JPH036095A - Inductor and composite component containing conductor and manufacture thereof - Google Patents

Abstract

PURPOSE:To shield the outside of a shielding electrode layer without influence of frequency characteristic of a using environment and to prevent deterioration of Q of an inductor, etc., by mainly shielding an electric field component by a sheet layer, mainly shielding a magnetic field component by a shielding electrode layer, and providing a protective layer outside the electrode layer. CONSTITUTION:A pair of sheet layers 4, 6, a pair of shielding electrode layers 3, 7 provided at both sides of the layers 4, 6, an inductor body 5, and a pair of protective layers 2, 8 made of magnetic material or insulator provided at both sides of the layers 4, 6 and 3, 7, are provided. The layers 3, 7 are not connected to a ground provided on a circuit board, etc. Thus, the layers 4, 6 are interposed between the body 5 and the layers 3, 7, an electric field component is shielded by the layers 4, 6, a magnetic field component is shielded by the layers 3, 7, and the layers 2, 8 are provided outside the layers 3, 7. Thus, it can be shielded without influence of the frequency characteristic of a using environment to prevent deterioration of Q of the inductor.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is generally installed on a circuit board, etc., and has a pattern of electrode films on both sides of a layered magnetic material having dielectric properties. The present invention relates to inductors formed and shielded on the outside thereof, composite components including inductors such as bandpass filters and duplexers, and methods of manufacturing the same.

For example, as a bandpass filter, Fig. 17 (front view), Fig. 18 (bottom view), Fig. 19 (rear view)
There is one that is configured as shown below. This involves forming two symmetrical U-shaped conductive patterns 221, 222, 223, and 224 on the front surface 220a and back surface 220b of a substrate 220 made of a dielectric material obtained by firing, respectively.
Grounding terminal 22 on conductive patterns 221 and 222 of 0a
5.225, and the conductive pattern 223 on the back surface 220b.
．． After soldering lead terminals 226 and 226 for external extraction to 224, the protruding parts of the lead terminals 225 and the grounding terminal 226 are immersed in an insulating resin bath to form a resin film (not shown). For example, the outside is surrounded by a shield case (not shown) made of a magnetic material to provide shielding.

This shield is provided to prevent deviations in frequency characteristics from occurring if a conductor such as metal is present nearby.

Further, inductors and other composite parts including inductors are similarly shielded.

However, in the above-mentioned shield structure,
A shield case made of magnetic material? Since the 1iff factor μ changes depending on the frequency characteristics, the magnetic permeability μ deteriorates in the high frequency region, and a sufficient shielding effect cannot be obtained.

Furthermore, when manufactured as described above, various manufacturing steps were required, such as baking the substrate, forming a conductive pattern, soldering the terminals, immersing it in resin, and covering it with a shield case. Therefore, in order to manufacture with fewer steps, in recent years it has been desired to manufacture by forming an integral structure with an electrode layer for shielding inside and firing it, but in reality, it is difficult to manufacture it by firing it. However, there was a problem in that Q deterioration occurred in the bandpass filter body, inductor body, etc. inside the shield electrode layer, making it impossible to implement.

The present invention has been made in view of the above circumstances, and provides an inductor and an inductor that can be shielded without being affected by the frequency characteristics of the usage environment, and that have a structure that does not cause Q deterioration in the inductor, etc. inside the shield. The purpose of the present invention is to provide composite parts including: and methods for manufacturing them.

The inductor according to the present invention has a structure in which coil pattern electrodes formed on both sides of a magnetic layer are electrically connected through a through hole formed in the magnetic layer. An inductor body, a pair of sheet layers made of a magnetic material or an insulator provided on both sides of the inductor body, and a pair of shield electrode layers provided on both sides of the inductor body and the pair of sheet layers. , comprising an inductor body, a pair of sheet layers, and a pair of protective layers made of a magnetic material or an insulator provided on both sides with a pair of shield electrode layers in between, and the shield electrode layer is connected to a ground provided on a circuit board or the like. Configure it to be in a disconnected state.

In addition, in a composite component including an inductor, a sheet layer, a shield electrode layer, a shield electrode layer, The structure includes a protective layer.

A bandpass filter is suitable for such a structure.

