JPH01208009A - Band-pass filter and its manufacture and method for adjusting frequency characteristic of same - Google Patents

Abstract

PURPOSE:To perform the adjustment of a frequency characteristic by constituting a device in such a way that a BPF in which a sheet layer and a shield electrode layer, etc., are laminated is divided between a BPF main body and the shield electrode layer, and an adhesive layer is inserted between them. CONSTITUTION:In the BPF, a protection layer 1, the shield electrode layer 2, the sheet layer 3 consisting of a dielectric or an insulator, a back electrode layer 4, dielectric layers 5 and 14, a surface electrode layer 6, the sheet layers 7 and 16 similar to the layer 3, the adhesive layer 3d, the sheet layer 21 similar to the layer 3, the shield electrode layer 22, and a protection layer 23 are laminated in sequence as the above from the lowest layer side. Those layers (1-7) and the layers 4 and 16 are formed integrally, and constitute the BPF as a first division block 10, and out of them, the layers 4 and 14, the layers 5, 6, and 16 constitute the BPF main body. Also, the layers (21-23) constitute the BPF as a second division block 20 with the block 20. Those blocks 10 and 20 are integrated via the layer 30. By constituting the device in such way and varying the thickness of the layers 3, 7, and 21 and the layer 30, the frequency characteristic of the BPF can be adjusted.

Description

[Detailed Description of the Invention] The present invention relates to a bandpass filter mainly composed of a bandpass filter body in which conductive patterns are formed on both sides of a layered dielectric, a method for manufacturing the same, and a bandpass filter. This invention relates to a method for adjusting frequency characteristics.

Conventionally, as one of the above-mentioned bandpass filters, a dielectric substrate 120 obtained by firing is used, as shown in FIG. 7 (front view), FIG. 8 (bottom view), and FIG. 9 (rear view). Two symmetrical U-shaped conductive patterns 121, 122, 123, and 124 are formed on the front surface 120a and the back surface 120b, respectively. 120b conductive pattern 1
23. Lead terminal for external extraction 126°12 at 124
6 is soldered, and then the protruding portions of the lead terminal 125 and the grounding terminal 126 are removed and immersed in an insulating resin bath to form a resin film. A bandpass filter having a bending configuration has been proposed by the present applicant in Japanese Patent Application No. 1983-097316. still,
This electrical effect will be explained in Examples.

Therefore, in conventional bandpass filters, the internal conductive pattern cannot be trimmed because the bandpass filter body is covered with a resin film. However, there was a problem in that it was difficult to adjust the frequency characteristics, for example, the center frequency.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a bandpass filter whose frequency characteristics can be adjusted, a method of manufacturing the same, and a method of adjusting the frequency characteristics of the bandpass filter.

The band-pass filter according to the present invention for the purpose of and a pair of shield electrode layers provided on both sides of the bandpass filter main body and the pair of sheet layers in a laminated state, and one or both of the pair of shield electrode layers and the band It is characterized in that the pass filter main body is divided into sections, and an adhesive layer is interposed between the plurality of divided blocks to integrate each divided block.

Furthermore, the method for manufacturing a bandpass filter according to the present invention includes:
A bandpass filter main body having a predetermined conductive pattern formed on both sides of a dielectric layer, a pair of sheet layers made of a dielectric or an insulator provided on both sides of the bandpass filter main body, and a bandpass filter main body and A method for manufacturing a bandpass filter comprising a pair of shield electrode layers provided on both sides with the pair of sheet layers in between, the bandpass filter comprising one or both of the pair of shield electrode layers and the bandpass filter. It is characterized in that a plurality of fired divided blocks are prepared or manufactured in advance and are divided from the main body, and an adhesive layer is interposed between each divided block to integrate the divided blocks.

