JP2013103264A - Laser soldering apparatus and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase soldering quality and to reduce soldering time.SOLUTION: The laser soldering apparatus 6 provides a solder 5 to a terminal by reflow or the like in a preceding process in order to solder the terminal 2 of an electric circuit board 1 and a conductor 4 being an electric wire end of a flat cable 3, and applies a red laser beam Lr to the solder, and a blue laser beam Lb to the terminal. The laser soldering apparatus includes: a red semiconductor laser 11 of a red laser light source; and a blue semiconductor laser 21 of a blue laser light source. Each laser beam is condensed by a condenser lens 9, respectively, spotted and applied to each object. The output of each laser light source can be adjusted according to the difference in temperature characteristics of a solder and the terminal (the temperature rising speed by the same laser beam). Especially, the temperatures of the solder and the terminal can be substantially simultaneously risen to a predetermined temperature by arranging a plurality of low output blue semiconductor lasers that are easy to obtain. Thus, heat damage is prevented from occurring because heat development of one of the solder and the terminal is increased.

Description

  The present invention relates to a laser soldering apparatus and method for performing soldering by irradiating a laser beam.

  Conventionally, when soldering a terminal of an electrical component to a substrate or the like, there is a possibility that a manual connection using a soldering iron may cause a bridge connection (short circuit) when adjacent terminals are close to each other, thus solving such a problem. Therefore, various soldering apparatuses have been developed that can be positioned with high precision and can be automatically soldered.

  As a soldering apparatus that performs soldering automatically, there is an apparatus that performs soldering by irradiating solder or an object to be soldered with laser light (see, for example, Patent Document 1). Since the laser beam can be irradiated as a minute spot, it can correspond to a minute terminal arranged at a high pitch in recent years.

JP 2008-55456 A

  In the soldering apparatus according to Patent Document 1, light having a pulse width of microseconds or more is obtained by a fiber laser apparatus that has a single core and outputs an optically amplified light using an amplification optical fiber that outputs the light in a single mode. Is output, and the output light is applied to the solder or the soldering object to perform soldering of a minute size. Specifically, laser light having a single wavelength of 1064 nm (or 532 nm) is used.

  On the other hand, there is a difference in the optical absorptance of the metal (mainly Sn) constituting the solder and the metal (copper or gold or the like) constituting the soldering object (the land) with respect to the wavelength of the laser beam. Therefore, in the above solder apparatus, when irradiating laser light having a wavelength with high light absorption rate of solder, it is applied to the solder, and when irradiating laser light having a wavelength with high light absorption rate of the soldering object, The irradiation target is changed according to the wavelength, for example, to the soldering target.

  However, when soldering is performed by melting the solder, the solder can be spread smoothly by raising the temperature of the soldering target to a temperature at which the solder can be melted, but the soldering time is reduced as much as possible. For this reason, as described above, when either one is heated quickly, there is a possibility that thermal damage may occur in the direction of heat generation before the heat is transferred to the other. When soldered in a state where thermal damage has occurred, the quality of the soldered portion is degraded. In order to prevent thermal damage from occurring, it is conceivable that heat is generated over time so that the irradiated portion of the laser beam does not generate heat suddenly, but since the soldering time is increased, productivity is lowered. There was a problem.

  The present invention has been devised to solve such problems of the prior art, and its main purpose is to provide a laser soldering apparatus capable of improving the soldering quality and shortening the soldering time. There is to do.

  The soldering apparatus of the present invention is a laser soldering apparatus for irradiating a soldering portion having two soldering objects and solder with laser light and soldering the soldering object more than the soldering object. A first laser light source that emits a first laser beam suitable for raising the temperature; and a second laser light source that emits a second laser beam suitable for raising the temperature of the soldering object rather than the solder. One of the first laser light source and the second laser light source has a lower output than the other, and the lower output is that the solder and the soldering object are irradiated with the laser beams at a predetermined temperature almost simultaneously. It is set as the structure provided in multiple so that it may heat up to.

