JP2013128907A - Drawing apparatus and pattern correction device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a drawing apparatus capable of preventing contact of the edge of a nozzle and the surface of a substrate.SOLUTION: The drawing device arranges the edge 1a of an inkjet nozzle 1 at a waiting position upward of the surface of the substrate 4 in waiting, and arranges the edge 1a of the nozzle 1 at a drawing position upward of the drawing start point to discharge a liquid material 2 after once stopping the edge 1a of the nozzle 1 at a correction position upward of a drawing start point in drawing. Thus, the contact of the edge 1a of the nozzle 1 and the surface of the substrate 4 can be prevented by setting a correction distance H between the correction position and the drawing position small.

Description

  The present invention relates to a drawing apparatus and a pattern correction apparatus, and more particularly to a drawing apparatus that draws a pattern by discharging a liquid material on the surface of a substrate, and a pattern correction apparatus that corrects a defect in a pattern formed on the surface of the substrate.

  The method of drawing a pattern on the surface of a substrate using an ink jet has higher utilization efficiency of ink than other drawing methods and has the effect of simplifying the work process, and has recently been used in various fields. . As an ink ejection method, a piezoelectric method, a heating method, an electrostatic suction method, and the like are known. In order to draw a finer pattern, an electrostatic suction type ink jet apparatus is used (see, for example, Patent Document 1).

  In an electrostatic suction type ink jet device, a pulse voltage is applied to a liquid substance injected into a nozzle. As a result, a conical tailor cone is formed from the nozzle tip toward the substrate, a jet flow (liquid column) is generated from the top of the tailor cone to the substrate surface, and a part of the liquid substance moves onto the substrate. Form droplets. By relatively moving the nozzle and the substrate in this state, a pattern having a desired shape can be drawn on the surface of the substrate.

  In addition, if there is a minute disconnection defect on the TFT (Thin Film Transistor) substrate of the liquid crystal display, it is corrected by applying conductive ink (correction liquid) to the disconnection defect using an electrostatic suction ink jet device. (For example, refer to Patent Document 2).

JP 2010-188264 A Japanese Patent No. 4248840

  In such an electrostatic suction type ink jet device, for example, a nozzle in which the tip of a glass tube is processed to be very thin is used, and at the time of drawing, the distance between the tip of the nozzle and the surface of the substrate is set to a minute distance of about several tens of μm. There is a need to. At that time, there is a problem that the tip of the nozzle contacts the surface of the substrate and damages the tip of the nozzle.

  For example, when setting the distance between the tip of the nozzle and the surface of the substrate, if the Z-axis stage is lowered at a high speed and the tip of the nozzle is moved from the standby position to the drawing position, the Z-axis stage overshoot or the nozzle In some cases, the tip of the nozzle collides with the surface of the substrate due to the vibration of the member to be fixedly supported. If the tip of the nozzle is damaged, the jet flow is disturbed and the discharge position becomes unstable, so the nozzle needs to be replaced.

  Therefore, a main object of the present invention is to provide a drawing device and a pattern correction device capable of preventing contact between the tip of the nozzle and the surface of the substrate.

  A drawing apparatus according to the present invention is a drawing apparatus that draws a pattern by discharging a liquid material onto the surface of a substrate, the tip being disposed opposite the surface of the substrate, and an electrostatic suction type in which the liquid material is injected A first positioning means for holding the substrate horizontally and relatively moving the substrate and the nozzle in the horizontal direction, a second positioning means for moving the nozzle in the vertical direction, and applying a pulse voltage to the liquid substance And controlling the pulse voltage generating means for discharging the liquid substance from the tip of the nozzle, the first and second positioning means and the pulse voltage generating means, and at the time of standby, the tip of the nozzle is placed at a standby position above the surface of the substrate. And at the time of drawing, the nozzle is lowered, the tip of the nozzle is placed at the drawing position above the drawing start point, and a control means for discharging the liquid substance from the tip of the nozzle is provided. The control means stops the nozzle at least once while moving the tip of the nozzle from the standby position to the drawing position.

  Preferably, the control unit lowers the tip of the nozzle from the standby position to the drawing position after temporarily stopping the tip of the nozzle at the correction position between the standby position and the drawing position. .

  Preferably, the distance between the standby position and the correction position is larger than the distance between the correction position and the drawing position.

  Preferably, the distance between the correction position and the drawing position is set larger than the overshoot amount of the second positioning means or the vibration width in the vertical direction of the nozzle.

Preferably, the distance between the correction position and the drawing position is set to 1 mm or less.
Preferably, the second positioning means includes a discarding member that receives the liquid material discarded by the nozzle, a driving unit that inserts and removes the discarding member between the tip of the nozzle and the substrate, a nozzle and the discarding member, And a scanning mechanism that raises the nozzle as the throwing member is inserted between the tip of the nozzle and the substrate and lowers the nozzle as the throwing member is extracted from between the nozzle and the substrate. The control means controls the driving means, and at the time of the discarding operation, a discarding member is inserted between the tip of the nozzle and the substrate to discharge the liquid material from the nozzle. Remove the scraping member from between the substrates. When the scraping member is extracted from between the nozzle and the substrate, the tip of the nozzle is disposed at the correction position.