Further, for the inductor having the above structure, an inductor body is formed in which coil pattern electrodes formed on both sides of the magnetic layer are electrically connected through a through hole formed in the magnetic layer. A protective layer made of a magnetic material or an insulating material, a shield electrode layer, a sheet layer made of a magnetic material or an insulating material 2, the inductor body, a sheet layer made of a magnetic material or an insulating material, a shield layer, and
It can be manufactured by performing a step of forming a laminate by laminating protective layers made of a magnetic material or an insulator in this order, and a step of firing the laminate.

Furthermore, for composite parts including inductors, there is a process of manufacturing a composite part main body formed by forming electrodes including coil patterns on both sides with a magnetic layer sandwiched therebetween, a protective layer made of a magnetic material or an insulator, and a shield electrode layer. , a sheet layer made of a magnetic material or an insulator, the composite component body, a sheet layer made of a magnetic material or an insulator.

forming a laminate by laminating a shield layer and a protective layer made of a magnetic material or an insulating material in this order;
It can be manufactured by performing the step of firing the laminate.

Sakuji - Moon - In the inductor of the present invention, a sheet layer made of a magnetic material or an insulator is interposed between the inductor main body and the shield electrode layer, so this sheet layer must be made thick. This can prevent deterioration of the Q of the inductor body caused by firing. In addition, the above-mentioned sheet layer mainly blocks electric field components, while the ungrounded shield electrode layer mainly blocks magnetic field components.In addition, since a protective layer is provided on the outside of the shield electrode layer, the shield electrode layer The magnetic permeability of the material does not change and does not depend on the frequency of the operating environment. Also,
This also applies to composite parts including inductors and bandpass filters.

Furthermore, in the case of manufacturing an inductor, a composite component including an inductor, and a bandpass filter by the method of the present invention, it is possible to manufacture it by stacking each layer in a laminated state and then performing integral firing, making it easy to manufacture.

Fig. 1 is an external perspective view showing an inductor according to the present invention;
FIG. 2 is a sectional view taken along the line ■--■ in FIG. 1. As shown in the figure, this inductor has a rectangular parallelepiped shape by laminating multiple layers, and the bottom layer 2 and the top layer 8 are sheet-shaped sheets with a thickness of 20 to 50 μm made of magnetic or insulating material. It is a protective layer. 3 and 7 on the inside are shield electrode layers made of, for example, copper or silver, 4 and 6 are sheet layers with a thickness of 1 to 1.5 m+a made of magnetic material or insulator, and 5 in the center is made of, for example, spinel. Six sheet-like magnetic layers 51, 52, 53, 54° 55.56 made of a magnetic material with a high dielectric constant such as ferrite and having a thickness of 20 to 50 μm are stacked, and a conductive material is made of a conductive material between them. This is an inductor body with a patterned electrode film. Further, in the figure, 11 is an input terminal, and 12 is an output terminal. Note that any magnetic material may be used for the protective layers 2, 8 and the sheet layer 4.6, regardless of the dielectric constant.

As shown in FIG. 3, the inductor main body 5 includes five magnetic layers 51. . . , 55, C-shaped electrode film patterns 51a, . This electrode film pattern 51a
The input terminal piece A provided on one end side (left side in the figure) of the electrode film pattern 51a formed on the uppermost magnetic layer 51 is sequentially shifted in the left-right direction, and the magnetic layer 52. ...,
The pie hole 52b, which is provided through the hole 55,...
55b is filled with a conductive material (not shown) to connect the ends of the upper and lower electrode film patterns 51a, etc., and the input terminal piece A to the output terminal piece B provided on the magnetic layer 55 are integrally connected. It is made with a spiral coil.

Note that 57 is a bonding electrode for reliably connecting the filled conductive material and the lower electrode film pattern to be connected. Further, the input terminal piece A and the output terminal B are exposed on the end face of the magnetic layer 51 and the like, and are connected to the input terminal 11 and the output terminal 12 formed at the left and right ends of the inductor. Although the electrode film pattern 51a and the like are formed in a C-shape, they are not limited to this and may be formed in a U-shape or the like.

Next, a method for manufacturing an inductor having such a structure will be explained. First, six magnetic layers 51. . . 56 are prepared, predetermined electrode film patterns 51a, etc. are formed thereon, and bonding electrodes 57 . Form the input terminal piece A and the output terminal piece B, and
The six magnetic layers 51 and the like are stacked by filling a conductive material in the space b and the like.

