodes DS, DT as control elements, wiring patterns (not shown) as wiring elements, and bonding wires 60, 61, 62, 63, 64 ( Hereinafter, it may be described as “60 to 64”), five conductive adhesives (not shown) and five mounting pads 601, 611, 621, 631, 641 (hereinafter “601 to 641”). ), Wire pads 602, 612, 622, 632, 642 (hereinafter sometimes referred to as “602 to 642”), the surrounding wall member 18, and the sealing member 180. It is obtain things.

(Description of socket part 11)
As shown in FIGS. 1 to 3, the socket portion 11 includes an insulating member 7, a heat radiating member 8, and three power feeding members 91, 92, and 93. The heat radiating member 8 having thermal conductivity and conductivity and the power feeding members 91 to 93 having conductivity are integrally incorporated in the insulating member 7 having insulation properties in an insulated state.

  The socket portion 11 has an integral structure of the insulating member 7, the heat radiating member 8, and the power feeding members 91 to 93. For example, the insulating member 7, the heat radiating member 8, and the power feeding members 91 to 93 are integrally formed by insert molding (integral molding). Or the said insulating member 7 and the said electric power feeding members 91-93 are comprised integrally by insert molding, and the said heat radiation member 8 is integrally attached to the said insulating member 7 and the said electric power feeding members 91-93 of an integral structure. is there. Alternatively, the power feeding members 91 to 93 are integrally assembled to the insulating member 7, and the heat radiating member 8 is integrally attached to the integrally assembled insulating member 7 and the power feeding members 91 to 93.

(Description of assembly structure of semiconductor light source unit 1)
As shown in FIGS. 1 to 3, the semiconductor-type light source unit 1 includes a surface of the heat radiating member 8 of the socket portion 11 in which the insulating member 7, the heat radiating member 8, and the power feeding members 91 to 93 are integrally molded. And the contact surface on the back surface of the substrate 3 on which the semiconductor light emitting elements 40 to 44 of the light source unit 10 are mounted and sealed are arranged in close contact with each other. At the same time, the power supply members 91 to 93 of the socket portion 11 and the wiring pattern of the substrate 3 are connected to the contact surface of the heat radiating member 8 and the contact of the substrate 3 via a connection member 17. While being in close contact with the surface, it is firmly electrically connected. That is, one end portion of the power supply members 91 to 93 protruding from the surface side of the heat radiating member 8 of the socket portion 11 is inserted into the cutout hole of the connection member 17, and one end portion of the power supply members 91 to 93 is inserted. And the connecting member 17 are electrically and mechanically connected by elastic contact, caulking, welding, or the like. On the other hand, the connecting member 17 is mechanically connected to the substrate 3 by fitting or the like, and electrically connected to the wiring pattern of the substrate 3 by solder or a conductive adhesive. The connection member 17 maintains a close state between the back surface of the substrate 3 and the surface of the heat dissipation member 8. As a result, the semiconductor light source unit 1 is excellent in heat dissipation performance. Further, the electrical connection state between the power feeding members 91 to 93 of the socket portion 11 and the wiring pattern of the substrate 3 is maintained. As a result, the electrical circuit connection state is strengthened.

(Description of substrate 3)
In this example, the substrate 3 is made of ceramic (or a highly heat conductive base material such as AIN or a metal substrate). As shown in FIGS. 2 and 3, the substrate 3 has a substantially octagonal plate shape when viewed from the top, that is, from above. Insertion holes through which the power feeding members 91, 92, and 93 of the socket portion 11 are inserted are provided at substantially the center of the right side, the left side, and the lower side of the three sides of the substrate 3. A flat mounting surface 34 is provided on the upper surface of one surface of the substrate 3. A flat contact surface is provided on the lower surface of the other surface of the substrate 3. A highly reflective surface 30 such as highly reflective paint or highly reflective vapor deposition may be further provided on the mounting surface 34 of the ceramic substrate 3 that is a highly reflective member.

  On the mounting surface 34 of the substrate 3, the five semiconductor light emitting elements 40 to 44 and the control elements RS, RT, DS, DT and the wiring elements 60 to 64, 601 to 641, 602 to 642 and the surroundings are provided. A wall member 18 is mounted.

(Description of the semiconductor light emitting elements 40 to 44)
The semiconductor-type light source composed of the five semiconductor light-emitting elements 40 to 44 uses a self-luminous semiconductor-type light source such as an LED or an EL (organic EL), and in this embodiment, an LED. As shown in FIGS. 2 to 4, the semiconductor light emitting elements 40 to 44 are semiconductors having a small rectangular shape, that is, a square or a rectangular shape when viewed from a plane, that is, from a direction perpendicular to the mounting surface 34 of the substrate 3. It consists of a chip (light source chip), and in this example, it consists of a bare chip. The five semiconductor light emitting elements 40 to 44 emit light from one front surface and four side surfaces other than the surface mounted on the substrate 3.

