JPH06103650B2 - Electronic parts - Google Patents
Electronic partsInfo
- Publication number
- JPH06103650B2 JPH06103650B2 JP1057165A JP5716589A JPH06103650B2 JP H06103650 B2 JPH06103650 B2 JP H06103650B2 JP 1057165 A JP1057165 A JP 1057165A JP 5716589 A JP5716589 A JP 5716589A JP H06103650 B2 JPH06103650 B2 JP H06103650B2
- Authority
- JP
- Japan
- Prior art keywords
- shield electrode
- electrode film
- bandpass filter
- electrode films
- films
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012212 insulator Substances 0.000 claims description 7
- 239000003990 capacitor Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 230000005672 electromagnetic field Effects 0.000 description 8
- 238000010304 firing Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 210000002105 tongue Anatomy 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Filters And Equalizers (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、誘電体層の厚み方向にある主表面に回路素子
を構成するパターン電極が形成され、回路中に少なくと
もインダクターを含んでなる電子部品本体に対し、その
周囲がシールドされた構成のバンドパスフィルタ、イン
ダクター及びLC複合部品等の電子部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component main body in which a pattern electrode forming a circuit element is formed on the main surface of the dielectric layer in the thickness direction, and the circuit includes at least an inductor. On the other hand, the present invention relates to electronic components such as a bandpass filter, an inductor, and an LC composite component having a shielded periphery.
従来の技術 上記バンドパスフィルタとしては、当初、第７図（正面
図）、第８図（底面図）、第９図（背面図）に示すよう
に形成したバンドパスフィルタ本体の周囲がシールドさ
れた構成のものが一般的であった。このフィルタは、図
示の如く、焼成して得た誘電体基板40の表側主表面40a
及び裏側主表面40bにそれぞれ左右対称な２つのコの字
体の導電パターン41,42,43,44が形成され、表側主表面4
0aの導電パターン41,42にアース端子45,45が、また裏側
主表面40bの導電パターン43,44に外部取り出し用リード
端子46,46が半田付けされており、リード端子46および
アース端子45の突出部分を除いてこれを絶縁用の樹脂浴
中に浸漬して樹脂膜（図示せず）が形成され、この外側
が図示しない磁性体にて覆われてシールドされた構成と
なっている。2. Description of the Related Art As the above bandpass filter, the bandpass filter body is initially shielded around the bandpass filter body formed as shown in FIG. 7 (front view), FIG. 8 (bottom view), and FIG. 9 (rear view). The one with the common structure was common. As shown in the figure, this filter has a front main surface 40a of a dielectric substrate 40 obtained by firing.
And two symmetrical U-shaped conductive patterns 41, 42, 43, 44 are formed on the back main surface 40b and the front main surface 4b, respectively.
Ground terminals 45, 45 are soldered to the conductive patterns 41, 42 of 0a, and lead terminals 46, 46 for external extraction are soldered to the conductive patterns 43, 44 of the back main surface 40b. A resin film (not shown) is formed by immersing this in a resin bath for insulation except the protruding portion, and the outside is covered with a magnetic body (not shown) to be shielded.
ところで、かかる構成のフィルタにあっては、一体焼成
が不可能であった。そこで、本願出願人は第10図及び第
11図（第10図をXI−XI線方向から見た矢示図）に示す構
成のものを先に提案している。このフィルタは、誘電体
層55を挟んでその厚み方向の両主表面にそれぞれ左右対
称な２つのコの字体の導電パターン54a,54b,56a,56bが
形成されてなるバンドパスフィルタ本体と、このバンド
パスフィルタ本体を挟んで両側に設けた誘電体等からな
る一対のシート層53,57と、バンドパスフィルタ本体及
び前記一対のシート層53,57を挟んで両側に設けてある
一対のシールド電極膜52,58と、バンドパスフィルタ本
体，一対のシート層53,57及び前記一対のシールド電極
膜52,58を挟んで両側に設けてある誘電体等からなる保
護用の一対のシート層51,59とを具備する構成であり、
一体焼成が可能な積層構造としてある。なお、図中60,6
1は、アース用の端子電極膜であり、62,63は入・出力用
の端子電極膜である。By the way, in the filter having such a structure, integral firing was impossible. Therefore, the applicant of the present application is
The structure shown in FIG. 11 (the arrow view of FIG. 10 taken along the line XI-XI) was previously proposed. This filter comprises a bandpass filter body having two symmetrical U-shaped conductive patterns 54a, 54b, 56a, 56b formed on both main surfaces in the thickness direction with a dielectric layer 55 interposed therebetween. A pair of sheet layers 53 and 57 made of a dielectric material or the like provided on both sides of the bandpass filter body, and a pair of shield electrodes provided on both sides of the bandpass filter body and the pair of sheet layers 53 and 57. Membranes 52 and 58, a bandpass filter body, a pair of sheet layers 53 and 57, and a pair of protective sheet layers 51 and 57 formed on both sides with the pair of shield electrode films 52 and 58 interposed therebetween for protection. 59 and the configuration,
It has a laminated structure capable of being integrally fired. In the figure, 60,6
1 is a terminal electrode film for grounding, and 62 and 63 are terminal electrode films for input / output.
