JPH0715213A - Irreversible circuit element - Google Patents

Irreversible circuit element

Info

Publication number
JPH0715213A
JPH0715213A JP5156890A JP15689093A JPH0715213A JP H0715213 A JPH0715213 A JP H0715213A JP 5156890 A JP5156890 A JP 5156890A JP 15689093 A JP15689093 A JP 15689093A JP H0715213 A JPH0715213 A JP H0715213A
Authority
JP
Japan
Prior art keywords
conductor
substrate
laminated substrate
electrode
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP5156890A
Other languages
Japanese (ja)
Inventor
Yukihiro Kawada
幸広 川田
Naoto Kobayashi
尚都 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP5156890A priority Critical patent/JPH0715213A/en
Publication of JPH0715213A publication Critical patent/JPH0715213A/en
Withdrawn legal-status Critical Current

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  • Non-Reversible Transmitting Devices (AREA)

Abstract

PURPOSE:To provide an irreversible circuit element which can exactly set the cross angle of center conductors and can easily adjust characteristics after manufacture. CONSTITUTION:The center conductors mutually crossed at 120 deg. are composed of conductor patterns printed and formed at the respective layers of a liminated substrate 11, and the peripheral edge part of the laminated substrate 11 is provided with electrodes 114-119 connected to the terminal parts of the respective central conductors. Further, an opening part 13a is formed at the center part of a dielectric substrate 13 provided with an area wider than the laminated substrate 11, and conductor patterns 134-136 through-hole-connected to conductor patterns 131-133 to be the electrodes of conductors and a conductor pattern 130 for grounding formed on the rear face are formed on the surface, and the electrodes 114-119 are soldered to the conductor patterns 131-136. Further a conductor board 14 is arranged under the dielectric substrate 13, a ferrite core is arranged at the opening part 13a, a permanent magnet is arranged on the laminated substrate 11, and they are housed in a shield case.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、微調整可能な非可逆回
路素子に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-reciprocal circuit device that can be finely adjusted.

【0002】[0002]

【従来の技術】従来、サーキュレータやアイソレータ等
の非可逆回路素子は、予め定められた特定方向にのみ電
力を伝送し、逆方向には伝送しない特性を有している。
この特性を利用して、例えば、サーキュレータは送受分
波器やフィルタ回路と組み合わせた多周波分波器として
用いられ、またアイソレータは高周波回路内のインピー
ダンス整合、増幅器のトランジスタ保護等に使用されて
いる。
2. Description of the Related Art Conventionally, non-reciprocal circuit elements such as circulators and isolators have a characteristic of transmitting electric power only in a predetermined specific direction and not transmitting electric power in the reverse direction.
Utilizing this characteristic, for example, a circulator is used as a multi-frequency demultiplexer combined with a transmission / reception demultiplexer and a filter circuit, and an isolator is used for impedance matching in a high-frequency circuit, transistor protection of an amplifier, etc. .

【0003】従来のサーキュレータの構成例を図2乃至
図6に基づいて説明する。図2及び図3に示すサーキュ
レータ素子は、フェライト1及び網状の中心導体2を挿
入するための開口部3aが形成された樹脂又はセラミッ
クからなる基板3を備え、この基板3上に形成された導
体パターン3b,3c,3dからなるキャパシタンスと
中心導体2からなるインダクタを組み合わせて構成され
ている。
A configuration example of a conventional circulator will be described with reference to FIGS. The circulator element shown in FIGS. 2 and 3 includes a substrate 3 made of resin or ceramic in which an opening 3a for inserting the ferrite 1 and the mesh-shaped central conductor 2 is formed, and a conductor formed on the substrate 3 It is configured by combining a capacitance composed of the patterns 3b, 3c and 3d and an inductor composed of the central conductor 2.

