JP4609161B2 - Soldering method and soldering apparatus - Google Patents

Description

  The present invention relates to a soldering method and a soldering apparatus.

As a kind of soldering method, a method of soldering two metal members using laser light is known. For example, the following Patent Documents 1 to 4 disclose a method of performing soldering by melting solder by irradiating a metal member to be heated with light from a light source.
JP-A-6-71425 JP-A-6-218534 JP-A-8-18214 Special opening and closing 11-197868 gazette

  However, in the conventional soldering method described above, the solder may be unevenly attached to one of the two metal members.

  An object of the present invention is to provide a soldering method capable of uniformly attaching solder to both of two metal members. Another object of the present invention is to provide a soldering apparatus suitable for the soldering method.

  A soldering method according to one aspect of the present invention extends to (a) a first metal member provided on a first base material and a second metal member provided on a second base material. A first step of supplying solder, and (b) a second step of irradiating the first metal member with the first light and irradiating the second metal member with the second light, (C) the temperature rise rate of one metal member of the first metal member and the second metal member is greater than the temperature rise rate of the other metal member, and (d) the one metal member is irradiated The product of the power of light and the light absorption rate of the one metal member is smaller than the product of the light power applied to the other metal member and the light absorption rate of the other metal member, It is characterized by that. Here, the temperature increase rate is the amount of temperature increase when light having a predetermined power is given for a predetermined time.

  According to this soldering method, the product of the power of light applied to one of the first metal member and the second metal member having a large temperature rise rate and the light absorption rate of the one metal member. That is, the energy application amount is smaller than the energy application amount in the other metal member. Therefore, the temperature increase rate of the first metal member and the temperature increase rate of the second metal member can be made closer to each other. As a result, it is possible to uniformly apply solder to the first metal member and the second metal member.

  In the second step, the solder may be further irradiated with the first light and the second light. According to this soldering method, the temperature rise of the solder can be accelerated. As a result, the time required for soldering is shortened.

  In the second step, the solder may be further irradiated with a third light. Also in this case, since the temperature rise of the solder can be accelerated, the time required for soldering is shortened.

  In the second step, the power of the third light may be reduced before the power of the first light and the second light. In this case, it is possible to prevent the solder temperature from rising excessively. As a result, solder oxidation can be reduced.

  In the second step, the first light is irradiated with the first power for a predetermined time from the start of irradiation, and after the predetermined time has elapsed, the first light is irradiated with the second power, and the second light Is preferably irradiated for a predetermined time from the start of irradiation with the third power, and after the predetermined time has elapsed, the second light is irradiated with the fourth power. Here, the second power is a power for heating the first metal member to a temperature higher than the melting temperature of the solder, and the first power is larger than the second power. The fourth power is a power for heating the second metal member to a temperature higher than the melting temperature of the solder, and the third power is larger than the fourth power. In this case, since the high-power first light and second light are irradiated for a predetermined time from the start of irradiation, the time until the first metal member and the second metal member reach the target temperature. Is shortened. As a result, the time required for soldering is shortened.

  In the second step, the first light is irradiated as a plurality of first spot lights, the second light is irradiated as a plurality of second spot lights, and the second metal member of the first spot lights The power of the spot light is decreased in order from the spot light irradiated to a position near to the position, and the power of the spot light is decreased in order from the spot light irradiated to the position near the first metal member in the second spot light. It is preferable to lower. In this case, since the power of the spot light applied to the portion to which the solder is attached is sequentially reduced, excessive heating of the solder is prevented. In addition, since the outflow speed of the solder in the first metal member and the second metal member is controlled, more uniform soldering is realized.

  A soldering apparatus according to another aspect of the present invention includes: (a) a first region, a second region, and a third region located between the first region and the second region. (B) a second light irradiating means for emitting a second light to the second region, and (c) a first light irradiating means for emitting the first light to the first region. Control means for controlling the power of the first light and the power of the second light. The control means causes the first light irradiating means to irradiate the first light with the first power for a predetermined time from the start of irradiation, and after the predetermined time has elapsed, the first light is smaller than the first power. The second light irradiation means is irradiated with the second light at a third power for a predetermined time from the start of irradiation, and the second light is smaller than the third power after the predetermined time has elapsed. Irradiate with fourth power.

  According to this soldering apparatus, since the first light and the second light with high power are irradiated for a predetermined time from the start of irradiation, the first metal member and the second region provided in the first region The time until the second metal member provided at the target temperature is reached is shortened. As a result, the time required for soldering is shortened.

  The soldering apparatus according to the present invention includes (a) the first region, the second region, and the third region among the third region located between the first region and the second region. 1st light irradiation means which radiate | emits 1st light to 1 area | region, (b) 2nd light irradiation means which radiate | emits 2nd light to 2nd area | region, (c) 1st light And control means for controlling the power of the second light. The first light irradiation unit irradiates the first light as a plurality of first spot lights, and the second light irradiation unit irradiates the second light as a plurality of second spot lights. The control means decreases the power of the spot light sequentially from the spot light irradiated to the position close to the second area of the first spot light, and the position of the second spot light close to the first area The power of the spot light is decreased in order from the spot light irradiated on the surface.

  According to this soldering apparatus, the power of the spot light applied to the portion where the solder adheres in the first metal member provided in the first region and the second metal member provided in the second region is sequentially reduced. Therefore, excessive heating of the solder is prevented. In addition, since the outflow speed of the solder in the first metal member and the second metal member is controlled, more uniform soldering is realized.

  According to the present invention, there is provided a soldering method capable of uniformly attaching solder to two metal members. Further, according to the present invention, a soldering apparatus suitable for the soldering method is provided.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals.

  [First embodiment]

  FIG. 1 is a perspective view schematically showing a soldering apparatus according to a first embodiment of the present invention. A soldering apparatus 10 shown in FIG. 1 uses a solder 16 to connect a first metal member 12 a provided on a first base 12 and a second metal member 14 a provided on a second base 14. It is an apparatus for soldering.

  An example of the first base 12 is a wiring board having an Au terminal as the first metal member 12a. An example of the second substrate 14 is a chip component having an Au terminal as the second metal member 14a. The solder 16 is exemplified by solder containing tin (Sn) such as Sn-3Ag-0.5Cu.

  The soldering apparatus 10 includes a first light irradiation unit 20, a second light irradiation unit 22, and a control unit 24. The first light irradiation unit 20 is a unit that irradiates the first region with the first light L1. The second light irradiation unit 22 is a unit that irradiates the second region with the second light L2.

  Note that there is a third region between the first region and the second region, and in the soldering method using this soldering apparatus 10, solder 16 is provided in the third region as will be described later. Be placed. In addition, the region 12b of the first metal member 12a is disposed in the first region, and the region 14b of the second metal member 14a is disposed in the second region. The region 12b is a region included in the first metal member 12a and excluding the solder supply region 26 to which the solder is supplied, and the region 14b is a region included in the second metal member 14a. This is an area excluding the solder supply area 26.

  The first light irradiation unit 20 includes a light source 20a and a lens 20b. The light source 20a generates the first light L1. The lens 20b receives the first light L1 generated by the light source 20a and irradiates the first region with the first light L1.

  The second light irradiation unit 22 includes a light source 22a and a lens 22b. The light source 22a generates the second light L2. The lens 22b receives the second light L2 generated by the light source 22a and irradiates the second region with the second light L2.

  In addition, instead of the lens 20b and the lens 22b, one lens may be shared by the first light irradiation unit 20 and the second light irradiation unit 22.

  Optical fibers may be provided between the light source 20a and the lens 20b and between the light source 22a and the lens 22b. The lens 20b and the lens 22b may be omitted, and in this case, the emission end of the optical fiber becomes the emission end of the first light irradiation unit 20 and the second light irradiation unit 22.

  Further, a plurality of light sources are used in place of the light source 20a, and the bundle fiber for guiding the light from the plurality of light sources is connected between the plurality of light sources and the lens 20b, respectively, and connected to the exit end of the bundle fiber. A large-diameter optical fiber may be provided. Similarly, a plurality of light sources are used in place of the light source 22a, and are connected between the plurality of light sources and the lens 22b, respectively, with a bundle fiber that guides light from the plurality of light sources and an emission end of the bundle fiber. A large-diameter optical fiber may be provided.

  The first light L1 and the second light L2 preferably have a center wavelength in the wavelength range of 200 nm to 600 nm. FIG. 2 is a diagram showing the wavelength dependence characteristics of the light absorptance of Au and Sn (the main component of Sn-3Ag-0.5Cu). As shown in FIG. 2, the metal member made of Au has a large light absorptance of light having a wavelength of 600 nm or less. Therefore, the first metal member 12a and the second metal member 14a can be efficiently heated by using light having a center wavelength of 600 nm or less as the first light L1 and the second light L2.

  The light source 20a and the light source 22a may be the same type of light source or different light sources. A light source using a semiconductor element can be used as the light source 20a and the light source 22a. As the light source 20a and the light source 22a, a laser diode (LD), a light emitting diode (LED), an LD excitation solid state laser, or the like can be used.

  For example, if the center wavelength is 550 nm or less, a light emitting diode having a center wavelength of 470 nm, which is used as a blue light source for traffic lights and is mass-produced, can be used. Therefore, a soldering apparatus having a high power and low cost light source 10 is realized. If the center wavelength is not less than 390 nm and not more than 420 nm, a laser diode having a center wavelength of 400 nm which is used as a high-density recording type digital video disk light source can be used. The attaching device 10 is realized. When the center wavelength is 370 nm or more, the light becomes visible light, and the irradiation state such as the position of the light and the beam diameter can be easily confirmed by visual observation or a general-purpose visible light camera.

  An example of the laser diode is a blue-violet laser diode having a center wavelength of 400 nm. Examples of the light emitting diode include a GaN LED having a central wavelength of 430 nm, an InGaN LED having a central wavelength of 500 nm, and a GaP LED having a central wavelength of 550 nm. Examples of the LD-pumped solid-state laser include an Nd-YAG third harmonic laser with a center wavelength of 355 nm, an Nd-YAG second harmonic laser with a center wavelength of 532 nm, and the like. Examples of other light sources include a He—Cd gas laser having a central wavelength of 442 nm, an Ar + gas laser having a central wavelength of 488 nm or 515 nm, a KrF excimer laser having a central wavelength of 248 nm, and an XeCl excimer laser having a central wavelength of 308 nm.

  The control unit 24 is a device that controls the first light irradiation unit 20 and the second light irradiation unit 22. The control unit 24 controls the first metal member 12a and the second metal member 14a so that the amount of energy applied to one metal member having a large temperature increase rate is smaller than the amount of energy applied to the other metal member. The light source 20a of the first light irradiation unit 20 and the light source 22a of the second light irradiation unit 22 are controlled.

  Here, the amount of energy applied is the product of the power of light applied to the member and the light absorption rate of the member. The temperature increase rate is the amount of temperature increase of a member when light having a predetermined power is given for a predetermined time. This rate of temperature increase also depends on the shape of the member itself and the substrate on which the member is formed. Therefore, even if the first metal member 12a and the second metal member 14a are made of the same size and the same material, since the formed base materials are different, the temperature increase rates are different.

  The control unit 24 may control the power of light irradiated on the first light irradiation unit 20 and the second light irradiation unit 22 according to time. FIG. 3 is a diagram for explaining temporal control of light power by the control unit. In FIG. 3, (a) shows the change over time of the power of the first light, (b) shows the change over time of the power of the second light, and (c) shows the change over time. The temperature change in the first metal member 12a and the second metal member 14a is shown.

  More specifically, as shown in FIG. 3A, the control unit 24 supplies the first light L1 to the first light irradiation unit 20 with the first power P1 at a predetermined time T1 from the start of irradiation. Irradiate. In addition, the control unit 24 causes the first light irradiation unit 20 to irradiate the first light L1 with the second power P2 after the elapse of the predetermined time T1.

  Here, the second power P2 is the power of the first light L1 for maintaining the first metal member 12a at the target temperature C2 higher than the melting temperature C1 of the solder 16. For example, the second power P2 can be a power for maintaining the first metal member 12a at a target temperature C2 that is 40 ° C. higher than the melting temperature C1 of the solder 16. The first power P1 is larger than the second power P2. When the solder 16 is made of Sn-3Ag-0.5Cu, the melting temperature C1 is 220 ° C., and the target temperature C2 is set to 260 ° C.

  As shown in FIG. 3B, the control unit 24 causes the second light irradiation unit 22 to irradiate the second light L2 with the third power P3 at a predetermined time T1 from the start of irradiation. Moreover, the control part 24 makes the 2nd light irradiation part 22 irradiate the 2nd light L2 with the 4th power P4 after progress of predetermined time T1.

  Here, the fourth power P4 is the power of the second light L2 for maintaining the second metal member 14a at the target temperature C2 higher than the melting temperature C1 of the solder 16. For example, the fourth power P4 can be a power for maintaining the second metal member 14a at the target temperature C2 that is 40 ° C. higher than the melting temperature C1 of the solder 16. Further, the third power P3 is larger than the fourth power P4.

  As shown by the alternate long and short dash line in FIG. 3C, the first light irradiation unit 20 with a constant power for maintaining the first metal member 12a and the second metal member 14a at the target temperature C2. When light is irradiated from the second light irradiation unit 22, the time until the target temperature is stabilized becomes longer.

  On the other hand, as indicated by a solid line in (c) of FIG. 3, the power of light emitted from the first light irradiation unit 20 and the second light irradiation unit 22 is set to a target at a predetermined time from the start of irradiation. By making it larger than the power for maintaining the first metal member 12a and the second metal member 14a at the temperature C1, the time required for soldering can be shortened.

  Next, a soldering method using the soldering apparatus 10 will be described. Reference is now made to FIG.

  <First Step> In this soldering method, first, the second base member 14 is mounted on the first base member 12, thereby arranging the second metal member 14a on the first metal member 12a. To do. An assembly in which the second base material 14 is previously mounted on the first base material 12 may be prepared. Next, the solder 16 is supplied so as to straddle the first metal member 12a and the second metal member 14a. And the area | region 12b of the 1st metal member 12a is arrange | positioned in the 1st area | region where the 1st light L1 is irradiated by the 1st light irradiation part 20. FIG. Moreover, the area | region 14b of the 2nd metal member 14a is arrange | positioned in the 2nd area | region where 2nd light L2 is irradiated by the 2nd light irradiation part 22. FIG.

  <Second Step> Next, the first light irradiation unit 20 emits the first light L1, the second light irradiation unit 22 emits the second light L2, and the first metal member 12a and the second light irradiation unit 22 are irradiated. The solder 16 is melted by heating the second metal member 14a.

  In this second step, the amount of energy applied to one of the first metal member 12a and the second metal member 14a having a large rate of temperature increase is smaller than the amount of energy applied to the other metal member. Are irradiated with the first light L1 and the second light L2. Therefore, it is possible to bring the temperature rise rate of the first metal member 12a close to the temperature rise rate of the second metal member 14a. As a result, the outflow speed of the solder 16 onto the first metal member 12a is close to the outflow speed of the solder 16 onto the second metal member 14a, so that the first metal member 12a and the second metal member 14a The solder 16 adheres uniformly.

  Note that the first light L <b> 1 and the second light L <b> 2 may be applied to the solder 16. FIG. 4 is a diagram for explaining a soldering method according to a modification of the first embodiment of the present invention. As shown in FIG. 4, by irradiating the solder 16 with the first light L1 irradiated from the first light irradiation unit 20 and the second light L2 irradiated from the second light irradiation unit 22, The temperature rise of the solder 16 can be accelerated. As a result, the time required for soldering is shortened.

  [Second Embodiment]

  FIG. 5 is a perspective view schematically showing a soldering apparatus according to the second embodiment of the present invention. Hereinafter, the soldering apparatus 10B shown in FIG. 5 and the soldering method using the soldering apparatus 10B will be described with respect to differences from the first embodiment.

  The soldering apparatus 10 </ b> B further includes a third light irradiation unit 28 in addition to the first light irradiation unit 20 and the second light irradiation unit 22. The third light irradiation unit 28 irradiates the third region with the third light L3. In the third region, the first region irradiated with the first light L1 from the first light irradiation unit 20 and the second region L2 irradiated with the second light L2 from the second light irradiation unit 22 are used. The area between the two areas.

  The third light irradiation unit 28 includes a light source 28a and a lens 28b. The light source 28a generates the third light L3. The lens 28b receives the third light L3 generated by the light source 28a, and irradiates the third region with the third light L3.

  In addition, instead of the lens 20b, the lens 22b, and the lens 28b, one lens may be shared by the first light irradiation unit 20, the second light irradiation unit 22, and the third light irradiation unit 28. .

  Further, optical fibers may be provided between the light source 20a and the lens 20b, between the light source 22a and the lens 22b, and between the light source 28a and the lens 28b, respectively. The lens 20b, the lens 22b, and the lens 28b may be omitted. In this case, the emission end of the optical fiber is the first light irradiation unit 20, the second light irradiation unit 22, and the third light irradiation unit. 28 exit ends.

  Further, a plurality of light sources are used in place of the light source 20a, and the bundle fiber for guiding the light from the plurality of light sources is connected between the plurality of light sources and the lens 20b, respectively, and connected to the exit end of the bundle fiber. A large-diameter optical fiber may be provided. Similarly, a plurality of light sources are used in place of the light source 22a, and are connected between the plurality of light sources and the lens 22b, respectively, with a bundle fiber that guides light from the plurality of light sources and an emission end of the bundle fiber. A large-diameter optical fiber may be provided. Similarly, a plurality of light sources are used in place of the light source 28a, and are connected between the plurality of light sources and the lens 28b, respectively, with a bundle fiber that guides light from the plurality of light sources and an emission end of the bundle fiber. A large-diameter optical fiber may be provided.

  In the soldering method using the soldering apparatus 10B, the solder 16 is disposed in the third region in the first step, and the third light is irradiated on the solder 16 in the second step. This is different from the soldering method of the first embodiment.

  The third light L3 preferably has a center wavelength in the wavelength range of 200 nm to 600 nm. Therefore, a light source similar to the light sources 20a and 22a can be used as the light source 28a.

  As shown in FIG. 2, when the solder 16 is made of Sn-3Ag-0.5Cu, the absorptance in Sn, which is the main component of the solder 16, of light having a central wavelength in the wavelength range of 200 nm to 600 nm is made of Au. It is smaller than the light absorptance of the light of the same wavelength in the first metal member 12a and the second metal member 14a which are terminals. Therefore, by employing light having a center wavelength in the wavelength range of 200 nm to 600 nm as the third light L3, it is possible to suppress an excessive temperature rise of the solder 16. As a result, the temperature of the solder 16 can be appropriately increased.

  [Third Embodiment]

  FIG. 6 is a plan view schematically showing a soldering apparatus according to the third embodiment of the present invention. FIG. 7 is a plan view showing the bundle fiber shown in FIG. The soldering apparatus 10C shown in FIGS. 6 and 7 includes a plurality of light sources 32, a plurality of lenses 34, a bundle fiber 36, and a control unit 42.

  The bundle fiber 36 has a plurality of optical fibers 36a in which the emission ends are two-dimensionally arranged, and a fixing member 36b for fixing the arrangement of the plurality of optical fibers 36a.

  Each of the light sources 32 is optically coupled to one surface of the corresponding lens among the lenses 34, and the other surface of the lens 34 is optically connected to the incident end of the corresponding optical fiber among the optical fibers 36a. Are combined.

  In the soldering apparatus 10C, the first light irradiation unit 38 is configured by the optical fibers 36a included in a plurality of rows on one side, the lens 34 and the light source 32 coupled to the optical fibers 36a. Further, the second light irradiation unit 40 is configured by the optical fibers 36a included in the plurality of rows on the other side, the lens 34 coupled to these optical fibers 36a, and the light source 32.

  FIG. 8 is a perspective view for explaining a soldering apparatus according to a third embodiment of the present invention. As shown in FIG. 8, from the 1st light irradiation part 38, 1st light L1 is irradiated as several 1st spot light S1. Further, the second light irradiation unit 40 emits the second light L1 as a plurality of second spot lights S2.

  Similar to the first embodiment, the first spot light S1 is applied to the first region, and the second spot light S2 is applied to the second region.

  The control unit 42 is a device that controls the first light irradiation unit 38 and the second light irradiation unit 40. The control unit 42 controls the first metal member 12a and the second metal member 14a so that the amount of energy applied to one metal member having a large temperature increase rate is smaller than the amount of energy applied to the other metal member. The light source 32 of the first light irradiation unit 38 and the light source 32 of the second light irradiation unit 40 are controlled.

  FIG. 9 is a perspective view for explaining a soldering apparatus according to a third embodiment of the present invention. FIG. 9 shows the irradiation state of the first spot light S1 and the second spot light S2 after a predetermined time has elapsed from the state shown in FIG. As shown in FIGS. 8 and 9, the control unit 42 can reduce the power of the first spot light S <b> 1 in order from a row close to the second metal member 14 a. That is, the control unit 42 may decrease the power of the first spot light S1 in order from the row closer to the second metal member 14a, or the first spot in order from the row closer to the second metal member 14a. The light S1 may be turned off.

  Further, as shown in FIGS. 8 and 9, the control unit 42 can reduce the power of the second spot light S2 in order from the row close to the first metal member 12a. In other words, the control unit 42 may decrease the power of the second spot light S2 in order from the row closer to the first metal member 12a, or the second spot in order from the row closer to the first metal member 12a. The light S2 may be turned off. It should be noted that the timing for executing the power reduction can be stored in the control unit 42 in advance. This timing is determined in advance according to the outflow speed of the solder 16.

  Hereinafter, a soldering method using the soldering apparatus 10C will be described. Note that the first step in the soldering method of the present embodiment is the same as that of the first embodiment.

  <Second Step> After the first step, the first light irradiation unit 38 irradiates the first spot light S1, the second light irradiation unit 40 irradiates the second spot light S2, and the first step. The solder 16 is melted by heating the first metal member 12a and the second metal member 14a.

  In this second step, the amount of energy applied to one of the first metal member 12a and the second metal member 14a having a large rate of temperature increase is smaller than the amount of energy applied to the other metal member. In addition, the powers of the first spot light S1 and the second spot light S2 are adjusted.

  In the second step, as described above, the power of the first spot light S1 and the power of the second spot light S2 in order from the column closest to the boundary between the first metal member 12a and the second metal member 14a. Is preferably reduced. As a result, the power of the first spot light S1 and the second spot light S2 applied to the portion where the solder 16 has already adhered is reduced, so that an excessive temperature rise of the solder 16 is prevented. As a result, the oxidation of the solder 16 is reduced.

  Also according to the present embodiment described above, the solder can be uniformly attached to the first metal member 12a and the second metal member 14a as in the first and second embodiments. In the present embodiment, since the bundle fiber 36 is used, the layout of the irradiation positions of the first spot light S1 and the second spot light S2 can be easily changed.

  As in the first embodiment, the control unit 42 causes the first light irradiation unit 38 to irradiate the first spot light S1 having the first power for a predetermined time from the start of irradiation, You may irradiate 1st spot light S2 of 2nd power after progress of the said predetermined time. The second power is the power of the first spot light S1 for maintaining the first metal member 12a at the target temperature, and the first power is higher than the second power.

  Further, similarly to the first embodiment, the control unit 42 causes the second light irradiation unit 40 to irradiate the second spot light S2 having the third power for a predetermined time from the start of irradiation, You may irradiate the 2nd spot light S2 of 4th power after progress of the said predetermined time. The fourth power is the power of the second spot light S2 for maintaining the second metal member 14a at the target temperature, and the third power is higher than the fourth power.

  Further, the first spot light S1 and the second spot light S2 may be irradiated to the solder 16 for the first time. In this case, since the temperature rise of the solder 16 is accelerated, the time required for soldering is shortened.

  [Fourth Embodiment]

  FIG. 10 is a plan view schematically showing a soldering apparatus according to the fourth embodiment of the present invention. FIG. 11 is a plan view showing the bundle fiber shown in FIG. FIG. 12 is a perspective view for explaining a soldering apparatus according to a fourth embodiment of the present invention. Hereinafter, the soldering apparatus 10D shown in FIGS. 10, 11, and 12 and the soldering method using the soldering apparatus 10D will be described below with respect to differences from the third embodiment.

  The soldering apparatus 10 </ b> D includes a third light irradiation unit 44 in addition to the first light irradiation unit 38 and the second light irradiation unit 40. The third light irradiation unit 44 includes a plurality of rows arranged between the optical fiber 36 a included in the first light irradiation unit 38 and the optical fiber 36 a included in the second light irradiation unit 40. The optical fiber 36a, the lens 34 and the light source 32 coupled to the optical fiber 36a.

  The third light irradiation unit 44 irradiates the third region with a plurality of spot lights S3 as the third light L3. The third region is a region between the first region and the second region. As the light source 32 included in the third light irradiation unit 44, the same light source as the light sources included in the first light irradiation unit 38 and the second light irradiation unit 40 can be used.

  Hereinafter, the soldering method of the present embodiment using such a soldering apparatus 10D will be described. The first step in the soldering method of the present embodiment is the same as that of the third embodiment. However, in the first step, the solder 16 is disposed in the third region.

  Further, in the second step of the soldering method of the present embodiment, the third spot light S3 is irradiated to the third region. According to this soldering method, since the third spot light S3 is also irradiated to the solder 16, the temperature rise of the solder 16 is accelerated. As a result, the time required for soldering is shortened.

  Note that, similarly to the third embodiment, the power of the first spot light S1 and the power of the second spot light S2 in order from the column closest to the boundary between the first metal member 12a and the second metal member 14a. May be reduced.

  In addition, as in the first embodiment, the control unit 42 causes the first light irradiation unit 38 to irradiate the first spot light S2 having the first power for a predetermined time from the start of irradiation, You may irradiate 1st spot light S2 of 2nd power after progress of the said predetermined time.

FIG. 1 is a perspective view schematically showing a soldering apparatus according to a first embodiment of the present invention. FIG. 2 is a diagram showing the wavelength dependence characteristics of the light absorptance of Au and Sn (the main component of Sn-3Ag-0.5Cu). FIG. 3 is a diagram for explaining temporal control of light power by the control unit. FIG. 4 is a diagram for explaining a soldering method according to a modification of the first embodiment of the present invention. FIG. 5 is a perspective view schematically showing a soldering apparatus according to the second embodiment of the present invention. FIG. 6 is a plan view schematically showing a soldering apparatus according to the third embodiment of the present invention. FIG. 7 is a plan view showing the bundle fiber shown in FIG. FIG. 8 is a perspective view for explaining a soldering apparatus according to a third embodiment of the present invention. FIG. 9 is a perspective view for explaining a soldering apparatus according to a third embodiment of the present invention. FIG. 10 is a plan view schematically showing a soldering apparatus according to the fourth embodiment of the present invention. FIG. 11 is a plan view showing the bundle fiber shown in FIG. FIG. 12 is a perspective view for explaining a soldering apparatus according to a fourth embodiment of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Soldering apparatus, 12 ... 1st base material, 12a ... 1st metal member, 14 ... 2nd base material, 14a ... 2nd metal member, 16 ... Solder, 20 ... 1st light irradiation part 22 ... second light irradiation unit, 24 ... control unit.

