JPH0690978B2 - Inductor, composite component including inductor, and manufacturing method thereof - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is generally installed on a circuit board or the like, in which electrode films are patterned on both sides of a layered dielectric,
The present invention relates to an inductor whose outside is shielded, a composite component including an inductor such as a bandpass filter and a duplexer, and a manufacturing method thereof.

2. Description of the Related Art Among the above, for example, there are band pass filters configured as shown in FIG. 17 (front view), FIG. 18 (bottom view), and FIG. 19 (rear view). This is because two symmetrical U-shaped conductor patterns 221, 222, 223, 224 are formed on the front surface 220a and the back surface 220b of the dielectric substrate 220 obtained by firing, and the ground terminals 2 are formed on the conductive patterns 221, 222 on the front surface 220a.
After soldering the lead terminals 226 and 226 for external extraction to the conductive patterns 223 and 224 on the back surface 220b and the conductive patterns 223 and 224, the lead terminals 225 and the grounding terminals 226 are immersed in an insulating resin bath except for the protruding portions of the resin. A film (not shown) is formed, and the outside is surrounded by a magnetic material (not shown) to provide a shield.

This shield is for preventing the frequency characteristic from being deviated when a conductor such as a metal is present nearby.

Further, the shield is similarly applied to the inductor and other composite parts including the inductor.

However, in the shield structure as described above,
Since the magnetic permeability μ of the magnetic material for shielding changes depending on the frequency characteristics, the magnetic permeability μ deteriorates in the high frequency region, and a sufficient shielding effect cannot be obtained.

Further, in the case of manufacturing as described above, various manufacturing steps such as firing of the substrate, formation of conductive patterns, soldering of terminals, dipping in resin, formation of shield, etc. were required. Therefore, in order to manufacture with a small number of steps, in recent years, it has been desired to manufacture by forming the electrode layer for shielding into an integrated structure inside and firing it. In addition, there is a problem in that Q cannot be implemented due to deterioration of Q in the main body of the bandpass filter and the main body of the inductor inside the shield electrode layer.

The present invention has been made in view of the above circumstances, and an inductor and an inductor configured such that shielding can be performed without being affected by the frequency characteristics of the use environment and that Q of the inductor and the like inside the shield does not deteriorate. It is an object of the present invention to provide a composite part including the above and a manufacturing method thereof.

Means for Solving the Problems An inductor according to the present invention is an inductor having a structure in which coil pattern electrodes formed on both sides of a dielectric layer are electrically connected through through holes formed in the dielectric layer. A main body, a pair of sheet layers made of a dielectric material provided on both sides of the inductor body, a pair of shield electrode layers provided on both sides of the inductor body and the pair of sheet layers, and an inductor body, A pair of protective layers made of a dielectric or an insulator provided on both sides with a pair of sheet layers and a pair of shield electrode layers sandwiched therebetween, the shield electrode layer being in a non-connected state with the ground provided on a circuit board or the like. To be configured.

In addition, the composite component including the inductor has the sheet layer, the shield electrode layer, and the sheet layer, the shield electrode layer, on both sides of the composite component body formed by forming the electrodes including the coil pattern on both sides of the dielectric layer, as in the case of the inductor. And a structure including a protective layer.

With such a structure, a band pass filter is suitable.

In addition, regarding the inductor having the above-mentioned structure, an inductor body having a structure in which coil pattern electrodes formed on both sides of a dielectric layer are electrically connected through through holes formed in the dielectric layer is formed. This process includes a protective layer made of a dielectric or an insulator, a shield electrode layer, a sheet layer made of a dielectric, the inductor body, a sheet layer made of a dielectric, a shield layer, and a protective layer made of a dielectric or an insulator. It can be manufactured by performing a step of forming a laminated body formed by laminating in order and a step of firing the laminated body.

Further, for a composite component including an inductor, a step of producing a composite component body in which electrodes including a coil pattern are formed on both sides of a dielectric layer, and a protective layer and a shield electrode layer made of a dielectric or an insulator. Forming a laminated body in which a sheet layer made of a dielectric material, the composite component body, a sheet layer made of a dielectric material, a shield layer, and a protective layer made of a dielectric material or an insulating material are laminated in this order; It can be manufactured by performing a step of firing the body.