【0004】この組立において、フェライト1は図3に
示すようにインダクタを形成する中心導体2によって包
まれ、この際、120度の角度で交差した中心導体が互
いに導通接触しないように絶縁フィルム4a,4bが介
在される。中心導体2に包まれたフェライト1は基板3
の開口部3aに挿入され、中心導体2の3つの入出力用
電極2a〜2cは基板1上のコンデンサ電極となる導体
パターン3b〜3dに接続される。さらに、中心導体2
及び基板3はシールドケース5に収納される。ここで、
基板3の裏面には一面に接地用の導体パターン(図示せ
ず)が形成され、この導体パターンはシールドケース5
に接触されている。これにより、図4の回路図に示すよ
うなインダクタL1〜L3及びコンデンサC1〜C3か
らなるサーキュレータが構成される。
In this assembly, the ferrite 1 is surrounded by the central conductors 2 forming an inductor as shown in FIG. 3, and at this time, the insulating films 4a, 4a are formed so that the central conductors intersecting at an angle of 120 degrees do not come into conductive contact with each other. 4b is interposed. The ferrite 1 wrapped in the central conductor 2 is the substrate 3
Of the center conductor 2 and the three input / output electrodes 2a to 2c of the central conductor 2 are connected to the conductor patterns 3b to 3d which are the capacitor electrodes on the substrate 1. Furthermore, the center conductor 2
The board 3 is housed in the shield case 5. here,
A conductor pattern (not shown) for grounding is formed on one surface of the back surface of the substrate 3, and the conductor pattern is used as the shield case 5.
Have been touched. As a result, a circulator composed of inductors L1 to L3 and capacitors C1 to C3 as shown in the circuit diagram of FIG. 4 is configured.

【0005】また、図5及び図6に示すサーキュレータ
素子は、インダクタを形成する中心導体及びこの中心導
体に接続されるコンデンサを積層基板6の各層に形成さ
れた導体パターンによって構成し、これにフェライト7
及び導体板8を組み合わせて構成されている。このサー
キュレータの回路も図4に示すものと同様である。
Further, in the circulator element shown in FIGS. 5 and 6, a central conductor forming an inductor and a capacitor connected to the central conductor are constituted by conductor patterns formed on each layer of the laminated substrate 6, and a ferrite is formed on the conductor pattern. 7
And the conductor plate 8 are combined. The circuit of this circulator is similar to that shown in FIG.

【0006】積層基板6は3枚の絶縁性樹脂シート61
〜63から構成され、その各シートの表面及び裏面には
図5に示すように、中心導体及びコンデンサを構成する
導体パターンが形成されている。即ち、第1のシート6
1の裏面には接地用電極611が形成されており、表面に
は接地用電極611 とスルーホールにより導通した3つの
アース電極612 〜614 及び1つのアース電極613 に一端
が接続された中心導体615 及び中心導体615 の他端に接
続された静電容量形成用電極616 が形成されている。第
2のシート62の裏面には第1のシート61のアース電
極612 〜614 に対応し、これらに導通する3つのアース
電極621 〜623 が形成され、表面にはスルーホールによ
りアース電極622,632 に導通したアース電極624,625 が
形成されると共に、一端がアース電極625 に接続された
中心導体626 及び中心導体626 の他端に接続された静電
容量形成用電極627 が形成されている。さらに、第3の
シート63の裏面にはアース電極624,625 に対応し、こ
れらに導通するアース電極631,632 が形成され、表面に
はスルーホールによりアース電極631 に導通するアース
電極633 が形成されると共に、一端がアース電極633 に
接続された中心導体634 及び中心導体634 の他端に接続
された静電容量形成用電極635 が形成されている。ここ
で、中心導体615,626,634 は互いに交差角度120度で
交差するように形成されている。
The laminated substrate 6 is composed of three insulating resin sheets 61.
5 to 63, conductor patterns forming a central conductor and a capacitor are formed on the front surface and the back surface of each sheet, as shown in FIG. That is, the first sheet 6
A grounding electrode 611 is formed on the back surface of No. 1, and three ground electrodes 612 to 614 electrically connected to the grounding electrode 611 through a through hole and a central conductor 615 having one end connected to one ground electrode 613 on the front surface. And a capacitance forming electrode 616 connected to the other end of the center conductor 615. Three ground electrodes 621 to 623 are formed on the back surface of the second sheet 62 corresponding to the ground electrodes 612 to 614 of the first sheet 61, and three ground electrodes 621 to 623 are formed on the front surface of the second sheet 62. The ground electrodes 624, 625 are formed, and the center conductor 626 having one end connected to the ground electrode 625 and the capacitance forming electrode 627 connected to the other end of the center conductor 626 are also formed. Further, ground electrodes 631 and 632 corresponding to the ground electrodes 624 and 625 are formed on the back surface of the third sheet 63, and ground electrodes 631 and 632 are formed on the front surface thereof, and ground electrodes 633 are formed on the front surface through the through holes and are connected to the ground electrode 631. A center conductor 634 having one end connected to the ground electrode 633 and a capacitance forming electrode 635 connected to the other end of the center conductor 634 are formed. Here, the central conductors 615, 626, 634 are formed so as to intersect with each other at a crossing angle of 120 degrees.

