JP2013105779A - Adhesion tray for manipulator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesion tray for a manipulator capable of pressure-welding the manipulator to an adhesive layer to sufficiently bury its tip part, appropriately and closely adhering an electronic component to the adhesive layer, and preventing poor pickup of the electronic component.SOLUTION: In an adhesion tray 1 constituted by laminating an adhesive adhesion film 5 on a tray 1, attachably/detachably adhering and holding a plurality of electronic devices 22 to be picked and placed with a pair of holding claws 21 of a manipulator 20 on the surface 6 of the adhesion film 5, an elastic cushion layer 10 having thickness of 200 μm-1 mm is interposed and adhered between the surface of a tray body 3 of the tray 1 and the rear surface of the adhesion film 5, its hardness is made into 70Hs or less by Shore hardness, a vacuum avoidance hole 4 is pierced in the thickness direction of the tray 1, air permeability is given to the cushion layer 10 to introduce the air from the vacuum avoidance hole 4 of the tray 1 to an interface 11 between the adhesion film 5 and the cushion layer 10.

Description

  The present invention relates to an adhesive tray for a manipulator that holds and holds electronic components such as semiconductor devices.

Although the conventional adhesive tray is not shown, it has a flat rectangular tray having rigidity, and an adhesive adhesive film is bonded to the surface of the tray, and the surface of this adhesive film is picked and placed by a manipulator. The electronic device is detachably adhered and held (see Patent Documents 1, 2, 3, 4, 5, and 6).
The pressure-sensitive adhesive film is formed to a thickness of about 50 to 200 μm using a predetermined resin film, and is given flexibility. The manipulator is provided with a pair of holding claws that can be opened and closed at the tip thereof, and an electronic device is sandwiched between the pair of holding claws.

  In the above configuration, when the electronic device is held on the adhesive tray, the electronic device is held between the pair of holding claws of the manipulator, and the pair of holding claws are brought into contact with the adhesive film of the adhesive tray. The electronic device can be adhered and held. At this time, in order to closely adhere the electronic device to the surface of the adhesive film, a pair of holding claws are pressed into contact with the adhesive film (in contact with pressure), and the tip of each holding nail is buried somewhat in the adhesive film. Is required.

  When picking up and removing an electronic device from the adhesive tray, hold the electronic device between the pair of holding claws of the manipulator and pull up the manipulator to peel off and remove the electronic device adhered to the surface of the adhesive film. Can do.

JP 2009-231338 A JP 2008-311377 A JP 2008-91696 A JP 2007-281503 A JP 2007-273546 A Japanese Patent Laid-Open No. 2002-64135

  The conventional adhesive tray is configured as described above, and since the adhesive film is about 50 to 200 μm in thickness, when the pair of holding claws of the manipulator are pressed against the adhesive film, the tip of each holding claw is placed on the surface of the tray. It collides and the tip of the holding claw cannot be fully buried. Therefore, there is a problem that the electronic device cannot be properly pressed and brought into close contact with the surface of the adhesive film, resulting in a pickup failure of the electronic device.

  The present invention has been made in view of the above, and a manipulator is press-contacted to the adhesive layer to fully embed the tip portion thereof, and the electronic component is properly adhered to the adhesive layer, or pickup failure of the electronic component is prevented. An object of the present invention is to provide an adhesive tray for a manipulator.

In the present invention, in order to solve the above problems, an adhesive adhesive layer is laminated on a tray, and an electronic component picked and placed by a manipulator is detachably adhered and held on an exposed surface of the adhesive layer. ,
An elastic buffer layer having a thickness of 200 μm to 1 mm is interposed between the tray and the adhesive layer, and the hardness of this buffer layer is set to 70 Hs or less in Shore A hardness.
It should be noted that a negative pressure avoidance hole is drilled in the thickness direction of the tray, and air permeability is imparted to the buffer layer so that gas from the negative pressure avoidance hole of the tray can be introduced into at least the interface between the adhesive layer and the buffer layer. Can do.

Moreover, the distribution part which distribute | circulates the gas from the negative pressure avoidance hole of a tray to the interface of an adhesion layer and a buffer layer can be formed in a buffer layer.
In addition, the flow section includes a flow groove formed on the back surface of the buffer layer and communicating with the negative pressure avoidance hole of the tray, and a flow hole provided in the thickness direction of the buffer layer and communicating with the negative pressure avoidance hole and the flow groove. Can also be included.
Further, the buffer layer can be formed of either urethane rubber or a sponge material having bubbles.