Furthermore, the method for adjusting frequency characteristics in a bandpass filter according to the present invention includes a bandpass filter body in which a predetermined conductive pattern is formed on both sides of a dielectric layer, and a dielectric layer provided on both sides of the bandpass filter body. A pair of sheet layers made of a body or an insulator, and a pair of shield electrode layers provided on both sides with the bandpass filter main body and the pair of sheet layers sandwiched in between are laminated. A bandpass filter in which one or both of the electrode layers and the bandpass filter main body are divided, and an adhesive layer is interposed between the plurality of divided blocks so that each divided block is integrated. A method for adjusting frequency characteristics, wherein the separation distance between the shield electrode layer and the bandpass filter body is adjusted by changing the thickness of at least one of the pair of sheet layers and/or the adhesive layer, thereby adjusting the bandpass filter body. It is characterized by adjusting the frequency characteristics of the pass filter body.

The present invention includes a bandpass filter main body, a pair of sheet layers, and a pair of shield electrode layers in a laminated state, and is divided between the bandpass filter main body and the shield electrode layer,
Since the structure has an adhesive layer interposed between them, the separation distance between the bandpass filter body and the shield electrode layer can be adjusted by changing the thickness of the sheet layer and the adhesive layer, contributing to the adjustment of frequency characteristics. do.

JLJI Fig. 1 is an external perspective view showing an embodiment of the product of the present invention, Fig. 2 is a sectional view (front view) taken along line ■-■ in Fig. 1, and Fig. 3 is a cross-sectional view taken along line m-m in Fig. 2. FIG. The bandpass filter according to the present invention has the following features: 1. As shown in Figure 2, it has a rectangular parallelepiped shape with 11 layers laminated, and from the bottom layer, the layers are made of dielectric or insulator and have a thickness of 20 to 5.
A sheet-like protective layer 1 having a thickness of 0 μm, a shield electrode layer 2,
A sheet layer 3 with a thickness of 1 to 1.5 nm made of a dielectric or an insulator, a back electrode layer 4 made of a conductive material such as copper, a dielectric,
For example, it is made of BaO-3i○2-ZrOZ dielectric,
A sheet-like dielectric layer 5 having a thickness of 20 to 50 μm, surface electrode layers 6 and 16 made of a conductive material such as copper, a sheet layer 7 having a thickness of 20 to 50 μm made of a dielectric or an insulator, and an adhesive layer 30. , a sheet 21 made of a dielectric or an insulator and having a thickness of 1 to 1.5 μm, a shield electrode layer 22, and a sheet-like protective layer 23 made of a dielectric or an insulator and having a thickness of 20 to 50 μm. is provided.

The protective layer 1, the shield electrode layer 2, the sheet layer 3, the back electrode layers 4 and 14, the dielectric layer 5, the front electrode layer 6, 16 and the sheet layer 7 are formed as an integral part, and a bandpass filter is formed. First divided block 10 consisting of 7 layers for configuration
Among them, the back electrode layers 4, 14, the dielectric layer 5, and the front electrodes [6, 16] constitute a bandpass filter main body.

Also, the above sheet JW21. The shield electrode layer 22 and the protection layer 23 are integrally formed as before,
This is a second divided block 20 consisting of three layers for configuring a bandpass filter together with the first divided block 20. Such first. The adhesive layer 30 interposed between the second divided blocks 10.20 is
0, and is made of an adhesive such as a thermoplastic or thermosetting synthetic resin adhesive or a synthetic rubber adhesive. Note that the protective layer 1.23 is for electrically insulating the bandpass filter and protecting it from scratches, and is not an essential requirement of the present invention.

The front electrode layer 6 and the back electrode layer 4 located on the left side of FIG. 3 are two capacitor electrode patterns 61°62.41.4.
2 are connected by one coil pattern 63 degrees 43, and has a U-shaped putter in plan view. The capacitor electrode patterns 61 and 41 and 62 and 42 face each other on both sides of the dielectric layer 5.
Capacitors CI and C2 are formed, each having a capacitance determined by the dielectric constant, thickness, and opposing area of the capacitor electrodes. - On the other hand, the coil patterns 63 and 43 have two capacitor electrode patterns 61 and 62 on the front and back surfaces of the dielectric layer 5, respectively.
．． 41 and 42 are connected. Each coil pattern 63.43 forms a coil in terms of high frequency, so if its inductance is Ll and L2, then the surface electrode layer 6. The back electrode layer 4 and the dielectric layer 5 therebetween have coils LL and L on both sides of the first capacitor C1, as shown in FIG.
A bandpass filter Q1 is constituted by an equivalent circuit in which a second capacitor C2 is connected in parallel to an LC circuit in which two capacitors are connected in series. Note that this equivalent circuit is the same for the conventional product shown in FIG.

Both the back electrode layer 4 and the front electrode layer 6 have tongues 4a and 6a that reach one side of the bandpass filter.
The exposed portions a and 5a are electrically connected to terminal electrode films 31 and 32 for leads made of a conductive material such as silver, which are formed in a 5-shape on the side surface portion below and the bottom portion following this, respectively. has been done. The terminal electrode films 31 and 32 are formed so as to be electrically insulated from each other and from other layers.

On the other hand, the front electrode layer 16 and the back electrode layer 14 located on the right side of FIG.
62.141.142 as one coil pattern 163,
143, which connects the front electrode layer 6 and the back electrode layer 4.
It has a U-shaped pattern shape in plan view that is symmetrical with respect to the case of . The capacitor electrode patterns 161 and 141 and 162 and 142 are opposed to each other on both sides of the dielectric layer 5, and the capacitor C3 has a capacitance determined by the dielectric constant and thickness of the dielectric layer 5, and the opposing area of the capacitor electrodes.
It forms C4. On the other hand, coil pattern 163,1
43 are formed to connect the two capacitor electrode patterns 161 and 162, and 141 and 142 on the front and back surfaces of the dielectric layer 5, respectively. Each coil pattern 16
3,143 forms a coil in terms of high frequency, so its inductance is L3. L4, the front electrode layer 16 degrees, the back electrode layer 14, and the dielectric layer 5 between them are arranged on both sides of the first capacitor C3 as shown in FIG. The bandpass filter Q2 is composed of any number of circuits, such as an LC circuit in which L4 is connected in series and a second capacitor C4 is connected in parallel.

Further, both the back electrode layer 14 and the front electrode layer 16 have tongues 14a and 16a that reach one side of the bandpass filter, and the exposed portions of the tongues 14a and 16a are connected to the lower side surface portions. Following this (terminal electrode film 3 for grounding made of conductive material such as silver formed in the shape of 5 characters on the bottom part)
3.34 is electrically connected. This terminal electrode film 3
3 and 34 are electrically insulated from each other and from other layers.

Then, the bandpass filter Ql having the above-mentioned equal number of circuits
, Q2 are in a state where the two coil patterns 63, 163 are brought close to each other with a distance d as shown in FIG. Construct a bandpass filter with such a number of circuits.

In the figure, M is the mutual inductance that represents the degree of magnetic coupling between the two coil patterns 63 and 163, and L31. L3
2 is the inductance of the terminal electrode films 31 and 32 for leads. Note that the above two bandpass filters Ql,
Since Q2 uses the dielectric layer 5, not only magnetic coupling but also capacitive coupling is performed. In the figure, C8 schematically indicates the coupling capacity.

A method for manufacturing a bandpass filter having such a structure will be described next. First, a protective layer 1, a sheet layer 3, and a dielectric layer 5 are prepared, and a shield electrode 2 is formed by screen printing or applying a paste made of a conductive material such as copper on the surface of the protective layer 1. On the surface of the layer 3, two U-shaped back electrodes 4.14 having the tongue pieces 4a, 14a and formed symmetrically on the left and right sides are formed in the same manner, and on the surface of the dielectric layer 5, the back electrodes 4.14 are formed in the same manner. The above tongue piece 6a is
, 16a, two symmetrical U-shaped surface electrodes 6 are formed, and these are overlapped with the sheet layer 7 and then pressed together to form the first divided block 10.
A paste made of a conductive material such as copper or silver is applied to the exposed portions of the tongues 4a, 14a, 6a, and 16a of the first divided block 10, the side surfaces below these, and the bottom surface continuing therefrom. Terminal electrode film 31 by printing
32,33,34, the first divided block 10 is fired at, for example, 1000°C for 2 hours.

Further, the shield electrode layer 22 is formed by screen printing or applying a paste made of a conductive material such as copper on the surface of the prepared sheet layer 21, and after stacking these together with the protective layer 23, they are pressed and baked. , a second divided block 20 consisting of three layers is obtained.

Note that it is optional whether the protective layers 1 and 23, the sheet layers 3, 7, and 21, and the dielectric layer 5 are each formed by one sheet material or by laminating a plurality of sheet materials. It can be selected as appropriate. Also the first
．． The second divided blocks 10.20 may be fired in advance.

In this example, the sheet layer 7 of the first divided block 10 obtained as described above and the sheet layer 21 of the second divided block 20 were made to face each other, and an adhesive layer 30 was interposed therebetween. Now, add adhesive and glue both side blocks 10 and 20 together.

Although adhesive is used for the adhesive layer 30 in this embodiment, a sheet-like material such as double-sided tape may also be used. In addition, each of the above seven layers (adhesive layer 3
(including 0) may be constructed from a single sheet material, or may be constructed by stacking two or more sheet materials made of the same material.

Shield electrode layers 22 and 2 are located at the upper and lower positions of the band-pass filter body manufactured in this way, that is, at positions in the direction that are easily affected by external magnetic fields and external conductors.
are arranged. Therefore, the bandpass filter main body is effectively shielded by this shield electrode layer 22.2, and both or any of the shield electrodes Ji22.2 can be Specifically, by changing the thickness of one sheet material for the four layers of sheet layers 3, 7. It becomes possible to adjust the frequency characteristics of

Next, a method for adjusting the frequency characteristics in a resonator according to the present invention will be described below, for example, in the case where the thickness of the adhesive layer 3o is changed.

First, if the center frequency is higher than the desired value, the adhesive layer 30 is made thicker. This causes the bandpass filter main body to be separated from the shield electrode layer 22, thereby lowering the center frequency. As shown in characteristic curve vA), the frequency characteristics can be adjusted from curve 1 to curve 3.

Conversely, if the center frequency is lower than the desired value, the adhesive layer 30 is made thinner. As a result, contrary to the above case, the shield electrode layer approaches the bandpass filter body, so the curve 1 changes to the curve 2, and the center frequency becomes higher.

Adjustment of the center frequency performed in this way requires not only the adhesive layer 30 but also one of the sheet layers 3 and 7° 21.
By changing the thickness along with the above (or adhesive layer 3
It can also be carried out (by changing the thickness of one or more of the sheet layers 3, 7, 21 without changing the thickness of the sheet layer 3, 7, 21).

In this embodiment, the adhesive layer 30 is provided between the sheet layer 7 and the sheet layer 21, but the present invention is not limited to this. The adhesive layer may be provided at any height position, if any. Further, it may be provided between the bandpass filter main body and the lower shield electrode layer 2, or further between the bandpass filter main body and the upper and lower shield electrode layers 22, 2.

This agrees with the fact that an adhesive layer may be interposed between a plurality of divided blocks formed by dividing one or both of the pair of shield electrode layers 2.22 and the bandpass filter body. .

In addition, in the above embodiment, the front electrode layer 6.16, the back electrode layer 4,
14 and the shield electrode layer 2.22 are formed by printing or coating, but the present invention is not limited to this.
16. Back electrode! 4.14 and the shield electrode layer 2.22 may be prepared by preparing sheet materials made of conductive material and stacking these sheets together with other sheet materials to create a plurality of divided blocks. Alternatively, the surface electrode layer 6 .16. Prepare a sheet material made of a conductive material for one or more of the back electrode layers 4, 14 and the shield electrode Fi2.22, and use it together with printing or coating to overlap each sheet material to form a plurality of sheets. You may also create divided blocks. Further, it is optional whether each of the sheet layers 3, 7, 21 and the dielectric layer 5 are formed by a single sheet material or by laminating a plurality of sheet materials, and the selection can be made as appropriate. can.

Prevention of Effects As described in detail above, in the case of the present invention, the bandpass filter main body, a pair of sheet layers, and a pair of shield electrode layers are provided in a laminated state, and between the bandpass filter main body and the shield electrode layer, Since it has a structure in which it is divided into parts and an adhesive layer is interposed between them, the separation distance between the bandpass filter body and the shield electrode layer can be adjusted by changing the thickness of the sheet layer and the thickness of the adhesive layer. , which has the excellent effect of making it possible to adjust the frequency characteristics.

