JPH09108827A - Light beam soldering method - Google Patents
Light beam soldering methodInfo
- Publication number
- JPH09108827A JPH09108827A JP27532195A JP27532195A JPH09108827A JP H09108827 A JPH09108827 A JP H09108827A JP 27532195 A JP27532195 A JP 27532195A JP 27532195 A JP27532195 A JP 27532195A JP H09108827 A JPH09108827 A JP H09108827A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- light beam
- soldering
- soldered
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、光ビームを照射し
て半田付けを行う光ビーム半田付け方法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light beam soldering method for irradiating a light beam for soldering.
【０００２】[0002]
【従来の技術】図２は光ビームを用いた半田付け装置の
概要を示している。この半田付け装置は、電源装置１と
ランプハウス２とビームヘッド３とから構成されてい
る。図２において、４はキセノンランプなどのランプ、
５はランプ４からの光を焦点６に集光させる反射鏡、７
は耐熱性の特殊石英バントル光ファイバであり、この光
ファイバ７の一端に設けられた受光端８は上記焦点６部
分に配置されている。９は光ファイバ７の他端に設けら
れた集光レンズであり、光ファイバ７を介して送られた
光ビーム１０はワーク（被半田付け部材）１１に集光さ
れる。ワーク１１の光ビーム１０が照射される部分に糸
半田が供給され、この糸半田が光ビーム１０の照射によ
り溶融しワーク１１が半田付けされるものである。１２
は受光端８へ入射する光を遮光するためのシャッターで
あり、このシャッター１２はモータ１３の駆動力により
回転駆動される。１４は受光端８に入射した光の一部を
フォトダイオード１５の受光部に導くセンシングファイ
バであり、フォトダイオード１５によって光ビーム１０
の強さが検出される。フォトダイオード１５の出力はラ
ンプハウスコントローラ１６に送られ、フォトダイオー
ド１５の出力に応じてランプ４に印加する電圧が調整さ
れ、ランプ４の発光の強さが制御されるため、光ビーム
１０の強さが常に一定に保持される。１７，１８，１９
はそれぞれランプ４のＸ軸、Ｙ軸、Ｚ軸方向の位置を調
整するためのモータ、２０はモータ冷却用のファンであ
る。2. Description of the Related Art FIG. 2 shows an outline of a soldering device using a light beam. This soldering device comprises a power supply device 1, a lamp house 2 and a beam head 3. In FIG. 2, 4 is a lamp such as a xenon lamp,
Reference numeral 5 is a reflecting mirror for focusing the light from the lamp 4 on the focal point 6, and 7
Is a heat-resistant special quartz buntle optical fiber, and the light receiving end 8 provided at one end of the optical fiber 7 is arranged at the focal point 6 portion. Reference numeral 9 denotes a condenser lens provided at the other end of the optical fiber 7, and the light beam 10 sent via the optical fiber 7 is condensed on a work (member to be soldered) 11. The solder wire is supplied to a portion of the work 11 irradiated with the light beam 10, and the solder wire is melted by the irradiation of the light beam 10 and the work 11 is soldered. 12
Is a shutter for blocking the light incident on the light receiving end 8, and the shutter 12 is rotationally driven by the driving force of the motor 13. Reference numeral 14 is a sensing fiber that guides a part of the light incident on the light receiving end 8 to the light receiving portion of the photodiode 15.
Is detected. The output of the photodiode 15 is sent to the lamp house controller 16, the voltage applied to the lamp 4 is adjusted according to the output of the photodiode 15, and the emission intensity of the lamp 4 is controlled, so that the intensity of the light beam 10 is increased. Is always kept constant. 17, 18, 19
Is a motor for adjusting the position of the lamp 4 in the X-axis, Y-axis, and Z-axis directions, and 20 is a fan for cooling the motor.