  Further preferably, it further comprises a measuring means for measuring the height of the surface of the substrate, and the control means corrects the distance between the tip of the nozzle and the surface of the substrate based on the measurement result of the measuring means.

  Preferably, the control means draws a pattern of the liquid material on the surface of the substrate by relatively moving the nozzle and the substrate in the horizontal direction while discharging the liquid material from the tip of the nozzle.

  The pattern correction apparatus according to the present invention is a pattern correction apparatus for correcting a defect in a pattern formed on the surface of a substrate, the tip of which is arranged facing the surface of the substrate, and a static solution into which correction liquid has been injected. Electrosuction type nozzle, first positioning means for holding the substrate horizontally and relatively moving the substrate and the nozzle in the horizontal direction, second positioning means for moving the nozzle in the vertical direction, and a pulse for the correction liquid A voltage is applied to control the pulse voltage generating means for discharging the correction liquid from the tip of the nozzle, the first and second positioning means, and the pulse voltage generating means. During standby, the nozzle is placed at a standby position above the substrate. The tip is arranged, and at the time of correction, the nozzle is lowered, the tip of the nozzle is arranged at the drawing position above the defect, and control means for discharging the correction liquid from the tip of the nozzle is provided. The control means stops the nozzle at least once while moving the tip of the nozzle from the standby position to the drawing position.

  In the drawing apparatus and the pattern correction apparatus according to the present invention, the nozzle is stopped at least once while the tip of the nozzle is moved from the standby position to the drawing position. Therefore, by setting the distance between the nozzle stop position and the drawing position small, it is possible to prevent contact between the nozzle tip and the surface of the substrate.

It is a block diagram which shows the principal part of the drawing apparatus by Embodiment 1 of this invention. FIG. 2 is a block diagram showing a drawing operation of the drawing apparatus shown in FIG. 1. It is a figure which shows the operation | movement which lowers the nozzle shown in FIG. 2 to a drawing position. It is a flowchart which shows operation | movement of the drawing apparatus shown in FIGS. It is a perspective view which shows the structure of the drawing apparatus by Embodiment 2 of this invention. It is a perspective view which shows the structure of the objective lens switch shown in FIG. It is a figure which shows operation | movement of the objective lens switch shown in FIG. 6 is a flowchart illustrating an operation of the drawing apparatus illustrated in FIG. 5. It is a front view which shows the structure of the support unit shown in FIG. FIG. 10 is a sectional view taken along line XX in FIG. 9. It is B arrow line view of FIG. It is a figure which shows operation | movement of the support unit shown in FIGS. It is another figure which shows operation | movement of the support unit shown in FIGS. FIG. 12 is still another view showing the operation of the support unit shown in FIGS. 9 to 11. It is a perspective view which shows the principal part of the drawing apparatus by Embodiment 3 of this invention. It is a flowchart which shows operation | movement of the drawing apparatus shown in FIG. It is a perspective view which shows the board | substrate of the correction object of the pattern correction apparatus by Embodiment 4 of this invention. It is a figure which shows the process of correcting the open defect part shown in FIG.

  In the drawing apparatus according to the present invention, the electrostatic suction type ink jet nozzle is disposed at a standby position far away from the substrate at the time of standby when drawing (discharge) is not performed. During the drawing operation, the nozzle is lowered in a plurality of stages from the standby position to the drawing position for drawing to avoid damage to the nozzle tip.

  That is, the electrostatic suction type nozzle is fixed to a Z-axis stage movable in the vertical direction, and the Z-axis stage is controlled by a control device. The control device drives the Z-axis stage in response to the drawing command, and as a first stage (first lowering), lowers the nozzle from the retracted position to the correction position and temporarily stops it. At the correction position, the distance between the nozzle tip and the substrate surface is set to a distance (G + H) obtained by adding the correction distance H to the drawing distance G.

  Next, the control device drives the Z-axis stage to lower the nozzle by the correction distance H and stop it at the drawing position as the second stage (second lowering). At the drawing position, the distance between the nozzle tip and the substrate surface is set to the drawing distance G, and the liquid substance can be discharged from the nozzle tip. The descending amount in the second stage is set smaller than the descending amount in the first stage, and the descending amount in the second stage is slight.