  According to the present invention, when two soldering objects are to be soldered, the temperature is raised by irradiating both the soldering object and the solder with different laser beams, respectively. Even if there is a difference in temperature characteristics from the target (temperature rise speed by the same laser beam), the output of each laser light source can be adjusted according to the temperature characteristics, and the solder and the soldering target are specified. Since the temperature can be raised almost simultaneously to the temperature, it is possible to prevent any one of the heat generations from increasing and causing thermal damage.

It is a principal part perspective view which shows an example of the laser soldering apparatus by this invention. It is a typical perspective view which shows the internal structure of the laser soldering apparatus based on this invention. It is a schematic diagram which shows the structure of a red laser emitting apparatus. It is a principal part expansion perspective view which shows the structure of the emission part of the blue laser beam of a blue laser emission apparatus. It is a principal part expanded sectional view which shows the relative position adjustment structure of a collimator lens. It is a figure which shows the condensing point of a blue laser beam. It is a figure which shows the change of condensing of four blue laser beams, (a) is the figure seen in the position of the arrow VIIa-VIIa line of FIG. 6, (b) is the arrow VIIb-VIIb line of FIG. FIG. 7C is a diagram viewed at the position of arrows VIIc-VIIc in FIG. 6. It is a figure which shows the irradiation point to the solder and conductor of a red and blue laser beam, (a) is a top view, (b) is a side view. It is a figure which shows the light absorptance by the difference in the kind (gold | gold / copper / tin) of a red and blue laser beam. It is a figure which shows the state after soldering by the laser soldering apparatus of this invention, (a) is a figure corresponding to Fig.8 (a), (b) is a figure corresponding to FIG.8 (b). .

  A first invention made to solve the above-described problems is a laser soldering apparatus for irradiating a soldering portion having two soldering objects and solder by irradiating a laser beam, the soldering A first laser light source that emits a first laser beam suitable for raising the temperature of the solder from the object, and a second laser light that emits a second laser beam suitable for raising the temperature of the soldering object than the solder. Two laser light sources, the second laser light source has a lower output than the first laser light source, and the solder is heated to a predetermined temperature by the irradiation of the first laser light substantially simultaneously with the temperature A plurality of soldering objects are also provided so as to increase the temperature to the predetermined temperature.

  According to this, when two soldering objects are soldered, both the soldering object and the solder are irradiated with different laser beams to raise the temperature. Even if there is a difference in the temperature characteristics (heating speed by the same laser beam), the output of each laser light source can be adjusted according to the temperature characteristics, and the solder and the soldering object are suitably determined. Since the temperature can be raised almost simultaneously to the temperature, it is possible to prevent any one of the heat generations from increasing and causing thermal damage.

  In a second aspect based on the first aspect, the first laser beam is a laser beam having a wavelength at which the light absorption rate of the solder is higher than that of the soldering object, and the second laser beam. Is a laser beam having a wavelength at which the light absorption rate of the soldering object is higher than that of the solder.

  According to this, since the laser beam having a suitable wavelength corresponding to the difference in the light absorption rate of the irradiation target is irradiated, heat can be generated efficiently.

  According to a third aspect, in the first or second aspect, the first laser light is red laser light, and the second laser light is blue laser light.

  According to this, using a readily available red semiconductor laser and blue semiconductor laser, the solder is irradiated with red laser light according to the difference in light absorption rate of each metal, and the conductor to be soldered is applied to the conductor. Since the blue laser light is irradiated, each can be efficiently heated.

  According to a fourth aspect of the present invention, in the third aspect of the present invention, the blue laser light is applied to the soldering object in a spot shape.

  According to this, since the blue semiconductor laser that is readily available has low output, it is arranged more than the red semiconductor laser that has high output compared to it, and further, for example, it is condensed by a condenser lens and irradiated in a pot The product to be soldered can be heated to a predetermined temperature almost simultaneously with the temperature rise of the solder irradiated with the red laser light.

  The fifth invention is a laser soldering method in which a soldering portion having two soldering objects and solder is irradiated with a laser beam for soldering, and the soldering object is obtained by a first laser light source. The solder is irradiated with a first laser beam suitable for raising the temperature of the solder than the object, and a second laser light suitable for raising the temperature of the soldering object than the solder is emitted by the second laser light source. Irradiating at least one of the objects to be soldered, and providing a plurality of low-powered ones of the first laser light source and the second laser light source, and the solder and the soldering object are irradiated with each laser beam. The temperature is raised to a predetermined temperature almost simultaneously.

  According to this, when two soldering objects are soldered, both the soldering object and the solder are irradiated with different laser beams to raise the temperature. Even if there is a difference in the temperature characteristics (heating speed by the same laser beam), the output of each laser light source can be adjusted according to the temperature characteristics, and the solder and the soldering object are suitably determined. Since the temperature can be raised almost simultaneously to the temperature, it is possible to prevent any one of the heat generations from increasing and causing thermal damage.

  In a sixth aspect based on the fifth aspect, the first laser beam is a laser beam having a wavelength at which the light absorption rate of the solder is higher than that of the object to be soldered. The laser beam is configured to be a laser beam having a wavelength such that the light absorption rate of the soldering object is higher than that of the solder, and a seventh aspect of the invention is the fifth or sixth aspect of the invention. The laser light is red laser light, and the second laser light is blue laser light. According to these, as laser light having a suitable wavelength according to the difference in light absorption rate of the irradiation target, the solder is irradiated with red laser light, and the conductor to be soldered is irradiated with blue laser light. Can generate heat efficiently.

  According to an eighth aspect of the present invention, in the seventh aspect of the invention, the blue laser light is applied to the soldering object in a spot shape.

  According to this, since the blue semiconductor laser that is readily available has low output, it is arranged more than the red semiconductor laser that has high output compared to it, and further, for example, it is condensed by a condenser lens and irradiated in a pot The product to be soldered can be heated to a predetermined temperature almost simultaneously with the temperature rise of the solder irradiated with the red laser light.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view of a main part showing an example of a laser soldering apparatus according to the present invention. In the example of FIG. 1, a plurality of terminals 2 as soldering objects that are printed and wired, for example, are arranged on the electric circuit board 1, and each of the electric wires exposed at the cable end of the flat cable 3 is connected to each of the terminals 2. The conductor 4 as an object to be soldered at the end is soldered. In addition, although the terminal 2 is formed in the plate-shaped body in the figure, you may form as a land which has a hole. The terminal 2 is provided with a predetermined amount of solder 5 by, for example, reflow in the previous process. Alternatively, the solder 5 may be soldered to the terminal 2 by reflow.

  Then, positioning is set so that the conductor 4 of the flat cable 3 is placed on the solder 5 provided on the terminal 2 as described above. The terminal 2 is formed in a strip shape long in the extending direction of the conductor 4, and the solder 5 is placed on substantially the entire upper surface. Further, the conductor 4 is positioned so as to cover substantially half of the solder 5 by a setting device (not shown).

  A laser soldering device 6 is disposed above the positioned conductor 4 and solder 5. In the present embodiment, the laser soldering device 6 outputs a red laser beam Lr as the first laser beam that irradiates the solder 5 and a blue laser beam Lb as the second laser beam that irradiates the conductor 4. The spots of the laser beams Lr and Lb in FIG. 1 on the solder 5 and the conductor 4 represent positions and are not limited in size.

  FIG. 2 is a schematic perspective view showing the internal configuration of the laser soldering apparatus according to the present invention. As shown in the drawing, inside the laser soldering device 6, a red laser emitting device 7 that emits red laser light Lr, a blue laser emitting device 8 that emits blue laser light Lb, and a red laser emitting device 7. A condensing lens (convex lens) 9 for condensing the red laser light Lr emitted from the laser 5 onto the solder 5 and condensing the blue laser light Lb emitted from the blue laser emitting device 8 onto the conductor 4; A control unit 10 for controlling the outputs of the device 7 and the blue laser emitting device 8 is provided. In FIG. 2, the laser beams Lr and Lb cross each other and irradiate the solder 5 and the conductor 4, respectively. It is also possible to irradiate without crossing by setting the tilt, the lens characteristics of the condenser lens 9 and the like, and in this case, the arrangement of the laser emitting devices 7 and 8 is opposite to that in the case of FIG.

  FIG. 3 is a schematic diagram showing the configuration of the red laser emitting device 7. In the figure, the casing and members for fixing the optical elements are omitted. As shown in the figure, in the red laser emitting device 7, for example, two red semiconductor lasers 11 as first laser light sources are arranged in parallel with each other, and on the optical axis of the red semiconductor laser 11, From the red laser semiconductor 11 side, a collimator lens 12, a polarization beam splitter 13, a λ / 4 plate 14, and a condenser lens 9 are arranged in this order. Two collimator lenses 12 are also provided for each red laser semiconductor 11.

  The red laser light Lr emitted from the red laser semiconductor 11 is diffused and emitted in a conical shape with the optical axis as a core, but is collimated by the collimator lens 12 and enters the polarization beam splitter 13. The polarization beam splitter 13 is provided with a polarization plane 13a inclined at 45 degrees with respect to the optical axis of the red laser light Lr. The component of the red laser beam Lr that has passed through the polarization plane 13 a (for example, P-polarized component) is 90 degrees out of phase by the λ / 4 plate 14, converged by the condenser lens 9, and irradiated as a spot at a predetermined position on the solder 5. Is done.

  Further, the reflected light from the solder 5 returns to the condenser lens 9 and is further shifted by 90 degrees by the λ / 4 plate 14 and enters the polarization beam splitter 13, so that it is reflected by the polarization plane 13 and polarized. The light is emitted to the side of the beam splitter 13 (right side in the figure). A black absorber 15, for example, is provided on the side of the polarization beam splitter 13, and the reflected light is absorbed by the absorber 15 and does not leak out of the apparatus.

  In FIG. 3, two red semiconductor lasers 11 are provided. However, the number may be any number depending on the size of the solder 5, the soldering time, and the output performance of the readily available red semiconductor laser. Three or more may be sufficient. Although the red laser emitting device 7 has been described with reference to FIG. 3, the blue laser emitting device 8 may have the same configuration as that of FIG. 3, and in particular, the configuration of the polarization beam splitter 13 and the λ / 4 plate 14 may be the same. In FIG. 3, the condensing lens 9 is shown exclusively for the red laser light Lr, but may be common to the blue laser light Lb as shown in FIG.

  FIG. 4 is an essential part enlarged perspective view showing the configuration of the emission part of the blue laser beam Lb of the blue laser emitting device 8. In the present embodiment, four blue semiconductor lasers 21 as second laser light sources are arranged in a lattice shape, and four collimator lenses 22 are arranged corresponding to each. Each blue laser semiconductor 21 is fixed to a substrate 23, and a rectangular frame spacer 24 surrounding each blue semiconductor laser 21 is fixed to the substrate 23. Retaining members 25 for individually retaining the four collimator lenses 22 are provided on the side of the spacer 24 opposite to the blue semiconductor lasers 21.

  FIG. 5 is an enlarged cross-sectional view of the main part showing the relative position adjustment structure of the collimator lens 22. A plate-like lid portion 24a is provided on the collimator lens 22 side of the spacer 24 to attach the holding member 25, and light emitted from the blue semiconductor laser 21 (blue laser light Lb) is passed through the lid-like portion 24a. An opening 24b having a sufficient opening area is provided.

  The holding member 25 has a rectangular frame shape as a whole, an opening 25a that communicates with the opening 24b and has a size larger than the opening area of the opening 24b, and outward (from the optical axis Cb of the blue laser light Lb). And four inner inclined surfaces 25b that form rectangular tapered holes that expand in the emission direction. Each inner inclined surface 25b extends linearly along each side of the rectangular holding member 25 and forms a regular tetragon as a whole.

  The body portion of the collimator lens 22 is formed in a cylindrical shape, and the incident surface 22a is formed in a circle centered on the optical axis Cc of the lens. The collimator lens 22 abuts the circular edge of the incident surface 22a on each inner inclined surface 25b at four points, and is positioned on the holding member 25 in a contact state of these four points, and is fixed to the holding member 25 by, for example, an adhesive. The

  With the above positioning structure, before the collimator lens 22 is bonded and fixed, the collimator lens 22 is moved by tilting while the edges of the incident surface 22a of the collimator lens 22 are in contact with the four inner inclined surfaces 25b at four points. Thus, the optical axis Cc of the collimator lens 22 can be tilted in an arbitrary direction with respect to the optical axis Cb of the blue semiconductor laser 21.

  As shown in FIG. 4, the orthogonal axis orthogonal to the optical axis Cb of the blue laser light Lb is taken as the XY axis, and the collimator lens 22 is shown in the X-axis and Y-axis directions as indicated by arcuate arrows Xθ and Yθ in the figure. When tilted, the tilt angle with respect to the X-axis direction becomes θx and the tilt angle with respect to the Y-axis direction becomes θy, as shown in FIG. Note that θx in FIG. 5 is the case where the illustrated cross section is along the X axis, and similarly, θy is the case where the illustrated cross section is along the Y axis. Since each θx and θy can be set at arbitrary angles, the inclination of the lens axis Cc of the collimator lens 22 with respect to the optical axis Cb can be set in an arbitrary direction.

  When the blue semiconductor laser 21 is fixed to the substrate 23 and the laser emission point Pb of the blue semiconductor laser 21 is deviated from the lens axis Cc of the collimator lens 22 as shown in FIG. Adjustment can be made so that the laser emission point Pb is positioned on the axis Cc. Thereby, even if an assembly error of the blue semiconductor laser 21 occurs, normal parallel light from the collimator lens 22 can be obtained without causing any problem. In the case of the present embodiment, four blue semiconductor lasers 21 are arranged, and the collimator lens 22 is arranged for each of them. Therefore, the above adjustment is performed four times.

  In the above embodiment, the procedure for adjusting the relative position of the collimator lens 22 in the blue laser emitting device 8 has been described. However, the same applies to the red laser emitting device 7, and the description thereof is omitted. In the red laser emitting device 7 of the present embodiment, two red semiconductor lasers 11 are arranged, so the same adjustment as described above may be performed twice.

  FIG. 6 is a diagram showing a condensing procedure of the blue laser light Lb. FIG. 7 is a diagram showing a change in condensing of the four blue laser beams, (a) is a diagram seen at the position of arrows VIIa-VIIa in FIG. 6, and (b) is a diagram in FIG. It is the figure seen at the position of the arrow VIIb-VIIb line, (c) is the figure seen at the position of the arrow VIIc-VIIc line of FIG. As shown in FIGS. 6 and 7, blue laser light Lb composed of four parallel lights is incident on the condenser lens 9 in a state of being separated from each other, and the four blue laser lights Lb are incident on the condenser lens 9. Are gathered together as they approach the conductor 4 and become one light on the conductor 4. In FIG. 7C, the light is condensed at one point as a spot. However, it is not always necessary to condense as one spot. For example, four circles in FIG. It may be enough to come close to touch.

  Similarly, the red laser light Lr may be condensed as one spot. In the present embodiment, the blue laser light Lb is four, whereas the red laser light Lr is two. Otherwise, it may be the same as above.

  FIGS. 8A and 8B are diagrams showing a procedure for irradiating the solder and conductor with red and blue laser beams, FIG. 8A is a plan view, and FIG. 8B is a side view. The spot of the blue laser light Lb is configured to irradiate a range in which the width of the tip of the conductor 4 is approximately the diameter and does not protrude from the conductor 4. The spot of the red laser beam Lr is configured so as to irradiate the center part of the substantially half plane area that is not covered by the conductor 4 in the solder 5 and the entire half plane area.

  In the present embodiment, the irradiation spot of the blue laser light Lb is sized so as not to protrude from the conductor 4, whereas the irradiation spot of the red laser light Lr is sized to protrude from the solder 5. Since the output of the blue semiconductor laser 21 that is easily available is smaller than the output of the easily available one of the red semiconductor laser 11, the number of the blue semiconductor lasers 21 is increased as described above. Only the conductor 4 is irradiated so as not to cause irradiation loss. As described above, the irradiation spot of the blue laser light Lb is preferably set to a size that does not protrude from the conductor 4, but the irradiation range only needs to irradiate the conductor 4 in a concentrated manner. It is not forbidden to protrude.

  On the other hand, since the red semiconductor laser 11 is easily available with a large output, even if a portion protruding from the solder 5 occurs, it does not affect the decrease in heat generation of the solder 5. As described above, by widening the irradiation range of the red laser light Lr having a sufficient output, the laser soldering device 6 may be positioned with reference to the blue laser light Lb having no sufficient output. Moreover, since the diameter of the irradiation spot of the blue laser light Lb is relatively small, it is suitable as a positioning reference.

  The reason why the solder 5 is irradiated with the red laser light Lr and the conductor 4 is irradiated with the blue laser light Lb as in the present embodiment is due to the difference in the light absorptance due to the difference in each metal. FIG. 9 is a diagram showing the light absorptance due to the difference in the metal types (gold, copper, tin) of red and blue laser beams. As shown in the figure, the light absorption rate of the blue laser light is the lowest among tin, the higher copper, and the highest gold. On the other hand, the light absorptance of the red laser light is the lowest among gold and copper and the highest among tin among the three types.

  Therefore, it is preferable to irradiate the solder 5 with the blue laser light Lb and irradiate the conductor 4 with the red laser light Lr as the irradiation target of each laser light. By doing so, the temperature rises of the semiconductor 5 and the conductor 4 can be adjusted by adjusting the outputs of the red and blue semiconductor lasers 11 and 21, and the semiconductor 5 and the semiconductor 4 are melted almost simultaneously. The temperature can be controlled. The conductor 4 is formed in a fixed shape at the component stage, and in the automated soldering process, the solder 5 is arranged by a predetermined amount in the previous process, and the irradiation time of the laser light of the solder 5 and the conductor 4 is predetermined. By setting the value, it is possible to always make the solder in the same molten state and perform soldering in the same state.

  10A and 10B are views showing a state after soldering by the laser soldering apparatus of the present invention, in which FIG. 10A corresponds to FIG. 8A and FIG. 10B corresponds to FIG. It is a figure to do. As shown in the figure, when the soldering is completed, the solder 5 flows in so as to cover the top surface of the tip of the conductor 4, and the conductor 4 and the terminal 2 are suitably soldered via the solder 5. .

  As described above, since soldering is performed by selecting a laser beam having a wavelength suitable for generating heat according to the type of each metal composition, for each laser beam irradiation target in soldering, as described above, The soldering object and the soldering object can be similarly heated and heated, and the soldering object is not heated excessively before the solder flows to cause damage. At the same time, when the solder melting temperature is reached, the solder can easily flow into the solder target, and the solder can be brought into a solid solder bond and a good appearance.

  Further, the conductor 4 as a soldering object is a metal having a composition of copper or gold, and the blue laser light Lb having a high light absorption rate of the metal may be used. As described above, the blue semiconductor laser 21 is obtained. Since what is easy to do has a relatively low output, a plurality of (four in the embodiment) blue semiconductor lasers 21 are provided. When a plurality of blue semiconductor lasers 21 are arranged in a lattice pattern as in the embodiment, four parallel laser beams can be emitted. However, since the laser beams are separated from each other as they are, the conductor 4 Cannot generate heat quickly.

  On the other hand, as described above, each laser beam can be condensed as one spot by the condensing lens 9, and heat can be accelerated by irradiating one place of the conductor 4 in a concentrated manner. Further, as described above, each of the blue laser lights Lb is provided with the collimator lens 22, and by adjusting the tilt angle of each collimator lens 22, the blue laser lights Lb are more reliably and easily collected at one point. Can be lighted.

  In the above-described embodiment, the single condensing lens 9 condenses the red and blue laser beams Lr and Lb for spotting, but one laser beam Lr and Lb is provided. A condensing lens may be provided. When one common condensing lens 9 is provided as in the above embodiment, a variable focus lens may be used as the lens structure. The variable focus lens may be of a known structure including, for example, a lens portion enclosing a liquid and an actuator using a piezoelectric element, and the description thereof is omitted.

  Although the present invention has been described above with reference to preferred embodiments, the present invention is not limited to such embodiments so that those skilled in the art can easily understand, and departs from the spirit of the present invention. It is possible to change appropriately within the range not to be. In addition, all the components shown in the above embodiment are not necessarily essential, and can be appropriately selected without departing from the gist of the present invention.

  The laser soldering apparatus according to the present invention can raise the temperature of a solder and an object to be soldered to a predetermined temperature almost simultaneously, and is useful as an apparatus for performing automatic soldering.

2 Terminal 4 Conductor 5 Solder 6 Laser soldering device 7 Red laser emitting device 8 Blue laser emitting device 11 Red semiconductor laser (first laser light source)
21 Blue semiconductor laser (second laser light source)

Claims (8)

A laser soldering apparatus for performing soldering by irradiating a laser beam onto a soldering portion having two soldering objects and solder,
A first laser light source that emits a first laser beam suitable for raising the temperature of the solder from the soldering object, and a second laser beam suitable for raising the temperature of the soldering object than the solder. A second laser light source that emits,
One of the first laser light source and the second laser light source has a lower output than the other, and the lower output is that the solder and the soldering object are approximately simultaneously heated to a predetermined temperature by irradiation of the laser beams. A laser soldering apparatus, wherein a plurality of laser soldering apparatuses are provided to increase the temperature.   The first laser beam is a laser beam having a wavelength at which the light absorption rate of the solder is higher than that of the soldering object, and the second laser beam has a light absorption rate of the soldering object that is higher than that of the solder. 2. The laser soldering apparatus according to claim 1, wherein the laser beam is a laser beam having a higher wavelength.   3. The laser soldering apparatus according to claim 1, wherein the first laser beam is a red laser beam, and the second laser beam is a blue laser beam. 4.   The laser soldering apparatus according to claim 3, wherein the blue laser light is irradiated in a spot shape on the soldering object. A laser soldering method in which a soldering portion having two soldering objects and solder is irradiated with a laser beam for soldering,
The first laser light source irradiates the solder with a first laser beam suitable for raising the temperature of the solder than the object to be soldered,
Irradiating at least one of the soldering objects with a second laser light source suitable for raising the temperature of the soldering object rather than the solder;
A plurality of low-power ones of the first laser light source and the second laser light source are provided, and the solder and the soldering object are heated to a predetermined temperature substantially simultaneously by irradiation of the laser beams, Laser soldering method.   The first laser beam is a laser beam having a wavelength at which the light absorption rate of the solder is higher than that of the object to be soldered, and the second laser beam is more toward the object to be soldered than the solder. The laser soldering method according to claim 5, wherein the laser beam has a wavelength that increases the light absorption rate.   7. The laser soldering method according to claim 5, wherein the first laser beam is a red laser beam and the second laser beam is a blue laser beam.   The laser soldering apparatus according to claim 7, wherein the blue laser light is applied to the soldering object in a spot shape.

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