  As shown in FIGS. 3 and 4, the five semiconductor light emitting elements 40 to 44 are arranged on a straight line XX. The five semiconductor light emitting elements 40 to 44 include three semiconductor light emitting elements 40, 41, and 44 that are light sources of a stop lamp, and two semiconductor light emitting elements 42 and 43 that are light sources of a tail lamp. That is, the five semiconductor light emitting elements 40 to 44 are semiconductor light emitting elements to which a small current is supplied, and are the three semiconductor light emitting elements 40, 41, and 44 that are light sources of the stop lamp, that is, the first group of semiconductors. A light emitting element 40, 41, 44 and a small current, that is, a semiconductor light emitting element to which a small current is supplied in comparison with a current supplied to the semiconductor light emitting elements 40, 41, 44, and a light source of a tail lamp. It is divided into two semiconductor light emitting elements 42, 43, that is, a second group of semiconductor light emitting elements 42, 43.

  Of the three semiconductor light emitting elements 40, 41, and 44 that are light sources of a stop lamp, one of the semiconductor light emitting elements 40 includes the focal point F of the reflector 103 of the optical system and the semiconductor light source unit 1. It is arranged at the center of the socket portion 11 and at the mounting rotation center O, that is, at the center O of the substrate 3 or in the vicinity thereof. That is, the center of one semiconductor light emitting element 40 that is a light source of a stop lamp and the center O of the substrate 3 and the center O of the heat radiating member 8 coincide with each other or substantially coincide with each other.

  Of the three semiconductor light emitting elements 40, 41, and 44, which are light sources of a stop lamp, the remaining two semiconductor light emitting elements 41 and 44 are respectively disposed at both ends of the substrate 3 on the straight line XX. Has been.

  The two semiconductor light emitting elements 42 and 43 that are the light source of the tail lamp are arranged between the one semiconductor light emitting element 40 that is the light source of the stop lamp and the two semiconductor light emitting elements 41 and 44 at both ends. Each is arranged.

  As shown in FIG. 6, the three semiconductor light emitting elements 40, 41, and 44, which are light sources of a stop lamp, are electrically connected in series in the forward direction, that is, the direction in which current flows. The two semiconductor light emitting elements 42 and 43 which are light sources of the tail lamp are electrically connected in series in the forward direction, that is, the direction in which current flows.

  Here, in the semiconductor light emitting devices 40 to 44 shown in FIG. 4A, the two semiconductor light emitting devices 42 and 43 which are light sources of the tail lamps are replaced with the three semiconductor light emitting devices which are light sources of the stop lamps. A chip smaller than the chips of the elements 40, 41, and 44 is used, and a chip in which an anode base and a cathode base are mixed is used.

  On the other hand, the semiconductor light emitting elements 40 to 44 shown in FIG. 4B are the semiconductor light emitting elements 40 to 41 that are the light sources of the stop lamps and the two semiconductor light emitting elements that are the light sources of the tail lamps. A chip having the same size as the chips of the elements 42 and 43 is used, and an anode base or a cathode base is used.

(Description of control element)
As shown in FIG. 6, the resistor RS and the diode DS are electrically connected in series to the three semiconductor light emitting elements 40, 41, and 44, which are light sources of a stop lamp. The resistor RT and the diode DT are electrically connected in series to the two semiconductor light emitting elements 42 and 43 that are light sources of the tail lamp.

  The resistors RS and RT and the diodes DS and DT are mounted on the substrate 3, and the wiring between the power feeding members 91 to 93 of the socket portion 11 and the five semiconductor light emitting elements 40 to 44 is performed. They are electrically connected via elements 60 to 64, 601 to 641, and 602 to 642. The resistors RS and RT and the diodes DS and DT are elements that control current supplied to the five semiconductor light emitting elements 40 to 44.

  The resistor RS that is electrically connected in series to the three semiconductor light emitting elements 40, 41, and 44 that are light sources of a stop lamp, and the two semiconductor light emitting elements 42 and 43 that are light sources of a tail lamp By trimming the resistor RT electrically connected in series, supply current to the three semiconductor light emitting elements 40, 41, and 44, which are light sources of a stop lamp, and two light sources of tail lamps The supply current to the semiconductor light emitting elements 42 and 43 can be made constant. Accordingly, the light fluxes of the three semiconductor light emitting elements 40, 41, and 44 that are the light source of the stop lamp and the light fluxes of the two semiconductor light emitting elements 42 and 43 that are the light source of the tail lamp can be made constant. .

(Description of wiring elements 60 to 64, 601 to 641, 602 to 642)
As shown in FIG. 4, the wiring element includes a plurality of wiring patterns, five bonding wires 60 to 64, five conductive adhesives, five mounting pads 601 to 641, and five Wire pads 602 to 642. The wiring elements 60 to 64, 601 to 641, and 602 to 642 are electrically connected to the power feeding members 91, 92, and 93 of the socket portion 11 through the connection member 17, and 5 through the control element. Power is supplied to the semiconductor light emitting elements 40 to 44.

  The plurality of wiring patterns are made of, for example, thin film wiring or thick film wiring of a conductive member. The resistors RS and RT and the diodes DS and DT are connected to the plurality of wiring patterns. The plurality of wiring patterns are provided with the mounting pads 601 to 641 and the wire pads 602 to 642, respectively. Among the plurality of wiring patterns, the area of the wiring pattern that supplies a large current to the semiconductor light emitting elements 40, 41, and 44 having the stop lamp function is substantially equal. Thereby, the heat generated in the plurality of wiring patterns can be released almost uniformly to the external heat radiating member 8 through the substrate 3. The plurality of wiring patterns are wired at predetermined intervals (gap).