  The correction distance H is set larger than the displacement caused by the overshoot of the Z-axis stage or the vibration of the member fixing the nozzle. The correction distance H is set to a value of 1 mm or less, for example, about 100 μm. Since the correction distance H is set to a very small value, overshoot of the Z-axis stage and vibration of the member that fixes the nozzle are suppressed to a negligible level during the second lowering. Therefore, collision between the nozzle tip and the substrate surface can be prevented, and damage to the nozzle tip can be avoided. Further, since the descending amount is small, the moving time is short, and even if the nozzle is lowered in two stages, the tact time is not significantly affected. Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[Embodiment 1]
FIG. 1 is a cross-sectional view showing a main part of a drawing apparatus according to Embodiment 1 of the present invention. In FIG. 1, the drawing apparatus includes an electrostatic suction type inkjet nozzle 1, a pulse voltage generation device 3, an XY stage 5, and a control device 7 that controls the entire drawing device. The nozzle 1 is a glass tube that is stretched to have a very small tip diameter. A liquid substance (liquid) 2 is injected into the nozzle 1, and a pulse voltage VP output from the pulse voltage generator 3 can be applied to the liquid substance 2. The substrate 4 is fixed horizontally on the XY stage 5. By driving the XY stage 5, a desired target position on the surface of the substrate 4 can be positioned below the nozzle 1.

  During the drawing operation, the tip 1a of the nozzle 1 and the surface of the substrate 4 face each other with a minute drawing distance G. When the pulse voltage VP is applied to the liquid material 2 injected into the nozzle 1 in this state, a conical tailor cone 2a is formed from the tip 1a of the nozzle 1 toward the substrate 4, and the surface of the substrate 4 is formed from the top of the tailor cone 2a. A jet flow (liquid column) 2b that reaches 1 is generated, and a part of the liquid material 2 moves onto the surface of the substrate 4 to form droplets 2c.

  FIG. 2 is a diagram illustrating a method of drawing a pattern of the liquid material 2 on the surface of the substrate 4 using a drawing apparatus. The drawing apparatus further includes a Z-axis stage 6 controlled by the control device 7. The nozzle 1 is fixed to the Z-axis stage 6. By driving the Z-axis stage 6, the nozzle 1 can be moved in the vertical direction, and the distance between the tip 1a of the nozzle 1 and the surface of the substrate 4 can be set to a desired distance. By driving the Z-axis stage 6, the distance between the tip 1 a of the nozzle 1 and the substrate 4 is adjusted to a drawing distance G that can be patterned.

  In this state, while applying the pulse voltage VP from the pulse voltage generator 3 to the liquid substance 2, the XY stage 5 is driven to move the nozzle 1 and the substrate 4 in the horizontal direction, thereby forming a pattern 2d having an arbitrary shape. Drawing can be performed on the surface of the substrate 4. Here, the XY stage 5 on which the substrate 4 is mounted is driven and relatively moved. However, the nozzle 1 may be moved in the XY directions. When the drawing is completed, the nozzle 1 is moved to a standby position that is largely separated upward from the substrate 4 by the Z-axis stage 6.

  When the drawing distance G between the tip 1a of the nozzle 1 and the surface of the substrate 4 is as small as several tens of μm, when the nozzle 1 is directly lowered from the standby position to the drawing position at a high speed, the Z-axis stage 6 is moved. It is also assumed that the tip 1a of the nozzle 1 collides with the substrate 4 due to overshoot exceeding the stop position or vibration of a member that fixes and supports the nozzle 1. In order to suppress overshoot and vibration, a method of slowing the descending speed of the Z-axis stage 6 or lengthening the deceleration time is conceivable, but it is not preferable because the descending (moving) time becomes longer and the tact time increases. . Therefore, there is a need for a method that prevents the tip 1a of the nozzle 1 from colliding with the substrate 4 and does not damage the tip 1a of the nozzle 1 even when the Z-axis stage 6 is lowered at high speed.

  Therefore, in the first embodiment, as shown in FIG. 3, the tip 1a of the nozzle 1 is placed on standby at the standby position during standby. In response to the drawing command, the control device 7 drives the Z-axis stage 6 to lower the nozzle 1, and the distance between the tip 1 a of the nozzle 1 and the surface of the substrate 4 adds the correction distance H to the drawing distance G. The tip 1a of the nozzle 1 is temporarily stopped at the correction position where the distance is (G + H) (first lowering). Next, the control device 7 drives the Z-axis stage 6 to lower the nozzle 1 by the correction distance H, and finally adjusts the interval between the tip 1a of the nozzle 1 and the surface of the substrate 4 to the drawing distance G (second). ).

  The correction distance H is set larger than the displacement caused by the overshoot of the Z-axis stage 6 or the vibration of the member that fixes the nozzle 1. The correction distance H is 1 mm or less, for example, about 100 μm. The second descending amount is set smaller than the first descending amount.

  When lowering the nozzle 1 by dividing the height of the nozzle 1 into two stages, the tip 1a of the nozzle 1 is temporarily stopped at the correction position in the first lowering. At this time, since the distance between the tip 1a of the nozzle 1 and the substrate 4 is set to a sufficiently large distance (G + H), even if the overshoot of the Z-axis stage 6 or the member that fixes the nozzle 1 vibrates, the nozzle The tip 1 a of 1 does not collide with the substrate 4.