【0007】これにより、中心導体の交差角度を120
度均等に形成することができると共に、積層基板6にコ
ンデンサを一体に形成しているので小型に形成すること
ができる。
As a result, the crossing angle of the central conductor is 120
The capacitor can be formed evenly and the capacitor can be formed in a small size because the capacitor is integrally formed on the laminated substrate 6.

【0008】[0008]

【発明が解決しようとする課題】しかしながら、前述し
た従来のサーキュレータ素子の構成においては次のよう
な問題点があった。即ち、前者の構成においては、フェ
ライト1を包む際の中心導体の折曲げ加工の精度が悪化
し、中心導体の交差角度を120度に設定することが非
常に困難であり、このため十分なサーキュレータ特性を
得ることが難しかった。また、後者の構成においては、
中心導体及びコンデンサを積層基板に一体に形成してい
るため、製造後にサーキュレータ特性の調整を行うこと
ができず、十分な特性を得られないことがあった。
However, the conventional circulator element described above has the following problems. That is, in the former configuration, the accuracy of bending the central conductor when wrapping the ferrite 1 is deteriorated, and it is very difficult to set the crossing angle of the central conductor to 120 degrees. Therefore, a sufficient circulator is used. It was difficult to get the characteristics. Also, in the latter configuration,
Since the central conductor and the capacitor are integrally formed on the laminated substrate, the circulator characteristics cannot be adjusted after manufacturing, and sufficient characteristics may not be obtained.

【0009】本発明の目的は上記の問題点に鑑み、中心
導体の交差角度を的確に設定できると共に、製造後の特
性調整を容易に行える非可逆回路素子を提供することに
ある。
In view of the above problems, it is an object of the present invention to provide a non-reciprocal circuit device in which the crossing angle of the central conductors can be set accurately and the characteristics can be easily adjusted after manufacturing.

【0010】[0010]