Action In the inductor of the present invention, since the sheet layer made of a dielectric material is interposed between the inductor body and the shield electrode layer, the Q of the inductor body generated by firing by increasing the thickness of this sheet layer Can be prevented from deteriorating. Further, the sheet layer made of the dielectric material mainly blocks the electric field component, while the ungrounded shield electrode layer mainly blocks the magnetic field component, and in addition to this, a protective layer is provided outside the shield electrode layer. Therefore, the magnetic permeability of the shield electrode layer does not change and does not depend on the frequency of the usage environment. This also applies to composite parts including inductors and bandpass filters.

Further, when the inductor, the composite component including the inductor, and the bandpass filter are manufactured by the method of the present invention, they can be manufactured by stacking each layer in a laminated state and then performing integral firing, and the manufacturing is easy.

Embodiment FIG. 1 is an external perspective view showing an inductor according to the present invention,
FIG. 2 is a sectional view taken along line II-II in FIG. This inductor has a rectangular parallelepiped shape by laminating a plurality of layers as shown in the figure, and the lowermost layer 2 and the uppermost layer 8 are formed of a dielectric or insulating sheet having a thickness of 20 to 50 μm. It is a protective layer. Inside, 3 and 7 are shield electrode layers, 4
Sheets 6 and 6 are made of a dielectric material and have a thickness of 1 to 1.5 mm, and a central portion 5 is made of, for example, a BaO-SiO ₂ -ZrO ₂ system dielectric material.
Sheet-shaped dielectric layers 51, 52, 53, 54, 55, 5 having a thickness of 20 to 50 μm
It is an inductor body in which 6 pieces of 6 are stacked and an electrode film is formed between them. In the figure, 11 is an input terminal and 12 is an output terminal.

As shown in FIG. 3, in the inductor body 5, C-shaped electrode film patterns 51a, ..., 55a are alternately formed on the lower surface of the five dielectric layers 51 ,. Has been done. The electrode film pattern 51a and the like are provided on one end side (left side in the drawing) of the electrode film pattern 51a formed on the uppermost dielectric layer 51.
The input terminal piece A provided on the dielectric layer 52, ..., 55 is sequentially changed in position in the left-right direction so as to penetrate the dielectric layer 52 ,.
55b is filled with a conductive material (not shown) to connect the ends of the upper and lower electrode film patterns 51a and the like, and the input terminal piece A to the output terminal piece B provided on the dielectric layer 55 are integrally formed. It is made as a spiral coil connected to. Reference numeral 57 is a bonding electrode for surely connecting the filled conductive material and the lower electrode film pattern to be connected. The input terminal piece A and the output terminal B are exposed on the end faces of the dielectric layer 51 and the like, and the input terminals formed on the left and right ends of the inductor.
11 and the output terminal 12 are connected.

Next, a method of manufacturing the inductor having such a structure will be described. First, six conductor layers 51, ..., 56 are prepared, and predetermined conductive patterns 51a and the like are formed on them, and a via hole 52b, a bonding electrode 57, an input terminal piece A and an output terminal piece B are formed. Then, a conductive material is filled in the via hole 52b and the like so that the six dielectric layers 51 and the like are stacked.

As shown in FIG. 2, the sheet layers 4 and 6, the shield electrode layers 3 and 7, and the protective layers 2 and 8 are sequentially laminated on both sides of the inductor body 5 thus produced. afterwards,
An input terminal 11 and an output terminal 12 are formed on the side surface portions of the input terminal piece A and the output terminal piece B, which are formed in advance so as to be exposed on the side surface of the inductor. As a result, the input terminal 11 is connected to the input terminal piece A, and the output terminal 12 is connected to the output terminal piece B.

Then, the one in this state is loaded into a firing furnace maintained at a predetermined temperature and fired. Then, the inductor having the above structure is manufactured. Although the earth terminal is not provided in this embodiment, even if the earth terminal is provided, it is not connected to the shield electrode films 3 and 7. Further, as shown in FIG. 4, the shield electrode layers 3 and 7 are formed to be slightly smaller than the sizes of the protective layers 2 and the like above and below the shield electrode layers 3 and 7, and a large number (in this example, in the central portion) It is preferable to form four through holes 3b (or 7b) to improve the adhesion between the upper and lower layers.

In the inductor manufactured as described above, since a laminated body formed by laminating each layer is formed and the formed laminated body is fired, the number of manufacturing steps can be reduced, and thus the inductor can be easily manufactured. In addition, since the input / output terminals are provided so as to be exposed to the outside, they can be surface-mounted on a circuit board or the like. In addition, since the sheet layers 4 and 6 made of a dielectric material are provided between the inductor body 5 and the shield electrode layers 3 and 7, the Q of the inductor body 5 remains even if firing is performed after the sheet layers are formed into an integral structure. It can prevent deterioration. Further, the sheet layers 4 and 6 made of the above-mentioned dielectric mainly block the electric field component, while the shield electrode layers 3 and 7 not grounded as described above mainly block the magnetic field component, and in addition to this, the shield electrode Tier 3,7
Since the protective layers 2 and 8 are formed on the outer side of, the magnetic permeability of the shield electrode layers 3 and 7 does not change even when a conductor such as a metal approaches the inductor, and the frequency characteristics do not shift. Although the electrode film patterns 51a, ..., 55a are formed in a C shape in this embodiment, the present invention is not limited to this and may be formed in a U shape.

Next, a case where the present invention is applied to a bandpass filter will be described. FIG. 5 is an external perspective view showing a bandpass filter according to the present invention, FIG. 6 is a sectional view (front view) taken along line VI-VI in FIG. 5, and FIG. 7 is a line VII-VII in FIG. 3 is a sectional view (plan view) of FIG. This bandpass filter is
As shown in FIG. 6, a sheet-shaped protective layer 21 and a shield electrode layer 22 each having a rectangular parallelepiped shape in which a plurality of layers are laminated, and made of a dielectric or an insulator in order from the bottom layer side and having a thickness of 20 to 50 μm , A sheet layer 23 made of a dielectric material and having a thickness of 1 to 1.5 mm,
Back electrode films 24, 34 made of a conductive material such as copper, for example, BaO-SiO
_A sheet-like dielectric layer 25 having a thickness of 20 to 50 μm and made of a _2- ZrO ₂ system dielectric, and a front electrode layer made of a conductive material such as copper.
26, 36, a sheet layer 27 having a thickness of 1 to 1.5 mm made of a dielectric, a shield electrode layer 28, and a sheet-like protective layer 29 made of a dielectric or an insulator and having a thickness of 20 to 50 μm. ing.

The front electrode film 26 (solid line) and the back electrode film 24 (broken line) located on the left side of FIG. 7 have two capacitor electrode patterns 61a,
62a, 41a, 42a are connected by one coil pattern 63a, 43a, and have a U-shaped pattern shape in a plan view. The capacitor electrode patterns 61a and 41a and 62a and 42a are opposed to each other on the front and back surfaces of the dielectric layer 25, respectively.
Capacitors C1 and C2 having a capacitance determined by the dielectric constant of 25, the thickness, and the facing area of the capacitor electrodes are formed. on the other hand,
The coil patterns 63a and 43a have two capacitor electrode patterns 61a, 62a and 41a on the front and back surfaces of the dielectric layer 25, respectively.
And 42a are connected to each other. Since each coil pattern 63a, 43a forms a coil in terms of high frequency, if this inductance is L1, L2, the front electrode film 26, the back electrode film
24 and the dielectric layer 25 between them are resonances represented by an equivalent circuit in which a second capacitor C2 is connected in parallel to an LC circuit in which coils L1 and L2 are connected in series on both sides of the first capacitor C1 as shown in FIG. Configure the container Q1. This equivalent circuit is
The same applies to the conventional product shown in FIG.

Further, the back electrode film 24 and the front electrode film 26 both have tongue pieces 24a, 26a reaching one side surface of the bandpass filter, and the exposed portions of the tongue pieces 24a, 26a are the side surface portions below this. Subsequent bottom portions are electrically connected to lead terminal electrode films 30 and 31 (see FIG. 5) made of a conductive material such as silver and formed in an L shape. This terminal electrode film 30,31
Are electrically insulated from each other and from other layers.

On the other hand, the front electrode film 36 located on the right side of FIG. 7 (solid line)
And the back electrode film 34 (broken line) are two capacitor electrode patterns 61b, 62b, 41b, 42b connected by one coil pattern 63b, 43b. The case of the front electrode film 26 and the back electrode film 24 is It has a symmetrical U-shaped pattern in plan view. The capacitor electrode patterns 61b and 41b, and 62b and 42b are opposed to each other on both front and back surfaces of the dielectric layer 25.
Capacitors C3 and C4 having a capacity determined by the dielectric constant of 25, the thickness, and the facing area of the capacitor electrodes are formed. on the other hand,
The coil patterns 63b and 43b are two capacitor electrode patterns 61b, 62b and 41b on the front and back surfaces of the dielectric layer 25, respectively.
And 42b are connected to each other. Since each coil pattern 63b, 43b forms a coil in terms of high frequency, assuming that the inductance is L3, L4, the front electrode film 36, the back electrode film
34 and the dielectric layer 25 between them are equivalent circuits in which the second capacitor C4 is connected in parallel to the LC circuit in which the coils L3 and L4 are connected in series on both sides of the first capacitor C3 as shown in FIG. A resonator Q2 represented by

Since the resonators Q1 and Q2 having the above-mentioned equivalent circuit are in the state where the two coil patterns 63a and 63b are close to the distance d as shown in FIG. 7, the two coil patterns 63a and 63b are Cause magnetic coupling to form a bandpass filter having an equivalent circuit as shown in FIG. In the figure, M is 2
Mutual inductances representing the degree of magnetic coupling between the coil patterns 63a and 63b, and L30 and L31 are inductances of the lead terminal electrode films 30 and 31. Since the two resonators Q1 and Q2 use the dielectric layer 25, not only magnetic coupling but also capacitive coupling is performed. In the figure, C _s schematically shows the binding capacity.

The shield electrode films 22 and 28 provided outside the bandpass filter body having such a structure are not grounded as in the case of the inductor.

A method of manufacturing the bandpass filter having such a structure will be described below. First, the protective layer 21, the sheet layers 23 and 27, the dielectric layer 2
5, prepare a shield electrode layer 22 so as to be partially exposed to the end surface of the protective layer 21, by screen-printing or applying a paste made of a conductive material such as copper on the surface of the protective layer 21, In addition, the tongue pieces 24a and 34a are formed on the surface of the sheet layer 23 in a similar manner to form two U-shaped rear surface electrode films 24 and 34 which are symmetrically formed, and the surface of the dielectric layer 25. In the same manner as described above, the surface electrode film 2 having two U-shaped patterns formed symmetrically with the tongue pieces 26a and 36a.
6,36 are formed, and similarly on the surface of the sheet layer 27,
The shield electrode layer 28 is partially exposed at the end surface of the sheet layer 27.
Is formed, and these are laminated together with the protective layer 29 and then pressure-bonded to form a laminated body, and the tongue piece in the laminated body is formed.
On the exposed portions of 24a, 34a, 26a, and 36a, the side surfaces lower than this, and the bottom surface subsequent to this, a paste made of a conductive material such as copper or silver is printed to form the terminal electrode films 30, 31, 32, and 33. Once formed, it is fired at 1000 ° C. for 2 hours, for example.