As shown in FIG. 2, the sheet layers 4 and 6, the shield electrode layers 3 and 7, and the protective layer 28 are sequentially laminated on both sides of the inductor main body 5 thus produced. Thereafter, an input terminal 11 and an output terminal 12 are respectively formed on the side surface portions where the input terminal piece A and the output terminal piece B, which have been previously formed so as to be exposed on the side surface of the inductor, are present. Thereby, the input terminal 11 is connected to the input terminal piece A, and the output terminal 12 is connected to the output terminal piece B, respectively.

Then, the product in this state is charged into a firing furnace maintained at a predetermined temperature and fired. Then, an inductor having the above structure is manufactured. In this embodiment, a ground terminal is not provided, but even if a ground terminal is provided, it is not connected to the shield electrode films 3 and 7. Further, as shown in FIG. 4, the shield electrode layer 37 is formed to be slightly smaller in size than the protective layer 2, etc. located above and below it, and a large number (4 in this example) are formed in the center. )
It is preferable to form a through hole 3b (or 7b) in order to improve the adhesion between the upper and lower layers. This through hole has a small cross section so that it does not interfere with the shield.

In the inductor manufactured in this way, each layer is laminated to form a laminate and this is fired to form the inductor, so the number of different manufacturing techniques can be reduced, which makes it easy to manufacture the inductor. Furthermore, since the terminals and output terminals are exposed to the outside, surface mounting on a circuit board or the like is possible. Furthermore, since the sheet layer 4.6 made of a magnetic material or an insulator is provided between the inductor body 5 and the shield electrode layers 3 and 7, the inductor body 5 can be It is possible to prevent the Q from deteriorating. Further, the sheet layer 4.6 mainly blocks electric field components, while the shield electrode film 3.7, which is not grounded as described above,
mainly blocks the magnetic field component, and in addition, since the shield 112.8 is formed on the outside of the shield electrode layer 3.7, even if a conductor such as a metal approaches the inductor, the shield electrode film 3.7 will not be transparent. Magnetic property does not change and there is no deviation in frequency characteristics.

Next, a case will be described in which the present invention is applied to a bandpass filter. Fig. 5 is an external perspective view showing the bandpass filter according to the present invention, Fig. 6 is a sectional view (front view) taken along the line ■-■ in Fig. 5, and Fig. 7 is taken along the line -■ in Fig. 6. It is a sectional view (plan view). This bandpass filter is
As shown in FIG. 6, it has a rectangular parallelepiped shape in which a plurality of layers are laminated, and from the bottom layer, a sheet-like protective layer 21 made of a magnetic material or an insulating material and having a thickness of 20 to 50 μm, such as copper or silver. The shield electrode layer 22 is made of a magnetic material or an insulating material and has a thickness of 1 to 1. A sheet layer 23 with a thickness of 5 mm, a back electrode film 24.34 made of a conductive material such as copper, and a sheet-like magnetic layer 25 made of a magnetic material with a high dielectric constant such as spinel ferrite and having a thickness of 20 to 50 μm. , a surface electrode film 26, 36 made of a conductive material such as copper, a sheet layer 27 of a thickness of 1 to 1.5 mm made of a magnetic material or an insulator, a shield electrode layer 28 made of a magnetic material or an insulator, and a thickness of A sheet-like protection N29 with a diameter of 20 to 50 μm is provided. The protective layer 21.29 and the sheet layer 23.
Any magnetic material may be used as the magnetic material 27, regardless of its dielectric constant.

The front electrode film 26 (solid line) and the back electrode film 24 (broken line) located on the left side of FIG. 7 are two capacitor electrode patterns 61a, 62a, 41a, 42a connected by one coil pattern 63a, 43a. It has a U-shaped pattern when viewed from above.

The capacitor electrode patterns 61a, 41a, and 62
a and 42a face each other on both sides of the magnetic layer 25, and form a capacitor C1 with a capacity ffk determined by the dielectric constant and thickness of the magnetic layer 25, and the facing area of the capacitor electrodes.
, C2.

On the other hand, the coil patterns 63a and 43a are connected to the magnetic layer 2, respectively.
Two capacitor electrode patterns 6 on each front and back side of 5
It is formed to connect 1a and 62a, and 41a and 42a. Each coil pattern 63a, 43a forms a coil in terms of high frequency, so its inductance is Ll,
If L2, the surface electrode film 26. The back electrode film 24 and the magnetic layer 25 therebetween are, as shown in FIG. 8, an equivalent circuit in which a second capacitor C2 is connected in parallel to an LC circuit in which coils Ll and L2 are connected in series on both sides of a first capacitor C1. A hail resonator Q1 is configured. Note that this equivalent circuit is the same for the conventional product shown in FIG.