【課題を解決するための手段】本発明は上記の目的を達
成するために、120度で交差する3つの中心導体から
なる中心導体部と、該中心導体部に対面する磁性体と、
前記各中心導体の他端に接続された複数のコンデンサと
を備えた非可逆回路素子において、少なくとも3層を有
し、各層に前記中心導体を構成する導体パターンが形成
されると共に、周縁部の所定位置に前記導体パターンの
端部に接続された電極が形成された所定面積の積層基板
と、前記積層基板よりも広い所定面積を有し、前記積層
基板よりも狭い所定面積の開口部が形成されると共に、
表面に前記各コンデンサの少なくとも一方の電極を構成
する導体パターンが形成され、且つ前記開口部の周囲所
定位置に前記積層基板の電極に接続される接続用導体パ
ターンが形成されたコンデンサ形成基板とを設け、前記
コンデンサ形成基板の開口部上に前記積層基板を重ねて
積層基板の電極と前記接続用導体パターンとを接続する
と共に、前記積層基板に対面して前記開口部に前記磁性
体を配置してなる非可逆回路素子を提案する。
In order to achieve the above-mentioned object, the present invention comprises a central conductor portion composed of three central conductors intersecting at 120 degrees, and a magnetic body facing the central conductor portion.
In a non-reciprocal circuit device including a plurality of capacitors connected to the other end of each of the central conductors, at least three layers are formed, and a conductor pattern forming the central conductor is formed in each layer and A laminated substrate having a predetermined area in which electrodes connected to the end of the conductor pattern are formed at a predetermined position, and an opening having a predetermined area wider than the laminated substrate and having a predetermined area narrower than the laminated substrate are formed. As well as
A capacitor-formed substrate on which a conductor pattern that forms at least one electrode of each capacitor is formed on the surface, and a connection conductor pattern that is connected to an electrode of the laminated substrate is formed at a predetermined position around the opening. And the electrode of the laminated substrate is connected to the connection conductor pattern by stacking the laminated substrate on the opening of the capacitor forming substrate, and the magnetic body is arranged in the opening facing the laminated substrate. We propose a non-reciprocal circuit device.

【0011】[0011]

【作用】本発明によれば、3つの中心導体のそれぞれは
積層基板の各層に導体パターンによって形成され、各中
心導体の両端は積層基板の周縁部に形成された電極に接
続される。これにより、各中心導体の交差角度は120
度に設定される。また、コンデンサ形成基板には、前記
積層基板よりも狭い所定面積の開口部が形成されると共
に、表面に前記中心導体に接続されるコンデンサの少な
くとも一方の電極を構成する導体パターンが形成され
る。さらに、コンデンサ形成基板の前記開口部の周囲所
定位置に前記積層基板の電極に接続される接続用導体パ
ターンが形成され、前記開口部上に前記積層基板が重ね
られて積層基板の電極と前記接続用導体パターンとが接
続されると共に、前記積層基板に対面して前記開口部に
磁性体が配置される。これにより、前記中心導体と前記
コンデンサが接続される。また、前記コンデンサ形成基
板の面積は、前記積層基板の面積よりも広く設定されて
いるので、前記コンデンサの少なくとも一方の電極は表
面に露出されトリミング可能となる。
According to the present invention, each of the three central conductors is formed by a conductor pattern on each layer of the laminated substrate, and both ends of each central conductor are connected to the electrodes formed on the peripheral portion of the laminated substrate. As a result, the crossing angle of each center conductor is 120
It is set to every. In addition, an opening having a predetermined area narrower than that of the laminated substrate is formed on the capacitor forming substrate, and a conductor pattern forming at least one electrode of the capacitor connected to the central conductor is formed on the surface. Further, a conductor pattern for connection to be connected to an electrode of the laminated substrate is formed at a predetermined position around the opening of the capacitor forming substrate, and the laminated substrate is stacked on the opening to connect the electrode of the laminated substrate and the connection. The conductor pattern is connected, and a magnetic material is arranged in the opening facing the laminated substrate. As a result, the central conductor and the capacitor are connected. Further, since the area of the capacitor forming substrate is set larger than the area of the laminated substrate, at least one electrode of the capacitor is exposed on the surface and can be trimmed.

【0012】[0012]

【実施例】以下、図面に基づいて本発明の一実施例を説
明する。図1は本発明の一実施例のサーキュレータ素子
を示す構成図である。図において、11は積層基板、1
2はフェライトコア、13は誘電体基板、14は導体板
である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram showing a circulator element according to an embodiment of the present invention. In the figure, 11 is a laminated substrate, 1
2 is a ferrite core, 13 is a dielectric substrate, and 14 is a conductor plate.