【０００３】図３、図４は、光ビームを用いた半田付け
装置を示している。図３、図４において、１は電源装
置、２はランプハウス、３はビームヘッド、７は光ファ
イバ、９は集光レンズ、１０は光ビームである。また、
２１は糸半田２２が巻かれたリール、２３は半田送り装
置であり、リール２１に巻かれた糸半田２２はこの半田
送り装置２３によって供給される。２４は糸半田２２を
案内するガイドパイプ、２５はガイドパイプ２４の先端
部を保持した移動部材であり、この移動部材２５はガイ
ドレール２６に案内されて円弧状に移動することができ
る。ガイドレール２６に沿って移動部材２５を移動させ
ると、ガイドパイプ２４の先端部が移動し糸半田２２の
供給位置が変更されるものである。3 and 4 show a soldering device using a light beam. 3 and 4, 1 is a power supply device, 2 is a lamp house, 3 is a beam head, 7 is an optical fiber, 9 is a condenser lens, and 10 is a light beam. Also,
21 is a reel on which the thread solder 22 is wound, 23 is a solder feeding device, and the thread solder 22 wound on the reel 21 is supplied by the solder feeding device 23. Reference numeral 24 is a guide pipe that guides the solder wire 22, and 25 is a moving member that holds the tip of the guide pipe 24. The moving member 25 can be guided by the guide rail 26 and move in an arc shape. When the moving member 25 is moved along the guide rail 26, the tip portion of the guide pipe 24 moves and the supply position of the thread solder 22 is changed.
【０００４】図３において、光ビーム１０の集光部分に
ワークを配置するとともに、糸半田２２を供給すると、
糸半田２２が光ビーム１０によって溶融されワークが半
田付けされるものである。In FIG. 3, when the work is arranged at the condensing portion of the light beam 10 and the thread solder 22 is supplied,
The wire solder 22 is melted by the light beam 10 and the work is soldered.
【０００５】図５は従来の装置により光ビームをワーク
に照射した場合の光ビームの照射時間とワークの昇温温
度との関係を示したものであり、ワークのヒートキャパ
シテイーによって昇温特性が異なり、ヒートキャパシテ
イーの大きなワーク（ａ）とヒートキャパシテイーの小
さなワーク（ｂ）とでは、照射時間が長くなるとワーク
の温度差（ΔＴ）が大きくなる。このため、光ビームの
照射時間と糸半田の供給タイミング、ワークのヒートキ
ャパシテイーの差などにより、半田付けに微妙な影響を
与え、半田付けが安定しないものであった。FIG. 5 shows the relationship between the irradiation time of the light beam and the temperature rising temperature of the work when the light beam is irradiated onto the work by the conventional apparatus. The temperature rising characteristic depends on the heat capacity of the work. In contrast, between the work (a) having a large heat capacity and the work (b) having a small heat capacity, the temperature difference (ΔT) between the works increases as the irradiation time increases. For this reason, the soldering is not stable because the irradiation time of the light beam, the timing of supplying the thread solder, the difference in the heat capacity of the work, and the like have a delicate influence on the soldering.
【０００６】図６（ａ）、（ｂ）、（ｃ）は、上記従来
装置による半田付けの過程を示している。図６（ａ）に
示すように、ワーク２７とワーク２８の半田付け部分に
光ビーム１０を照射するとともに、半田送り装置２３に
よって糸半田２２を半田付け部分に供給する。図６
（ｂ）に示すように、照射された光ビーム１０中に糸半
田２２の先端２２Ａをワーク２７，２８の半田付け部分
に向かって挿入すると、糸半田２２の先端２２Ａがワー
ク２７，２８に達する前に溶融し、溶融半田がその表面
張力によって丸くなり、ワーク２７，２８に溶融半田が
十分流れなくなり半田付けの不安定の要因になってい
た。また、図６（ｃ）に示すように、糸半田２２の先端
が光ビーム１０に挿入する際に半田の溶融位置にバラツ
キが生じるため、糸半田２２のワーク上での滑り方にバ
ラツキが発生し、半田付け不安定の要因となるものであ
った。FIGS. 6A, 6B and 6C show the process of soldering by the conventional device. As shown in FIG. 6A, the soldering portions of the work 27 and the work 28 are irradiated with the light beam 10, and the solder feeding device 23 supplies the thread solder 22 to the soldering portions. FIG.
As shown in (b), when the tip 22A of the thread solder 22 is inserted into the irradiated light beam 10 toward the soldering portions of the works 27, 28, the tip 22A of the thread solder 22 reaches the works 27, 28. It melted before, and the molten solder became round due to the surface tension, and the molten solder did not flow sufficiently to the works 27 and 28, which was a cause of instability of soldering. Further, as shown in FIG. 6C, when the tip of the thread solder 22 is inserted into the light beam 10, variations occur in the melting position of the solder, which causes variations in the way the thread solder 22 slides on the work. However, this is a cause of unstable soldering.
