JP2013131563A5 - - Google Patents
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- JP2013131563A5 JP2013131563A5 JP2011278788A JP2011278788A JP2013131563A5 JP 2013131563 A5 JP2013131563 A5 JP 2013131563A5 JP 2011278788 A JP2011278788 A JP 2011278788A JP 2011278788 A JP2011278788 A JP 2011278788A JP 2013131563 A5 JP2013131563 A5 JP 2013131563A5
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- JP
- Japan
- Prior art keywords
- conductive sheet
- heat conductive
- thickness direction
- examples
- thermal conductivity
- Prior art date
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- 230000000052 comparative effect Effects 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
Description
実施例1〜実施例6で得られた熱伝導性シートは、熱伝導性シートの厚み方向における熱伝導率が、熱伝導性シートの断面全体で22.3〜33.1W/mKであり、厚み方向の熱伝導性が良好であることが分かった。これは、実施例1〜実施例6で得られた熱伝導性シートは、熱伝導性シートの表面を測定したときのL*a*b表色系における「L*」値で表される明度L*が32.5以上であったため、ピッチ系炭素繊維が熱伝導性シートの厚み方向に沿って配向され、熱伝導性シートの厚み方向の熱伝導性を良好にすることができたと考えられる。 The heat conductive sheets obtained in Examples 1 to 6 have a heat conductivity in the thickness direction of the heat conductive sheet of 22.3 to 33.1 W / mK across the entire cross section of the heat conductive sheet. It was found that the thermal conductivity in the thickness direction was good. This is the brightness represented by the “L *” value in the L * a * b color system when the surface of the heat conductive sheet measured in Examples 1 to 6 is measured. Since L * was 32.5 or more, it is considered that the pitch-based carbon fibers were oriented along the thickness direction of the thermal conductive sheet, and the thermal conductivity in the thickness direction of the thermal conductive sheet could be improved. .
一方、比較例1〜比較例3で得られた熱伝導性シートは、熱伝導率が20.2W/mK以下であり、実施例1〜実施例6で得られた熱伝導性シートと比較して、厚み方向の熱伝導性が良好でないことが分かった。これは、比較例1〜比較例3で得られた熱伝導性シートは、熱伝導性シート中に窒化アルミニウムが含有されておらず、また、熱伝導性シートの表面を測定したときのL*a*b表色系における「L*」値で表される明度L*が32.5以上ではないためと考えられる。 On the other hand, the thermally conductive sheet obtained in Comparative Example 1 to Comparative Example 3 has a thermal conductivity of not more than 20.2W / mK, compared with thermally conductive sheet obtained in Examples 1 to 6 Thus, it was found that the thermal conductivity in the thickness direction is not good. This is because the heat conductive sheet obtained in Comparative Examples 1 to 3 does not contain aluminum nitride in the heat conductive sheet, and L * when the surface of the heat conductive sheet is measured. This is presumably because the lightness L * represented by the “L *” value in the a * b color system is not 32.5 or higher.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011278788A JP6034562B2 (en) | 2011-12-20 | 2011-12-20 | Thermally conductive sheet and method for producing the thermally conductive sheet |
CN201810153894.6A CN108384248B (en) | 2011-12-20 | 2012-12-18 | Thermally conductive sheet and method for producing thermally conductive sheet |
PCT/JP2012/082817 WO2013094613A1 (en) | 2011-12-20 | 2012-12-18 | Thermally conductive sheet and method for manufacturing thermally conductive sheet |
CN201280061296.7A CN103975429B (en) | 2011-12-20 | 2012-12-18 | The manufacture method of thermal conductivity piece and thermal conductivity piece |
TW101148546A TWI611013B (en) | 2011-12-20 | 2012-12-20 | Thermal conductive sheet and method for producing thermally conductive sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011278788A JP6034562B2 (en) | 2011-12-20 | 2011-12-20 | Thermally conductive sheet and method for producing the thermally conductive sheet |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013131563A JP2013131563A (en) | 2013-07-04 |
JP2013131563A5 true JP2013131563A5 (en) | 2015-02-19 |
JP6034562B2 JP6034562B2 (en) | 2016-11-30 |
Family
ID=48668500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011278788A Active JP6034562B2 (en) | 2011-12-20 | 2011-12-20 | Thermally conductive sheet and method for producing the thermally conductive sheet |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6034562B2 (en) |
CN (2) | CN108384248B (en) |
TW (1) | TWI611013B (en) |
WO (1) | WO2013094613A1 (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6069112B2 (en) | 2013-06-19 | 2017-02-01 | デクセリアルズ株式会社 | Thermally conductive sheet and method for producing the thermally conductive sheet |
JP2015073067A (en) * | 2013-09-06 | 2015-04-16 | バンドー化学株式会社 | Thermally conductive resin molded product |
EP3228590A4 (en) * | 2014-12-02 | 2018-07-25 | Sekisui Chemical Co., Ltd. | Thermally-conductive sheet and method for producing same |
JP6178389B2 (en) * | 2014-12-25 | 2017-08-09 | デクセリアルズ株式会社 | Method for manufacturing thermal conductive sheet, thermal conductive sheet, and semiconductor device |
CN106810876B (en) * | 2015-12-02 | 2020-11-10 | 中国科学院金属研究所 | Composite material with directionally arranged fillers and preparation method thereof |
JP6200119B1 (en) * | 2016-02-01 | 2017-09-20 | バンドー化学株式会社 | Thermally conductive resin molded product |
CN107022196A (en) * | 2016-02-02 | 2017-08-08 | 中兴通讯股份有限公司 | Heat Conduction Material, its preparation method and heat-conducting piece |
CN110191925A (en) * | 2017-01-19 | 2019-08-30 | 国立大学法人福井大学 | High conductivity material and its manufacturing method |
WO2020100482A1 (en) * | 2018-11-16 | 2020-05-22 | 富士高分子工業株式会社 | Heat-conductive sheet and method for manufacturing same |
JP6692512B1 (en) * | 2018-12-25 | 2020-05-13 | 富士高分子工業株式会社 | Thermally conductive composition and thermally conductive sheet using the same |
US11781053B2 (en) | 2018-12-25 | 2023-10-10 | Fuji Polymer Industries Co., Ltd. | Thermally conductive composition and thermally conductive sheet using the same |
CN110625877B (en) * | 2019-09-05 | 2021-06-08 | 上海阿莱德实业股份有限公司 | Preparation method of heat-conducting interface material |
KR102564309B1 (en) * | 2020-02-21 | 2023-08-07 | 세키수이 폴리머텍 가부시키가이샤 | Thermal conductive sheet and manufacturing method thereof |
CN112712944B (en) * | 2020-12-24 | 2022-04-08 | 武汉肯达科讯科技有限公司 | High-thermal-conductivity insulating gasket and preparation method thereof |
CN115141460B (en) * | 2021-03-30 | 2023-09-01 | 太阳油墨(苏州)有限公司 | Thermosetting resin composition, cured product, and electronic component |
CN114106564B (en) * | 2021-11-17 | 2023-08-29 | 深圳市鸿富诚新材料股份有限公司 | Oriented heat conduction gel, preparation method and application thereof |
JP2023120623A (en) * | 2022-02-18 | 2023-08-30 | 信越化学工業株式会社 | Heat-conductive sheet and manufacturing method of heat-conductive sheet |
JP2023179996A (en) * | 2022-06-08 | 2023-12-20 | デクセリアルズ株式会社 | Laminate and method for manufacturing the same |
JP2023179992A (en) * | 2022-06-08 | 2023-12-20 | デクセリアルズ株式会社 | Laminate and method for manufacturing the same |
JP2023179989A (en) * | 2022-06-08 | 2023-12-20 | デクセリアルズ株式会社 | Laminate and method for manufacturing the same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4545246B2 (en) * | 1999-06-02 | 2010-09-15 | 電気化学工業株式会社 | Method for producing thermally conductive silicone molded body |
JP2001294676A (en) * | 2000-04-13 | 2001-10-23 | Jsr Corp | Heat-conductive sheet, method for producing heat- conductive sheet and radiating structure using heat- conductive sheet |
JP2006124206A (en) * | 2004-10-27 | 2006-05-18 | Sumitomo Electric Ind Ltd | Degreased intermediate for aluminum nitride and sintered compact |
JP4897360B2 (en) * | 2006-06-08 | 2012-03-14 | ポリマテック株式会社 | Thermally conductive molded body and method for producing the same |
EP2118191A1 (en) * | 2007-01-10 | 2009-11-18 | Momentive Performance Materials Inc. | Thermal interface materials and methods for making thereof |
JP2008266586A (en) * | 2007-03-27 | 2008-11-06 | Toyoda Gosei Co Ltd | Low electric conductivity high heat radiation polymer material and molded article |
-
2011
- 2011-12-20 JP JP2011278788A patent/JP6034562B2/en active Active
-
2012
- 2012-12-18 CN CN201810153894.6A patent/CN108384248B/en active Active
- 2012-12-18 WO PCT/JP2012/082817 patent/WO2013094613A1/en active Application Filing
- 2012-12-18 CN CN201280061296.7A patent/CN103975429B/en active Active
- 2012-12-20 TW TW101148546A patent/TWI611013B/en active
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