In the bid pass filter manufactured in this manner, since a laminated body formed by laminating each layer is formed and formed by firing, it is possible to reduce the number of manufacturing steps, which facilitates the band pass filter. Since it can be manufactured, and the input / output terminals are provided so as to be exposed to the outside, it can be surface-mounted on a circuit board or the like. Further, since the sheet layers 23 and 27 made of a dielectric material are provided between the bandpass filter body and the shield electrode layers 22 and 28, even if the bandpass filter body is fired after being formed into an integral structure. It is possible to prevent Q from deteriorating. Also, the dielectric sheet layer 2 on the outside of the bandpass filter body
3, 27 mainly shield the electric field component, and the outer shield electrode layers 22, 28 mainly shield the magnetic field component, and in addition to this, protective layers 21, 29 are formed outside the shield electrode layers 22, 28. Therefore, even if the conductor such as metal approaches the bandpass filter, the magnetic permeability of the shield electrode layers 22 and 28 does not change,
There is no deviation in frequency characteristics.

The shield electrodes 22 and 28, the back surface electrode films 24 and 34 are the front surface electrode films
The positions where the 26 and 36 are formed are not limited to those described above, and for example, the shield electrode 22 may be formed not on the front surface of the protective layer 21 but on the back surface of the sheet layer 23.

In the bandpass filter manufactured in this way, the terminal electrode films 30, 31, 32, and 33 are exposed to the outside and are formed into a film shape. Only by placing it, surface mounting can be easily performed.

The pressure bonding is not an essential requirement of the present invention. Further, the front electrode layers 26, 36, the back electrode films 24, 34 and the shield electrode layers
Each of the above five layers except 22,28 may be formed of one sheet material or may be formed by stacking two or more sheet materials of the same material.

The shield electrode layer 2 is disposed above and below the bandpass filter body, that is, at a position that is easily influenced by a magnetic field from the outside or a conductor existing outside, via the sheet layers 27 and 23, respectively.
8,22 are arranged. Therefore, the bandpass filter body is effectively shielded by the shield electrode layers 28 and 22, and by changing the thickness of both or one of the sheet layers 27 and 23, that is, the thickness of one sheet material. It is possible to adjust the frequency characteristic of the bandpass filter by changing the above or by increasing or decreasing the number of the plurality of sheet materials forming the sheet layers 27 and 23. For example, a case where the thickness on the sheet layer 27 side is changed to adjust the frequency characteristic will be described below.

First, when the center frequency is higher than a desired value, the sheet layer 27 is thickened. As a result, the bandpass filter body is separated from the shield electrode 28, etc., and the center frequency is lowered. As a result, the frequency characteristic can be adjusted from the curve 1 to the curve 3 as shown in FIG. 11 (frequency characteristic curve).

On the contrary, when the center frequency is lower than the desired value, the sheet layer 27 is thinned. As a result, contrary to the above case, the shield electrode layer approaches the bandpass filter main body, so that the curve 1 is changed to the curve 2 and the center frequency is increased.

Further, the above-mentioned sheet layers 27 and 23 can have a uniform thickness, respectively, and therefore, the shield electrode layers 28 and 22,
The front and back electrode films 26, 36, 24, 34 can be made parallel to each other, and the interval can be made constant, for example, 1 mm or more. As a result, it is possible to suppress the deterioration of the electrical characteristics of the shielded bandpass filter.

In the above embodiment, the front electrode films 26, 36, the back electrode films 24, 34 and the shield electrode layers 22, 28 are formed by printing or coating, but the present invention is not limited to this, and the front electrode films 26, 36, the back electrode films 24, 34 and the shield electrode layers 26, 28 are made of sheet materials made of a conductive material, respectively, and nine sheet materials may be stacked, or the front electrode films 26, 36, the back electrodes Membrane 24,34
Alternatively, a sheet material made of a conductive material may be prepared for one or more of the shield electrode layers 22 and 28, and the sheet materials may be overlapped with each other in combination with printing or coating.

Further, it is optional whether the protective layers 21 and 29, the sheet layers 23 and 27, and the dielectric layer 25 are formed of a single sheet material or a plurality of sheet materials are laminated, respectively. You can choose.

FIG. 11 is an external perspective view showing a duplexer according to the present invention, and FIG. 12 is a sectional view taken along line XII-XII in FIG. 11 (the same portions as those in FIG. 6 are designated by the same reference numerals). .). This duplexer has the same number of laminated layers and the same material as those of the bandpass filter described above, but as shown in FIG. 12, the front electrode film formed on both sides of the dielectric layer 25 at the center of the laminated body. The shapes of 80a and the back electrode film 80b are different. The front electrode film 80a and the back electrode film 80b are shown by the solid line and the broken line in FIG. 13, respectively, and have a shape that constitutes the duplexer body represented by the equivalent circuit in FIG.
That is, to explain in order from the low input terminal piece C, the upper surface electrode film 80a connected to the terminal piece C and the lower back electrode with the conductive material 25b filled in the through hole 25a provided on the right side of the dielectric layer 25. Membrane 80
The part that is connected to b and faces vertically or diagonally is
A circuit in which the capacitor C11 and the coil L11 are in parallel is configured. Further, after this circuit, the front electrode film 80a and the back electrode film 80b are connected to the common output terminal strip E through the capacitor C12 which faces each other. Common output terminal strip E and high input terminal strip D
The side is an upper front electrode film 80a and a lower back electrode film with a conductive material 25d filled in a through hole 25c provided in the central portion of the dielectric layer 25.
It is connected to the coil L12 which is connected to 80b. this
The tip of the lower back electrode film 80b forming L12 is branched into two in the middle, one of which is a through hole provided on the left side of the dielectric layer 25.
It is connected to the upper surface electrode film 80a through the conductive material 25f filled in 25e, and is connected to the high input terminal piece D. The other end is connected to the high input terminal piece D via a coil L14 formed only of the lower back electrode film 80b and a capacitor C13 opposed to the upper front electrode film 80a at this end.

The low input terminal piece C, the high input terminal piece D and the common output terminal piece E of the duplexer body having such a structure are exposed on the end surface of the dielectric layer 25. Is connected to the low input terminal 81 and the high input terminal 82 formed in an L-shape over the front surface and the bottom surface connected to the duplexer shown in FIG. 11, and the common output terminal strip E is the back surface of the duplexer and the bottom surface connected to it. Is connected to a common output terminal 83 formed in an L shape. The shield electrode layers 22, 28 provided on the outside of the duplexer body described above
As for the above, do not ground as before.

Therefore, this duplexer also has the same effect.

In addition, in the case of the above-described inductor, the shield electrode layers are formed on both sides of the dielectric layer located in the central portion to shield the inside, but the present invention is not limited to this.
In addition to these shield electrode layers 3 and 7, as shown in Fig. 15,
The shield electrode film 3 '(shown by a broken line) may be formed on the side surfaces (two surfaces) of the inductor where the input terminal 11 and the output terminal 12 are not formed. This way,
There is an advantage that the shield can be made more reliable. The same effect can be obtained by applying this to a composite component including an inductor such as the band-pos filter described above.

Further, as described above with reference to FIG. 4 for the inductor, the shield electrode layer is provided with a large number of through holes, but the present invention is replaced with this, and FIG. 16 (a), ( As shown in b), one shield electrode layer 3 (7) may be divided into two or four, and these may be separated and sandwiched by upper and lower layers, for example, the protective layer 2 and the like. This is also preferably applied to bandpass filters, duplexers and the like.

EFFECTS OF THE INVENTION As described in detail above, in the case of the present invention, since a laminated body formed by laminating each layer is formed and is formed by firing,
The number of manufacturing processes can be reduced, which allows inductors,
It becomes possible to easily manufacture composite parts including inductors. Also, the sheet layers made of dielectric material provided on both sides of the main body of the inductor and composite parts mainly block the electric field components and do not ground further to the outside. The shield electrode layer provided on the main shields the magnetic field component, and in addition to this, since the protective layer is provided outside the shield electrode layer, the magnetic permeability of the shield electrode layer does not change even when a conductor such as a metal approaches. There is no deviation in frequency characteristics. Further, since the sheet layer is provided between the inductor body, the composite component body and the shield electrode layer, it is possible to prevent deterioration of the Q of the body portion, and by changing the thickness of this sheet layer, the frequency characteristic It has excellent effects such as adjustment being possible.

[Brief description of drawings]

FIG. 1 is an external perspective view showing an inductor according to the present invention,
2 is a sectional view taken along the line II-II in FIG. 1, FIG. 3 is an exploded perspective view showing an inductor body portion inside the inductor according to the present invention, and FIG. 4 is a shield electrode suitable for use in the present invention. FIG. 5 is a perspective view showing a membrane, FIG. 5 is an external perspective view showing a bandpass filter according to the present invention, and FIG. 6 is a VI-V of FIG.
A sectional view taken along the line I, FIG. 7 is a sectional view taken along the line VII-VII (front view) in FIG. 6, FIG. 8 is an equivalent circuit diagram relating to the resonator portion of the bandpass filter, and FIG. 9 is the bandpass thereof. FIG. 10 is an equivalent circuit diagram of the filter body, FIG. 10 is a graph showing a frequency characteristic curve of the bandpass filter, FIG. 11 is an external perspective view showing a duplexer according to the present invention, FIG. 12 is a longitudinal sectional view thereof, and FIG. Is a plan view showing the circuit of the duplexer main body, FIG. 14 is an equivalent circuit diagram of the duplexer main body, FIG. 15 is an external perspective view showing another inductor example to which the present invention is applied, and FIG. 16 is the present invention. FIG. 17 is a perspective view showing another shield electrode film suitable for use, FIG. 17 is a front view showing a conventional product, FIG. 18 is its bottom view, and FIG. 19 is its rear view. 2,8,21,29 …… Protective layer, 3,7,22,28 …… Shield electrode layer,
4,6,23,27 …… Sheet layer, 24,34,80b …… Back electrode film, 25,5
1,52,53,54,55,56 …… Dielectric layer, 51a, 52a, 53a, 54a, 55a,
56a …… conductive pattern, 26,36,80a …… front electrode film.

Claims (5)

[Claims] 1. An inductor mounted on a circuit board or the like, wherein a coil pattern electrode formed on both sides of a dielectric layer is electrically connected through a through hole formed in the dielectric layer. An inductor body, a pair of dielectric sheet layers provided on both sides of the inductor body, a pair of shield electrode layers disposed on both sides of the inductor body and the pair of sheet layers, and an inductor body , A pair of protective layers made of a dielectric material or an insulating material provided on both sides of the sheet electrode layer and the pair of shield electrode layers, and the shield electrode layer is not connected to the earth provided on the circuit board or the like. An inductor characterized by being configured to be in a state. 2. A composite component including an inductor, which is installed on a circuit board or the like, and a composite component body having electrodes having a coil pattern formed on both sides of a dielectric layer, and the composite component body being sandwiched. A pair of sheet layers made of a dielectric material provided on both sides, a composite component body and a pair of shield electrode layers provided on both sides of the pair of sheet layers, and a composite component body, a pair of sheet layers and a pair of shield electrode layers. A pair of protective layers made of a dielectric material or an insulating material provided on both sides of the shield electrode layer, and the shield electrode layer is not connected to the ground provided on the circuit board or the like. A composite component including an inductor characterized in that 3. The composite component including the inductor according to claim 2, wherein the composite component body is a bandpass filter body. 4. A method for manufacturing an inductor, comprising: an inductor body having a structure in which coil pattern electrodes formed on both sides of a dielectric layer are electrically connected through through holes formed in the dielectric layer. Forming step, protective layer made of dielectric or insulator, shield electrode layer, sheet layer made of dielectric, inductor body, sheet layer made of dielectric, shield layer, and protective layer made of dielectric or insulator A method of manufacturing an inductor, comprising: a step of forming a laminated body in which the above are laminated in this order; and a step of firing the laminated body. 5. A method of manufacturing a composite component including an inductor, comprising the steps of producing a composite component main body in which electrode films including a coil pattern are formed on both sides of a dielectric layer, and a dielectric or insulator is used. And a shield electrode layer, a sheet layer made of a dielectric material, the composite component body, a sheet layer made of a dielectric material, a shield layer, and a protective layer made of a dielectric material or an insulating material are laminated in this order. A method of manufacturing a composite component including an inductor, comprising: a forming step; and a step of firing the laminate.