[Brief explanation of the drawing]

Fig. 1 is an external perspective view showing an embodiment of the product of the present invention, Fig. 2 is a sectional view (front view) taken along the line ■-■ in Fig. 1, and Fig. 3 is taken along m-m 11 in Fig. 2. 4 is an equivalent circuit diagram of the band-pass filter portion of the product of the present invention, FIG. 5 is an equivalent circuit diagram of the band-pass filter body of the product of the present invention, and FIG. 6 is a diagram showing the frequency characteristics of the product of the present invention. FIG. 7 is a front view of a conventional product, FIG. 8 is a bottom view thereof, and FIG. 9 is a rear view thereof. 2.22... Shield electrode layer, 3,7.21... Sheet layer, 4.14... Back electrode layer, 5... Dielectric layer,
6゜16... Surface electrode layer, 10... First divided block, 20... Second divided block, 30... Adhesive layer. Patent applicant 2 Murata Manufacturing Co., Ltd. Figure 4 Figure 5 Figure 8 Figure 9 Procedural amendment (voluntary) 1. Indication of matter f1 1988 Patent Application No. 32162 2 Name of the invention Band-pass filter and its manufacturing method and method for adjusting frequency characteristics in a band-pass filter 3 Relationship with the case of the person making the amendment Patent applicant address Kyoto 2-26-10 Tenjin, Okakyo City, Fukuoka Name (
623) Mura Co., Ltd. 1) Manufacturing Co., Ltd. 6, subject of amendment (1) “From page 4, line 17 of the specification to page 5, line 1 of the specification”
Therefore, in the conventional bandpass filter, 12
901301 had a problem, for example, that it was difficult to adjust the center frequency. ” is corrected as follows. ``However, in conventional bandpass filters, in order to adjust the frequency characteristics, for example, the center frequency, it is necessary to trim the electrodes, which makes adjustment difficult.''

Claims (3)

[Claims] (1) A bandpass filter main body with a predetermined conductive pattern formed on both sides of a dielectric layer, a pair of sheet layers made of dielectric or insulator provided on both sides of the bandpass filter main body, and a bandpass filter A filter main body and a pair of shield electrode layers provided on both sides with the pair of sheet layers in between are provided in a stacked state, and a space between one or both of the pair of shield electrode layers and the bandpass filter main body is divided, A bandpass filter characterized in that a plurality of divided blocks are integrated with each other by interposing an adhesive layer between the divided blocks. (2) A bandpass filter main body with a predetermined conductive pattern formed on both sides of a dielectric layer, a pair of sheet layers made of dielectric or insulator provided on both sides of the bandpass filter main body, and a bandpass filter A method for manufacturing a bandpass filter comprising a filter main body and a pair of shield electrode layers provided on both sides with the pair of sheet layers in between, the bandpass filter comprising one or both of the pair of shield electrode layers and a band. The method is characterized in that a plurality of fired divided blocks are prepared or manufactured in advance and are divided between the pass filter main body, and an adhesive layer is interposed between each divided block to integrate each divided block. A method for manufacturing a bandpass filter. (3) A bandpass filter body with a predetermined conductive pattern formed on both sides of a dielectric layer, a pair of sheet layers made of dielectric or insulator provided on both sides of the bandpass filter body, and a bandpass filter body with a predetermined conductive pattern formed on both sides of a dielectric layer; A filter main body and a pair of shield electrode layers provided on both sides with the pair of sheet layers in between are provided in a stacked state, and one or both of the pair of shield electrode layers and the bandpass filter main body are divided, A method for adjusting frequency characteristics in a bandpass filter in which a plurality of divided blocks are interposed with an adhesive layer to integrate each divided block, the method comprising: at least one of the pair of sheet layers; and/or changing the thickness of the adhesive layer to adjust the separation distance between the shield electrode layer and the bandpass filter body, thereby adjusting the frequency characteristics of the bandpass filter body. How to adjust frequency characteristics.