JP2013135139A - バイト切削方法 - Google Patents
バイト切削方法 Download PDFInfo
- Publication number
- JP2013135139A JP2013135139A JP2011285576A JP2011285576A JP2013135139A JP 2013135139 A JP2013135139 A JP 2013135139A JP 2011285576 A JP2011285576 A JP 2011285576A JP 2011285576 A JP2011285576 A JP 2011285576A JP 2013135139 A JP2013135139 A JP 2013135139A
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- Prior art keywords
- sealing body
- brightness
- cutting
- thickness
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims abstract description 8
- 238000007789 sealing Methods 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 10
- 238000005259 measurement Methods 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Dicing (AREA)
Abstract
【解決手段】基板と、該基板上に搭載された複数のLEDチップと、LEDチップを被覆する蛍光材料を含む封止体とからなる封止体を切削して所望の明るさに封止体を薄化するバイト切削方法であって、LEDチップの明るさと該封止体の厚みとの相関関係を示す相関表11を準備する相関表準備ステップと、被加工物の該LEDチップに電圧をかけて該LEDチップが発光した際の明るさを測定する明るさ測定ステップと、該明るさ測定ステップで測定した明るさと相関表11とから該封止体の厚みを算出する算出ステップと、該算出ステップを実施した後、被加工物の該封止体を該バイト切削手段で切削する切削ステップを具備する。
【選択図】図3
Description
11 相関表
13 相関直線
17 被加工物
19 基板
21 LEDチップ
25 バイトホイール
26 バイト工具
27 封止体(封止樹脂)
29 蛍光材料
30 チャックテーブル
Claims (1)
- 基板と、該基板上に搭載された複数のLEDチップと、該複数のLEDチップを被覆する蛍光材料を含む封止体と、からなる被加工物の該封止体をバイト切削手段で切削して該LEDチップが所望の明るさに発光する厚みへと該封止体を薄化するバイト切削方法であって、
LEDチップを発光させた際の明るさと該封止体の厚みとの相関関係を示す相関表を準備する相関表準備ステップと、
被加工物の該LEDチップに電圧をかけて該LEDチップが発光した際の明るさを測定する明るさ測定ステップと、
該明るさ測定ステップで測定した明るさと該相関表とから該封止体の厚みを算出する算出ステップと、
該算出ステップを実施した後、被加工物の該封止体を該バイト切削手段で切削して該LEDチップが所望の明るさに発光する厚みに該封止体を仕上げる切削ステップと、
を具備したことを特徴とするバイト切削方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011285576A JP5885499B2 (ja) | 2011-12-27 | 2011-12-27 | バイト切削方法 |
CN201210500259.3A CN103187492B (zh) | 2011-12-27 | 2012-11-29 | 刨刀切削方法 |
US13/706,616 US8574930B2 (en) | 2011-12-27 | 2012-12-06 | Tool cutting method for workpiece having a plurality of LED chips sealed by sealing member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011285576A JP5885499B2 (ja) | 2011-12-27 | 2011-12-27 | バイト切削方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013135139A true JP2013135139A (ja) | 2013-07-08 |
JP5885499B2 JP5885499B2 (ja) | 2016-03-15 |
Family
ID=48654941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011285576A Active JP5885499B2 (ja) | 2011-12-27 | 2011-12-27 | バイト切削方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8574930B2 (ja) |
JP (1) | JP5885499B2 (ja) |
CN (1) | CN103187492B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017018470A1 (ja) * | 2015-07-27 | 2017-02-02 | 国立研究開発法人理化学研究所 | 発光装置、発光システム、及び、発光装置の製造方法 |
WO2018012273A1 (ja) * | 2016-07-14 | 2018-01-18 | 日本電気硝子株式会社 | 波長変換部材の製造方法及び波長変換部材群 |
KR20190121976A (ko) * | 2018-04-19 | 2019-10-29 | 서우테크놀로지 주식회사 | 반도체 패키지 그라인더의 연삭 두께 조절장치 및 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004186488A (ja) * | 2002-12-04 | 2004-07-02 | Nichia Chem Ind Ltd | 発光装置、発光装置の製造方法および発光装置の色度調整方法 |