  As shown in FIG. 4, the mounting pads 601 to 641 have the same number as the five semiconductor light emitting elements 40 to 44 with a substantially equal gap on the straight line XX, in this example, Five are arranged. The five semiconductor light emitting elements 40 to 44 are bonded to the five mounting pads 601 to 641 through the five conductive adhesives such as silver paste, respectively. The mounting pads 601 to 641 are from a plane, that is, from the top, and viewed from the direction perpendicular to the mounting surface 34 of the substrate 3. Shape. That is, of the sides of the mounting pads 601 to 641, the side facing the wire pads 602 to 642 has a quarter circular shape.

  Although not shown in the drawing, the five conductive adhesives form a minute circular shape when seen from a plane by dropping (stamp). The diameter of the circular conductive adhesive is larger than the length of one side of the square semiconductor light emitting elements 40 to 44. One side and a diameter of the mounting pads 601 to 641 having a combination of a square and a circle are larger than the diameter of the circular conductive adhesive.

  As shown in FIG. 4, the wire pads 602 to 642 are orthogonal to the column direction of the five semiconductor light emitting elements 40 to 44, that is, the direction intersecting the straight line XX direction, that is, the straight line XX. The same number as the five semiconductor light emitting elements 40 to 44 in the straight line direction and inside the two semiconductor light emitting elements 41 and 44 outside the five semiconductor light emitting elements 40 to 44, in this example Five are provided. The five wire pads 602 to 642 are on an intermediate line between the two adjacent semiconductor light emitting elements 40 to 44 and at positions spaced equidistant from the two adjacent semiconductor light emitting elements 40 to 44. To position. The wire pads 602 to 642 have a minute circular shape when viewed from the plane, that is, from the top and from the direction perpendicular to the mounting surface 34 of the substrate 3. Note that the wire pads 632 and 642 in FIG. 4B have a shape in which two circles are combined.

  The five bonding wires 60 to 64 are bonded to the mounting pads 601 to 641 and the wire pads 602 to 642, respectively. Here, the wire pads 602 to 642 have a minute circular shape. On the other hand, of the sides of the mounting pads 601 to 641, the side facing the wire pads 602 to 642 has a quarter circular shape. As a result, the circular edges of the wire pads 602 to 642 and the circular edges of the mounting pads 601 to 641 are line segments connecting the centers of the mounting pads 601 to 641 and the centers of the wire pads 602 to 642. That is, it is orthogonal to the bonding wires 60-64.

  Only the sides of the mounting pads 601 to 641 may be arcuate (or a straight line perpendicular to the line connecting the centers), or only the sides of the wire pads 602 to 642 are arcuate. (Or a straight line orthogonal to a line segment connecting the centers). The sides of the mounting pads 601 to 641 and the sides of the wire pads 602 to 642 may be straight lines that are inclined with respect to a line segment that connects the centers (that is, straight lines that are not orthogonal).

(Description of the surrounding wall member 18)
The surrounding wall member 18 is made of an insulating member such as a resin, in this example, a resin having elasticity that can follow the expansion and contraction of the sealing member 180, such as a thermoplastic elastomer or an olefinic TPO resin. It is configured. As shown in FIGS. 2 to 4, the surrounding wall member 18 includes all of the five semiconductor light emitting elements 40 to 44 and a part of the wiring element, that is, a part of the plurality of wiring patterns and the five. An elliptical ring shape surrounding all of the bonding wires 60 to 64, all of the five conductive adhesives, all of the five mounting pads 601 to 641 and all of the five wire pads 602 to 642 It is.

  The surrounding wall member 18 has a height higher than the heights of the semiconductor light emitting elements 40 to 44 and the bonding wires 60 to 64 of the wiring elements. The surrounding wall member 18 is a member that regulates the capacity of filling the sealing member 180 to a small capacity.

  On the lower end surface of the one end surface of the surrounding wall member 18, there are at least two fitting convex portions for temporary fixing and positioning, ie, positioning, as fitting portions. An ellipse drawn by the bottom of the inner wall surface of the surrounding wall member 18. It is integrally provided on a diagonal line passing through the center of the ring shape. On the other hand, the board 3 is provided with at least two fitting holes for temporary fixing and positioning as fitting parts corresponding to the fitting convex parts. By fitting the fitting convex portion and the fitting hole to each other, the surrounding wall member 18 and the substrate 3 are fixed to each other and positioned.

  The lower end surface of one end surface of the surrounding wall member 18 that is temporarily fixed to the substrate 3 and positioned by the fitting convex portion and the fitting hole is bonded to the mounting surface 34 of the substrate 3 with an adhesive ( (Not shown) is adhesively fixed or mounted.

  In the surrounding wall member 18 mounted on the substrate 3, in the space defined by the mounting surface 34 of the substrate 3 and the inner peripheral surface of the surrounding wall member 18, The semiconductor light emitting elements 40 to 44 and the five wire pads 602 to 642 are respectively mounted, the five bonding wires 60 to 64 are bonded, and the sealing member 180 is filled. .