Claims (8)

A first step of supplying solder so as to straddle a first metal member provided on the first substrate and a second metal member provided on the second substrate;
A second step of irradiating the first metal member with a first light and irradiating the second metal member with a second light;
Including
The one of the first metal member and the second metal member with respect to the product of the power of the light at the irradiation point of light irradiating one metal member and the light absorptance of the one metal member. The rate of temperature rise of the metal member is the rate of temperature rise of the other metal member with respect to the product of the power of the light at the irradiation point of light irradiating the other metal member and the light absorption rate of the other metal member. big,
The product of the power of the light at the irradiation point of light applied to the one metal member and the absorption rate of the light of the one metal member is the product of the light at the irradiation point of light applied to the other metal member . Smaller than the product of the power and the light absorption rate of the other metal member,
Soldering method.   The soldering method according to claim 1, wherein, in the second step, the solder is further irradiated with the first light and the second light.   The soldering method according to claim 1, wherein in the second step, the solder is further irradiated with a third light. The power of the third light at the irradiation point of the third light is decreased before the power at the irradiation point of the first light and the second light in the second step. The soldering method described. In the second step, the first light is irradiated at the irradiation point with the first power for a predetermined time from the start of irradiation, and after the predetermined time has elapsed, the first light is irradiated at the irradiation point for the second time. Irradiating with the power, irradiating the second light with the third power at the irradiation point for a predetermined time from the start of irradiation, and after the predetermined time has passed, the second light with the fourth power at the irradiation point. Irradiated,
The second power is a power for heating the first metal member to a temperature higher than the melting temperature of the solder,
In the irradiation point of the first light, the first power is larger than the second power,
The fourth power is a power for heating the second metal member to a temperature higher than the melting temperature of the solder,
In the irradiation point of the second light, the third power is larger than the fourth power.
The soldering method as described in any one of Claims 1-4. In the second step, the first light is irradiated as a plurality of first spot lights, the second light is irradiated as a plurality of second spot lights, and among the first spot lights, the The power at the irradiation point of the spot light is decreased sequentially from the spot light irradiated to the position close to the second metal member, and the position close to the first metal member is irradiated among the second spot light. The soldering method according to any one of claims 1 to 4, wherein power at an irradiation point of the spot light is decreased in order from the spot light. The first light is emitted to the first region out of the first region, the second region, and the third region located between the first region and the second region. First light irradiation means;
Second light irradiation means for emitting second light to the second region;
Control means for controlling the power at the irradiation point of the first light and the power at the irradiation point of the second light;
With
Wherein, the first light irradiating means, said first predetermined time period from the start irradiation light is irradiated to the power at the irradiation point is the first power, the following course of the predetermined time the 1 of light, is irradiated to the power at the irradiation point is the first power is less than the second power, the second light irradiating means, during a predetermined time after the start of irradiation of the second light, irradiation is irradiated to the third power at the point, the second light after the lapse of the predetermined time, and irradiates to the power at the irradiation point is the third power is less than the fourth power,
Soldering device. The first light is emitted to the first region out of the first region, the second region, and the third region located between the first region and the second region. First light irradiation means;
Second light irradiation means for emitting second light to the second region;
Control means for controlling the power at the irradiation point of the first light and the power at the irradiation point of the second light;
With
The first light irradiation means irradiates the first light as a plurality of first spot lights,
The second light irradiation means irradiates the second light as a plurality of second spot lights,
The control means reduces the power at the irradiation point of the spot light sequentially from the spot light irradiated to a position close to the second region of the first spot light, and the power of the second spot light Reducing the power at the point of irradiation of the spot light in order from the spot light irradiated at a position close to the first region;
Soldering device.

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