JP2004343070A (ja) * | 2003-04-21 | 2004-12-02 | Kyocera Corp | 発光装置および照明装置 |
JP2005072527A (ja) * | 2003-08-28 | 2005-03-17 | Tomio Inoue | 発光素子およびその製造方法 |
JP2005332963A (ja) * | 2004-05-19 | 2005-12-02 | Shoei Chem Ind Co | 発光装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5962971A (en) * | 1997-08-29 | 1999-10-05 | Chen; Hsing | LED structure with ultraviolet-light emission chip and multilayered resins to generate various colored lights |
JP3470077B2 (ja) * | 2000-02-18 | 2003-11-25 | 三菱電機株式会社 | 放電発光装置 |
JP3589187B2 (ja) | 2000-07-31 | 2004-11-17 | 日亜化学工業株式会社 | 発光装置の形成方法 |
US20040159900A1 (en) * | 2003-01-27 | 2004-08-19 | 3M Innovative Properties Company | Phosphor based light sources having front illumination |
ATE395391T1 (de) * | 2004-05-27 | 2008-05-15 | Koninkl Philips Electronics Nv | Beleuchtungssystem mit einer strahlungsquelle und einem fluoreszierenden material |
JP2006140083A (ja) * | 2004-11-15 | 2006-06-01 | Tohoku Univ | 蛍光ランプ |
JP2006245033A (ja) | 2005-02-28 | 2006-09-14 | Toyoda Gosei Co Ltd | 発光装置 |
JP2006261540A (ja) * | 2005-03-18 | 2006-09-28 | Stanley Electric Co Ltd | 発光デバイス |
JP4753904B2 (ja) * | 2007-03-15 | 2011-08-24 | シャープ株式会社 | 発光装置 |
US8096677B2 (en) * | 2008-02-15 | 2012-01-17 | Excelitas Technologies LED Solutions, Inc. | Staggered LED based high-intensity light |
TW200937667A (en) * | 2008-02-20 | 2009-09-01 | Advanced Optoelectronic Tech | Package structure of chemical compound semiconductor device and fabricating method thereof |
JP5342867B2 (ja) * | 2008-12-19 | 2013-11-13 | スタンレー電気株式会社 | 半導体発光装置及び駆動方法 |
-
2011
- 2011-12-27 JP JP2011285576A patent/JP5885499B2/ja active Active
-
2012
- 2012-11-29 CN CN201210500259.3A patent/CN103187492B/zh active Active
- 2012-12-06 US US13/706,616 patent/US8574930B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004186488A (ja) * | 2002-12-04 | 2004-07-02 | Nichia Chem Ind Ltd | 発光装置、発光装置の製造方法および発光装置の色度調整方法 |
JP2004343070A (ja) * | 2003-04-21 | 2004-12-02 | Kyocera Corp | 発光装置および照明装置 |
JP2005072527A (ja) * | 2003-08-28 | 2005-03-17 | Tomio Inoue | 発光素子およびその製造方法 |
JP2005332963A (ja) * | 2004-05-19 | 2005-12-02 | Shoei Chem Ind Co | 発光装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017018470A1 (ja) * | 2015-07-27 | 2017-02-02 | 国立研究開発法人理化学研究所 | 発光装置、発光システム、及び、発光装置の製造方法 |
WO2018012273A1 (ja) * | 2016-07-14 | 2018-01-18 | 日本電気硝子株式会社 | 波長変換部材の製造方法及び波長変換部材群 |
KR20190121976A (ko) * | 2018-04-19 | 2019-10-29 | 서우테크놀로지 주식회사 | 반도체 패키지 그라인더의 연삭 두께 조절장치 및 방법 |
KR102121061B1 (ko) * | 2018-04-19 | 2020-06-10 | 서우테크놀로지 주식회사 | 반도체 패키지 그라인더의 연삭 두께 조절장치 및 방법 |
Also Published As
Publication number | Publication date |
---|---|
CN103187492B (zh) | 2017-06-06 |
US20130164864A1 (en) | 2013-06-27 |
JP5885499B2 (ja) | 2016-03-15 |
US8574930B2 (en) | 2013-11-05 |
CN103187492A (zh) | 2013-07-03 |
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