JP2008059086A - Rfid tag structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an RFID tag structure easy to remove from a managed object to be reused without impairing the appearance of the managed object even when the RFID tag is removed. <P>SOLUTION: The RFID tag structure comprises the RFID tag in which an antenna 12 and a semiconductor chip 13 connected thereto are formed on a surface of a base film 11, and a suction layer 22 with many fine suction cups 23 on a surface formed on at least either the top or bottom surface of the RFID tag via or not via a sheet film 21. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an RFID tag structure used for merchandise management, for example.

  RFID (Radio Frequency IDentification) tags incorporating an antenna and an IC chip are beginning to be used for merchandise management. The price of this RFID tag (hereinafter also referred to as an IC tag) has been reduced due to mass production. However, the actual situation is that the cost is still high in order to use it only once with the product to be managed being pasted like a barcode.

  Therefore, in order to spread the IC tag for system use such as product management, it is indispensable to reduce the cost of the IC tag. In order to reduce the cost of IC tags, it is important to construct a mechanism that allows IC tags to be reused, as well as to establish inexpensive mass production technology.

  By the way, as a structure of an IC tag, the following is common. That is, as shown in FIG. 6A, an antenna 12 is formed on a polyethylene terephthalate (PET) film 11 serving as a base, an IC chip 13 is connected to the antenna, and the antenna and the IC chip are further protected. A film (for example, PET film) 14 is bonded and laminated with an adhesive.

  In addition, as an IC tag, the thing of the structure by the potting by a thermosetting resin is used without using a protective film. That is, as shown in FIG. 6B, an antenna 12 is formed on a PET film 11, an IC chip 13 is connected to the antenna, and a connection portion between the antenna and the semiconductor chip is connected to a thermosetting resin ( Potting) 15 is used for protection.

  As a method of attaching the IC tag to a management object (hereinafter also referred to as an object), a double-sided adhesive tape affixed to the back surface of the base film of the IC tag is used or an applied adhesive is often used. In addition, once the IC tag is attached to an object, it is generally used on the assumption that it is not removed.

  Here, in order to reuse the IC tag attached to the object, the IC tag must be removed from the object.

  When removing the IC tag, the IC tag must be peeled off with a force exceeding the adhesive strength of the double-sided adhesive tape or adhesive. At this time, there is a problem that the IC tag is bent and electrical connection between the antenna and the IC chip is often lost, and the IC tag does not function. In addition, there is an invention characterized in that the individual tag management is emphasized and the IC tag function is lost when the IC tag is peeled off from the object.

  Further, if the IC tag is repeatedly attached and detached, the connection portion between the antenna and the IC chip may be stressed many times and the electrical connection may not be established.

  Furthermore, after the IC tag is removed, the adhesive remains on the surface of the object, which may impair the appearance.

  Japanese Patent Laying-Open No. 2006-001069 discloses a home delivery slip with an IC tag, which is characterized in that an IC tag is adhered to a collection slip portion of the home delivery slip, and ensures the collection of the IC tag. However, in order to reuse the IC tag, the collection slip and the IC tag must be peeled off using a cleaning solution or the like.

  Japanese Patent Laid-Open No. 2002-1557569 discloses an IC in which an IC tag is loaded on an inner surface where a base material and a covering material are overlapped without bonding, and the base material, the covering material, and the periphery are joined by an adhesive layer. A tag enclosure is disclosed. With such a configuration, the IC tag can be easily taken out and can be easily reused. However, the IC tag enclosure itself is bonded to the management object via the adhesive layer.

In addition, JP 2005-216275 A proposes a clip having an IC tag as a mechanism for attaching the IC tag to an object. However, there is a problem that the clip has to be used and the versatility is poor.
JP 2006-001069 A Japanese Patent Laid-Open No. 2002-157469 JP 2005-216275 A

  The present invention provides an RFID tag structure that can be easily attached to and removed from an object to be managed in order to make the IC tag reusable. In addition, an RFID tag structure that does not impair the appearance of the management target after the IC tag is removed is provided.

