JPH0576027U - Mounting structure for laminated integrated components - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] To provide a mounting structure for a high-frequency laminated integrated component in which the influence of the ground terminal electrode on the side surface on the characteristics of the laminated integrated component is reduced. [Structure] One or more inductors 4 and 1 having a laminated structure
Built-in capacitor 6 and more, and terminal electrode 10 on the side
And at least a part of the capacitor 6 is connected to the terminal electrode 10
It is applied to a laminated integrated component connected to the ground land 8 on the substrate 7 via. 6 parts of capacitors were arranged on the substrate 7 side.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention is a laminated integrated component in which one or more inductors and one or more capacitors each having a laminated structure are built-in and terminal electrodes are provided on the side surfaces, and the laminated integrated component is soldered to a substrate such as a printed wiring board It is related to the structure that is fixed by such as.

[0002]

[Problems to be solved by conventional techniques and devices]

 A high-frequency filter having a laminated structure is configured by integrally laminating one or more inductors and one or more capacitors, and is used for mobile wireless devices such as car phones, various wireless devices such as mobile phones, or the like. It has been attempted to be used as a component such as a voltage-controlled oscillator incorporated in the. Conventionally, such a laminated integrated component is faced with solder as shown in FIG. In FIG. 2A, reference numeral 1 is a laminated integrated component, and inside the laminated integrated component 1, an inductor 4 including a dielectric 2 such as ceramic and a coil conductor 3 such as silver, a dielectric 2 and an internal electrode. A capacitor 6 composed of 5 and 5 is laminated by a sheet method or a printing method and is manufactured by firing, and a ground terminal electrode 10, an input terminal electrode (not shown) and an output terminal electrode (not shown) are provided on the side surface. It is provided by baking, electroplating, etc. The ground terminal electrode 10 is connected to the ground land 8 on the substrate 7 via the solder 9, and at the same time, the laminated integrated component 1 is fixed to the substrate 7.

FIG. 2B shows an example of a filter circuit realized by such a laminated integrated component 1. Reference numerals 11 and 12 respectively denote an input terminal electrode and an output terminal electrode formed on the side surface of the laminated integrated component 1. The filter circuit is composed of inductors L2 and L4 and capacitors C1 to C5.

However, in such a mounting structure of the laminated integrated component 1, when it is used at a high frequency, the ground terminal electrode 10 itself acts as an inductor of the inductance Ls as shown in FIG. There was a problem that it was difficult to obtain the characteristics.

In view of the above problems, an object of the present invention is to provide a mounting structure for a high-frequency laminated integrated component in which the influence of the ground terminal electrode on the side surface on the characteristics of the laminated integrated component is reduced.

[0006]

[Means for Solving the Problems]

 In order to achieve this object, the present invention has one or more inductors and one or more capacitors having a laminated structure, a terminal electrode on a side surface, and at least a part of the capacitor having the terminal electrode. In the mounting structure of the laminated integrated component connected to the grounding land on the board via the capacitor section, the capacitor section is arranged on the board side.

[0007]

[Action]

 In view of the fact that the inductance is proportional to the transmission line length, the present invention reduces the inductance by arranging the capacitor section on the board side, thereby shortening the path length from the capacitor to the ground land on the board. It is a thing.

[0008]

【Example】

 FIG. 1A is a sectional view showing an embodiment of a mounting structure of a laminated integrated component according to the present invention, and FIG. 1B is a circuit diagram showing an example thereof. As shown in FIG. 1 (A), in the present invention, the capacitor 6 is fixed to the ground land 8 on the substrate 7 by solder 9 (which may be a conductive adhesive) on the substrate 7 side. With such a mounting structure, the distance from the capacitor 6 to the substrate 7 is significantly shortened, and the inductance in the ground terminal electrode 10 is considerably reduced, as is clear from comparison with the conventional example of FIG. It is reduced, and as shown in FIG. 1B, it can be expressed by a circuit in which this inductance is ignored.

In the above embodiments, the LC filter has been described as an example, but the present invention can be applied to a laminated integrated component for other applications in which other elements are combined in a laminated structure in addition to the capacitor and the inductor. It is also possible to form a wiring pattern or a resistor network by thick film printing on this laminated integrated component and mount an IC or a transistor on it to be applied as a hybrid integrated circuit element.

[0010]

[Effect of the device]

 According to the present invention, since the capacitor portion is arranged on the substrate side, the line length of the ground terminal electrode from the capacitor to the ground land on the substrate is shortened, which reduces the inductance at this ground terminal electrode. Desired characteristics can be obtained without damaging the characteristics of the laminated integrated component by the ground terminal electrode.

[Brief description of drawings]

1A is a sectional view showing an embodiment of a laminated integrated component according to the present invention, and FIG. 1B is an example view of a circuit thereof.

FIG. 2A is a sectional view showing a conventional laminated integrated component,
(B) is an example diagram of the circuit.

[Explanation of symbols] 1 laminated integrated component 2 dielectric 3 coil conductor 4, L2, L4 inductor 5 internal electrode 6, C1 to C5 capacitor 7 substrate 8 grounding land 9 solder 10 grounding terminal electrode 11 input terminal electrode 12 output terminal electrode

Claims (1)

[Scope of utility model registration request] Claim: What is claimed is: 1. One or more inductors and one or more capacitors having a laminated structure are built in, terminal electrodes are provided on the side surfaces, and at least a part of the capacitors is grounded on the substrate through the terminal electrodes. A mounting structure for a laminated integrated component, wherein a capacitor section is arranged on a substrate side in the mounting structure for the laminated integrated component connected to a land for use.