Further, both the back electrode film 24 and the front electrode film 26 have tongues 24a and 26a that reach one side of the bandpass filter, and the exposed portions of the tongues 24a and 2'i3a are located on the side surface below this. L on each part and the bottom part following this.
An input terminal electrode film 32 made of a conductive material such as silver and formed into a character shape. It is electrically connected to a terminal electrode film 30 for grounding (see FIG. 5). The terminal electrode films 32 and 30 are formed so as to be electrically insulated from each other and from other layers.

On the other hand, the front electrode film 36 (solid line) and the back electrode film 34 (broken line) located on the right side of FIG. 7 are two capacitor electrode patterns 61b, 62b, 41b42b connected by one coil pattern 63b, 43b. The front electrode film 26 and the back electrode film 24 have a symmetrical U-shaped pattern in plan view. The capacitor electrode patterns 61b and 41b and 62b and 42b are respectively formed on the magnetic layer 2.
50 are opposed on both sides, forming capacitors C3 and C4 having a capacity determined by the dielectric constant and thickness of the magnetic layer 25 and the facing area of the capacitor electrodes. On the other hand, the coil patterns 63b and 43b are formed to connect two capacitor electrode patterns 61b and 62b, and 41b and 42b on each of the front and back surfaces of the magnetic layer 25, respectively. Each coil pattern 63b, 43b forms a coil in terms of high frequency, so if its inductance is L3L4, then the front electrode film 36. The back electrode film 34 and the magnetic layer 25 therebetween are arranged on both sides of the first capacitor C3 as well as the coil L3. L with series connection of L4
A resonator Q2 is constituted by an equivalent circuit in which a second capacitor C4 is connected in parallel to a C circuit.

Furthermore, both the back electrode film 34 and the front electrode film 36 have tongues 34a and 36a that reach one side of the bandpass filter, and the exposed portions of the tongues 34a and 36a are connected to the lower side surface portions. Terminal electrode films 33 for output made of a conductive material such as silver formed in an L-shape on the bottom part following this.
．． It is electrically connected to a terminal electrode film 31 for grounding (see FIG. 5). The terminal electrode films 33 and 31 are formed so as to be electrically insulated from each other and from other layers.

Then, a resonator Q1. having the above-mentioned equivalent circuit. Q2 is
As shown in FIG. 7, two coil patterns 63a
, 63b are close to each other with the distance d, the two coil patterns 63a and 63b are magnetically coupled, and the ninth
A bandpass filter with an equivalent circuit as shown in the figure is constructed. In the figure, M indicates two coil patterns 63a and 63b.
Mutual inductance, L3, which determines the degree of magnetic coupling between
0L31 is the inductance of the grounding terminal electrode film 30.31. Note that since the two resonators Q1 and Q2 use the magnetic layer 25, they are not only coupled pneumatically but also capacitively.

In the figure, C3 schematically indicates the coupling capacity.

The shield electrode films 22 and 28 provided on the outside of the bandpass filter main body having such a structure are not grounded as in the case of the inductor described above.

A method for manufacturing a bandpass filter having such a structure will be described next. First, a protective layer 21, a sheet layer 23, 27, and a magnetic layer 25 are prepared, and by screen printing or applying a paste made of a conductive material such as copper on the surface of the protective layer 21, a part of the protective layer 21 is The shield electrode layer 22 is formed so as to be exposed on the end face of the tongue piece 24., and the tongue piece 24. a, 34a, and two symmetrically formed U-shaped back electrode films 2.
4.34, and two U-shaped surface electrode films 26.36 having the tongues 26a, 36a and symmetrically formed on the surface of the magnetic layer 25 are formed in the same manner. Further, in the same manner, a shield electrode layer 28 is formed on the surface of the sheet layer 27 by exposing a part to the end face of the sheet layer 27, and these are stacked together with a protective layer 29 and then pressed together to form a laminate. , the tongue piece 2 in this laminate
A paste made of a conductive material such as copper or silver is printed on the exposed portions of 4a, 34a, 26a, and 36a, the side surfaces below these, and the bottom surface following this to form the terminal electrode film 30.
, 31, 32, 33, and a ground terminal film 43 made of a conductive material such as copper or silver is formed on the partially exposed side surface of the shield electrode layer 22, 28. Bake for 2 hours.