  The RFID tag structure according to the present invention includes an RFID tag in which an antenna and a semiconductor chip connected thereto are formed on the surface of a base film, and at least one of the surface or the back surface of the RFID tag via a sheet film or It is characterized by comprising a suction structure having a large number of minute suction cups on the surface without being interposed.

  In the RFID tag structure according to the present invention, any of the above-described films is preferably a rigid member. The RFID tag structure according to the present invention may be configured by further laminating a resin rigid plate.

  Furthermore, the adsorption structure in the RFID tag structure according to the present invention is preferably made of, for example, a foamed resin sheet obtained by foaming an acrylic resin.

  Further, in the RFID tag structure, when the film constituting the RFID tag structure is made of a rigid member or laminated with a rigid resin plate, the antenna tag and the semiconductor chip are not electrically bent without being excessively bent. There is no fear that the connection will be lost.

  For example, when a sheet having a fine suction cup on the surface is adsorbed to an object, the sheet is easily peeled off when the end of the sheet is rolled up. If the RFID tag structure according to the present invention has a rigid configuration as described above, it is possible to prevent the end from rolling up, and thus it is possible to provide an RFID tag structure that is difficult to come off in a normal use level.

  In this specification, the term “adsorption” is used to mean sticking with a small suction cup, and is different from so-called chemical adsorption or physical adsorption.

  Thus, since the RFID tag structure according to the present invention has the adsorption structure on at least one of the front surface and the back surface thereof, it can be easily attached to an object having a smooth surface.

  Further, it is not necessary to interpose an adhesive on the adsorption surface, and no adhesive remains when the RFID tag is removed, so that the appearance of the management target is not impaired.

  In the RFID tag structure of the present invention, the surface in contact with the management object is an adsorption structure provided with a large number of minute suction cups. As a result, it is possible to provide an RFID tag structure that can be repeatedly adsorbed to the management object, can be reused, and does not leave an adhesion trace on the surface of the management object. That is, since no adhesive or adhesive is used on the surface in contact with the product or the like, no adhesion trace is left. In addition, when reusable, even if an expensive RFID tag is used, the cost per use can be reduced.

  Such an adsorption structure may be formed by applying a foamed resin sheet technique or by a printing technique using a flexible resin as a suction cup structure.

The foamed resin sheet used for the RFID tag structure of the present invention is made of a resin such as an acrylic resin, silicone rubber, silicone gel, or fluororubber. Preferably, an elastic resin is used. A gas such as air is added to the resin raw material, subjected to a mechanical foaming machine, formed into a sheet, dried and vulcanized or crosslinked. After forming the sheet, gas escapes from the sheet surface or bubbles are destroyed to generate foam marks. When this foaming mark is left as it is and vulcanized or crosslinked, a suction cup composed of a foam hole (hereinafter also referred to as a foam suction cup) is formed. A preferable number of the foam suction cups is 10,000 to 30,000 / cm ² . With this foam suction cup, it is possible to repeatedly adsorb the object to be managed. Independent foaming remains in the sheet.

  Other materials for the foam sucker include polystyrene elastomers (for example, Asahi Kasei Kogyo's trade names “Tufprene”, “Tough Tech”), olefinic elastomers (for example, JSR's trade name “Dynalon CEBC”, Mitsui Chemicals) Name “mistramer”), urethane elastomer, ester elastomer, amide elastomer, chlorinated polyethylene elastomer, Syn-1,2-polybutadiene, Trans-1,4-polyisoprene, fluorine elastomer and the like can be used. These are described in “Plastic Data Book” published by the Industrial Research Council, December 1, 1999, pages 854 to 857, and the polymers described therein can also be used in the present invention.

  The average diameter of the foam sucker is preferably in the range of 1 to 300 μm. The pressure-sensitive adhesive and adhesive are not present on the surface in contact with the management object. A pressure-sensitive adhesive or an adhesive has a problem of heat resistance, and has a problem that a mark remains after being removed.

  Furthermore, in the RFID tag structure of the present invention, in order to protect the IC chip and the antenna of the IC tag, the foamed resin sheet is directly adsorbed, and the base film of the IC tag and the foamed resin sheet are integrated. Good.