  If the amount of the second descent is as small as 1 mm or less, the overshoot of the Z-axis stage 6 and the vibration of the member that fixes the nozzle 1 can be suppressed so as to be almost negligible. And the surface of the substrate 4 can be avoided. Therefore, even if the drawing distance G between the tip 1a of the nozzle 1 and the substrate 4 is set to several tens of μm, it is possible to prevent the nozzle 1 from being damaged.

  Further, if the correction distance H is set to a very small distance, the moving time is also short, so that the tact time is not affected much even if the nozzle 1 is lowered in two steps.

  FIG. 4 is a flowchart showing the operation of the drawing apparatus. When the drawing position and the drawing shape (drawing range) are designated in step S1, the control device 7 drives the XY stage 5 in step S2 so that the tip 1a of the nozzle 1 becomes the drawing start point (target position) of the substrate 4. Move to the upper standby position. Next, in step S3, the control device 7 drives the Z-axis stage 6 to lower the nozzle 1, and temporarily stops the tip 1a of the nozzle 1 at the correction position (first lowering).

  Next, in step S4, the control device 7 drives the Z-axis stage 6 to lower the nozzle 1, and stops the tip 1a of the nozzle 1 at the drawing position (second lowering). Next, in step S5, the control device 7 causes the pulse voltage generation device 3 to generate a pulse voltage to discharge the droplet 2c from the tip 1a of the nozzle 1 onto the surface of the substrate 4, and also drives the XY stage 5 to drive the nozzle 1. Is moved in the horizontal direction, and the pattern 2d of the liquid substance 2 is drawn in the range designated in step S1. When the drawing is finished, the control device 7 drives the Z-axis stage 6 in step S6, raises the nozzle 1, moves the tip 1a of the nozzle 1 to the standby position, and finishes a series of steps.

  In addition, a discarding process may be added between step S2 and step S3, and the liquid material 2 at the tip of the nozzle 1 may be refreshed by discharging a large amount of the liquid material 2 from the nozzle 1. The discarding of the liquid substance 2 is preferably performed not on the substrate 4 but on a discarding plate (not shown).

[Embodiment 2]
FIG. 5 is a perspective view showing a configuration of a drawing apparatus (pattern correction apparatus) 10 according to Embodiment 2 of the present invention. In FIG. 5, the drawing apparatus 10 includes a surface plate 11. A chuck 12 is provided at the center of the surface plate 11, and a substrate 13 is fixed to the chuck 12. A gantry-type XY stage 14 is mounted on the surface plate 11. The XY stage 14 includes an X-axis stage 14a and a gate-shaped Y-axis stage 14b. The Y-axis stage 14b is provided so as to straddle the chuck 12, and moves in the Y-axis direction in the drawing. The X-axis stage 14a is mounted on the Y-axis stage 14b and moves in the X direction in the figure.

  A Z-axis stage 15 that can move in the vertical direction is mounted on the X-axis stage 14a. An observation optical system 16 is fixed to the Z-axis stage 15. A laser 17 is mounted above the observation optical system 16, and an objective lens switching device 19 for switching the objective lens 18 is fixed below the laser 17. Further, a support unit 20 that fixes and supports the electrostatic suction type inkjet nozzle 1 shown in FIG. 1 is fixed to the objective lens switching unit 19. The laser 17 is used for removing and shaping a pattern already formed on the surface of the substrate 13, and is not mounted when laser processing is unnecessary.

  By controlling the X axis stage 14a, the Y axis stage 14b, and the Z axis stage 15, each of the observation optical system 16 and the support unit 20 can be moved above a desired position on the surface of the substrate 13.

  As shown in FIG. 6, the objective lens switching device 19 includes an XY stage movable plate 19a for moving a plurality of objective lenses 18 having different magnifications in the XY directions. By moving the movable plate 19a, the magnification of the objective lens 18 can be changed, and the support unit 20 can be moved in the XY directions. The support unit 20 may be directly fixed to the Z-axis stage 15.

  The support unit 20 is fixed to the lower surface of the movable plate 19a, and a fixed base 21 to which the nozzle 1 is fixed, a Z-axis stage 22 for moving the fixed base 21 up and down, a disc-shaped discarding plate 23, and a discarding plate An X-axis stage 24 for moving 23 in the horizontal direction is provided. The discarding plate 23 is supported by the X-axis stage 24 in a rotatable state. The Z-axis stage 22 can be moved up and down in conjunction with the movement of the X-axis stage 24 by a cam mechanism (not shown).

  In FIG. 6, a standby state is shown, and the tip 1 a of the nozzle 1 and the surface of the discarding plate 23 are opposed to each other with a minute distance, and the liquid material 2 can be discarded. FIG. 7 is a perspective view showing a state in which the discarding plate 23 is retracted so as to be detached from the lower side of the nozzle 1.