In the band-pass filter manufactured in this way, the layers are laminated to form a laminate, which is then fired to form a laminate, so the number of different manufacturing techniques can be reduced, and this allows the band-pass filter to be manufactured by It can be easily manufactured, and since the terminals and output terminals are exposed to the outside, it can be surface mounted on a circuit board or the like. In addition, the bandpass filter body and the shield electrode layer 2
228 and a sheet layer 23 made of a magnetic material or an insulating material.
．． 27, it is possible to prevent the Q of the bandpass filter body from deteriorating even if it is formed into an integral structure and then fired. Further, the sheet layers 23.27 on the outside of the bandpass filter body mainly block electric field components, and the shield electrode layers 22.28 on the outside mainly block magnetic field components.
Since the protective layers 21 and 29 are formed on the outside of 28,
Even when a conductor such as a metal approaches the bandpass filter, the magnetic permeability of the shield electrode layers 22 and 28 does not change, and no deviation occurs in the frequency characteristics.

In addition, the shield electrodes 22 and 28, the back electrode films 24 and 34
The positions where the surface electrode films 26 and 36 are formed are not limited to those described above; for example, the shield electrode 22 may be formed not on the surface of the protective layer 21 but on the back surface of the sheet layer 23.

In the bandpass filter manufactured in this way, the terminal electrode films 30, 31. ．． Since the portions 32 and 33 are exposed to the outside and formed in the form of a film, surface mounting can be easily carried out by simply placing a bandpass filter in alignment with the circuit board.

Note that t for crimping is not an essential requirement of the present invention. Furthermore, each of the above five layers except for the front electrode films 26 and 36, the front electrode film 24.34, and the shield electrode layer 22.28 may be constructed from one sheet material or two made of the same material. It may be constructed by stacking more than one sheet material.

Shield electrode layers 28 and 22 are disposed through sheet layers 27 and 23 at the upper and lower positions of the bandpass filter main body, that is, at the directional positions that are easily affected by external magnetic fields and external conductors. Therefore, the bandpass filter main body is effectively shielded by the shield electrode layer 28.22, and by changing the thickness of either or both of the sheet layers 2723,
Change the thickness of the sheet material or sheet layer 27.2
It is possible to adjust the frequency characteristics of the bandpass filter by increasing or decreasing the number of the plurality of sheet materials forming the bandpass filter. For example, a case where the frequency characteristics are adjusted by changing the thickness of the sheet [27 side] will be described below.

First, if the center frequency is higher than a desired value, the sheet layer 27 is made thicker. As a result, the bandpass filter main body is separated from the shield electric layer Ii layer 28, so that the center frequency is lowered. As a result, the frequency characteristic can be adjusted from curve 1 to curve 3 as shown in FIG. 11 (frequency characteristic curve).

Conversely, if the center frequency is lower than the desired value, the sheet layer 27 is made thinner. This causes, contrary to the above case,
Since the shield electrode layer approaches the bandpass filter body, curve 1 changes to curve 2, and the center frequency becomes higher.

Further, the sheet layers 27 and 23 described above can each have a uniform thickness, so that the shield electrode layer 28.
22 and the front and back electrode films 26, 36, 24, and 34 can be made parallel to each other, and the spacing can be made constant, for example, 1 mm or more. Thereby, deterioration of the electrical characteristics of the shielded bandpass filter can be suppressed.

In addition, in the above embodiment, the front electrode film 26, 36 and the back electrode film 2
4.34 and the shield electrode layer 22.28 are formed by printing or coating, but the present invention is not limited to this. Alternatively, sheet materials made of conductive material may be prepared respectively, and nine sheet materials may be stacked on top of each other, or one or more of the front electrode films 26, 36, the back electrode films 24.34, and the shield electrode layers 22.28. It is also possible to prepare sheet materials made of conductive material and to overlap each sheet material by printing or coating.

Further, it is optional whether the protective layer 21.29, the sheet layer 23.27, and the magnetic layer 25 are each made of a single sheet material or by laminating a plurality of sheet materials, and as appropriate. You can choose.