発明が解決しようとする課題 しかしながら、上記先に提案した電子部品においては、
シールド電極膜52,58の存在により、その両側の共に誘
電体等からなるシート層51と53及び57と59間での密着強
度が弱くなり、剥離し易くなるという問題点があった。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, in the electronic parts proposed above,
Due to the presence of the shield electrode films 52 and 58, there is a problem that the adhesion strength between the sheet layers 51 and 53 and 57 and 59 made of a dielectric material or the like on both sides of the shield electrode films is weakened and peeling easily occurs.
本発明はかかる課題を解決すべくなされたものであり、
シールド電極膜の両側のシート層間での密着強度を強く
して剥離が生じにくくした、一体焼成が可能な電子部品
を提供することを目的とする。The present invention has been made to solve such problems,
An object of the present invention is to provide an electronic component capable of integral firing, in which the adhesion strength between the sheet layers on both sides of the shield electrode film is increased to prevent peeling.
課題を解決するための手段 本発明に係る電子部品は、誘電体層の厚み方向にある主
表面に回路素子を構成するパターン電極が形成され、回
路中に少なくともインダクターを含んでなる電子部品本
体の両側に対し、透孔を有するシールド電極膜が、誘電
体又は絶縁体からなるシート層で挟まれた状態で２層以
上設けられていると共に、電子部品本体の両側それぞれ
において、前記シート層を介して対向積層するシールド
電極膜に形成された透孔が、前記対向積層するすべての
シールド電極膜に形成された透孔において共通の重なり
部分がないように偏位させて形成していることを特徴と
する。Means for Solving the Problems An electronic component according to the present invention is an electronic component main body in which a pattern electrode forming a circuit element is formed on a main surface in the thickness direction of a dielectric layer, and the circuit includes at least an inductor. Two or more shield electrode films having through holes are provided on both sides in a state of being sandwiched by sheet layers made of a dielectric or an insulator, and the sheet layers are provided on both sides of the electronic component body with the sheet layers interposed therebetween. The through-holes formed in the shield electrode films that are oppositely laminated are formed so as to be offset so that there is no common overlapping portion in the through-holes formed in all the shield electrode films that are oppositely laminated. And
作用 本発明の構成とした場合には、各シールド電極膜にそれ
ぞれ透孔が設けられているため、その両側にシート層を
積層すると両シート層が透孔を介して連結され、強固に
密着する。また、電子部品本体の両側それぞれにおい
て、前記シート層を介して対向積層するシールド電極膜
に形成された透孔が、前記対向積層するすべてのシール
ド電極膜に形成された透孔において共通の重なり部分が
ないように偏位させて形成していることにより、電子部
品本体に近いシールド電極膜の透孔から漏洩した電磁界
が外側のシールド電極膜にて遮断されることになり、電
磁界の外部への漏洩がない。In the case of the configuration of the present invention, since each shield electrode film is provided with a through hole respectively, when sheet layers are laminated on both sides of the shield electrode film, both sheet layers are connected through the through hole and firmly adhere to each other. . Further, on each of both sides of the electronic component body, the through holes formed in the shield electrode films which are laminated to face each other with the sheet layer interposed therebetween are common overlapping portions in the through holes formed in all the shield electrode films which are laminated to face each other. By forming it so that there is no gap, the electromagnetic field leaking from the through hole of the shield electrode film close to the electronic component body is blocked by the outer shield electrode film, and There is no leakage to.