  The adhesive and the sealing member 180 are made of the same resin member. In this example, the adhesive and the sealing member 180 have low elastic characteristics in the high temperature environment region of the semiconductor light emitting devices 40 to 44, and the adhesive and the sealing member 180 in the high temperature environment region and the It consists of a member that absorbs the expansion and contraction of the surrounding wall member 18, for example, a phenyl silicone resin member. The adhesive and the sealing member 180 may be made of the same resin member, for example, a methyl silicone resin member, an epoxy resin member, or a polyurethane resin member (urethane resin member). May be.

  On the inner peripheral surface of the surrounding wall member 18, light emitted from the semiconductor light emitting elements 40 to 44, particularly the four side surfaces of the semiconductor light emitting elements 40 to 44, is transmitted in a predetermined direction, for example, the semiconductor light emitting elements 40 to 40. A reflecting surface 181 is provided to reflect light in the same direction as the direction of light emitted from the front surface 44. As shown in FIGS. 2 and 3, the reflecting surface 181 is inclined so as to extend from the lower end of the inner peripheral surface of the surrounding wall member 18 to the upper end of the other end. The reflective surface 181 is configured such that the entire surrounding wall member 18 is made of a highly reflective member, or, for example, titanium oxide is contained in the resin of the surrounding wall member 18 such as PBT, PPA, etc. Are formed white, or only the inner peripheral surface of the surrounding wall member 18 is formed of a highly reflective member.

(Description of the shape of the inner peripheral surface of the surrounding wall member 18)
The shape of the inner peripheral surface of the surrounding wall member 18 is the contour shape of the portion where the mounting surface 34 of the substrate 3 and the inner peripheral surface of the surrounding wall member 18 are in contact, that is, the inner periphery of the surrounding wall member 18. It is the outline shape of the angle | corner which a surface and a bottom face make. As shown in FIG. 4, the shape of the inner peripheral surface of the surrounding wall member 18 is the column direction of the five semiconductor light emitting elements 40 to 44 when viewed in the direction perpendicular to the mounting surface 34 of the substrate 3, that is, The shape is based on an ellipse whose major axis is the straight line XX direction.

  The reflection surface 181 on the inner peripheral surface of the surrounding wall member 18 is inclined so as to extend from the lower end at one end to the upper end at the other end. For this reason, the contour shape of the angle formed by the inner peripheral surface and the upper surface of the surrounding wall member 18, that is, the contour shape of the upper end of the inner peripheral surface of the surrounding wall member 18 is a shape based on an ellipse. The contour shape of the angle formed by the inner peripheral surface and the bottom surface of the surrounding wall member 18, that is, the shape that is slightly larger than the lower end contour shape of the inner peripheral surface of the surrounding wall member 18. The inner peripheral surface of the surrounding wall member 18 is not necessarily an inclined surface but may be a vertical surface. In this case, the lower end contour shape of the inner peripheral surface of the surrounding wall member 18 and the upper end contour shape of the inner peripheral surface of the surrounding wall member 18 are substantially the same.

  The shape of the outer peripheral surface of the surrounding wall member 18 is slightly larger than the shape of the inner peripheral surface of the surrounding wall member 18, that is, the row direction of the five semiconductor light emitting elements 40 to 44, that is, the straight line X−. The shape is based on an ellipse whose major axis is the X direction. The wall thickness of the surrounding wall member 18, that is, the thickness from the inner circumferential surface to the outer circumferential surface of the surrounding wall member 18 is substantially uniform. That is, the shape and size of the cross section of the surrounding wall member 18 are uniform or almost uniform. The cross section of the surrounding wall member 18 is a surface cut by a plane orthogonal to the inner and outer peripheral surfaces of the surrounding wall member 18. By making the wall thickness of the surrounding wall member 18 substantially uniform, the five semiconductor light emitting elements 40 to 44 and a part of the wiring elements (one of the plurality of wiring patterns) sealed by the sealing member 180 are formed. And the five bonding wires 60 to 64 and the five mounting pads 601 to 641 and the five wire pads 602 to 642 and the five conductive adhesives) by the sealing member 180. Since stress can be made uniform (even), adverse effects due to stress bias can be prevented.

  Between the lower end of one end of the inner peripheral surface of the surrounding wall member 18 and the wire pads 612, 622 (or 632), 642, the lower end of one end of the inner peripheral surface of the surrounding wall member 18 and the wire pad 612 , 622 (or 632) and 642 are set to a distance that does not contact each other, for example, 0.3 mm to 0.5 mm. Between the lower end of one end of the inner peripheral surface of the surrounding wall member 18 and the conductive adhesive of the semiconductor light emitting elements 41 and 44, the lower end of one end of the inner peripheral surface of the surrounding wall member 18 and the semiconductor light emission A distance such as 0.3 mm to 0.5 mm is provided so that the conductive adhesives of the elements 41 and 44 do not contact each other.

(Description of sealing member 180)
The sealing member 180 is the same resin member as the adhesive and is made of a light transmissive member. The sealing member 180 is the surrounding wall that is fitted and fixed to the substrate 3 after the semiconductor light emitting elements 40 to 44 are mounted on the substrate 3 and the bonding wires 60 to 64 are bonded. The recess formed by the member 18 is filled. When the sealing member 180 is cured, all of the five semiconductor light emitting elements 40 to 44, a part of the plurality of wiring patterns, all of the bonding wires 60 to 64, all of the mounting pads 601 to 641, and the above All the wire pads 602 to 642 and the conductive adhesive are sealed by the sealing member 180.