  When the X-axis stage 24 is moved in the direction of arrow A in FIG. 6, the discarding plate 23 is also moved in the A direction, and the discarding plate 23 is removed from directly below the nozzle 1, and the cam mechanism (not shown) causes Z to move. The axis stage 22 is lowered to the lower end. At this time, the fixed base 21 fixed to the Z-axis stage 22 is also lowered, and the tip 1 a of the nozzle 1 is positioned below the throwing plate 23.

  For example, when the discarding plate 23 is retracted in a state where the Z-axis stage 15 is positioned at a focal position where the surface of the substrate 13 can be observed by the observation optical system 16, the nozzle 1 is lowered and the tip 1a of the nozzle 1 is corrected. Placed in position. At the correction position, the distance between the tip 1a of the nozzle 1 and the surface of the substrate 4 is set to a predetermined distance (G + H).

  FIG. 8 is a flowchart showing the operation of the drawing apparatus 10 shown in FIG. The drawing apparatus 10 is provided with a control device (not shown) that controls the entire apparatus. The control device is constituted by a personal computer, for example. When the drawing position and drawing shape (drawing range) are designated in step S11, the control device drives the movable plate 19a of the XY stage 14 and the objective lens switching device 19 in step S12, and the tip 1a of the nozzle 1 is placed on the substrate 4. Is moved to a standby position above the drawing start point (target position).

  Next, the control device drives the Z-axis stage 15 in step S13, lowers the nozzle 1 and moves the tip 1a of the nozzle 1 to the discarding position, and in step S14, pulses the pulse voltage generator (not shown). A voltage VP is generated to cause the liquid material 2 to be discarded.

  Next, in step S <b> 15, the control device retracts the discarding plate 23 from below the nozzle 1. When the discarding plate 23 is retracted, the nozzle 1 is also lowered in conjunction with it, and the tip 1a of the nozzle 1 is moved to the correction position (corresponding to the first drop in FIG. 4). Next, in step S16, the control device drives the Z-axis stage 15, lowers the nozzle 1 by the correction distance H, and moves the tip 1a of the nozzle 1 to the drawing position (corresponding to the second lowering in FIG. 4). .

  Next, in step S17, the control device causes the pulse voltage generator to generate a pulse voltage to discharge the droplet 2c from the tip 1a of the nozzle 1 onto the surface of the substrate 13, and drives the XY stage 14 to move the nozzle 1 in the horizontal direction. The pattern 2d of the liquid substance 2 is drawn in the range designated in step S11. When the drawing is completed, the control device drives the Z-axis stage 15 in step S18, raises the nozzle 1, moves the tip 1a of the nozzle 1 to the standby position, and ends the series of steps.

  9 to 11 are views showing the configuration of the support unit 20. In particular, FIG. 9 is a front view of the support unit 20, FIG. 10 is a sectional view taken along the line XX of FIG. It is B arrow line view of FIG. 9 to 11 show a state in which the discarding plate 23 is opposed to the nozzle 1 for applying the liquid substance 2 with a gap therebetween so that the discarding operation is possible.

  12 to 14 show a state in which the throwing plate 23 is retracted sideways and the nozzle 1 is lowered so that the tip 1a of the nozzle 1 and the substrate 1 face each other with a gap W2 (drawing distance G). Show. In this state, the liquid substance 2 can be applied to the surface of the substrate 13. 12 is a front view of the support unit 20, FIG. 13 is a cross-sectional view taken along line XIII-XIII in FIG. 12, and FIG. 14 is a view taken in the direction of arrow C in FIG.

  First, the structure of the support unit 20 is demonstrated using FIGS. 9-11. The base plate 30 that supports the entire support unit 20 is provided vertically, the slide portion 31 a of the linear motion guide bearing 31 is fixed to the surface of the base plate 30, and the slide of the linear motion guide bearing 32 is fixed to the back surface of the base plate 30. The part 32a is fixed. The slide portion 31a of the linear motion guide bearing 31 is disposed vertically, and the slide portion 32a of the linear motion guide bearing 32 is disposed horizontally.

  A Z-axis stage 22 having an L-shaped cross section is fixed to the rail portion 31 b of the linear motion guide bearing 31. Therefore, the Z-axis stage 22 is supported by the linear motion guide bearing 31 so as to be able to advance and retract in the vertical direction with respect to the base plate 30. A roller 33 is fixed to the protruding end of the Z-axis stage 22, and a plurality of magnets 34 are embedded on one side surface thereof. The X-axis stage 24 is fixed to the rail portion 32 b of the linear motion guide bearing 32. Therefore, the X-axis stage 24 is supported by the linear motion guide bearing 32 so as to be able to advance and retreat in the horizontal direction with respect to the base plate 30.