実施例 第１図は本発明を適用したバンドパスフィルタを示す外
観斜視図、第２図は第１図のII−II線による断面図、第
３図は第２図をIII−III線の方向から見たバンドパスフ
ィルタ本体部分の平面図である。このバンドパスフィル
タは、第２図に示す如く複数の層を積層した直方体形状
をなし、最下層側から順に、誘電体又は絶縁体からなる
厚さが20〜50μｍの保護用のシート層１、銅等からなる
シールド電極膜２、誘電体又は絶縁体からなる厚さが20
〜50μｍのシート層３、銅等からなるシールド電極膜
４、誘電体又は絶縁体からなる厚さが１〜1.5mmのシー
ト層５、銅等の導電材料からなる裏電極膜6,16、BaO−S
iO2−ZrO2系誘電体等からなる厚さが20〜50μｍの誘電
体層７、銅等の導電材料からなる表電極膜8,18、誘電体
又は絶縁体からなる厚さが１〜1.5mmのシート層９、銅
等からなるシールド電極膜10、誘電体又は絶縁体からな
る厚さが20〜50μｍのシート層11、銅等からなるシール
ド電極膜12、誘電体又は絶縁体からなる厚さが20〜50μ
ｍの保護用のシート層13が設けられている。EXAMPLE FIG. 1 is an external perspective view showing a bandpass filter to which the present invention is applied, FIG. 2 is a sectional view taken along line II-II of FIG. 1, and FIG. 3 is a direction of line III-III of FIG. It is a top view of the bandpass filter main body seen from above. This band-pass filter has a rectangular parallelepiped shape in which a plurality of layers are laminated as shown in FIG. 2, and a protective sheet layer 1 having a thickness of 20 to 50 μm, which is made of a dielectric or an insulating material in this order from the bottom layer side, The shield electrode film 2 made of copper or the like, the thickness made of a dielectric or an insulator is 20
˜50 μm sheet layer 3, shield electrode film 4 made of copper or the like, sheet layer 5 made of a dielectric or insulator and having a thickness of 1 to 1.5 mm, back electrode films 6, 16 made of a conductive material such as copper, BaO -S
A dielectric layer 7 having a thickness of 20 to 50 μm made of an iO 2 —ZrO 2 system dielectric, surface electrode films 8 and 18 made of a conductive material such as copper, and a thickness of 1 to 1.5 made of a dielectric or an insulator. mm sheet layer 9, shield electrode film 10 made of copper or the like, sheet layer 11 made of dielectric or insulator with a thickness of 20 to 50 μm, shield electrode film 12 made of copper or the like, thickness made of dielectric or insulator 20 to 50μ
m protective sheet layer 13 is provided.
そして、このバンドパスフィルタは、例えば上述の表電
極膜8,18と裏電極膜6,16を夫々、その下の誘電体層７と
シート層５の上に、また、シールド電極膜2,4,10及び12
を夫々、その下のシート層1,3,9及び11用の４つのグリ
ーンシート上に印刷又は塗布により形成した後、上記の
ような構成に積層して一体焼成して製造している。This band-pass filter has, for example, the above-mentioned front electrode films 8 and 18 and back electrode films 6 and 16, respectively, on the dielectric layer 7 and the sheet layer 5 thereunder, and the shield electrode films 2 and 4. , 10 and 12
Is formed by printing or coating on the four green sheets for the sheet layers 1, 3, 9 and 11 thereunder, respectively, and then laminated and fired integrally in the above-mentioned structure.
第３図の右側に位置する上記表電極膜８（実線）と裏電
極膜６（破線）とは２つのコンデンサ電極パターン8a,8
c,6a,6cを１つのコイルパターン8b,6bで接続している。
前記コンデンサ電極パターン8aと6a、及び8cと6cはそれ
ぞれ誘電体層７の表裏両主表面において対向しており、
誘電体層７の誘電率、厚さ、コンデンサ電極の対向面積
によって決まる容量のコンデンサC1,C2を形成してい
る。一方、コイルパターン8b,6bは、夫々誘電体層７の
表裏各主表面において２つのコンデンサ電極パターン8a
と6a、8cと6cを接続する状態で形成されている。各コイ
ルパターン8b,6bは高周波的にはコイルを形成するの
で、そのコイルをL1,L2とすると、表電極膜8,裏電極膜
６及びその間の誘電体層７は第４図に示すように第１の
コンデンサC1の両側にコイルL1,L2を直列接続したLC回
路に第２のコンデンサC2を並列接続した等価回路であら
わされる共振器Q1を構成する。なお、この等価回路は第
11図に示す先に提案したものと同様である。The front electrode film 8 (solid line) and the back electrode film 6 (broken line) located on the right side of FIG. 3 have two capacitor electrode patterns 8a and 8a.
c, 6a, 6c are connected by one coil pattern 8b, 6b.