  The sealing member 180 includes all of the five semiconductor light emitting elements 40 to 44, a part of the plurality of wiring patterns, the bonding wires 60 to 64, the mounting pads 601 to 641, and the wire pads 602. All 642 and the conductive adhesive are protected from the influence from the outside, for example, contact with other things and adhesion of dust, and are protected from ultraviolet rays, sulfurized gas, NOx and water. . That is, the sealing member 180 protects the five semiconductor light emitting elements 40 to 44 from disturbance.

(Description of insulating member 7)
The insulating member 7 is provided with an attachment portion 70 for attaching the semiconductor light source unit 1 to the vehicular lamp 100 detachably or fixedly. The insulating member 7 is made of, for example, an insulating resin member. The insulating member 7 has a substantially cylindrical shape whose outer diameter is slightly smaller than the inner diameter of the mounting hole 104 of the lamp housing 101. A flange portion 71 is integrally provided at an upper end portion of one end portion of the insulating member 7. In the upper end portion of the one end portion of the insulating member 7, a plurality of, in this example, four mounting portions 70 are integrally provided so as to correspond to the concave portion of the lamp housing 101.

  The mounting portion 70 is used to equip the vehicular lamp 100 with the semiconductor light source unit 1. That is, a part of the socket portion 11 on the lens portion 12 side and the mounting portion 70 are inserted into the mounting hole 104 and the concave portion of the lamp housing 101. In this state, the socket portion 11 is rotated around the center O axis, and the mounting portion 70 is brought into contact with the stopper portion of the lamp housing 101. At this time, the mounting portion 70 and the flange portion 71 sandwich the edge of the mounting hole 104 of the lamp housing 101 from above and below via the packing 108 (see FIG. 1).

  As a result, as shown in FIG. 1, the socket portion 11 of the semiconductor light source unit 1 is detachably or fixedly attached to the lamp housing 101 of the vehicular lamp 100 via the packing 108. At this time, as shown in FIG. 1, a portion of the socket portion 11 that protrudes outward from the lamp housing 101, that is, a portion below the lamp housing 101 in FIG. 1 is in the lamp chamber 105 of the socket portion 11. Is larger than the portion housed in the lamp housing 101, that is, the portion above the lamp housing 101 in FIG.

  On the upper end surface of the one end surface of the insulating member 7, a convex portion is integrally provided. A light source connector 13 is integrally provided at the lower end of the other end of the insulating member 7. A connector 14 on the power supply side is attached to the connector portion 13 so as to be mechanically detachable and electrically connectable.

(Description of heat dissipation member 8)
The heat radiating member 8 radiates heat generated by the light source unit 10 to the outside. The heat dissipating member 8 is made of, for example, an aluminum die casting or a resin member having heat conductivity and conductivity. The heat dissipating member 8 has a flat shape at the upper end at one end and a fin shape from the middle to the lower end at the other end. A contact surface is provided on the upper surface of one end of the heat radiating member 8. The heat radiating member 8 is bonded to the contact surface with a heat conductive medium (not shown) in a state where the contact surfaces of the substrate 3 are in contact with each other. As a result, the semiconductor light emitting elements 40 to 44 are positioned corresponding to the center O of the heat radiating member 8 and the portion near the center O of the socket portion 11 through the substrate 3. .

  The heat conductive medium is, for example, a heat conductive adhesive, and is made of an epoxy resin adhesive, a silicone resin adhesive, an acrylic resin adhesive, etc. Form, tape form, etc. The heat conductive medium may be a heat conductive grease in addition to the heat conductive adhesive.

  Cutouts are provided in the center of the right side, the left side, and the lower side of the three sides of the heat radiating member 8 so as to correspond to the insertion hole of the substrate 3 and the convex portion of the insulating member 7, respectively. The three power supply members 91 to 93 are disposed in the notch of the heat dissipation member 8 and the insertion hole of the substrate 3, respectively. The insulating member 7 is interposed between the heat radiating member 8 and the power feeding members 91 to 93. The heat radiating member 8 is in close contact with the insulating member 7. The power supply members 91 to 93 are in close contact with the insulating member 7.

(Description of power supply members 91-93)
The power supply members 91 to 93 supply power to the light source unit 10. The power feeding members 91 to 93 are made of, for example, a conductive metal member. The upper end portions of the one end portions of the power supply members 91 to 93 have a divergent shape, and are respectively located in the notches of the heat radiating member 8 and the insertion holes of the substrate 3. One end portions of the power supply members 91 to 93 protrude from the convex portion of the insulating member 7 and are electrically and mechanically connected to the connection member 17.

  The lower ends of the other end portions of the power supply members 91 to 93 have a narrowed shape and are disposed in the connector portion 13. The other ends of the power supply members 91 to 93 constitute male terminals, that is, male terminals.

  As shown in FIG. 6, of the three power supply members 91 to 93, one power supply member 91 is electrically connected to the two semiconductor light emitting elements 42 and 43 that are light sources of the tail lamp. Yes. Of the three power supply members 91 to 93, the other power supply member 92 is electrically connected to the three semiconductor light emitting elements 40, 41, and 44, which are light sources of a stop lamp. Yes. Furthermore, of the three power supply members 91 to 93, the remaining one power supply member 93 serves as a ground, the three semiconductor light emitting elements 40, 41, and 44, which are light sources of a stop lamp, and a light source of a tail lamp. Are electrically connected to the two semiconductor light emitting elements 42 and 43.