  Such a foamed resin sheet is commercially available under the following trade names. These include Zeon AL sheet (Zeon Kasei Co., Ltd.), Diafit (Diamic Co., Ltd.), Pitatto-kun (Ookura Paper Co., Ltd.). Since these foamed resin sheets do not use an adhesive or the like, the foamed resin sheet has a feature that no adhesive or the like remains on the peeled mark.

  Moreover, what is necessary is just to manufacture as an adsorption structure using a printing technique by the method disclosed by Unexamined-Japanese-Patent No. 6-238845, for example. This is a method of forming a sucker by “printing a continuous sucker-type pattern of a mesh-like sucker on a softened ink-like substance by a screen printing method”. Japanese Patent Application Laid-Open No. 2000-274421 also discloses a similar technique.

In order to adsorb the RFID tag structure of the present invention to the management object, it is only necessary to lightly press it by hand. Thereby, for example, an adsorption force of about 80 to 90 kg / cm ² is obtained. When removing the RFID tag structure from the object to be managed, the RFID tag structure can be easily removed by peeling from the end side. Since the RFID tag structure is only attached by adsorption, no trace remains after removal.

  The RFID tag structure of the present invention includes a semiconductor chip and an antenna connected to the semiconductor chip on the surface of the base film. Thereby, electric power is supplied from the antenna to the semiconductor chip by electromagnetic induction, and various management information is written. For example, various information such as product type, raw material, production history, usage, user name, destination, and the like. If such information is read accurately, it can be used for many managements such as production management, supply management, quality control, and the like.

  Hereinafter, the present invention will be described in detail with reference to specific examples of the present invention.

(Specific example 1)
(1) Production of foamed resin sheet 1000 g of acrylic copolymer resin (trade name “DICNAL MEP-20WO” manufactured by Dainippon Chemical Co., Ltd.) and foam stabilizer (trade name “DICNAL M-40” manufactured by Dainippon Chemical Co., Ltd.) 100 g, 100 g of thickener (trade name “DICNAL MX” manufactured by Dainippon Kagaku Kogyo Co., Ltd.) and 50 g of cross-linking agent melamine resin (product of Dainippon Chemical Co., Ltd.) are mixed to form an acrylic emulsion. An acrylic emulsion liquid containing air bubbles having a foaming ratio of 1.5 times was prepared by putting in an automatic foaming machine and mixing air.

  This acrylic emulsion liquid was applied to the surface of a polyethylene terephthalate sheet film (width 30 cm, thickness 50 μm, long product) with a knife coater so as to have a dry thickness of 200 μm. Crosslinking was performed while drying over a period of minutes. Thereafter, a 30 μm thick polyethylene terephthalate protective film was coated on the crosslinked acrylic resin foam layer. Thus, an acrylic resin foam layer could be formed on one side of the polyethylene terephthalate sheet film.

On the surface of the foamed layer of the acrylic resin, foaming traces formed by gas escape or foam destruction were present at a rate of 10,000 to 30,000 / cm ² . The surface of this foam layer functions as an adsorption surface.

Thus, the foamed resin sheet which consists of a foamable acrylic resin was manufactured. When this foamed resin sheet was pressed against a glass plate, an adsorption force of 80 to 90 kg / cm ² was obtained.

  In addition, when this acrylic emulsion liquid is apply | coated and bridge | crosslinked also to the back surface of the sheet | seat film mentioned above, it can be set as a double-sided type foamed resin sheet.

(2) Formation of RFID Tag FIG. 1A shows a schematic sectional view of Example 1. First, an RFID tag 10 in which an antenna 12 and a semiconductor chip 13 connected to the antenna 12 were formed on the surface of the base film 11 and a protective film 14 was further laminated thereon was prepared.

  An RFID tag structure having a structure in which a sheet film 21 having a foamable acrylic resin adsorbing layer 22 formed on the back surface of the base film 11 of the RFID tag 10, that is, a foamed resin sheet 20 is bonded via an adhesive layer 30. 1. Many suction cups 23 are formed on the suction surface 24 of the foamed resin sheet 20. Note that a double-sided adhesive tape may be used instead of the adhesive layer.