  Here, the tray, the adhesive layer, and the buffer layer in the claims can be formed into a planar rectangle, a polygon, a circle, an ellipse, or the like, if necessary. The negative pressure avoidance hole of the tray is not particularly limited. Moreover, the opposing surface which opposes the buffer layer of a tray can be formed in an unevenness | corrugation from a viewpoint of distribute | circulating the gas from a negative pressure avoidance hole. Similarly, the opposing surface of the buffer layer facing the tray can also be formed uneven so that gas flows.

  The facing surface of the adhesive layer that faces the buffer layer can be formed with irregularities from the viewpoint of gas flow from the negative pressure avoidance hole. Similarly, the opposing surface of the buffer layer that faces the adhesive layer can also be formed with irregularities for gas flow. It is preferable that at least a part of the peripheral portion or the like is adhered (including adhesive) to the opposing surface of the adhesive layer and the buffer layer.

  According to the present invention, when an electronic component is held on the manipulator adhesive tray, the electronic component is held on the exposed surface of the adhesive layer by holding the electronic component on the manipulator and bringing the manipulator into strong contact with the adhesive layer of the tray. Let it stick. At this time, since a thick buffer layer is positioned in the thickness direction of the adhesive layer to ensure a burial allowance necessary for burying the manipulator, the manipulator can be brought into strong contact with the adhesive layer to fully bury its tip. .

  According to the present invention, the manipulator can be press-contacted to the adhesive layer to fully embed the tip thereof, and this sufficient embedment can properly attach the electronic component to the adhesive layer or cause poor pickup of the electronic component. There is an effect that it can be prevented.

In addition, according to the second aspect of the present invention, since the generation of a vacuum state can be prevented by the negative pressure avoidance hole of the tray, at least the adhesive layer can be appropriately deformed and restored, thereby hindering peeling of electronic components and the like. Can be prevented.
Further, according to the invention of claim 3, since the gas flowing into the negative pressure avoidance hole of the tray can be reliably guided to the interface between the adhesive layer and the buffer layer by the flow part, the adhesive layer is deformed, The deformed adhesive layer can be restored to its original state.

  Further, according to the invention of claim 4, since the buffer layer is formed of urethane rubber, the tip of the manipulator is stuck in the buffer layer, which may hinder the separation of the tip of the manipulator from the adhesive layer. It is possible to prevent the buffer layer from being damaged. Furthermore, if the buffer layer is formed of a sponge material, the gas can be circulated through at least most of the buffer layer, so that the configuration can be simplified by omitting the circulator.

It is a whole perspective view showing typically an embodiment of an adhesive tray for manipulators concerning the present invention. It is a section explanatory view showing typically an embodiment of an adhesive tray for manipulators concerning the present invention. It is a section explanatory view showing typically the state where the holding claw of the manipulator was press-contacted to the adhesive film in the embodiment of the adhesive tray for manipulators concerning the present invention. It is a section explanatory view showing typically a 2nd embodiment of the adhesion tray for manipulators concerning the present invention.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 3, the adhesive tray for a manipulator in the present embodiment has an adhesive film 5 laminated on the tray 1 and a manipulator 20. An adhesive tray that sticks and holds an electronic device 22 picked and placed by a pair of holding claws 21. An elastic cushion layer 10 is interposed between the tray 1 and the adhesive film 5, and the cushion layer 10 has air permeability. The air from the vacuum avoidance hole 4 of the tray 1 is introduced to the interface 11 between the adhesive film 5 and the cushion layer 10.

  As shown in FIGS. 1 to 3, the tray 1 includes a frame frame 2 having a flat frame shape that can be gripped, and a flat planar rectangular tray body 3 is integrally formed on the inner peripheral surface of the frame frame 2. The cushion layer 10 and the adhesive film 5 are sequentially laminated on the surface excluding the peripheral edge of the tray body 3.

  The tray 1 is formed of a predetermined material, for example, aluminum, stainless steel, nickel, glass epoxy, glass substrate, and the like, and air that is gas (see the arrows in FIGS. 2 and 3) in the thickness direction of the center of the tray body 3. A vacuum avoidance hole 4 that circulates from below to above is perforated, and the vacuum avoidance hole 4 functions to prevent a vacuum from being generated when the electronic device 22 is picked up.

  The pressure-sensitive adhesive film 5 is formed into a flat rectangular shape by, for example, a polypropylene-based elastomer or a polyolefin-based elastomer, has a thickness of approximately 50 to 200 μm, has adhesiveness, and a plurality of adhesive films 5 are exposed on the exposed weakly-adhesive surface 6. The electronic device 22 is detachably adhered. The material of the pressure-sensitive adhesive film 5 is not particularly limited as long as it is in good contact with the electronic device 22, but it is preferable to select an inexpensive and flexible polypropylene-based elastomer having excellent heat resistance, chemical resistance, and the like. . The back surface of the pressure-sensitive adhesive film 5 may be flat, but as shown in FIGS. 2 and 3, from the viewpoint of improving the degree of adhesion with the cushion layer 10 and the like, the central portion may be slightly thin and the peripheral portion may be slightly thick. .

  As shown in FIGS. 2 and 3, the cushion layer 10 is formed into a planar rectangle having a size substantially the same as that of the adhesive film 5 by using a predetermined elastic material, and is adhered to the surface of the tray main body 3 and is adhesive. A circulation portion 12 is formed that is adhered to the back surface of the film 5 and distributes air from the vacuum avoidance hole 4 of the tray body 3 to the interface 11 between the adhesive film 5 and the cushion layer 10.

  Examples of the predetermined elastic material forming the cushion layer 10 include, but are not limited to, urethane rubber, silicone rubber, foamed sponge material, foam material, and the like. However, in order to avoid the situation where the holding claws 21 of the manipulator 20 are pierced, it is desirable to employ urethane rubber having excellent piercing resistance.

  The thickness of the cushion layer 10 is adjusted to a thickness in which the tip end portion of the holding claw 21 is appropriately buried, specifically, in a range of 200 μm to 1 mm. This is because when the thickness of the cushion layer 10 is less than 200 μm, the electronic device 22 cannot be sufficiently suppressed, and conversely, when the thickness of the cushion layer 10 exceeds 1 mm, the remarkable effect is increased. This is because the mounting area of the electronic device 22 may be reduced.

  The hardness of the cushion layer 10 is set to 70 Hs or less in Shore A hardness. This is because, when the Shore A hardness of the cushion layer 10 exceeds 70 Hs, the holding claws 21 of the manipulator 20 are not properly buried and the electronic device 22 may not be provided with a sufficient pressing force. based on.

  The surface of the cushion layer 10 is bonded to at least a part of the back surface of the pressure-sensitive adhesive film 5, but may not be in close contact with the back surface of the pressure-sensitive adhesive film 5 without a gap. For example, the front surface peripheral part of the cushion layer 10 is slightly thinned and bonded to the back surface peripheral part of the adhesive film 5, and the front surface central part of the cushion layer 10 is opposed to the back surface central part of the adhesive film 5 through a slight gap. It may be a simple contact relationship. In bonding the cushion layer 10, various adhesives, pressure-sensitive adhesives, pressure-sensitive adhesive sheets, and the like are appropriately used.

  For example, the circulation portion 12 is cut out on the back surface of the cushion layer 10 to communicate with the required number of circulation grooves 13 communicating with the vacuum avoidance holes 4 of the tray body 3, and the circulation grooves 13 are perforated in the thickness direction of the cushion layer 10. And a plurality of flow holes 14 communicating with each other. The flow grooves 13 are formed so as to extend radially outward from the center of the back surface of the cushion layer 10, for example.

  In the above configuration, when the electronic device 22 is held on the manipulator adhesive tray, the electronic device 22 is held between the pair of holding claws 21 of the manipulator 20 and the pair of holding claws 21 are pressed against the adhesive film 5 of the tray 1. Thus, the electronic device 22 can be adhered and held on the surface 6 of the adhesive film 5.

  At this time, since the thick cushion layer 10 is located immediately below the thin adhesive film 5 to secure the burial allowance of the holding claws 21, each of the holding films 21 is pressed against the surface of the tray 1 even if the pair of holding claws 21 are pressed against the adhesive film 5. The front end portions of the holding claws 21 do not stop when colliding with each other, and the front end portions of the respective holding claws 21 can be sufficiently buried (see FIG. 3). Therefore, the electronic device 22 can be appropriately pressed and brought into close contact with the surface 6 of the adhesive film 5, effectively preventing pickup failure of the electronic device 22 and improving productivity.

  When picking up and removing the electronic device 22 from the adhesive tray 1, the pair of holding claws 21 of the manipulator 20 are pressed against the adhesive film 5, and the adhesive electronic device 22 is held between the pair of holding claws 21. If the manipulator 20 is pulled up, the electronic device 22 adhered to the surface 6 of the adhesive film 5 can be peeled off and removed.

  At this time, air flows into the vacuum avoidance hole 4 of the tray 1 and sequentially passes through the flow groove 13 and the flow hole 14 of the flow part 12 and is introduced into the interface 11 between the adhesive film 5 and the cushion layer 10. Generation of a vacuum state can be prevented. Therefore, at least the pressure-sensitive adhesive film 5 is appropriately deformed and restored, and there is no hindrance to peeling of the electronic device 22.

  Next, FIG. 4 shows a second embodiment of the present invention. In this case, the cushion layer 10 is not made of urethane rubber, but is formed of a flexible sponge material in which bubbles are continuous. The air is circulated to introduce the air into the interface 11 between the adhesive film 5 and the cushion layer 10 or the like. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.

  Also in this embodiment, the same effect as the above-mentioned embodiment can be expected, and since the cushion layer 10 is formed of a sponge material having air permeability, it is not necessary to dare to form the circulation part 12. Therefore, it is obvious that the configuration can be simplified by omitting the flow grooves 13 and the flow holes 14.

  In the above embodiment, the tray 1 is shown in which the tray main body 3 is installed on the inner peripheral surface of the frame frame 2. However, the tray 1 is formed in a cross-sectional dish shape, and the cushion layer 10 and the adhesive film 5 are formed therein. You may store by laminating. In this case, a necessary number of outflow grooves may be cut out on the inner peripheral surface of the tray 1 or the peripheral surface of the cushion layer 10, and the outflow grooves may be communicated with the flow grooves 13 and the flow holes 14 of the flow portion 12.

  Moreover, the flow hole 14 of the flow part 12 may be single. In the above embodiment, the pair of holding claws 21 of the manipulator 20 is shown, but the present invention is not limited to this. For example, the holding claws 21 may be a plurality of three or four, or each holding claw 21 may have a tapered shape, a pin, or the like.

  The adhesive tray for manipulators according to the present invention can be used in the field of handling various electronic components such as circuit components, glass components, and semiconductor devices.

1 Tray 3 Tray body 4 Vacuum avoidance hole (negative pressure avoidance hole)
5 Adhesive film (adhesive layer)
6 Surface 10 Cushion layer (buffer layer)
DESCRIPTION OF SYMBOLS 11 Interface 12 Flowing part 13 Flowing groove 14 Flowing hole 20 Manipulator 21 Holding claw 22 Electronic device (electronic component)

Claims (4)

An adhesive tray for a manipulator, in which an adhesive adhesive layer is laminated on a tray, and an electronic component picked and placed by a manipulator is detachably attached to an exposed surface of the adhesive layer,
An adhesive tray for manipulators, characterized in that an elastic buffer layer having a thickness of 200 μm to 1 mm is interposed between the tray and the adhesive layer, and the hardness of the buffer layer is set to 70 Hs or less in Shore A hardness.   2. A negative pressure avoidance hole is perforated in a thickness direction of the tray to impart air permeability to the buffer layer so that gas from the negative pressure avoidance hole of the tray can be introduced at least into an interface between the adhesive layer and the buffer layer. Adhesive tray for manipulator as described.   The pressure-sensitive adhesive tray for manipulators according to claim 2, wherein a circulation part is formed in the buffer layer for flowing gas from the negative pressure avoidance hole of the tray to the interface between the pressure-sensitive adhesive layer and the buffer layer.   The pressure-sensitive adhesive tray for manipulators according to claim 1, 2, or 3, wherein the buffer layer is formed of either urethane rubber or a sponge material having bubbles.

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