FIG. 11 is an external perspective view showing the duplexer according to the present invention, and FIG. 12 is a cross-sectional view taken along the line Xn-Xn in FIG. 11 (the same parts as in FIG. 6 are given the same symbols. ). This duplexer has the same number of laminated layers, materials, etc. as the above-mentioned bandpass filter, but the first
As shown in FIG. 2, the shapes of the front electrode film 80a and the back electrode film 80b formed on both sides of the magnetic layer 25 at the center of the stack are different. Front electrode film 80'a, back electrode film 80b
are respectively shown by solid lines and broken lines in FIG. 13, and have a shape constituting the duplexer body represented by the equivalent circuit in FIG. 14. That is, to explain in order from the low input terminal piece C, the upper surface electrode film 80 connected to the terminal piece C
a and the conductive material 25b filled in the through hole 25a provided on the right side of the magnetic layer 25 to form the lower back electrode 11! The portions connected to J80b and facing vertically or diagonally constitute a circuit in which the capacitor C1l and the coil Lll are connected in parallel. Further, this circuit is connected to the common output terminal piece E via a capacitor C12 formed by facing the front electrode film 80a and the back electrode film 80b. The high input terminal piece side of the common output terminal piece E has the upper surface electrode film 80a and the magnetic layer 25.
A conductive material 25d filled in a through hole 25c provided in the center of the
The coil L is connected to the lower back electrode film 80b at
It is connected to 12. The tip of the lower back electrode film 80b constituting this L12 is branched into two in the middle, and one is connected to the upper side via the conductive material 25f filled in the through hole 25e provided on the left side of the magnetic layer 25. connected to the surface electrode film 80a of
It is connected to one high input terminal. The other end is connected to one of the high input terminals via a coil L14 consisting only of the lower back electrode film 80b and a capacitor C13 which faces the upper front electrode film 80a.

The low input terminal piece C2 of the duplexer body having such a structure
The high input terminal piece and the common output terminal piece E have a magnetic layer 25.
The low input terminal piece C1 is exposed on the end face of the high input terminal piece C1, and the low input terminal piece 81. Connected to high input terminal 82, common output terminal piece E
is connected to a common output terminal 83 formed in an L-shape across the back surface of the duplexer and the bottom surface connected thereto. Note that the shield electrode layers 22 and 28 provided on the outside of the duplexer body described above are not grounded as before.

Therefore, this duplexer also has a similar effect.

In the case of the above-mentioned inductor, shield electrode layers are formed on both sides of the magnetic layer located in the center, thereby shielding the inside, but the present invention is not limited to this. In addition to this shield electrode layer 3.7, a shield electrode film 3' (indicated by a broken line) is also formed on the side surfaces (two sides) of the inductor where the input terminal 11 and the output terminal 12 are not formed. Good too. This has the advantage that shielding can be made more reliable. The same effect can be obtained even when this is applied to a composite component including an inductor such as the above-mentioned bandpass filter.

Further, as explained in the above-mentioned inductor using FIG.
As shown in b), one shield electrode layer 3 (7) may be divided into two or four parts, and these parts may be separated and sandwiched between upper and lower layers, such as the protective layer 2. This is preferably applied to bandpass filters, duplexers, etc.

Furthermore, according to the present invention, there are the following advantages in an inductor and a composite part including the inductor.

Taking the above-mentioned inductor as an example, the protective layer 2
, 8 and the sheet layer 4.6, even if a magnetic material with a small magnetic permeability μ is used to sufficiently extend the usage band to the high frequency range, the shielding effect is ensured due to the existence of the shield electrode films 3 and 7. In this state, the usage band can be extended to the high wave side. 4
As described in detail above, in the case of the present invention, each layer is laminated to form a laminate, and this is formed by firing, so the number of different manufacturing techniques can be reduced, and this This makes it possible to easily manufacture inductors and composite components including inductors, and sheet layers made of magnetic or insulating materials provided on both sides of the inductor body and composite component body mainly block electric field components. Furthermore, the shield electrode layer provided without grounding on the outside mainly blocks the magnetic field component, and in addition to this, a protective layer is provided on the outside of the shield electrode layer, so even if a conductor such as a metal approaches, the shield electrode layer will remain intact. Magnetic permeability does not change, and there is no deviation in frequency characteristics.

Furthermore, since a sheet layer is provided between the inductor body, the composite component body, and the shield electrode layer, deterioration of the Q of the body part can be prevented, and by changing the thickness of this sheet layer, the frequency characteristics can be changed. It has excellent effects such as being able to make adjustments.

[Brief explanation of the drawing]

FIG. 1 is an external perspective view showing an inductor according to the present invention;
FIG. 2 is a sectional view taken along the line ff-[[ of FIG. FIG. 5 is a perspective view of an electrode film, FIG. 5 is an external perspective view of a bandpass filter according to the present invention, FIG. 6 is a sectional view taken along line Vl--Vl in FIG. 5, and FIG. ■A cross-sectional view (front view) drawn by line, Fig. 8 is an equivalent circuit diagram of the resonator part of the band-pass filter, Fig. 9 is an equivalent circuit diagram of the main body of the band-pass filter, and Fig. 10 is an equivalent circuit diagram of the band-pass filter. A graph showing a frequency characteristic curve, FIG. 11 is an external perspective view showing a duplexer according to the present invention, FIG. 12 is a longitudinal sectional view thereof, FIG. 13 is a plan view showing a circuit of the duplexer main body portion, and FIG. 14 is a An equivalent circuit diagram of the duplexer main body, FIG. 15 is an external perspective view showing another example of an inductor to which the present invention is applied, and FIG. 16 is a perspective view showing another shield electrode film suitable for use in the present invention. FIG. 17 is a front view of a conventional product, FIG. 18 is a bottom view thereof, and FIG. 19 is a rear view thereof. 2.8.21.29...Protective layer, 3,7.2228.
...Shield electrode layer, 4,6,23.27...Shito layer, 24. ．． 34.80b... Back electrode film, 2551.5
2, 53, 54, 55. 56... magnetic layer, 51a,
52a 53a, 54a, 55a,
56a... Conductive pattern, 26.36.80a...
- Surface electrode film.

Claims (5)

[Claims] (1) In an inductor installed on a circuit board, etc., the inductor body has a structure in which coil pattern electrodes formed on both sides of a magnetic layer are electrically connected through a through hole drilled in the magnetic layer. A pair of sheet layers made of a magnetic material or an insulator provided on both sides of the inductor body, a pair of shield electrode layers provided on both sides of the inductor body and the pair of sheet layers, and an inductor. It comprises a main body, a pair of sheet layers, and a pair of protective layers made of a magnetic material or an insulator provided on both sides with a pair of shield electrode layers in between, and the shield electrode layer is connected to a ground provided on the circuit board etc. An inductor configured to be in a connected state. (2) In a composite component including an inductor installed on a circuit board, etc., a composite component body is formed by forming electrodes including a coil pattern on both sides with a magnetic layer sandwiched therebetween, and a composite component body is formed with electrodes including a coil pattern on both sides of the composite component body. A pair of sheet layers made of a magnetic material or an insulator provided, a pair of shield electrode layers provided on both sides of the composite component body and the pair of sheet layers, the composite component body, the pair of sheet layers, and the pair of sheet layers. a pair of protective layers made of a magnetic material or an insulator provided on both sides of the shield electrode layer, and configured such that the shield electrode layer is not connected to the ground provided on the circuit board, etc. A composite part including an inductor characterized by: (3) The composite component including an inductor according to claim 2, wherein the composite component body is a bandpass filter body. (4) In a method for manufacturing an inductor, an inductor body is formed in which coil pattern electrodes formed on both sides of a magnetic layer are electrically connected through a through hole drilled in the magnetic layer. A protective layer made of a magnetic material or an insulator, a shield electrode layer, a sheet layer made of a magnetic material or an insulator, the inductor body, a sheet layer made of a magnetic material or an insulator, a shield layer, and a magnetic material or an insulator. A method for manufacturing an inductor, comprising the steps of: forming a laminate by laminating protective layers in this order; and firing the laminate. (5) A method for manufacturing a composite component including an inductor, including a step of manufacturing a composite component body by forming an electrode film including a coil pattern on both sides with a magnetic layer sandwiched therebetween, and a protection made of a magnetic material or an insulator. layer, a shield electrode layer, a sheet layer made of a magnetic material or an insulator, the composite component body,
A step of forming a laminate by laminating a sheet layer made of a magnetic material or an insulating material, a shield layer, and a protective layer made of a magnetic material or an insulating material in this order, and a step of firing the laminate. A method for manufacturing a composite part including a featured inductor.