The capacitor electrode patterns 8a and 6a and 8c and 6c are opposed to each other on both front and back main surfaces of the dielectric layer 7,
Capacitors C1 and C2 having a capacitance determined by the dielectric constant and thickness of the dielectric layer 7 and the facing area of the capacitor electrodes are formed. On the other hand, the coil patterns 8b and 6b are two capacitor electrode patterns 8a on the front and back main surfaces of the dielectric layer 7, respectively.
And 6a, and 8c and 6c are connected. Since each coil pattern 8b, 6b forms a coil in terms of high frequency, assuming that the coils are L1, L2, the front electrode film 8, the back electrode film 6 and the dielectric layer 7 between them are as shown in FIG. A resonator Q1 represented by an equivalent circuit in which a second capacitor C2 is connected in parallel to an LC circuit in which coils L1 and L2 are connected in series on both sides of the first capacitor C1 is configured. This equivalent circuit is
It is similar to the one previously proposed as shown in FIG.
また、前記表電極膜８及び裏電極膜６は共にバンドパス
フィルタの一側面に達する舌片8d,6dを有し、この舌片8
d,6dのバンドパスフィルタ側面に露出した部分には、こ
れよりも下の側面部分とこれに続く底面部分に夫々Ｌ字
状に形成した銅等の導電材料からなるアース用の端子電
極膜20,入力用の端子電極膜22（第１図参照）と電気的
に接続されている。The front electrode film 8 and the back electrode film 6 both have tongues 8d and 6d reaching one side surface of the bandpass filter.
In the exposed portions on the side surfaces of the band-pass filters d and 6d, the terminal electrode film 20 for earth made of a conductive material such as copper is formed in L-shapes on the side surface portion below this and the bottom surface portion following this. Then, it is electrically connected to the input terminal electrode film 22 (see FIG. 1).
この端子電極膜20,22は夫々相互にかつ他の層に対して
も電気的に絶縁されて形成してある。The terminal electrode films 20 and 22 are formed so as to be electrically insulated from each other and from other layers.
一方、第３図の左側に位置する上記表電極膜18（実線）
と裏電極膜16（破線）とは２つのコンデンサ電極パター
ン18a,18c,16a,16cを１つのコイルパターン18b,16bで接
続している。前記コンデンサ電極パターン18aと16a、及
び18cと16cはそれぞれ誘電体層７の表裏両主表面におい
て対向しており、誘電体層７の誘電率、厚さ、コンデン
サ電極の対向面積によって決まる容量のコンデンサC3,C
4を形成している。一方、コイルパターン18b,16bは、夫
々誘電体層７の表裏各主表面において２つのコンデンサ
電極パターン18aと16a、18cと16cを接続する状態で形成
されている。各コイルパターン18b,16bは高周波的には
コイルを形成するので、そのコイルをL3,L4とすると、
表電極膜18,裏電極膜16及びその間の誘電体層７は第４
図に示すように第１のコンデンサC3の両側にコイルL3,L
4を直列接続したLC回路に第２のコンデンサC4を並列接
続した等価回路であらわされる共振器Q2を構成する。な
お、この等価回路は第11図に示す先に提案したものと同
様である。On the other hand, the front electrode film 18 located on the left side of FIG. 3 (solid line)
And the back electrode film 16 (broken line) connect two capacitor electrode patterns 18a, 18c, 16a, 16c by one coil pattern 18b, 16b. The capacitor electrode patterns 18a and 16a, and 18c and 16c are opposed to each other on both the front and back main surfaces of the dielectric layer 7, and a capacitor having a capacitance determined by the dielectric constant and thickness of the dielectric layer 7 and the opposed area of the capacitor electrodes. C3, C
Forming four. On the other hand, the coil patterns 18b and 16b are formed on the front and back main surfaces of the dielectric layer 7 so as to connect the two capacitor electrode patterns 18a and 16a and 18c and 16c, respectively. Since each coil pattern 18b, 16b forms a coil in terms of high frequency, if the coil is L3, L4,
The front electrode film 18, the back electrode film 16 and the dielectric layer 7 between them are the fourth
Coil L3, L on both sides of the first capacitor C3 as shown
A resonator Q2 represented by an equivalent circuit in which a second capacitor C4 is connected in parallel to an LC circuit in which 4 is connected in series is configured. Note that this equivalent circuit is similar to the previously proposed one shown in FIG.