  FIG. 1B shows the result of observing the surface (adsorption surface) and the cross section of the foamable acrylic resin with a scanning electron microscope (manufactured by Hitachi, S-4500, acceleration voltage: 5 kV, photographing magnification: 250 times). Each is shown in FIG. 1C.

  According to the observation result, many open bubbles are observed on the surface of the foamable acrylic resin. Inside the foamable acrylic resin, some bubbles are observed as if multiple bubbles are united, but as is clear from the cross-sectional observation results, a series of bubbles that communicate from the front surface to the back surface. There is no independent foam. A large number of bubbles existing on the surface of the foamable acrylic resin function as a fine sucker, and constitute a foamed resin sheet.

The foamed resin sheet had a thickness of 1 mm, and was cut into a size of 30 mm length and 70 mm width. In order to adsorb the foamed resin sheet to an object to be managed (for example, an electrical appliance), it is only necessary to lightly press it with a hand. Thereby, for example, an adsorption force of about 80 to 90 kg / cm ² is obtained. The average diameter of the foam sucker is in the range of 1 to 300 μm.

  In Specific Example 1 shown in FIG. 1A, an RFID tag structure according to the present invention can be easily obtained by simply bonding a commercially available foamed resin sheet to an existing IC tag with an adhesive or a double-sided adhesive tape. it can.

  With such a structure, the RFID tag structure according to the present invention can be easily attached to an object. Further, no adhesive remains when the RFID tag structure is removed.

  At this time, the sheet film of the foamed resin sheet may be thick or may be difficult to bend by changing the material. This is preferable because the connection portion between the semiconductor chip and the antenna is less painful when the RFID tag structure is removed. The material of the base film is preferably polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET) or the like.

  Further, the base film of the IC tag may be thick or may be changed so that it is difficult to bend, and further, the protective film may be difficult to be bent. The sheet film may be a film material similar to the base film.

  Further, the base film 11 of the IC tag and the sheet film 21 of the foamed resin sheet may be shared as shown in FIG. 1D.

  In the specific example 1, it was set as the structure by which the foamed resin sheet 20 matched with the magnitude | size of the existing IC tag 10 was adhere | attached. The size of the IC tag 10 is about 10 mm in length, 45 mm in width, and about 100 μm in thickness, and may not be sufficiently large from the viewpoint of ease of handling and visibility. Since the size of the existing IC tag is almost the same, if necessary, the foamed resin sheet 20 is made larger than the existing IC tag 10 and the IC tag 10 is arranged at the center as shown in FIG. 1E. Thus, the RFID tag structure 1 may be configured. In addition, if the RFID tag structure is not easily peeled off, an IC tag may be arranged not only at the center but also at the end.

(Specific example 2)
FIG. 2A shows a schematic sectional view of Example 2. This specific example 2 has the same structure as the specific example 1 except that the sheet film 21 on which the foamable acrylic resin adsorption layer is formed is bonded to the surface of the protective film 14 of the IC tag via the adhesive layer 30. It is.

  Further, the IC tag protective film 14 and the foamed resin sheet sheet 21 may be shared as shown in FIG. 2B.

(Specific example 3)
FIG. 3A shows a schematic sectional view of Example 3. This specific example 3 is an example in which a resin plate made of PP (polypropylene), PE (polyethylene), PET, acrylic resin or the like is laminated, and the resin rigid plate 40 is bonded onto the protective film of the specific example 1. (Adhesive layers are not shown) and are laminated. If the laminated structure as shown in FIG. 3A is used, the resin rigid plate 40 can protect the surface of the IC tag 10 and can be handled without damaging the RFID tag structure 1 if the resin rigid plate 40 is gripped. .

  If the resin rigid plate is not located on the surface in contact with the object, the stacking position is not particularly limited, and the resin rigid plate 40 is interposed between the IC tag 10 and the foamed resin sheet 20 as shown in FIG. 3B. May be arranged. The adhesive layer between the resin rigid plate 40 and the protective film 14 of the IC tag 10 is not shown.