(Description of connecting member 17)
The connecting member 17 is composed of a member having conductivity, elasticity, malleability, ductility, and plasticity, for example, a member such as phosphor bronze or brass. The connecting member 17 electrically connects the light source unit 10 and the socket unit 11.

  That is, the connection member 17 is mechanically connected to the substrate 3 by fitting or the like, and is connected to the conductor of the wiring element of the substrate 3 by solder or a conductive adhesive (not shown). Electrically connected. On the other hand, the connection member 17 is electrically and mechanically connected to one end of the power supply members 91 to 93 by elastic contact, crimping, welding, or the like.

(Description of connector portion 13 and connector 14)
The connector 14 is provided with a female terminal, that is, a female terminal (not shown) that is electrically connected to the male terminal of the connector portion 13. By attaching the connector 14 to the connector portion 13, the female terminal is electrically connected to the male terminal. Further, by removing the connector 14 from the connector portion 13, the electrical connection between the female terminal and the male terminal is interrupted.

  As shown in FIG. 1, the first female terminal and the second female terminal among the female terminals of the connector 14 are connected to a power source, for example, a DC power source battery (not shown) via harnesses 144 and 145 and a switch (not shown). (Not shown). A third female terminal of the female terminals of the connector 14 is grounded or grounded via a harness 146. The connector portion 13 and the connector 14 are 3-pin type connector portions and connectors. That is, they are a three-pin type connector portion and a connector including the three power supply members 91 to 93, the three male terminals, and the three female terminals.

(Description of the lens unit 12)
The lens unit 12 is made of a light transmissive member. The lens unit 12 is provided with an optical control unit (not shown) such as a prism that optically controls and emits light from the five semiconductor light emitting elements 40 to 44. The lens unit 12 is an optical component.

  As shown in FIG. 1, the lens portion 12 is attached to one end opening of one end portion of the cylindrical socket portion 11 so as to cover the light source portion 10. The lens portion 12 together with the sealing member 180 prevents the five semiconductor light emitting elements 40 to 44 from being affected from the outside, for example, contact with other things or adhesion of dust, and It protects against ultraviolet rays, sulfur gas, NOx and water. That is, the lens unit 12 protects the five semiconductor light emitting elements 40 to 44 from disturbance. In addition to the five semiconductor light emitting elements 40 to 44, the lens unit 12 includes the resistance of the control element, the plurality of wiring patterns of the diode and the wiring element, the bonding wires 60 to 64, and the mounting. The pads 601 to 641, the wire pads 602 to 642, and the conductive adhesive are also protected from disturbance. The lens portion 12 may be provided with a vent (not shown).

(Description of the operation of the embodiment)
The semiconductor-type light source (light source unit 10) of the vehicle lamp in this embodiment, the semiconductor-type light source unit 1 of the vehicle lamp in this embodiment, and the vehicle lamp 100 in this embodiment (hereinafter referred to as “semiconductor-type light source in this embodiment”). (The light source unit 10, the semiconductor light source unit 1, and the vehicular lamp 100 ”) are configured as described above, and the operation thereof will be described below.

  First, the switch is operated to turn on the tail lamp. Then, current is supplied to the two semiconductor light emitting elements 42 and 43 having the tail lamp function via the power supply member 91. As a result, the two semiconductor light emitting elements 42 and 43 having the tail lamp function emit light. At this time, as shown in FIG. 7, a predetermined supply current I1 and a predetermined supply voltage V1 are supplied to the two semiconductor light emitting elements 42 and 43 having the tail lamp function. The luminous flux emitted from the light emitting elements 42 and 43 is constant.

  Light emitted from the two semiconductor light emitting elements 42 and 43 having the tail lamp function is transmitted through the sealing member 180, the air layer, and the lens portion 12 of the semiconductor light source unit 1, and the light distribution is controlled. A part of the light emitted from the semiconductor light emitting elements 42 and 43 is reflected by the high reflection surface 30 of the substrate 3 to the lens unit 12 side. The light subjected to the light distribution control is transmitted through the lamp lens 102 of the vehicular lamp 100, is again subjected to the light distribution control, and is irradiated to the outside. Thereby, the vehicular lamp 100 irradiates the light distribution of the tail lamp function to the outside.

  Next, the switch is operated to turn on the stop lamp. Then, current is supplied to the three semiconductor light emitting elements 40, 41, 44 having the stop lamp function via the power supply member 92. As a result, the three semiconductor light emitting elements 40, 41, and 44 having the stop lamp function emit light. At this time, as shown in FIG. 7, a predetermined supply current I1 and a predetermined supply voltage V1 are supplied to the three semiconductor light emitting elements 40, 41, and 44 having the stop lamp function. The luminous flux emitted from the three semiconductor light emitting elements 40, 41, 44 is constant.