また、前記表電極膜18及び裏電極膜16は共にバンドパス
フィルタの一側面に達する舌片18d,16dを有し、この舌
片18d,16dのバンドパスフィルタ側面に露出した部分に
は、これよりも下の側面部分とこれに続く底面部分に夫
々Ｌ字状に形成した銅等の導電材料からなるアース用の
端子電極膜21,出力用の端子電極膜23（第１図参照）と
電気的に接続されている。この端子電極膜21,23は夫々
相互にかつ他の層に対しても電気的に絶縁されて形成し
てある。Further, both the front electrode film 18 and the back electrode film 16 have tongue pieces 18d and 16d reaching one side surface of the bandpass filter, and the tongue pieces 18d and 16d are exposed on the side surface of the bandpass filter. A grounding terminal electrode film 21, an output terminal electrode film 23 (see FIG. 1), which are made of a conductive material such as copper and are formed in an L-shape on the side surface portion below and the bottom surface portion following this, respectively. Connected to each other. The terminal electrode films 21 and 23 are formed so as to be electrically insulated from each other and from other layers.
そして、上述の等価回路を持つ共振器Q1,Q2が、第３図
に示しているように２つのコイルパターン8b,18bを間隔
ｄに接近させた状態であるので、２つのコイルパターン
8b,18bが磁気結合を生じ、第５図に示す如き等価回路を
もつバンドパスフィルタを構成する。図中Ｍは２つのコ
イルパターン8b,18b間の磁気的結合度をあらわす相互イ
ンダクタンス、L20,L21はアース用の端子電極膜20,21の
もつインダクタンスである。なお、上記２つの共振器Q
1,Q2は、その間に誘電体層７が存在するため、磁気的結
合だけでなく容量的結合も行われている。図中Csはその
結合容量を模式的に示している。Since the resonators Q1 and Q2 having the above-mentioned equivalent circuit are in the state where the two coil patterns 8b and 18b are close to the distance d as shown in FIG.
8b and 18b generate magnetic coupling to form a bandpass filter having an equivalent circuit as shown in FIG. In the figure, M is a mutual inductance that represents the degree of magnetic coupling between the two coil patterns 8b and 18b, and L20 and L21 are the inductances of the terminal electrode films 20 and 21 for grounding. The above two resonators Q
Since 1 and Q2 have the dielectric layer 7 between them, not only magnetic coupling but also capacitive coupling is performed. In the figure, Cs schematically shows the binding capacity.
このような構造からなるバンドパスフィルタ本体の下側
には、２つ１組のシールド電極膜２と４が配設され、ま
た、上側にも２つ１組のシールド電極膜10と12が配設さ
れており、すべてのシールド電極膜2,4,10及び12は、そ
の上下に位置するシート層1,3等よりも平面視で縦横寸
法を小さくなしてある。下側のシールド電極膜２と４に
は、それぞれ第６図の（ａ）と（ｂ）に示すように多数
の透孔2aと4aが形成されており、一方のシールド電極膜
２の両側に設けたシート層１と３とは、焼成前の積層時
に、グリーンシートが透孔2aを介して連結し、また周囲
においても接触した状態となり、その後焼成されるため
焼成後においては前記透孔2a、4aを介してシート層１、
３が融着し、密着強度が高いものとなっている。他方の
シールド電極膜４の両側に設けたシート層３と５とにお
いても、同様に密着強度が高い。Two pairs of shield electrode films 2 and 4 are arranged on the lower side of the bandpass filter body having such a structure, and two pairs of shield electrode films 10 and 12 are arranged on the upper side. All of the shield electrode films 2, 4, 10 and 12 are provided so that the vertical and horizontal dimensions are smaller in plan view than the sheet layers 1, 3 and the like located above and below them. A large number of through holes 2a and 4a are formed in the lower shield electrode films 2 and 4 as shown in FIGS. 6 (a) and (b), respectively. The provided sheet layers 1 and 3 are connected to each other through the through holes 2a when the green sheets are laminated before firing, and are in contact with each other in the surroundings. , Sheet layer 1 via 4a,
3 is fused and has high adhesion strength. Similarly, the adhesion strength is high between the sheet layers 3 and 5 provided on both sides of the other shield electrode film 4.