【０００７】また、従来装置では、ワークのヒートキャ
パシテイーに差があると、ヒートキャパシテイーの大き
いワークが暖まる前にヒートキャパシテイーの小さなワ
ークが酸化していしまい半田付けができなくなる（濡れ
なくなる）ものであった。また、糸半田が振動すると糸
半田の先端の光ビームへの突入位置、突入量が変わり、
半田付け位置にバラツキが発生するものであった。Further, in the conventional apparatus, if there is a difference in the heat capacities of the workpieces, the workpieces with a small heat capacity are oxidized before the workpieces with a large heat capacity are warmed up, and soldering becomes impossible (no wetting). It was a thing. Also, when the solder wire vibrates, the position and amount of penetration of the tip of the solder wire into the light beam change,
There were variations in the soldering position.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、上記従
来の光ビームによる半田付け方法は、照射されている光
ビームの中に糸半田をワークに向けて突入させているた
め、半田付けが安定しない問題があった。However, in the above-described conventional light beam soldering method, the soldering is not stable because the thread solder is rushed into the irradiated light beam toward the workpiece. was there.
【０００９】本発明は、上記従来の問題点を解決するも
のであり、安定した半田付けができる光ビーム半田付け
方法を提供することを目的とするものである。The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a light beam soldering method capable of stable soldering.
【００１０】[0010]
【課題を解決するための手段】上記課題を解決するため
に、請求項１に記載の発明は、糸半田の先端を被半田付
け部材に当接させた状態で、上記糸半田の先端に光ビー
ムを照射して上記糸半田を溶融させて半田付けを行うこ
とを特徴とするものである。In order to solve the above-mentioned problems, the invention according to claim 1 is characterized in that the tip of the solder wire is exposed to the member to be soldered while the tip of the solder wire is exposed to light. It is characterized by irradiating a beam to melt the above-mentioned thread solder and perform soldering.
【００１１】請求項２に記載の発明は、糸半田にバネ力
を作用させることにより上記糸半田の先端を被半田付け
部材に当接させた状態で、上記糸半田の先端に光ビーム
を照射して上記糸半田を溶融させて半田付けを行うこと
を特徴とするものである。According to a second aspect of the invention, the tip of the solder wire is irradiated with a light beam in a state where the tip of the solder solder is brought into contact with the member to be soldered by applying a spring force to the solder solder. Then, the above-mentioned thread solder is melted and soldered.
【００１２】請求項３に記載の発明は、糸半田にバネ力
を作用させることにより上記糸半田の先端を被半田付け
部材に当接させることにより被半田付け部材を密着させ
た状態で、上記糸半田の先端に光ビームを照射して上記
糸半田を溶融させて半田付けを行うことを特徴とするも
のである。According to a third aspect of the present invention, a spring force is exerted on the solder wire to bring the tip of the solder wire into contact with the member to be soldered, so that the member to be soldered is brought into close contact with the soldered member. It is characterized in that the tip of the wire solder is irradiated with a light beam to melt the wire solder and perform soldering.
【００１３】請求項４に記載の発明は、糸半田の先端を
ヒートキャパシテイーの異なる被半田付け部材に当接さ
せた状態で、上記糸半田の影が上記ヒートキャパシテイ
ーの小さな被半田付け部材にできる方向から、光ビーム
を上記糸半田の先端に照射して上記糸半田を溶融させて
半田付けを行うことを特徴とするものである。According to a fourth aspect of the present invention, in the state where the tip of the thread solder is brought into contact with the soldered members having different heat capacities, the shadow of the thread solder has a small heat capacity. In this direction, the tip of the solder wire is irradiated with a light beam from a direction that can be set to melt the solder wire and soldering is performed.
【００１４】これにより、被半田付け部材に安定した半
田付けができる光ビーム半田付け方法を提供することが
できる。Thus, it is possible to provide a light beam soldering method capable of performing stable soldering on a member to be soldered.
【００１５】[0015]
【発明の実施の形態】本発明の請求項１に記載の発明
は、糸半田の先端を被半田付け部材に当接させた後に光
ビームを照射するため、糸半田の溶融起点が一定となり
安定した半田付けが可能となる。According to the first aspect of the present invention, since the light beam is irradiated after the tip of the solder wire is brought into contact with the member to be soldered, the melting origin of the solder wire is constant and stable. Soldering is possible.
【００１６】また、請求項２に記載の発明は、バネ力に
より糸半田を被半田付け部材に当接させた後に光ビーム
を照射するため、被半田付け部材が密着し、また糸半田
の溶融起点が一定となり、安定した半田付けができる。According to the second aspect of the present invention, since the light beam is emitted after the thread solder is brought into contact with the member to be soldered by the spring force, the member to be soldered adheres to the member to be soldered and the solder wire melts. The starting point is constant and stable soldering is possible.
【００１７】また、請求項３に記載の発明は、糸半田に
印加されたバネ力により被半田付け部材間が密着した状
態で半田付けができる。According to the third aspect of the invention, soldering can be performed in a state where the members to be soldered are in close contact with each other by the spring force applied to the thread solder.
【００１８】また、請求項４に記載の発明は、ヒートキ
ャパシテイーの小さな被半田付け部材の昇温し過ぎが防
止でき、また被半田付け部材が密着された状態で半田付
けされるため、ヒートキャパシテイーの異なる被半田付
け部材同志の半田付けが安定になるものである。Further, in the invention according to claim 4, the temperature of the soldered member having a small heat capacity can be prevented from rising excessively, and the soldered member is soldered in a closely contacted state. The soldering of members to be soldered with different capacities becomes stable.
【００１９】以下、本発明の実施の形態について図１
（ａ）〜（ｅ）とともに説明する。 （実施の形態１）図１は、本発明の実施の形態における
光ビーム半田付け方法を示す要部拡大図である。図１
（ａ）において、３０は糸半田２２が挿入される孔を有
する部材、３１は部材３０をワーク２７，２８方向に付
勢するバネであり、このバネ３１の力によって糸半田２
２は矢印Ａ方向に付勢され糸半田２２の先端はワーク２
７，２８の半田付け部分に押圧される。この糸半田のワ
ーク２７，２８への押圧力によりワーク２７と２８との
半田付け部分は密着される。３２は糸半田２２内に封入
されたフラックスである。FIG. 1 shows an embodiment of the present invention.
It will be described together with (a) to (e). (Embodiment 1) FIG. 1 is an enlarged view of a main part showing a light beam soldering method according to an embodiment of the present invention. FIG.
In (a), 30 is a member having a hole into which the thread solder 22 is inserted, 31 is a spring for urging the member 30 toward the works 27, 28, and the force of the spring 31 causes the thread solder 2 to move.
2 is urged in the direction of arrow A, and the tip of the thread solder 22 is the work 2
It is pressed against the soldering portions of 7, 28. The soldering portions of the works 27 and 28 are brought into close contact with each other by the pressing force of the thread solder on the works 27 and 28. 32 is a flux enclosed in the solder wire 22.
【００２０】この状態で図１（ｂ）に示すように半田付
け部分に光ビーム１０を照射し糸半田２２を溶融させ
る。この場合、光ビーム１０の照射方向は、ヒートキャ
パシテイーの小さなワーク２８に糸半田２２の影ができ
る方向である。このような方向から光ビーム２２を照射
すると、ヒートキャパシテイーの大きなワーク２７との
ヒートバランスがとれ半田付け性が安定するものであ
る。このように、糸半田２２はワーク２７，２８と密着
した状態で溶融され、この溶融半田が図１（ｃ）に示す
ようにワーク２７，２８の側に流れ出すのに追従してバ
ネ３１の力によって糸半田２２が矢印Ａ方向に供給され
るため、ワーク２７，２８への半田濡れ性が安定する。
糸半田２２が予め設定された量だけ供給されると、図１
（ｄ）に示すように、糸半田２２は矢印Ｂの方向に戻さ
れ、図１（ｅ）に示す状態で半田付けが完了する。In this state, as shown in FIG. 1B, the soldered portion is irradiated with the light beam 10 to melt the thread solder 22. In this case, the irradiation direction of the light beam 10 is a direction in which the thread solder 22 is shaded on the work 28 having a small heat capacity. When the light beam 22 is irradiated from such a direction, the heat balance with the work 27 having a large heat capacity can be obtained and the solderability can be stabilized. In this way, the solder wire 22 is melted in a state of being in close contact with the works 27, 28, and the force of the spring 31 follows as the melted solder flows toward the works 27, 28 as shown in FIG. 1C. Since the thread solder 22 is supplied in the direction of arrow A, the wettability of the solder to the works 27, 28 is stabilized.
When the soldering solder 22 is supplied in a preset amount, as shown in FIG.
As shown in (d), the thread solder 22 is returned in the direction of the arrow B, and soldering is completed in the state shown in FIG. 1 (e).
【００２１】このように上記実施の形態では、糸半田２
２にバネ３１の力を作用させ、この糸半田２２をワーク
２７，２８に接触させているため、常にワーク同志を密
着させた状態で光ビームを照射して半田付けを行うこと
ができ、安定した半田付けを行うことができる。またワ
ーク同志を密着させた状態で半田付けを行うため、ヒー
トキャパシテイーの異なるワークでも一方のワークだけ
が昇温し過ぎることが無くなり、熱伝導を均一化しなが
ら半田付けができ安定した半田付けを行うことができ
る。また、光ビーム１０の照射方向をヒートキャパシテ
イーの小さなワークに糸半田の影ができる方向にしてい
るため、ヒートキャパシテイーの小さなワークが昇温し
にくくなり、ヒートキャパシテイーに差のあるワーク同
志の半田付けでもヒートバランスをとりながら安定した
半田付けが可能となる。さらに、上記実施例では、糸半
田２２を予めワークに接触するように供給しておいてか
ら、光ビームを供給するため、糸半田２２の溶融起点を
常に一定にすることができ、従来例のように光ビームの
中に糸半田を突入させる場合に生じる溶融起点のバラツ
キは発生せず安定した半田付けが可能となるものであ
る。As described above, in the above embodiment, the thread solder 2 is used.
Since the force of the spring 31 is applied to 2 and the thread solder 22 is brought into contact with the works 27 and 28, it is possible to irradiate a light beam and perform soldering while the works are always in close contact with each other, which is stable. Soldering can be performed. In addition, since soldering is performed in a state where the works are in close contact with each other, even if the work with different heat capacities does not become too hot, only one work can be soldered while uniform heat conduction and stable soldering. It can be carried out. Further, since the irradiation direction of the light beam 10 is set such that the shadow of the wire solder is formed on the work having a small heat capacity, it is difficult for the work having a small heat capacity to rise in temperature, and the works having different heat capacities are different from each other. Even when soldering, stable soldering is possible while maintaining heat balance. Further, in the above-described embodiment, since the thread solder 22 is supplied in advance so as to come into contact with the work, and then the light beam is supplied, the melting start point of the thread solder 22 can be made constant at all times. As described above, there is no variation in the melting start point that occurs when the thread solder is thrust into the light beam, and stable soldering is possible.
【００２２】[0022]
【発明の効果】以上のように、請求項１に記載の発明に
よれば、糸半田の先端を被半田付け部材に当接させた状
態で光ビームを照射するため、糸半田の溶融起点が一定
となり安定した半田付けが可能となるものである。ま
た、従来例のように糸半田の光ビームへの突入位置、突
入量の変化に起因する半田付け位置のバラツキが生じな
い利点を有するものである。As described above, according to the first aspect of the present invention, since the light beam is radiated in the state where the tip of the solder wire is in contact with the member to be soldered, the melting start point of the solder wire is It becomes constant and stable soldering is possible. Further, unlike the conventional example, there is an advantage that variation in the soldering position due to a change in the position of the solder paste into the light beam and the amount of protrusion does not occur.
【００２３】また、請求項２に記載の発明によれば、バ
ネ力により糸半田の先端を被半田付け部材に押圧した状
態で半田付けを行うことができるため、半田付けがより
安定する利点があるものである。According to the second aspect of the invention, since the soldering can be performed while the tip of the solder wire is pressed against the soldered member by the spring force, there is an advantage that the soldering is more stable. There is something.
【００２４】また、請求項３に記載の発明によれば、糸
半田に作用したバネ力によって被半田付け部材間が密着
するため、被半田付け部材間の半田付けを確実に、かつ
安定して行うことができるものである。According to the third aspect of the present invention, the spring force acting on the thread solder causes the members to be soldered to come into close contact with each other, so that the soldering of the members to be soldered can be performed reliably and stably. Is what you can do.
【００２５】さらに、請求項４に記載の発明によれば、
ヒートキャパシテイーの異なる被半田付け部材間の半田
付けが安定に行える利点を有するものである。Further, according to the invention described in claim 4,
This has an advantage that stable soldering can be performed between soldered members having different heat capacities.