  Although depending on the resin material, if the thickness of the resin rigid plate is about 0.3 to 2 mm, the RFID tag structure of the present invention has sufficient rigidity and is easy to handle. Even when the antenna is removed, the connection between the antenna and the semiconductor chip is not damaged.

  In the third specific example, one resin rigid plate is laminated, but a plurality of resin rigid plates may be laminated.

(Specific example 4)
FIG. 4A shows a schematic sectional view of Example 4. This specific example 4 is an RFID tag structure configured such that one surface of a double-sided type foamed resin sheet is adsorbed to a semiconductor chip and an antenna, and the other surface is used for adsorption to an object. Furthermore, in the specific example 4, as shown in FIG. 4B, a configuration may be adopted in which a resin rigid plate is bonded and laminated on the back side of the base film.

  In the above specific examples, the adsorption layer made of foamable acrylic resin has been exemplified, but the present invention is not limited to this, and an adsorption layer made of foamable urethane resin may be used.

  Further, as shown in FIG. 5, a flexible resin, for example, polyvinyl chloride resin 25, is formed so that its cross section is convex and has a mesh shape in plan view (21, (11, 14)) may be screen-printed to form a large number of small suction cups 23 to form an adsorption structure.

FIG. 1A is a schematic cross-sectional view of Example 1 of the present invention. FIG. 1B shows the result of observing the surface of the foamable acrylic resin used in Example 1. FIG. 1C is a result of observing a cross section of the foamable acrylic resin used in the specific example 1. FIG. 1D is a schematic cross-sectional view of a modification of the specific example 1. FIG. 1E is a plan view of another modified example of the first specific example. FIG. 2A is a schematic cross-sectional view of the second specific example. FIG. 2B is a schematic cross-sectional view of a modified example of the second specific example. FIG. 3A is a schematic cross-sectional view of the third specific example. FIG. 3B is a schematic cross-sectional view of a modified example of the third specific example. FIG. 4A is a schematic cross-sectional view of the fourth specific example. FIG. 4B is a schematic cross-sectional view of a modified example of the fourth specific example. FIG. 5 shows an example in which an adsorption layer is formed by screen-printing a resin having the same flexibility to form a large number of small suction cups. 6A and 6B are schematic cross-sectional views of a conventional general IC tag.

Explanation of symbols

1: RFID tag structure 10: IC tag 11: Base film 12: Antenna 13: IC chip 14: Protective film 15: Potting 20: Foamed resin sheet 21: Sheet film 22: Adsorption layer 23: Minute suction cup 24: Adsorption surface 25: Resin having flexibility 30: Adhesive layer (double-sided adhesive tape)
40: Rigid resin plate

Claims (10)

An RFID tag in which an antenna and a semiconductor chip connected to the antenna are formed on the surface of the base film;
An RFID tag structure comprising an adsorption structure having a large number of minute suction cups on the surface, with or without a sheet film, on at least one of the front surface or the back surface of the RFID tag.   The RFID tag structure according to claim 1, wherein the adsorption structure is made of a foamed resin sheet having a large number of foam holes formed on a surface thereof.   The RFID tag structure according to claim 2, wherein the foamed resin sheet is formed by foaming an acrylic resin.   2. The RFID tag structure according to claim 1, wherein the adsorption structure is formed by printing a flexible resin on the front surface or the back surface so that the cross section is convex and has a mesh shape in plan view. .   The RFID tag structure according to any one of claims 1 to 4, wherein the adsorption structure is formed on the back surface of the base film with or without a sheet film. A protective film is laminated on the antenna and the semiconductor chip,
The RFID tag structure according to claim 1, wherein the adsorption structure is formed on the surface of the protective film with or without a sheet film.   The RFID tag structure according to claim 1, wherein the base film is a rigid member.   The RFID tag structure according to claim 1, 5 or 6, wherein the sheet film is a rigid member.   The RFID tag structure according to claim 1, wherein the protective film is a rigid member.   The RFID tag structure according to claim 1, further comprising a resin rigid plate laminated thereon.