また、上下２つのシールド電極膜２と４に設けた多数の
透孔2aと4aは、第６図に示すように相互に上下方向で共
通の重なり部分が存在しないように偏位させて配設して
あるので、透孔2aの上にはシート層３を介した透孔4a部
を除くシールド電極膜４部分が覆い、一方前記透孔4aの
下にはシート層３を介した透孔2a部を除くシールド電極
膜２部分が覆う。このため、バンドパスフィルタ本体に
近いシールド電極膜４の透孔4aから電磁界が漏洩して
も、他方のシールド電極膜２により遮蔽され、逆に外界
からバンドパスフィルタ本体へ向かう電磁界も遮蔽され
る。なお、透孔2aと4aとに上記共通の重なり部分が存在
する場合には、この共通の重なり部分から電磁界が自由
に漏洩するといった不都合が生じる恐れがある。Further, as shown in FIG. 6, a large number of through holes 2a and 4a provided in the upper and lower two shield electrode films 2 and 4 are arranged so as to be offset from each other so that there is no common overlapping portion in the vertical direction. Therefore, the shield electrode film 4 portion excluding the through hole 4a portion through the sheet layer 3 is covered on the through hole 2a, while the through hole 2a through the sheet layer 3 is under the through hole 4a. The shield electrode film 2 portion except the portion is covered. Therefore, even if the electromagnetic field leaks from the through hole 4a of the shield electrode film 4 near the bandpass filter body, it is shielded by the other shield electrode film 2, and conversely the electromagnetic field from the outside to the bandpass filter body is also shielded. To be done. When the above-mentioned common overlapping portion exists in the through holes 2a and 4a, there is a possibility that an inconvenience may occur in which the electromagnetic field freely leaks from this common overlapping portion.
一方、バンドパスフィルタ本体よりも上側の２つ１組の
シールド電極膜10と12においても、前同様に縦横寸法が
小さく、多数の透孔10aと12aが形成されている（第６図
参照）。よって、シールド電極膜10、12それぞれの両側
に設けたシート層９と11、及び11と13は、密着強度が高
い。On the other hand, also in the pair of shield electrode films 10 and 12 on the upper side of the bandpass filter body, the vertical and horizontal dimensions are small as before, and a large number of through holes 10a and 12a are formed (see FIG. 6). . Therefore, the sheet layers 9 and 11 and 11 and 13 provided on both sides of the shield electrode films 10 and 12 have high adhesion strength.
また、上下２つのシールド電極膜10と12に設けた多数の
透孔10aと12aは、相互に上下方向で共通の重なり部分が
存在しないように偏位させて配設してあるので、透孔10
aの上にはシート層11を介した透孔12a部を除くシールド
電極膜12部分が覆い、一方透孔12aの下にはシート層11
を介した透孔10a部を除くシールド電極膜10部分が覆
う。このため、バンドパスフィルタ本体に近いシールド
電極膜10の透孔10aから電磁界が漏洩しても、他方のシ
ールド電極膜12により遮蔽され、逆に外界からバンドパ
スフィルタ本体側へ向かう電磁界も遮蔽される。Further, since the large numbers of through holes 10a and 12a provided in the two upper and lower shield electrode films 10 and 12 are arranged so as to be offset from each other so that there is no common overlapping portion in the vertical direction, the through holes are formed. Ten
A portion of the shield electrode film 12 excluding the through hole 12a through the sheet layer 11 is covered on a, while the sheet layer 11 is below the through hole 12a.
The shield electrode film 10 portion excluding the through hole 10a portion through is covered. Therefore, even if the electromagnetic field leaks from the through hole 10a of the shield electrode film 10 close to the bandpass filter body, it is also shielded by the other shield electrode film 12, and conversely the electromagnetic field from the outside to the bandpass filter body side. Shielded.
したがって、密着強度を高めた状態でバンドパスフィル
タ本体の周りのシールドが可能である。Therefore, it is possible to shield the periphery of the bandpass filter main body in a state where the adhesion strength is increased.
なお、シールド電極膜2,4,10及び12は、その上下に位置
するシート層1,3等よりも平面視で縦横寸法を小さくす
る必要は必ずしもなく、同一寸法にして透孔2a,4a,10a
及び12aにより各上下にあるシート層1,3等を強固に密着
させるようにしてもよい。The shield electrode films 2, 4, 10 and 12 do not necessarily need to have smaller vertical and horizontal dimensions in plan view than the upper and lower sheet layers 1, 3 and the like, and have the same dimensions as the through holes 2a, 4a, 10a
Alternatively, the upper and lower sheet layers 1, 3 and the like may be firmly adhered to each other by means of 12a.
また、透孔2a,4a,10a及び12aの形や大きさについては、
図示のように同じ大きさの正方形とする必要はなく、要
は或るシールド電極膜の透孔から電磁界が漏洩しても、
他のシールド電極膜により遮蔽できるようになしてあれ
ばよい。Further, regarding the shape and size of the through holes 2a, 4a, 10a and 12a,
It is not necessary to make the squares of the same size as shown in the figure, the point is that even if the electromagnetic field leaks from a through hole of a certain shield electrode film,
It suffices if it can be shielded by another shield electrode film.