  Light emitted from the three semiconductor light emitting elements 40, 41, 44 having the stop lamp function is transmitted through the sealing member 180, the air layer, and the lens unit 12 of the semiconductor light source unit 1, and the light distribution is controlled. A part of the light emitted from the semiconductor light emitting elements 40, 41, 44 is reflected by the highly reflective surface 30 of the substrate 3 to the lens unit 12 side. The light subjected to the light distribution control is transmitted through the lamp lens 102 of the vehicular lamp 100, is again subjected to the light distribution control, and is irradiated to the outside. Thereby, the vehicular lamp 100 irradiates the light distribution of the stop lamp function to the outside. The light distribution of the stop lamp function is brighter, that is, the luminous flux, the luminance, the luminous intensity, and the illuminance are larger than the light distribution of the tail lamp function.

  Here, the heat generated in the semiconductor light emitting elements 40 to 44 of the light source unit 10 and the resistances RS and RT of the control elements, the diodes DS and DT, and the conductors of the wiring elements are radiated through the substrate 3 and the heat conductive medium 8. And is radiated from the heat radiating member 8 to the outside.

(Explanation of effect of embodiment)
The semiconductor-type light source, that is, the light source unit 10, the semiconductor-type light source unit 1, and the vehicular lamp 100 according to this embodiment is configured and operated as described above. The effects will be described below.

  In this embodiment, the semiconductor light source, that is, the light source unit 10, the semiconductor light source unit 1, and the vehicular lamp 100 has five semiconductor light emitting elements 40 to 44 arranged on a straight line XX, and is a light source of a stop lamp. Of the three semiconductor light emitting elements 40, 41, 44, one semiconductor light emitting element 44 is arranged at or near the center O of the substrate 3, and the remaining two semiconductor light emitting elements 41, 44 are the substrate. 3 are arranged at both ends on one straight line XX. As a result, the light distribution characteristic of the stop lamp shown in FIG. 5 (that is, the luminance is 60 cd (Japan, Europe) or 80 cd (US) having the highest luminance at the center (V-0 °, H-0 °) point, It is 54 cd (Japan, Europe) or 70 cd (USA) with the second highest brightness at the left and right (V-0 °, H-5 °) points, and 3 at the upper and lower (V-5 °, H-0 °) points. 42 cd (Japan, Europe) or 40 cd (United States) with the highest brightness of 21 cd (Japan, Europe) or 30 cd (US) with the fourth brightness at the left and right (V-0 °, H-10 °) points. Yes, 12 cd (Japan, Europe) or 16 cd (USA) with 5th brightness at top and bottom (V-10 °, H-5 °) and top and bottom (left and right) (V-5 °, H-10 °) points The brightness of 6th place at the top, bottom, left and right (V-5 °, H-20 °) points. This is almost the same as the light distribution characteristic of a stop lamp of 6 cd (Japan, Europe) or 10 cd (USA).

  Further, in the semiconductor type light source, that is, the light source unit 10, the semiconductor type light source unit 1, and the vehicle lamp 100 in this embodiment, the five semiconductor light emitting elements 40 to 44 are arranged on the straight line XX, and the light source of the tail lamp The two semiconductor light emitting elements 42 and 43 are arranged between one semiconductor light emitting element 40 as a light source of a stop lamp and two semiconductor light emitting elements 41 and 44 at both ends. As a result, the light distribution characteristic of the tail lamp shown in FIG. 5 (that is, 4.0 cd (Japan, Europe) or 2.0 cd (US) where the luminance is the highest at the center (V-0 °, H-0 °) point. It is 3.6 cd (Japan, Europe) or 1.8 cd (USA) with the second highest brightness at the left and right (V-0 °, H-5 °) points, and the upper and lower (V-5 °, H It is 2.8 cd (Japan, Europe) or 0.8 cd (US) at the 3rd place brightness at the (−0 °) point, and 1 at the 4th place brightness at the left and right (V-0 °, H-10 °) points. .4 cd (Japan, Europe) or 0.8 cd (United States), 5 at the top and bottom (V-10 °, H-5 °) points and the top, bottom, left and right (V-5 °, H-10 °) points. Brightness of 0.8 cd (Japan, Europe) or 0.4 cd (United States), and at the top, bottom, left and right (V-5 °, H-20 °) points. And the light distribution characteristics of the tail lamp which is 0.4 cd (Japan, Europe) or 0.3 cd (USA) with 6th brightness.

  As described above, the semiconductor-type light source, that is, the light source unit 10, the semiconductor-type light source unit 1, and the vehicular lamp 100 in this embodiment uses the common optical system of the tail lamp and the stop lamp, and the light distribution pattern of the stop lamp and the tail lamp. Each of the light distribution patterns can be efficiently irradiated.

  In this embodiment, the semiconductor light source, that is, the light source unit 10, the semiconductor light source unit 1, and the vehicular lamp 100 includes three semiconductor light emitting elements 40, 41, and 44 that are light sources of stop lamps electrically connected in series. Therefore, for example, even when the load of the power source (battery) of the vehicle suddenly changes in idling stop, cell motor activation, air conditioner activation, etc., the rated voltage (see V3 in FIG. 7) or higher can be maintained. . As a result, even during a sudden change in the load of the power source of the vehicle, the light emission state of the three semiconductor light emitting elements 40, 41, and 44, which are the light sources of the stop lamp, can be maintained. In particular, it is optimal for a semiconductor light source that controls the supply current to the three semiconductor light emitting elements 40, 41, and 44, which are the light sources of the stop lamp, by a resistor RS mounted on the substrate 3 without using an electronic circuit. is there.

  Further, in the semiconductor type light source, that is, the light source unit 10, the semiconductor type light source unit 1, and the vehicle lamp 100 in this embodiment, three semiconductor light emitting elements 40, 41, 44 that are light sources of stop lamps are electrically connected in series. In addition, two semiconductor light emitting elements 42 and 43 that are light sources of the tail lamp are electrically connected in series. That is, the semiconductor-type light source in this embodiment, that is, the light source unit 10, the semiconductor-type light source unit 1, and the vehicular lamp 100 are the three semiconductor light-emitting elements 40, 41, 44 that are the light source of the stop lamp and the light source 2 of the tail lamp. The semiconductor light emitting elements 42 and 43 are configured independently of each other. For this reason, the following effects can be achieved.

  That is, three semiconductor light emitting elements 40, 41, and 44, which are light sources of a stop lamp, and two semiconductor light emitting elements 42, 43, which are light sources of a tail lamp, are respectively linear regions of IV characteristics of the semiconductor light emitting elements ( 7 can be used in the region between I1 and I2 and V1 and V2 in FIG. In addition, the semiconductor light emitting elements 40 to 44 are connected in series as compared with a semiconductor light source in which a plurality of semiconductor light emitting elements that are light sources of stop lamps and a plurality of semiconductor light emitting elements that are light sources of tail lamps are combined. The width of the resistors RS and RT (similarly, the trimming width) can be set narrow. Further, since the ratio of the luminance of the tail lamp to the luminance of the stop lamp is 1:15 to 20 (Japan, Europe) or 1:40 (US), the two semiconductor light emitting elements 42 and 43 that are the light sources of the tail lamp are used. Has a margin (flux tolerance) in the luminous flux. As a result, even if the stop lamp light distribution is optimally designed, the adjustment range of the tail lamp light distribution can be widened. That is, the arrangement of the three semiconductor light emitting elements 40, 41, and 44, which are the light sources of the stop lamp, and the arrangement of the two semiconductor light emitting elements 42, 43, which are the light sources of the tail lamp, are generally similar. Even if the light distribution is optimally designed, the light distribution of the tail lamp can be adjusted widely.

DESCRIPTION OF SYMBOLS 100 Vehicle lamp 101 Lamp housing 102 Lamp lens 103 Reflector 104 Mounting hole 105 Lamp chamber 106 Through-hole 107 Reflecting surface 108 Packing 1 Semiconductor type light source unit 10 Light source part (semiconductor type light source)
DESCRIPTION OF SYMBOLS 11 Socket part 12 Lens part 13 Connector part 14 Connector 144, 145, 146 Harness 17 Connection member 18 Enclosure wall member 180 Sealing member 181 Reflective surface 3 Substrate 30 High reflective surface 34 Mounting surface 40, 41, 42, 43, 44 Semiconductor Light emitting element 60, 61, 62, 63, 64 Bonding wire (wiring element)
601, 611, 621, 631, 641 Mounting pad (wiring element)
602, 612, 622, 632, 642 Wire pad (wiring element)
7 Insulating member 70 Mounting portion 71 Hut 8 Heat radiation member 91, 92, 93 Feed member F Focus O Center RS, RT Resistance (control element)
DS, DT diode (control element)
XX Straight line HL-HR Horizontal lines on left and right of screen VU-VD Vertical lines on top and bottom of screen

Claims (4)

A substrate having a mounting surface;
A plurality of semiconductor light emitting elements mounted on the mounting surface of the substrate;
A control element for controlling light emission of the semiconductor light emitting element;
A wiring element that feeds power to the semiconductor light emitting element via the control element;
A ring-shaped surrounding wall member surrounding all of the plurality of semiconductor light emitting elements;
A light-transmitting sealing member that seals the plurality of semiconductor light-emitting elements in the recess formed in the mounting surface of the substrate and the surrounding wall member;
With
The plurality of semiconductor light emitting elements are arranged in a straight line, and are composed of three semiconductor light emitting elements that are light sources of a stop lamp and two semiconductor light emitting elements that are light sources of a tail lamp,
Of the three semiconductor light emitting elements that are light sources of a stop lamp, one of the semiconductor light emitting elements is disposed at or near the center of the substrate, and the remaining two semiconductor light emitting elements are Arranged on both ends of the substrate on the straight line,
The two semiconductor light emitting elements that are light sources of the tail lamps are respectively disposed between the one semiconductor light emitting element at the center that is the light source of the stop lamp and the two semiconductor light emitting elements at both ends.
A semiconductor-type light source for a vehicular lamp. The three semiconductor light emitting elements that are light sources of the stop lamps are electrically connected in series,
The two semiconductor light-emitting elements that are light sources of the tail lamp are electrically connected in series.
The semiconductor-type light source of the vehicular lamp according to claim 1. A socket portion formed by combining an insulating member, a heat radiating member, and a power feeding member;
The semiconductor-type light source of the vehicular lamp according to claim 1 or 2, attached to the socket portion,
Comprising
A semiconductor-type light source unit for a vehicular lamp. A lamp housing and a lamp lens that partition the lamp chamber;
A semiconductor-type light source unit for a vehicular lamp according to claim 3;
With
The socket portion is attached to the lamp housing, and the semiconductor light source is disposed in the lamp chamber;
A vehicular lamp characterized by the above.

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