【図１】本発明の実施の形態例における光ビーム半田付
け方法を示す要部拡大図FIG. 1 is an enlarged view of essential parts showing a light beam soldering method according to an embodiment of the present invention.
【図２】光ビーム半田付け装置の概要を示す構成図FIG. 2 is a configuration diagram showing an outline of a light beam soldering device.
【図３】従来の光ビーム半田付け装置の正面図FIG. 3 is a front view of a conventional light beam soldering device.
【図４】同従来例の側面図FIG. 4 is a side view of the conventional example.
【図５】光ビーム半田付け装置による被半田付け部材の
昇温温度特性を示す特性図FIG. 5 is a characteristic diagram showing a temperature rise temperature characteristic of a member to be soldered by a light beam soldering device.
【図６】従来の光ビーム半田付け方法を示す要部拡大図FIG. 6 is an enlarged view of a main part showing a conventional light beam soldering method.
１０ 光ビーム ２２ 糸半田 ２７，２８ ワーク（被半田付け部材） ３１ バネ 10 light beam 22 thread solder 27, 28 work (member to be soldered) 31 spring
Claims (4)
せた状態で、上記糸半田の先端に光ビームを照射して上
記糸半田を溶融させて半田付けを行うことを特徴とする
光ビーム半田付け方法。1. The soldering is performed by irradiating the tip of the thread solder with a light beam to melt the thread solder while the tip of the thread solder is in contact with a member to be soldered. Light beam soldering method.
上記糸半田の先端を被半田付け部材に当接させた状態
で、上記糸半田の先端に光ビームを照射して上記糸半田
を溶融させて半田付けを行うことを特徴とする請求項１
記載の光ビーム半田付け方法。2. The tip of the solder wire is melted by irradiating a light beam to the tip of the solder solder while the tip of the solder solder is brought into contact with a member to be soldered by applying a spring force to the solder solder. The soldering is carried out by performing the soldering.
The described light beam soldering method.
上記糸半田の先端を被半田付け部材に当接させることに
より被半田付け部材を密着させた状態で、上記糸半田の
先端に光ビームを照射して上記糸半田を溶融させて半田
付けを行うことを特徴とする請求項１記載の光ビーム半
田付け方法。3. A light beam is applied to the tip of the thread solder in a state where the tip of the thread solder is brought into contact with the member to be soldered by applying a spring force to the thread solder to bring the member to be soldered into close contact. 2. The light beam soldering method according to claim 1, wherein the soldering is performed by irradiating the wire solder to melt the thread solder.
異なる被半田付け部材に当接させた状態で、上記糸半田
の影が上記ヒートキャパシテイーの小さな被半田付け部
材にできる方向から、光ビームを上記糸半田の先端に照
射して上記糸半田を溶融させて半田付けを行うことを特
徴とする光ビーム半田付け方法。4. A light beam from a direction in which the shadow of the solder wire is formed on the soldered member having a small heat capacity with the tip of the solder solder abutting on the soldered member having a different heat capacity. Is applied to the tip of the thread solder to melt the thread solder for soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27532195A JP3171071B2 (en) | 1995-10-24 | 1995-10-24 | Light beam soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27532195A JP3171071B2 (en) | 1995-10-24 | 1995-10-24 | Light beam soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09108827A true JPH09108827A (en) | 1997-04-28 |
| JP3171071B2 JP3171071B2 (en) | 2001-05-28 |
Family
ID=17553827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27532195A Expired - Fee Related JP3171071B2 (en) | 1995-10-24 | 1995-10-24 | Light beam soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3171071B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007067168A (en) * | 2005-08-31 | 2007-03-15 | Fujifilm Corp | Laser soldering method and laser soldering equipment |
| JP2009090360A (en) * | 2007-10-11 | 2009-04-30 | Toyota Motor Corp | Laser brazing device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102375780B1 (en) * | 2020-07-09 | 2022-03-18 | 노경현 | Exhibition Showcase |
-
1995
- 1995-10-24 JP JP27532195A patent/JP3171071B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007067168A (en) * | 2005-08-31 | 2007-03-15 | Fujifilm Corp | Laser soldering method and laser soldering equipment |
| JP2009090360A (en) * | 2007-10-11 | 2009-04-30 | Toyota Motor Corp | Laser brazing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3171071B2 (en) | 2001-05-28 |
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