そして、また、上記実施例ではバンドパスフィルタの片
方に２つのシールド電極膜を設けた構成としてあるが、
本発明はこれに限らず、シールド電極膜を３層以上設け
るようにしてもよい。但し、各シールド電極膜に形成す
る透孔の配設位置は、上下方向において透孔が共通の重
なり部分が存在しない状態とする。In addition, in the above-mentioned embodiment, the configuration is such that two shield electrode films are provided on one side of the bandpass filter.
The present invention is not limited to this, and three or more shield electrode films may be provided. However, the positions of the through holes formed in each shield electrode film are set so that there is no overlapping portion where the through holes are common in the vertical direction.
更に、本発明は、バンドパスフィルタに限らず、インダ
クターやLC複合部品等の電子部品一般に適用できること
は勿論である。Furthermore, it goes without saying that the present invention can be applied not only to bandpass filters but also to general electronic components such as inductors and LC composite components.
発明の効果 以上詳述した如く本発明による場合には、各シールド電
極膜にそれぞれ透孔が設けられているため、その両側に
シート層を積層すると両シート層が透孔を介して連結さ
れ、焼成時の融着により強固に密着するので、それらが
剥離するのを防止できると共に、電子部品本体の両側そ
れぞれにおいて、前記シート層を介して対向積層するシ
ールド電極膜に形成された透孔が、前記対向積層される
すべてのシールド電極膜に形成された透孔において、共
通の重なり部分がないように偏位させて形成しているこ
とにより、対向する一方のシールド電極膜における透孔
から漏洩した電磁界が他方の電極膜において遮断される
ことになるで、電子部品本体におけるシールド効果を確
実に達成することができるといった優れた効果が得られ
る。従来同様に図ることができる。Effects of the Invention In the case of the present invention as described in detail above, since each shield electrode film is provided with a through hole, when sheet layers are laminated on both sides of the shield electrode film, both sheet layers are connected through the through hole, Since they are firmly adhered by fusion during firing, they can be prevented from peeling off, and on each of both sides of the electronic component body, the through holes formed in the shield electrode films that are laminated facing each other via the sheet layer, Since the through holes formed in all of the opposing shield electrode films are formed so as not to have a common overlapping portion, they leak from the through holes in one of the opposing shield electrode films. Since the electromagnetic field is blocked by the other electrode film, the excellent effect that the shield effect in the electronic component body can be achieved reliably can be obtained. It can be achieved in the same manner as in the past.
第１図は本発明を適用したバンドパスフィルタを示す外
観斜視図、第２図は第１図のII−II線による断面図、第
３図は第２図をIII−III線の方向から見たバンドパスフ
ィルタ本体部分の平面図、第４図はバンドパスフィルタ
本体に形成されたLC回路の等価回路図、第５図はバンド
パスフィルタ本体の等価回路図、第６図（ａ）と（ｂ）
は２枚１組でシールドを行うための各シールド電極膜を
示す平面図、第７図は当初の電子部品本体部分を示す正
面図、第８図はその底面図、第９図は背面図、第10図は
本願出願人が先に提案したバンドパスフィルタを示す縦
断面図、第11図は第10図をXI−XI線の方向から見たバン
ドパスフィルタ本体部分の平面図である。 1,3,5,9,11,13…シート層、2,4,10,12…シールド電極
膜、2a,4a,10a,12a…透孔、6,16…裏電極膜、７…誘電
体層、8,18…表電極膜。FIG. 1 is an external perspective view showing a bandpass filter to which the present invention is applied, FIG. 2 is a sectional view taken along the line II-II of FIG. 1, and FIG. 3 is a view of FIG. 2 seen from the direction of the line III-III. FIG. 4 is an equivalent circuit diagram of the LC circuit formed in the bandpass filter body, FIG. 5 is an equivalent circuit diagram of the bandpass filter body, and FIG. b)
Is a plan view showing each shield electrode film for performing a pair of shields, FIG. 7 is a front view showing an original electronic component main body portion, FIG. 8 is a bottom view thereof, and FIG. 9 is a rear view. FIG. 10 is a vertical cross-sectional view showing a bandpass filter previously proposed by the applicant of the present application, and FIG. 11 is a plan view of the bandpass filter main body seen from the direction of the line XI-XI in FIG. 1,3,5,9,11,13 ... sheet layer, 2,4,10,12 ... shield electrode film, 2a, 4a, 10a, 12a ... through hole, 6,16 ... back electrode film, 7 ... dielectric Layer, 8,18 ... Front electrode film.
