JP2013115174A - Manufacturing method of wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board capable of enhancing the reliability and quality of a product by reducing complication and delay during the lamination work of a thin copper foil and a prepreg, and preventing displacement or creasing of the copper foil.SOLUTION: In the method of manufacturing a thin wiring board by laminating a copper foil 3 and a prepreg 4 on a support substrate 1 having a predetermined rigidity, an adhesive layer 2 of frame shape is provided at the peripheral edge on the surface of the support substrate 1, the peripheral edge of the copper foil 3 having a thickness of 18 μm or less is stuck to the adhesive layer 2 removably, a prepreg 4 having a thickness of 100 μm or less and a copper foil 5 for lamination are laminated sequentially on the copper foil 3 and pressed, a predetermined wiring pattern is formed on the copper foil 5 for lamination thus forming a laminate 6, and after separating the laminate 6 from the support substrate 1, a predetermined electrode pattern is formed on the copper foil 3 forming the laminate 6.

Description

  The present invention relates to a method of manufacturing a wiring board used for a semiconductor package, a switch, a mobile phone, a portable information terminal and the like.

  Conventionally, when manufacturing and shipping wiring boards, after determining the performance and specifications as electronic equipment in the pattern design process, prepare the required number of copper foils and prepregs (not shown), and create these as artwork processes and inner layers Processed into a wiring board in the process, multilayer lamination process, hole processing process, plating process, outer layer pattern creation process, solder resist formation process, surface treatment / outline processing process, and this wiring board was inspected and shipped in the finished product inspection process (See Patent Documents 1, 2, 3, 4, and 5).

  There are various types of copper foil and prepreg, but when the wiring board is required to be light and thin, a copper foil with a thickness of 18 μm or less is used, and a prepreg with a thickness of 100 μm or less is selected. The

JP 2004-235323 A JP 2007-324161 A JP 2000-068648 A Japanese Patent Laid-Open No. 09-153661 Japanese Patent Application Laid-Open No. 07-224252

  Conventional wiring boards are manufactured as described above, and when thinning is required, very thin and flexible copper foil is used, so when laminating difficult copper foil and prepreg, especially the first one When laminating the copper foil and the prepreg of the eye, the laminating work may be complicated and delayed. Further, the copper foil may be displaced or wrinkled, and the reliability and quality of the product may not be improved.

  The present invention has been made in view of the above, and causes less complication and delay during the operation of laminating a thin copper foil and a prepreg, preventing the occurrence of misalignment and wrinkles of the copper foil, It is an object of the present invention to provide a method for manufacturing a wiring board capable of improving quality.

In the present invention, in order to solve the above problems, a wiring board is produced by laminating a copper foil and a prepreg on a support base material,
A frame-shaped adhesive layer is provided on a substantially peripheral portion of at least one of the front and back surfaces of the support substrate, and a substantially peripheral portion of a copper foil having a thickness of 18 μm or less is detachably adhered to the adhesive layer. A prepreg having a thickness of 100 μm or less and a copper foil for laminating are sequentially laminated and pressed, and a predetermined conductor pattern is formed on the copper foil for laminating to form a laminated body. After separating the above, a predetermined conductor pattern is formed on the copper foil forming the laminate.

In addition, the laminated body can be multilayered by repeatedly laminating and pressing a laminated copper foil on the laminated body through a prepreg and forming a predetermined conductor pattern on the laminated copper foil.
Moreover, the laminated body is separated from the support substrate by cutting the peripheral part of the laminated body along the inner peripheral part of the adhesive layer and removing the peripheral part of the laminated body together with the adhesive layer, and then forming the laminated body A predetermined conductor pattern can be formed on the copper foil to be etched by an etching method.