  The nozzle 1 is held on a fixed base 21. A plurality of magnets 35 are embedded in one end surface of the fixed base 21. The fixed base 21 is attached to the Z-axis stage 22 by the attractive force of the magnet 34 and the magnet 35. Since the magnet 34 and the magnet 35 are arranged so as to be shifted from each other, when the fixing base 21 is mounted on the Z-axis stage 22, the fixing base 21 is attracted downward, and the end surface 21 a of the Z-axis stage 22 is fixed. It is pressed and positioned on the upper surface 22a.

  A motor 36 is fixed to the lower end of the X-axis stage 24, and the rotation shaft of the motor 36 is fixed to the center of the surface of the disc-shaped discarding plate 23. By rotating the discarding plate 23 by a predetermined angle by the motor 36, the discarding position of the liquid material 2 can be changed little by little. A throwing plate 23 is opposed to a certain gap W1 directly below the nozzle 1, and throwing is performed in this state. In order to prevent the discarded liquid material 2 from coming into contact with the tip 1a of the nozzle 1 and contaminating the tip 1a of the nozzle 1, the discarding plate 23 is rotated in advance by a predetermined angle before being discarded.

  The roller 33 fixed to the Z-axis stage 22 is in contact with the upper end portion of the X-axis stage 24. A copying surface (cam surface) having a horizontal portion 24 a and an inclined portion 24 b is formed at the upper end portion of the X-axis stage 24. Therefore, the vertical height position of the tip 1 a of the nozzle 1 is determined by the contact position between the roller 33 and the X-axis stage 24. By moving the X-axis stage 24 in the horizontal direction and changing the contact position between the roller 33 and the X-axis stage 24, it is possible to retreat the throwing plate 23 and lower the nozzle 1 simultaneously. A drive device 37 (for example, an air cylinder or a linear motion solenoid actuator) that moves the X-axis stage 24 is fixed to the base plate 30, and its output shaft is connected to the X-axis stage 24. The output shaft of the drive device 37 expands and contracts in the horizontal direction.

  When the nozzle 1 discards the liquid material 2 in the state of FIG. 9, the liquid material 2 adheres on the discard plate 23. After the disposal is completed, the rotation shaft of the motor 36 is rotated by a predetermined angle to rotate the disposal plate 23 by a predetermined angle to prepare for the next disposal. If the throwing plate 23 is always rotated at the same position without rotating the throwing plate 23, the discarded liquid material 2 droplets accumulate and come into contact with the tip 1 a of the nozzle 1 to contaminate the pattern 2 d around the drawing. There is a concern to do. However, the concern is eliminated by having the function of rotating the throwing plate 23. When the discarding is completed and the discarding plate 23 is rotated at a predetermined angle, the discarding plate 23 is retracted and the nozzle 1 is lowered by operating the driving device 37.

  Next, a process of lowering the Z-axis stage 22 as the X-axis stage 24 moves will be described. When the X-axis stage 24 moves horizontally by operating the drive device 37, the roller 33 and the horizontal portion 24a of the X-axis stage 24 are initially in contact with each other, so the Z-axis stage 22 does not descend and the X-axis stage Only 24 moves horizontally. This state continues from directly under the nozzle 1 until the throwing plate 23 comes off. Thereafter, when the roller 33 starts to come into contact with the inclined portion 24 b of the X-axis stage 24, the Z-axis stage 22 starts to descend by its own weight by the linear motion guide bearing 31, and the protruding portion of the Z-axis stage 22 is the upper part of the base plate 30. The descent stops when it touches. 12 to 14 show a state where the Z-axis stage 22 is lowered and stopped.

  With such a configuration, even one drive device 37 can be driven biaxially in the horizontal direction and the vertical direction, and the device can be simplified. Further, it is possible to retract the discarding plate 23 and lower the nozzle 1 in a short time.

[Embodiment 3]
If the thickness of the substrate 13 varies, or depending on the installation method of the substrate 13, it is assumed that the surface height of the substrate 13 varies, and if the variation is larger than the drawing distance G, the nozzle 1 is damaged. It is also possible to do. As a means for avoiding this, it is desirable to correct the amount of movement of the Z-axis stage 15 by measuring the height of the surface of the substrate 13 before drawing.

  FIG. 15 is a diagram showing a main part of a drawing apparatus according to Embodiment 3 of the present invention, and is a diagram contrasted with FIG. Referring to FIG. 15, this drawing apparatus is different from the drawing apparatus according to the second embodiment in that a distance sensor 40 that measures the height of the surface of the substrate 13 is provided on the lower surface of the movable plate 19 a of the objective lens switch 19. It is a point provided.

  The controller of this drawing apparatus measures the height of the surface of the substrate 13 from the reference position in advance using the distance sensor 40, and corrects the movement amount of the nozzle 1 based on the measurement result. For example, when the measured value of the height of the surface of the substrate 13 is higher than the standard value (the substrate 13 is thicker than the standard product), the amount of movement to be moved in the first lowering is reduced according to the measured value. On the contrary, when the measured value of the height of the surface of the substrate 13 is lower than the standard value (the substrate 13 is thinner than the standard product), the amount of movement to be moved in the first downward movement is increased according to the measured value. .

  FIG. 16 is a flowchart showing the operation of this drawing apparatus, and is a figure to be compared with FIG. Referring to FIG. 16, this drawing apparatus is different from the drawing apparatus according to the second embodiment in that step S11A is added between steps S11 and S12. The control device measures the height of the surface of the substrate 13 from the reference position in step S11A, and corrects the descending amount of the nozzle 1 in step S15 based on the measurement result. Since other configurations and operations are the same as those in the second embodiment, description thereof will not be repeated.

  In the third embodiment, even when the surface height of the substrate 13 varies, the distance between the tip 1a of the nozzle 1 and the surface of the substrate 13 at the time of drawing can be set to a predetermined distance G. Therefore, the collision between the tip 1a of the nozzle 1 and the surface of the substrate 13 can be avoided, and the pattern 2d of the liquid substance 2 can be accurately drawn on the surface of the substrate 13.

[Embodiment 4]
FIG. 17 is a perspective view showing a substrate 41 that is a correction target of the pattern correction apparatus according to the fourth embodiment of the present invention. The configuration of the pattern correction apparatus is the same as that of the drawing apparatus shown in the first to third embodiments.

  In FIG. 17, the substrate 41 includes an insulating substrate 42 such as a glass substrate. A conductive pattern (wiring) 43 is formed on the surface of the insulating substrate 42. It is assumed that the conductive pattern 43 has an open defect 43a. As the liquid substance 2, conductive ink (correction liquid) 44 is used. The open defect portion 43a is corrected by applying the conductive ink 44 to the range including the defect portion 43a and the normal conductive pattern 43 on both sides thereof, and then heating and baking the conductive ink 44 to the range including the defect portion 43a. This is done by forming a conductive correction layer.

  18A to 18E are cross-sectional views showing a process for correcting the defect portion 43a. 18A to 18E is a cross-sectional view taken along line XVIII-XVIII in FIG. First, as shown in FIG. 18A, the tip 1a of the nozzle 1 is placed at a standby position above the drawing start point (target position). The center point of the end of the normal conductive pattern 43 on one side (left side in the figure) of the open defect 43a is set as a drawing start point.

  Next, as shown in FIG. 18B, the first lowering is performed, and the tip 1a of the nozzle 1 is temporarily stopped at the correction position. At this time, the distance between the tip 1a of the nozzle 1 and the surface of the substrate 41 is set to the sum (G + H) of the drawing distance G and the correction distance H. Next, as shown in FIG. 18C, the second lowering is performed to lower the nozzle 1 by the correction distance H, and the tip 1a of the nozzle 1 is aligned with the drawing position. At this time, the interval between the tip 1 a of the nozzle 1 and the surface of the substrate 41 is set to the drawing distance G.

  In this state, as shown in FIG. 18D, the nozzle 1 and the substrate 41 are connected in the length direction of the conductive pattern 43 while applying the pulse voltage VP to the conductive ink 44 from a pulse voltage generator (not shown). The pattern of the conductive ink 44 is drawn. The pattern of the conductive ink 44 is from the end of the normal conductive pattern 43 on one side (left side in the figure) of the open defect part 43a to the other side (right side in the figure) of the open defect part 43a through the open defect part 43a. It is formed in a range reaching the end of the normal conductive pattern 43. When the film thickness of the pattern of the conductive ink 44 is thin, the pattern of the conductive ink 44 is laminated a plurality of times by drawing repeatedly. When the drawing is completed, the nozzle 1 is moved to a standby position far away from the substrate 41.

  Next, as shown in FIG. 18E, the conductive correction layer 44 </ b> A is formed by heating and baking the pattern of the conductive ink 44 using the heating device 45. Thereby, the defective part 43a is corrected and the conduction of the conductive pattern 43 is ensured.

  In this Embodiment 4, after adjusting the space | interval of the front-end | tip 1a of the nozzle 1 and the surface of the board | substrate 41 in two steps, the defect part 43a is corrected. Therefore, when the distance between the tip 1a of the nozzle 1 and the surface of the substrate 41 is adjusted to the drawing distance G, the tip 1a of the nozzle 1 can be prevented from coming into contact with the surface of the substrate 41, and the defect portion can be stabilized. 43a can be modified. Moreover, since damage to the tip 1a of the nozzle 1 can be avoided, the replacement frequency of the nozzle 1 can be reduced, and the maintenance load can be reduced. Similarly to the third embodiment, the distance sensor 40 may be used to measure the surface height of the substrate 41 in advance, and the movement amount of the nozzle 1 may be corrected based on the result.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  1 inkjet nozzle, 2 liquid material, 2a tailor cone, 2b jet flow, 2c droplet, 2d pattern, 3 pulse voltage generator, 4,13,41 substrate, 5,14 XY stage, 6,15,22 Z axis stage 7 control device, 10 drawing device, 11 surface plate, 12 chuck, 14 XY stage, 14a, 24 X axis stage, 14b Y axis stage, 16 observation optical system, 17 laser, 18 objective lens, 19 objective lens switcher, 19a Movable plate, 20 Support unit, 21 Fixed base, 21a End surface, 23 Discarding plate, 24a Horizontal portion, 24b Inclined portion, 30 Base plate, 31, 32 Linear motion guide bearing, 31a, 32a Slide portion, 31b, 32b Rail Part, 33 roller, 34, 35 magnet, 36 motor, 37 drive device, 40 Distance sensor, 42 Insulating substrate, 43 Conductive pattern, 43a Open defect, 44 Conductive ink, 44A Correction layer, 45 Heating device.

Claims (9)

A drawing apparatus for drawing a pattern by discharging a liquid substance on the surface of a substrate,
An electrostatic suction type nozzle in which a tip is arranged to face the surface of the substrate and the liquid substance is injected;
A first positioning means for holding the substrate horizontally and relatively moving the substrate and the nozzle in a horizontal direction;
Second positioning means for moving the nozzle in the vertical direction;
Pulse voltage generating means for applying a pulse voltage to the liquid material and discharging the liquid material from the tip of the nozzle;
The first and second positioning means and the pulse voltage generating means are controlled, the tip of the nozzle is arranged at a standby position above the surface of the substrate during standby, and the nozzle is lowered during drawing. A control means for disposing the tip of the nozzle at a drawing position above the drawing start point and discharging the liquid substance from the tip of the nozzle;
The drawing device, wherein the control means stops the nozzle at least once while moving the tip of the nozzle from the standby position to the drawing position.   The control means lowers the tip of the nozzle from the standby position, temporarily stops the tip of the nozzle at a correction position between the standby position and the drawing position, and then moves the tip of the nozzle from the correction position. The drawing apparatus according to claim 1, wherein the drawing apparatus is lowered to the drawing position.   The drawing apparatus according to claim 2, wherein a distance between the standby position and the correction position is larger than a distance between the correction position and the drawing position.   The distance between the correction position and the drawing position is set to be larger than an overshoot amount of the second positioning means or a vertical vibration width of the nozzle. Drawing device.   The drawing apparatus according to claim 2, wherein a distance between the correction position and the drawing position is set to 1 mm or less. The second positioning means includes
A discarding member for receiving the liquid substance discarded by the nozzle;
Drive means for inserting and removing the discarding member between the tip of the nozzle and the substrate;
The nozzle is provided between the nozzle and the discarding member, and the nozzle is raised as the discarding member is inserted between the tip of the nozzle and the substrate, and the discarding from between the nozzle and the substrate is performed. A scanning mechanism that lowers the nozzle as the member is removed;
The control means controls the driving means, and during the discarding operation, the discarding member is inserted between the tip of the nozzle and the substrate, and the liquid material is discharged from the nozzle, and the discarding operation is performed. After the end, the discard member is extracted from between the nozzle and the substrate,
6. The drawing apparatus according to claim 2, wherein when the discarding member is extracted from between the nozzle and the substrate, the tip of the nozzle is disposed at the correction position. 7. Furthermore, a measuring means for measuring the height of the surface of the substrate is provided,
The drawing apparatus according to claim 1, wherein the control unit corrects a distance between the tip of the nozzle and the surface of the substrate based on a measurement result of the measurement unit.   The said control means draws the pattern of the said liquid substance on the surface of the said board | substrate by relatively moving the said nozzle and the said board | substrate horizontally while discharging the said liquid substance from the front-end | tip of the said nozzle. Item 8. The drawing device according to any one of Items 7 to 7. A pattern correction apparatus for correcting defects in a pattern formed on a surface of a substrate,
An electrostatic suction nozzle in which a tip is arranged to face the surface of the substrate and a correction liquid is injected;
A first positioning means for holding the substrate horizontally and relatively moving the substrate and the nozzle in a horizontal direction;
Second positioning means for moving the nozzle in the vertical direction;
Pulse voltage generating means for applying a pulse voltage to the correction liquid and discharging the correction liquid from the tip of the nozzle;
The first and second positioning means and the pulse voltage generating means are controlled, and the tip of the nozzle is arranged at a standby position above the substrate during standby, and the nozzle is lowered during correction to correct the defect. A control means for disposing the tip of the nozzle at a drawing position above and discharging the correction liquid from the tip of the nozzle,
The pattern correction apparatus, wherein the control unit stops the nozzle at least once while moving the tip of the nozzle from the standby position to the drawing position.

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