Claims (1)
子を構成するパターン電極が形成され、回路中に少なく
ともインダクターを含んでなる電子部品本体の両側に対
し、透孔を有するシールド電極膜が、誘電体又は絶縁体
からなるシート層で挟まれた状態で２層以上設けられて
いると共に、電子部品本体の両側それぞれにおいて、前
記シート層を介して対向積層するシールド電極膜に形成
された透孔が、前記対向積層するすべてのシールド電極
膜に形成された透孔において共通の重なり部分がないよ
うに偏位させて形成していることを特徴とする電子部
品。1. A shield electrode having a pattern electrode constituting a circuit element formed on a main surface in the thickness direction of a dielectric layer and having a through hole on both sides of an electronic component body including at least an inductor in the circuit. Two or more layers of films are provided in a state of being sandwiched by sheet layers made of a dielectric or an insulator, and formed on the shield electrode films facing each other via the sheet layers on both sides of the electronic component body. The through-holes are formed so as to be offset so that there is no common overlapping portion in the through-holes formed in all the shield electrode films that are laminated facing each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1057165A JPH06103650B2 (en) | 1989-03-09 | 1989-03-09 | Electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1057165A JPH06103650B2 (en) | 1989-03-09 | 1989-03-09 | Electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02237004A JPH02237004A (en) | 1990-09-19 |
| JPH06103650B2 true JPH06103650B2 (en) | 1994-12-14 |
Family
ID=13047947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1057165A Expired - Fee Related JPH06103650B2 (en) | 1989-03-09 | 1989-03-09 | Electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06103650B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8178717B2 (en) | 2005-08-17 | 2012-05-15 | Evonik Stockhausen Gmbh | Process for production of (meth)acrylic acid with high boiling fraction work-up by means of crystallization |
| WO2016013339A1 (en) * | 2014-07-23 | 2016-01-28 | 株式会社 村田製作所 | Laminated coil component |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6159522A (en) * | 1984-08-30 | 1986-03-27 | Fujitsu Ltd | touch panel keyboard |
| JPS6361766A (en) * | 1986-09-01 | 1988-03-17 | Haruo Kitamura | Fuel activating device |
-
1989
- 1989-03-09 JP JP1057165A patent/JPH06103650B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8178717B2 (en) | 2005-08-17 | 2012-05-15 | Evonik Stockhausen Gmbh | Process for production of (meth)acrylic acid with high boiling fraction work-up by means of crystallization |
| WO2016013339A1 (en) * | 2014-07-23 | 2016-01-28 | 株式会社 村田製作所 | Laminated coil component |
| JPWO2016013339A1 (en) * | 2014-07-23 | 2017-04-27 | 株式会社村田製作所 | Multilayer coil parts |
| US11024451B2 (en) | 2014-07-23 | 2021-06-01 | Murata Manufacturing Co., Ltd. | Multilayer coil component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02237004A (en) | 1990-09-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3061088B2 (en) | Noise filter | |
| US5392019A (en) | Inductance device and manufacturing process thereof | |
| JPH01295407A (en) | Inductor, composite component including inductor and manufacture thereof | |
| JP2670490B2 (en) | Inductor, composite component including inductor, and method of manufacturing the same | |
| JPH06103650B2 (en) | Electronic parts | |
| JP2819643B2 (en) | Resonator and bandpass filter | |
| JP2819641B2 (en) | Bandpass filter | |
| JPH0690978B2 (en) | Inductor, composite component including inductor, and manufacturing method thereof | |
| JPH0654749B2 (en) | Electronic parts | |
| JPH11307392A (en) | Stacked differential transmission line | |
| JPH0115160Y2 (en) | ||
| JP2982558B2 (en) | Multilayer feedthrough capacitors | |
| JPH01208009A (en) | Band-pass filter and its manufacture and method for adjusting frequency characteristic of same | |
| JP2715552B2 (en) | Inductor, composite component including inductor, and method of manufacturing the same | |
| JP2663270B2 (en) | Resonator and manufacturing method thereof | |
| JPH0397314A (en) | Laminated type piezoelectric resonator component | |
| JP2844582B2 (en) | Resonator | |
| JP2600921B2 (en) | Piezoelectric resonator | |
| JP2971124B2 (en) | Electronic components | |
| JP2600917B2 (en) | Bandpass filter | |
| JPH04154102A (en) | Composite electronic component | |
| JPH0715213A (en) | Irreversible circuit element | |
| JP3717384B2 (en) | Circulator | |
| JP2703439B2 (en) | Dielectric filter | |
| JP2616106B2 (en) | Resonator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |