JP2013098539A - Inductor - Google Patents
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- JP2013098539A JP2013098539A JP2012180439A JP2012180439A JP2013098539A JP 2013098539 A JP2013098539 A JP 2013098539A JP 2012180439 A JP2012180439 A JP 2012180439A JP 2012180439 A JP2012180439 A JP 2012180439A JP 2013098539 A JP2013098539 A JP 2013098539A
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 14
- 239000010931 gold Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 230000005855 radiation Effects 0.000 abstract description 9
- 230000000903 blocking effect Effects 0.000 abstract 5
- 238000000034 method Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012946 outsourcing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
- H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/02—Fixed inductances of the signal type without magnetic core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
- H05K9/0033—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids disposed on both PCB faces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
Abstract
Description
本発明は、インダクタに関する。 The present invention relates to an inductor.
電気及び電子回路において、一般的に使われる受動素子は、抵抗、キャパシタ、インダクタに大別することができる。そのうち、キャパシタとインダクタは、エネルギーを保存及び供給することができる最も基本的な素子であり、周波数特性を持つため、使用する周波数、電圧または電流によって使用材料が違わなければならない。 In electrical and electronic circuits, passive elements that are generally used can be broadly classified into resistors, capacitors, and inductors. Among these, capacitors and inductors are the most basic elements that can store and supply energy, and have frequency characteristics, so that materials used must be different depending on the frequency, voltage, or current used.
一方、最近の電子器機は、小型化、軽量化及び薄型化しており、このような器機に使われている受動素子も製造技術及び設計技術の発達によってさらに小型化されている。特に、前述したキャパシタ及びインダクタの小型化は、製品のサイズを決定する重要な基準となることもある。 On the other hand, recent electronic devices have been reduced in size, weight and thickness, and passive elements used in such devices have been further downsized due to the development of manufacturing technology and design technology. In particular, the above-described miniaturization of capacitors and inductors may be an important criterion for determining the size of a product.
このうち、インダクタは、他の受動素子とは異なり、低電力の信号用に使われている極めて一部の場合を除けばレディーメードがないため、インダクタを要する場合、設計、製作、試験、評価、外注などの多くの段階を経て採用する場合が一般的である。 Of these, unlike other passive components, inductors are not ready-made except in very few cases where they are used for low-power signals. Therefore, when inductors are required, they are designed, manufactured, tested, and evaluated. In many cases, it is adopted after many stages such as outsourcing.
そして、二つ以上のインダクタを一つのコア（ｃｏｒｅ）に共有させれば変圧器となり、変圧器は、一般的に電気的絶縁、インピーダンスの変換、電圧及び電流の大きさ変換、フィルターなどの目的で用いられる重要な素子である。 And if two or more inductors are shared by one core, it becomes a transformer, and the transformer is generally used for electrical insulation, impedance conversion, voltage and current magnitude conversion, filter, etc. It is an important element used in the above.
したがって、インダクタと変圧器は、コアに巻線を行うので基本的に同じ構造を持っているが、用途には大きな差がある。 Therefore, the inductor and the transformer have basically the same structure because they are wound around the core, but there is a great difference in application.
従来のＩＣパッケージやプリント基板に使用されているインダクタの構造は、基板の外層にマイクロストリップで構成される２Ｄ形態をなしており、インダクタをマイクロストリップとともにパターンで具現するためには、線路を長くしても可能であるが、空間的制約があるので、主に螺旋状（ｓｐｉｒａｌ）、蛇行状（ｍｅａｎｄｅｒ）、ループ状（ｌｏｏｐ）に具現できる。 Inductor structures used in conventional IC packages and printed circuit boards have a 2D configuration consisting of microstrips on the outer layer of the board. To implement the inductors with microstrips in a pattern, the lines must be long. However, since there is a spatial restriction, it can be implemented mainly in a spiral shape, a meander shape, and a loop shape.
このうち、螺旋状インダクタ（ｓｐｉｒａｌ ｉｎｄｕｃｔｏｒ）が、特許文献１に開示されている。 Among these, a spiral inductor is disclosed in Patent Document 1.
このような螺旋状インダクタ（ｓｐｉｒａｌ ｉｎｄｕｃｔｏｒ）は、長いパターンの形成に有利であるので多く使われ、一方向に同心円をなすので、相互インダクタンスにおいて同一方向に磁場が加わるため、小さなサイズでも高いインダクタンス値を作り出すことができる利点があるが、図６及び図７のように、上下左右に電磁波妨害（ＥｌｅｃｔｒｏＭａｇｎｅｔｉｃ Ｉｎｔｅｒｆｅｒｅｎｃｅ：ＥＭＩ）ノイズ放射がより多く発生する欠点を有する。 Such a spiral inductor is often used because it is advantageous for forming a long pattern, and since a concentric circle is formed in one direction, a magnetic field is applied in the same direction in mutual inductance, so that even a small size has a high inductance value. 6 and FIG. 7, there is a disadvantage that more electromagnetic interference (EMI) noise radiation occurs vertically and horizontally as shown in FIGS. 6 and 7.
本発明は前述した従来技術の問題点を解決するためになされたもので、本発明の目的は、電磁波妨害（ＥＭＩ）ノイズ放射を遮蔽するインダクタを提供することである。 The present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide an inductor that shields electromagnetic interference (EMI) noise radiation.
本発明の一面によるインダクタは、インダクタ用パターン、前記インダクタ用パターンの上部及び下部に離隔して形成される一対の遮蔽板、及び前記一対の遮蔽板を電気的に連結する複数の遮蔽用ビアを含む。 An inductor according to an aspect of the present invention includes an inductor pattern, a pair of shielding plates formed separately above and below the inductor pattern, and a plurality of shielding vias that electrically connect the pair of shielding plates. Including.
この際、前記一対の遮蔽板は、互いに平行であることが好ましい。 At this time, the pair of shielding plates are preferably parallel to each other.
また、前記遮蔽板は、板状であってもよい。 The shielding plate may be plate-shaped.
また、前記遮蔽板の面積は、前記インダクタ用パターンの表面積より大きくなることが好ましい。 The area of the shielding plate is preferably larger than the surface area of the inductor pattern.
また、前記遮蔽板は、銀（Ａｇ）、パラジウム（Ｐｄ）、銅（Ｃｕ）、ニッケル（Ｎｉ）または金（Ａｕ）でなることが好ましい。 The shielding plate is preferably made of silver (Ag), palladium (Pd), copper (Cu), nickel (Ni) or gold (Au).
また、前記複数の遮蔽用ビアは、前記一対の遮蔽板の間に形成され、前記一対の遮蔽板の縁部を連結するように形成されることが好ましい。 The plurality of shielding vias are preferably formed between the pair of shielding plates so as to connect edges of the pair of shielding plates.
また、前記複数の遮蔽用ビアは、前記インダクタ用パターン側部から離隔して形成されることが好ましい。 The plurality of shielding vias are preferably formed apart from the inductor pattern side.
また、前記インダクタ用パターンは、螺旋状であってもよい。 The inductor pattern may be spiral.
また、前記インダクタ用パターンは、複数のコイルパターン及び前記複数のコイルパターンの間を電気的に連結するための複数のコイルビアを含むことが好ましい。 The inductor pattern preferably includes a plurality of coil patterns and a plurality of coil vias for electrically connecting the plurality of coil patterns.
この際、前記コイルパターンは、銀（Ａｇ）、パラジウム（Ｐｄ）、銅（Ｃｕ）、ニッケル（Ｎｉ）または金（Ａｕ）でなることが好ましい。 At this time, the coil pattern is preferably made of silver (Ag), palladium (Pd), copper (Cu), nickel (Ni) or gold (Au).
本発明の特徴及び利点は、添付図面に基づいた以降の詳細な説明からより明らかになるであろう。 The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.
本発明の詳細な説明に先立ち、本明細書及び特許請求の範囲に使用された用語や単語は、通常的で辞書的な意味に解釈されてはいけなく、発明者がその自分の発明を最良の方法で説明するために用語の概念を適切に定義することができるという原則にしたがって本発明の技術的思想にかなう意味と概念に解釈されなければならない。 Prior to the detailed description of the invention, the terms and words used in the specification and claims should not be construed in the usual lexicographic sense, and the inventor shall best understand his or her invention. In order to explain in this method, the concept of the term should be construed in accordance with the principle and concept that meet the technical idea of the present invention.
本発明は、インダクタ用パターンの上部及び下部に遮蔽板を形成し、上部及び下部の遮蔽板の縁部を遮蔽用ビアで連結して前記インダクタ用パターンを前記遮蔽板と遮蔽用ビアで取り囲むことで、前記インダクタ用パターンで上下左右に放射される電磁波妨害（ＥＭＩ）ノイズを遮蔽することができる効果がある。 According to the present invention, shielding plates are formed on the upper and lower portions of the inductor pattern, the edges of the upper and lower shielding plates are connected by shielding vias, and the inductor pattern is surrounded by the shielding plates and shielding vias. Thus, the inductor pattern has an effect of shielding electromagnetic interference (EMI) noise radiated vertically and horizontally.
また、本発明は、前述したように、インダクタ用パターンから放射されるＥＭＩノイズを遮蔽することにより、周辺回路に及ぶノイズを最小化することができる効果がある。 In addition, as described above, the present invention has an effect of minimizing noise reaching the peripheral circuit by shielding the EMI noise radiated from the inductor pattern.
本発明の目的、特定の長所及び新規の特徴は、添付図面に係る以下の詳細な説明及び好ましい実施例によってさらに明らかになるであろう。本明細書において、各図面の構成要素に参照番号を付け加えるに際し、同一の構成要素に限っては、たとえ異なる図面に示されても、できるだけ同一の番号を付けるようにしていることに留意しなければならない。また、「第１」、「第２」などの用語は、一つの構成要素を他の構成要素から区別するために用いられるものであり、構成要素が前記用語によって限定されるものではない。以下、本発明を説明するにあたり、本発明の要旨をあいまいにする可能性がある係る公知技術についての詳細な説明は省略する。 Objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments with reference to the accompanying drawings. In this specification, it should be noted that when adding reference numerals to the components of each drawing, the same components are given the same number as much as possible even if they are shown in different drawings. I must. Moreover, terms such as “first” and “second” are used to distinguish one component from other components, and the component is not limited by the terms. Hereinafter, in describing the present invention, detailed descriptions of known techniques that may obscure the subject matter of the present invention are omitted.
以下、添付図面に基づいて、本発明の実施形態を詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
図１は、本発明の一実施例によるインダクタの構造を示す平面図、図２は、本発明の一実施例によるインダクタの構造を示す斜視図、図３は、本発明の一実施例によるインダクタの構造を示す側面図、図４及び図５は、本発明の一実施例によるインダクタにおけるＥＭＩ放射特性を示す写真である。 1 is a plan view showing the structure of an inductor according to an embodiment of the present invention, FIG. 2 is a perspective view showing the structure of an inductor according to an embodiment of the present invention, and FIG. 3 is an inductor according to an embodiment of the present invention. FIGS. 4 and 5 are photographs showing EMI radiation characteristics of an inductor according to an embodiment of the present invention.
図１を参照すれば、本発明の一実施例によるインダクタ１００は、インダクタ用パターン１１０、インダクタ用パターン１１０の上部及び下部に形成される一対の遮蔽板１２０、及び上部及び下部に位置する一対の遮蔽板１２０を電気的及び機械的に連結する複数の遮蔽用ビア１３０を含む。 Referring to FIG. 1, an inductor 100 according to an embodiment of the present invention includes an inductor pattern 110, a pair of shielding plates 120 formed above and below the inductor pattern 110, and a pair of upper and lower portions. A plurality of shielding vias 130 that electrically and mechanically connect the shielding plate 120 are included.
本実施例において、インダクタ用パターン１１０は、図１及び図２に示すように、螺旋状（ｓｐｉｒａｌ）に具現されるが、これは一実施例に過ぎなく、蛇行状（ｍｅａｎｄｅｒ）またはループ状（ｌｏｏｐ）などの多様な形態に具現できる。 In this embodiment, the inductor pattern 110 is implemented in a spiral shape as shown in FIGS. 1 and 2, but this is only one embodiment, and a meander or loop shape ( loop) and the like.
本実施例において、インダクタ用パターン１１０は、複数のコイルパターン１１０ａ、１１０ｂ、１１０ｃ、１１０ｄ、複数のコイルパターン１１０ａ、１１０ｂ、１１０ｃ、１１０ｄの間を連結する複数のコイルビア１１１ａ、１１１ｂ、及び二つのリードアウトパターンＬ１０を備えることが好ましい。 In this embodiment, the inductor pattern 110 includes a plurality of coil patterns 110a, 110b, 110c, and 110d, a plurality of coil vias 111a and 111b that connect the plurality of coil patterns 110a, 110b, 110c, and 110d, and two leads. It is preferable to provide the out pattern L10.
図３において、複数のコイルパターン１１０ａ、１１０ｂ、１１０ｃ、１１０ｄは、４層で具現されているが、これは一実施例に過ぎなく、より少ないか多い数の層で具現させることもできる。 In FIG. 3, the plurality of coil patterns 110a, 110b, 110c, and 110d are implemented with four layers. However, this is only an example, and may be implemented with a smaller or larger number of layers.
また、図１及び図２に示すように、複数のコイルパターン１１０ａ、１１０ｂ、１１０ｃ、１１０ｄは、内側のパターンより外側に行くほどその長さがますます長くなって、前述したように、スパイラル状（ｓｐｒｉａｌ）に形成できるが、特にこれに限定されるものではない。 Also, as shown in FIGS. 1 and 2, the coil patterns 110a, 110b, 110c, and 110d are longer in length toward the outer side than the inner pattern. However, the present invention is not particularly limited to this.
また、複数のコイルパターン１１０ａ、１１０ｂ、１１０ｃ、１１０ｄは、マイクロストリップ状に形成され、各層のコイルパターンは互いに平行に離隔して形成できる。 In addition, the plurality of coil patterns 110a, 110b, 110c, and 110d are formed in a microstrip shape, and the coil patterns of each layer can be formed in parallel with each other.
また、本実施例において、複数のコイルパターン１１０ａ、１１０ｂ、１１０ｃ、１１０ｄの幅は、実質的にほぼ等しく具現したが、これは一実施例に過ぎなく、層ごとにパターンの幅または厚さを互いに異なるように具現することも可能であると言える。 In the present embodiment, the widths of the plurality of coil patterns 110a, 110b, 110c, and 110d are substantially equal. However, this is only an example, and the width or thickness of the pattern is different for each layer. It can be said that it can be embodied differently.
例えば、複数のコイルパターン１１０ａ、１１０ｂ、１１０ｃ、１１０ｄの内側及び外側の幅を調節して、直流抵抗値とＱ値を調節することができる。 For example, the DC resistance value and the Q value can be adjusted by adjusting the inner and outer widths of the plurality of coil patterns 110a, 110b, 110c, and 110d.
ここで、コイルパターン１１０ａ、１１０ｂ、１１０ｃ、１１０ｄは、銀（Ａｇ）、パラジウム（Ｐｄ）、銅（Ｃｕ）、ニッケル（Ｎｉ）、または金（Ａｕ）などからなることが好ましいが、特にこれに限定されるものではない。 Here, the coil patterns 110a, 110b, 110c, and 110d are preferably made of silver (Ag), palladium (Pd), copper (Cu), nickel (Ni), or gold (Au). It is not limited.
また、コイルパターン１１０ａ、１１０ｂ、１１０ｃ、１１０ｄ及びコイルビア１１１ａ、１１１ｂは、特にこれに限定されるものではないが、当業界一般的に使われる回路形成工程、例えば、フォトリソグラフィー（ｐｈｏｔｏｌｉｔｈｏｇｒａｐｈｙ）法、エッチング（ｅｔｃｈｉｎｇ）法及びホール加工法を組み合わせた工程で形成できる。 In addition, the coil patterns 110a, 110b, 110c, and 110d and the coil vias 111a and 111b are not particularly limited thereto. However, a circuit forming process generally used in the industry, for example, a photolithography method, etching, and the like. (Etching) method and hole processing method can be combined.
複数のコイルビア１１１ａ、１１１ｂは、複数のコイルパターン１１０ａ、１１０ｂ、１１０ｃ、１１０ｄに垂直に形成されて、互いに対応する複数のコイルパターン１１０ａ、１１０ｂ、１１０ｃ、１１０ｄの間を電気的に連結する。 The plurality of coil vias 111a and 111b are formed perpendicular to the plurality of coil patterns 110a, 110b, 110c, and 110d, and electrically connect the plurality of coil patterns 110a, 110b, 110c, and 110d corresponding to each other.
この際、複数のコイルビア１１１ａ、１１１ｂは、各層を貫く貫通ホール（図示せず）に無電解銅メッキ層と電解銅メッキ層を形成して導電層を確保し、中央部分には、導電性ペーストが充填されるかあるいはフィルメッキされた形態であることができるが、特にこれに限定されるものではない。 At this time, the plurality of coil vias 111a and 111b are formed by forming an electroless copper plating layer and an electrolytic copper plating layer in a through hole (not shown) penetrating each layer to secure a conductive layer. However, the present invention is not particularly limited thereto.
また、複数のコイルビア１１１ａ、１１１ｂの両端には、導電層を強化するために、それぞれランド部（図示せず）が形成できる。 In addition, land portions (not shown) can be formed at both ends of the plurality of coil vias 111a and 111b in order to reinforce the conductive layer.
本実施例においては、図１及び図２に示すように、インダクタ用パターン１１０の上部及び下部にインダクタ用パターン１１０から離隔した一対の遮蔽板１２０が形成できる。 In this embodiment, as shown in FIGS. 1 and 2, a pair of shielding plates 120 separated from the inductor pattern 110 can be formed above and below the inductor pattern 110.
ここで、遮蔽板１２０は、板状の導体パターンを意味するもので、その面積は、インダクタ用パターン１１０の表面積より大きくなることが好ましいが、特にこれに限定されるものではない。 Here, the shielding plate 120 means a plate-like conductor pattern, and its area is preferably larger than the surface area of the inductor pattern 110, but is not particularly limited thereto.
ただ、インダクタ用パターン１１０の面積より大きく具現されるとき、電磁波妨害（ＥｌｅｃｔｒｏＭａｇｎｅｔｉｃ Ｉｎｔｅｒｆｅｒｅｎｃｅ：ＥＭＩ）ノイズ遮蔽に一層高い効果があり得る。 However, when implemented to be larger than the area of the inductor pattern 110, the electromagnetic shielding (EMI) noise shielding may have a higher effect.
また、図１及び図２において遮蔽板１２０を四角形に具現しているが、これは一実施例に過ぎなく、いろいろの多様な形状に具現できる。 1 and 2, the shielding plate 120 is implemented in a square shape, but this is only an example, and can be implemented in various shapes.
本実施例において、遮蔽板１２０は、前述したコイルパターン１１０ａ、１１０ｂ、１１０ｃ、１１０ｄと同様に、銀（Ａｇ）、パラジウム（Ｐｄ）、銅（Ｃｕ）、ニッケル（Ｎｉ）、または金（Ａｕ）などでなることが好ましいが、特にこれに限定されるものではない。 In the present embodiment, the shielding plate 120 is made of silver (Ag), palladium (Pd), copper (Cu), nickel (Ni), or gold (Au) similarly to the coil patterns 110a, 110b, 110c, and 110d described above. However, it is not particularly limited to this.
また、本実施例において、インダクタ用パターン１１０の上部及び下部に形成された一対の遮蔽板１２０を電気的及び機械的に連結するための複数の遮蔽用ビア１３０を含むことができる。 In this embodiment, a plurality of shielding vias 130 for electrically and mechanically connecting a pair of shielding plates 120 formed on the upper and lower portions of the inductor pattern 110 may be included.
ここで、複数の遮蔽用ビア１３０は、図１〜図３に示すように、遮蔽板１２０の縁部に形成されて、上部及び下部に形成された一対の遮蔽板１２０を機械的及び電気的に連結する。 Here, as shown in FIGS. 1 to 3, the plurality of shielding vias 130 are formed at the edge of the shielding plate 120, and mechanically and electrically connect the pair of shielding plates 120 formed at the upper and lower portions. Connect to
この際、遮蔽用ビア１３０の個数及び直径は、特に限定されない。 At this time, the number and diameter of the shielding vias 130 are not particularly limited.
結果として、本実施例によるインダクタ１００は、インダクタ用パターン１１０の上部及び下部に一対の遮蔽板１２０を形成し、側部には遮蔽板１２０と連結される遮蔽用ビア１３０を形成することで、インダクタ用パターン１１０を遮蔽板１２０及び遮蔽用ビア１３０で取り囲むことにより、インダクタ用パターン１１０から上下左右に放射される電磁波妨害（ＥＭＩ）ノイズを遮蔽板１２０及び遮蔽用ビア１３０によって効果的に遮蔽することができる。 As a result, the inductor 100 according to the present embodiment forms a pair of shielding plates 120 on the top and bottom of the inductor pattern 110 and forms shielding vias 130 connected to the shielding plate 120 on the side portions. By surrounding the inductor pattern 110 with the shielding plate 120 and the shielding via 130, electromagnetic interference (EMI) noise radiated from the inductor pattern 110 vertically and horizontally is effectively shielded by the shielding plate 120 and the shielding via 130. be able to.
本実施例によるインダクタ１００の電磁波妨害（ＥＭＩ）ノイズ遮蔽特性をシミュレーションした結果を、図４及び図５に示す。 The simulation results of the electromagnetic interference (EMI) noise shielding characteristics of the inductor 100 according to this embodiment are shown in FIGS.
ここで、図４は、Ｈ−ｆｉｅｌｄ（Ｍａｇｎｅｔｉｃ−ｆｉｅｌｄ、磁界）放射特性を示し、図５は、Ｅ−ｆｉｅｌｄ（Ｅｌｅｃｔｒｉｃ−ｆｉｅｌｄ、電界）放射特性を示す。 Here, FIG. 4 shows H-field (Magnetic-field) emission characteristics, and FIG. 5 shows E-field (Electric-field) emission characteristics.
図４及び図５に示した本実施例によるインダクタ１００の電磁波妨害（ＥＭＩ）ノイズ遮蔽特性と、図６及び図７に示した従来技術によるインダクタの電磁波妨害（ＥＭＩ）ノイズ遮蔽特性を比較して見ると、本実施例によるインダクタ１００のインダクタ用パターン１１０の上部、下部及び側部に放射される電磁波妨害（ＥＭＩ）ノイズを効果的に遮蔽できることが分かる。 The electromagnetic wave interference (EMI) noise shielding characteristic of the inductor 100 according to the present embodiment shown in FIGS. 4 and 5 is compared with the electromagnetic wave interference (EMI) noise shielding characteristic of the inductor according to the prior art shown in FIGS. It can be seen that electromagnetic interference (EMI) noise radiated to the upper, lower and side portions of the inductor pattern 110 of the inductor 100 according to the present embodiment can be effectively shielded.
以上、本発明を具体的な実施例に基づいて詳細に説明したが、これは本発明を具体的に説明するためのものであり、本発明はこれに限定されず、該当分野における通常の知識を有する者であれば、本発明の技術的思想内にての変形や改良が可能であることは明白であろう。 As described above, the present invention has been described in detail based on the specific embodiments. However, the present invention is only for explaining the present invention, and the present invention is not limited thereto. It will be apparent to those skilled in the art that modifications and improvements within the technical idea of the present invention are possible.
本発明の単純な変形乃至変更はいずれも本発明の領域に属するものであり、本発明の具体的な保護範囲は添付の特許請求の範囲により明確になるであろう。 All simple variations and modifications of the present invention belong to the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.
本発明は、電磁波妨害（ＥＭＩ）ノイズ放射を遮蔽するインダクタに適用可能である。 The present invention is applicable to inductors that shield electromagnetic interference (EMI) noise radiation.
１００ インダクタ
１１０ インダクタ用パターン
１１０ａ、１１０ｂ、１１０ｃ、１１０ｄ コイルパターン
１１１ａ、１１１ｂ コイルビア
１２０ 遮蔽板
１３０ 遮蔽用ビア
DESCRIPTION OF SYMBOLS 100 Inductor 110 Inductor pattern 110a, 110b, 110c, 110d Coil pattern 111a, 111b Coil via | veer 120 Shielding board 130 Shielding via
Claims (10)
前記インダクタ用パターンの上部及び下部に離隔して形成される一対の遮蔽板；及び
前記一対の遮蔽板を電気的に連結する複数の遮蔽用ビア；
を含むインダクタ。 Inductor pattern;
A pair of shielding plates formed separately above and below the inductor pattern; and a plurality of shielding vias that electrically connect the pair of shielding plates;
Including inductor.
複数のコイルパターン；及び
前記複数のコイルパターンの間を電気的に連結するための複数のコイルビア；
を含む請求項１に記載のインダクタ。 The inductor pattern is:
A plurality of coil patterns; and a plurality of coil vias for electrically connecting the plurality of coil patterns;
The inductor according to claim 1, comprising:
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| KR10-2011-0110731 | 2011-10-27 | ||
| KR1020110110731A KR20130046254A (en) | 2011-10-27 | 2011-10-27 | Inductor |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020161645A (en) * | 2019-03-26 | 2020-10-01 | 国立大学法人信州大学 | Electronic component |
| JP2020202255A (en) * | 2019-06-07 | 2020-12-17 | 株式会社デンソー | Electronic apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102016500B1 (en) | 2018-04-02 | 2019-09-02 | 삼성전기주식회사 | Coil Component |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62154607A (en) * | 1985-12-26 | 1987-07-09 | Matsushita Electric Ind Co Ltd | High frequency coil |
| JPH036095A (en) * | 1989-06-01 | 1991-01-11 | Murata Mfg Co Ltd | Inductor and composite component containing conductor and manufacture thereof |
| JPH10199734A (en) * | 1997-01-14 | 1998-07-31 | Murata Mfg Co Ltd | Electromagnetic shield structure of air-core coil |
| JPH10335142A (en) * | 1997-05-29 | 1998-12-18 | Citizen Electron Co Ltd | Chip inductor and its manufacture |
| JP2002198490A (en) * | 2000-12-26 | 2002-07-12 | Toshiba Corp | Semiconductor device |
| JP2005183890A (en) * | 2003-12-24 | 2005-07-07 | Taiyo Yuden Co Ltd | Multilayer substrate, method of designing a plurality of kinds of multilayer substrates, and simultaneous sintering multilayer substrate |
| JP2005203641A (en) * | 2004-01-16 | 2005-07-28 | Murata Mfg Co Ltd | Laminated structural component and its manufacturing method |
| JP2006173145A (en) * | 2004-12-10 | 2006-06-29 | Sharp Corp | Inductor, resonant circuit, semiconductor integrated circuit, oscillator, and communication system |
| JP2009085783A (en) * | 2007-09-28 | 2009-04-23 | Daihen Corp | Current-voltage detecting printed board and current-voltage detector |
| JP2009188343A (en) * | 2008-02-08 | 2009-08-20 | Nec Corp | Shield for inductor, and inductor with the shield |
| JP2011124373A (en) * | 2009-12-10 | 2011-06-23 | Shinko Electric Ind Co Ltd | Component with built-in inductor |
-
2011
- 2011-10-27 KR KR1020110110731A patent/KR20130046254A/en not_active Application Discontinuation
-
2012
- 2012-08-16 JP JP2012180439A patent/JP2013098539A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62154607A (en) * | 1985-12-26 | 1987-07-09 | Matsushita Electric Ind Co Ltd | High frequency coil |
| JPH036095A (en) * | 1989-06-01 | 1991-01-11 | Murata Mfg Co Ltd | Inductor and composite component containing conductor and manufacture thereof |
| JPH10199734A (en) * | 1997-01-14 | 1998-07-31 | Murata Mfg Co Ltd | Electromagnetic shield structure of air-core coil |
| JPH10335142A (en) * | 1997-05-29 | 1998-12-18 | Citizen Electron Co Ltd | Chip inductor and its manufacture |
| JP2002198490A (en) * | 2000-12-26 | 2002-07-12 | Toshiba Corp | Semiconductor device |
| JP2005183890A (en) * | 2003-12-24 | 2005-07-07 | Taiyo Yuden Co Ltd | Multilayer substrate, method of designing a plurality of kinds of multilayer substrates, and simultaneous sintering multilayer substrate |
| JP2005203641A (en) * | 2004-01-16 | 2005-07-28 | Murata Mfg Co Ltd | Laminated structural component and its manufacturing method |
| JP2006173145A (en) * | 2004-12-10 | 2006-06-29 | Sharp Corp | Inductor, resonant circuit, semiconductor integrated circuit, oscillator, and communication system |
| JP2009085783A (en) * | 2007-09-28 | 2009-04-23 | Daihen Corp | Current-voltage detecting printed board and current-voltage detector |
| JP2009188343A (en) * | 2008-02-08 | 2009-08-20 | Nec Corp | Shield for inductor, and inductor with the shield |
| JP2011124373A (en) * | 2009-12-10 | 2011-06-23 | Shinko Electric Ind Co Ltd | Component with built-in inductor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020161645A (en) * | 2019-03-26 | 2020-10-01 | 国立大学法人信州大学 | Electronic component |
| JP2020202255A (en) * | 2019-06-07 | 2020-12-17 | 株式会社デンソー | Electronic apparatus |
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| KR20130046254A (en) | 2013-05-07 |
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