  Here, the substantially peripheral edge portion of the support base material in the claims includes the peripheral edge portion of the support base material and the vicinity thereof. Moreover, copper foil adheres to the front and back of a support base material, the surface of a support base material, or the back surface of a support base material. The substantially peripheral edge portion on one side of the copper foil includes the peripheral edge portion on the one side of the copper foil and the vicinity thereof. The copper foil and the copper foil for lamination can be patterned as necessary, or a part or all of them can be removed. Further, a via for connection is formed between the layers of the laminate, and the via can be plated.

  According to the present invention, a thin copper foil having a thickness of 18 μm or less is integrally adhered to the support base material by an adhesive layer, and rigidity is secured. Therefore, when laminating copper foil and prepreg which are difficult to handle, especially one sheet When laminating the copper foil and the prepreg of the eye, the work is less likely to be complicated and delayed.

  According to the present invention, there is little inconvenience and delay during the operation of laminating a thin copper foil and a prepreg, and the reliability and quality of the product are improved by preventing the displacement of the copper foil and the occurrence of wrinkles. There is an effect that can be.

According to the second aspect of the present invention, since the multilayer body is multi-layered to cope with an increase in the amount of wiring, it is possible to cope with high performance and miniaturization of the LSI, an increase in the number of component leads, and the like.
Furthermore, according to the invention described in claim 3, when the adhesive layer is deteriorated so as to hinder the removal of the laminate from the support substrate, or when it is desired to remove the laminate regardless of the adhesiveness of the adhesive layer, The body can be removed reliably.

It is a perspective explanatory view showing typically an embodiment of a manufacturing method of a wiring board concerning the present invention. It is a perspective explanatory view showing typically the state where the peripheral part of copper foil is stuck to the adhesion layer of the support substrate in the embodiment of the manufacturing method of the wiring board concerning the present invention. Partial cross-sectional explanatory drawing schematically showing a state in which a multilayer laminate is formed by sequentially laminating and pressing a prepreg and a laminating copper foil on the exposed surface of the copper foil in an embodiment of the method for producing a wiring board according to the present invention. It is. It is a partial section explanatory view showing typically the state where the copper foil of the layered product in the embodiment of the manufacturing method of the wiring board concerning the present invention was patterned into the predetermined electrode pattern. It is a fragmentary sectional view showing typically the state where it punches and removes the peripheral part of the layered product in the embodiment of the manufacturing method of the wiring board concerning the present invention.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 5, a method of manufacturing a wiring board according to the present embodiment includes a copper foil 3 on a support base 1 having a predetermined rigidity. Is detachably adhered through the adhesive layer 2, the prepreg 4 and the laminated copper foil 5 are laminated and pressed on the copper foil 3, and a predetermined wiring pattern is formed on the laminated copper foil 5 and laminated. After forming the body 6 and separating the support substrate 1 and the laminated body 6, a predetermined electrode pattern 9 is formed on the copper foil 3 of the laminated body 6.

  As shown in FIG. 1 and FIG. 2, the support base material 1 is formed into a flat plate larger than the copper foil 3, the prepreg 4 and the laminated copper foil 5 using a predetermined material, and is weakly adhered to a flat surface. The adhesive layer 2 for the copper foil 3 having the properties is laminated. Although this support base material 1 is not specifically limited, for example, a metal sheet made of copper, 42 alloy or the like, aluminum, stainless steel, nickel, glass epoxy (glass epoxy) or the like is used, and rigidity, handling property, and handling property are used. From the viewpoint of ensuring the above, etc., it is formed to a thickness of 25 μm to 1 mm.

  The adhesive layer 2 is made of a silicone-based, fluorine-based, epoxy-based, or urethane-based adhesive having a thickness of 1 to 50 μm, preferably about 20 μm. As shown in FIG. 2 and FIG. And is adhered to the periphery of the surface of the support substrate 1 or the vicinity thereof. The material of the adhesive layer 2 is not particularly limited, but prevents unnecessary gas from being generated and diffused when the copper foil 3, the prepreg 4 and the laminated copper foil 5 are pressed, and has excellent adhesiveness. In order to obtain, and peelability, it is preferable to employ a thermosetting pressure sensitive adhesive, that is, a silicone pressure sensitive adhesive.

  The adhesive layer 2 may be formed by arranging and adhering a plurality of adhesives in a frame shape, or may be formed in a frame shape and adhered in advance. Alternatively, the adhesive may be applied to the frame shape by a screen printing method or a method using a dispenser, and the applied adhesive may be cured.

  The copper foil 3 and the laminated copper foil 5 are of a type in which at least the thickness of the copper foil 3 is 18 μm or less, preferably 12 μm or less, for example 9 μm, in order to contribute to thinning of the wiring board. The contact surfaces that come into contact with the copper foil 3 and the prepreg 4 of the laminated copper foil 5 are each roughened from the viewpoint of improving the strength. The copper foil 3 and the laminated copper foil 5 function to improve reliability in the case of solder connection.

  As shown in FIGS. 1 and 3, the prepreg 4 is an adhesive sheet in which a glass cloth as a reinforcing material is impregnated with a thermosetting resin so as to be in a semi-cured B state. A type having a thickness of 100 μm or less, for example, a thickness of about 30 μm is used. The prepreg 4 is heated and pressed together with the copper foil 3 and the copper foil 5 for lamination to become a copper-clad laminate.

  In the above, when manufacturing a thin wiring board, first, the support base material 1 and the copper foil 3 are prepared, and one side of the copper foil 3 is opposed to the surface of the support base material 1 (see FIG. 2). The opposing one-side peripheral part of the copper foil 3 is detachably adhered to the adhesive layer 2 having adhesiveness on the surface of the substrate. Since the copper foil 3 is adhered to the support base material 1 to integrate them, the copper foil 3 does not flutter, and the copper foil 3 can be easily handled regardless of the thickness.

  When the copper foil 3 is adhered to the support substrate 1, the prepreg 4 and the laminated copper foil 5 are sequentially laminated on the exposed surface of the copper foil 3 (see FIG. 1) and pressed, and the laminated copper foil 5 is pressed. A laminate 6 is formed by patterning a predetermined wiring pattern. The predetermined wiring pattern is formed, for example, by forming an etching resist, patterning the resist, and etching away unnecessary portions of the laminated copper foil 5.

  When the multilayer body 6 is required to have multiple layers (for example, three layers, five layers, etc.), the copper foil 5 for lamination is newly added to the surface of the copper foil 5 for lamination forming the multilayer body 6 via the prepreg 4. Lamination press is performed, and a process of patterning a predetermined wiring pattern on the new copper foil 5 for lamination is repeatedly performed as many times as necessary, so that the laminate 6 is multilayered (see FIG. 3). When the multilayer body 6 is multi-layered, the strength of the multilayer body 6 is gradually increased. Therefore, unlike the case of the first copper foil 3, there is little trouble in the adhesion and lamination of the copper foil 5 for lamination. The stacked body 6 may be formed with a plurality of vias that electrically connect the layers, and each via may be plated.

  Next, the laminate 6 is gradually peeled off from the adhesive layer 2 of the support substrate 1, and the exposed back surface of the laminate 6, ie, the copper foil 3 forming the laminate 6 is patterned into a predetermined electrode pattern 9 (see FIG. 4), a thin wiring board can be manufactured. In this case, since the support base material 1 and its adhesive layer 2 are not damaged at all, they can be used again, and the number of parts and cost can be greatly reduced. The predetermined wiring pattern is appropriately formed by various etching methods.

  When the properties of the pressure-sensitive adhesive layer 2 are deteriorated to hinder the peeling of the laminated body 6 or when it is desired to reliably separate the laminated body 6 regardless of the adhesiveness of the pressure-sensitive adhesive layer 2, as shown in FIG. 6 is punched into a frame shape with a punching blade 7 along the inner peripheral surface of the adhesive layer 2, the unnecessary peripheral edge 8 of the laminate 6 is removed together with the adhesive layer 2, and then the unnecessary peripheral edge 8 is removed. If the copper foil 3 of the body 6 is etched and patterned into a predetermined electrode pattern 9, a thin wiring board can be manufactured.

  When punching with the punching blade 7, adjustment may be made so that the peripheral edge portion of the support substrate 1 is not punched. Moreover, you may punch and remove together the peripheral part of the support base material 1 as needed.

  According to the above manufacturing method, the copper foil 3 is adhered to the support base material 1 with the adhesive layer 2 to ensure rigidity. Therefore, when the thin copper foil 3 and the prepreg 4 which are difficult to handle are laminated, When the copper foil 3 and the prepreg 4 are laminated, the laminating work is not complicated or delayed. In addition, since the copper foil 3 is adhered to effectively prevent the positional deviation and wrinkles, the occurrence of wiring unevenness can be suppressed, and the reliability and quality of the product can be greatly improved.

  Further, the laminated body 6 is not peeled off from the entire surface of the support base material 1 in a bow shape, but an unnecessary peripheral edge 8 of the laminated body 6 is removed together with the adhesive layer 2 to remove the laminated body 6 from the support base material 1. Since it can also remove, there is no possibility that the laminated body 6 will be damaged by curvature, and it can remove safely. Moreover, since the adhesive layer 2 of the support base material 1 adheres not only to the entire surface of one side of the copper foil 3 but only to the peripheral edge of one side, the adhesive region is limited to a narrow range. The work of patterning 3 into a predetermined electrode pattern 9 is not hindered.

  Furthermore, since the support base material 1 is formed with a thickness in the range of 25 μm to 1 mm, it is possible to ensure excellent rigidity or to improve handling and simplify handling.

  In the above embodiment, the copper foil 3 is adhered to the surface of the support base material 1 with the adhesive layer 2, but the copper foil 3 is detachably adhered to the front and back surfaces of the support base material 1 with the adhesive layer 2, respectively. The laminated body 6 may be formed. Moreover, in the said embodiment, although the copper foil 3 which forms the laminated body 6 was patterned to the electrode pattern 9, you may pattern the copper foil 3 to a wiring pattern. Furthermore, the wiring pattern of the wiring board and the electrode pattern 9 may be subjected to corrosion resistance plating, and the electrode pattern 9 may be formed with solder bumps or the like.

  The method for manufacturing a wiring board according to the present invention can be used in the field of manufacturing interposers, coreless buildup substrates, semiconductor packages, printed wiring boards, and the like.

DESCRIPTION OF SYMBOLS 1 Support base material 2 Adhesive layer 3 Copper foil 4 Prepreg 5 Copper foil 6 for lamination | stacking Laminated body 8 Peripheral part 9 of a laminated body Electrode pattern (conductor pattern)

Claims (3)

A wiring board manufacturing method for manufacturing a wiring board by laminating a copper foil and a prepreg on a support substrate,
A frame-shaped adhesive layer is provided on a substantially peripheral portion of at least one of the front and back surfaces of the support substrate, and a substantially peripheral portion of a copper foil having a thickness of 18 μm or less is detachably adhered to the adhesive layer. A prepreg having a thickness of 100 μm or less and a copper foil for laminating are sequentially laminated and pressed, and a predetermined conductor pattern is formed on the copper foil for laminating to form a laminated body. A method for manufacturing a wiring board, comprising: forming a predetermined conductor pattern on a copper foil forming a laminated body after separating the substrate.   2. The wiring board according to claim 1, wherein the laminated body is multilayered by pressing a laminated copper foil on the laminated body through a prepreg and repeating a process of forming a predetermined conductor pattern on the laminated copper foil. Production method.   Copper that forms the laminate by separating the laminate from the support substrate by cutting the periphery of the laminate along the inner periphery of the adhesive layer and removing the periphery of the laminate together with the adhesive layer The method for manufacturing a wiring board according to claim 1, wherein a predetermined conductor pattern is formed on the foil by an etching method.

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