【0013】積層基板11は、後述する誘電体基板13
の開口部13aよりもやや広い面積を有し、図7に示す
ように3層のセラミック厚膜シート(以下、シートと称
する)111 〜113 を積層して直方体形状に構成され、各
シートには中心導体を構成する導体パターン111a,112a,
113aが印刷によって形成されている。ここで、各導体パ
ターン111a,112a,113aの交差角度は120度に設定さ
れ、各導体パターン111a,112a,113aの端部は積層基板1
1の側面から表裏面に掛けて形成された接続用の電極11
4 〜119 に導電接続されている。
The laminated substrate 11 is a dielectric substrate 13 described later.
Has a slightly larger area than the opening 13a, and is formed into a rectangular parallelepiped shape by laminating three layers of ceramic thick film sheets (hereinafter referred to as sheets) 111 to 113 as shown in FIG. Conductor patterns 111a, 112a forming the central conductor,
113a is formed by printing. Here, the crossing angle of each conductor pattern 111a, 112a, 113a is set to 120 degrees, and the end of each conductor pattern 111a, 112a, 113a has a laminated substrate 1
Connection electrodes 11 formed from the side surface of 1 to the front and back surfaces
Conductive connection to 4-119.

【0014】誘電体基板13は、積層基板11よりも広
い面積を有する長方形をなし、その中央部には円形のフ
ェライト挿入用の開口部13aが形成されている。さら
に、開口部13aの周囲には、積層基板11の電極114
〜119 に接続可能な位置にコンデンサの一方の電極とな
る導体パターン131 〜133 及び接続用のランドとなる導
体パターン134 〜136 が形成されている。また、誘電体
基板13の裏面には図示していないが前面に接地用の導
体パターン130 が形成され、スルーホール137〜139 に
よって表面の導体パターン134 〜136 に導電接続されて
いる。
The dielectric substrate 13 has a rectangular shape having an area larger than that of the laminated substrate 11, and a circular opening 13a for ferrite insertion is formed in the center thereof. Furthermore, the electrode 114 of the laminated substrate 11 is surrounded by the opening 13a.
Conductor patterns 131 to 133 which are one of the electrodes of the capacitor and conductor patterns 134 to 136 which are lands for connection are formed at positions connectable to the electrodes 119 to 119. Although not shown in the figure, a conductor pattern 130 for grounding is formed on the front surface of the dielectric substrate 13 on the front surface thereof, and conductively connected to the conductor patterns 134 to 136 on the front surface through through holes 137 to 139.

【0015】導体板14は、誘電体基板13と同じ形状
を有し、その中央部には開口部13aと同形状の開口部
14aが形成されている。
The conductor plate 14 has the same shape as the dielectric substrate 13, and an opening 14a having the same shape as the opening 13a is formed in the center thereof.

【0016】組立に際しては、導体板14上に誘電体基
板13が重ねられる。この際、誘電体基板13の裏面の
接地用の導体パターン130 と導体板14が導通接触され
る。次いで、誘電体基板13及び導体板14の開口部1
3a,14aにフェライトコア12が挿入され、フェラ
イトコア12の上面に対面して積層基板11が誘電体基
板13上に載置される。この際、積層基板11の各電極
114 〜119 が導体パターン131 〜136 の位置に対応する
ように載置され、各電極114 〜119 は導体パターン131
〜136 に半田付けされる。さらに、積層基板上に永久磁
石(図示せず)が重ねられ、これら全体が図示せぬシー
ルドケース内に収納される。
At the time of assembly, the dielectric substrate 13 is placed on the conductor plate 14. At this time, the conductor pattern 130 for grounding on the back surface of the dielectric substrate 13 and the conductor plate 14 are conductively contacted. Then, the openings 1 of the dielectric substrate 13 and the conductor plate 14
The ferrite core 12 is inserted into 3a and 14a, and the laminated substrate 11 is placed on the dielectric substrate 13 so as to face the upper surface of the ferrite core 12. At this time, each electrode of the laminated substrate 11
114 to 119 are placed so as to correspond to the positions of the conductor patterns 131 to 136, and the electrodes 114 to 119 are connected to the conductor patterns 131 to 136, respectively.
Solder to ~ 136. Further, permanent magnets (not shown) are stacked on the laminated substrate, and the whole of them is housed in a shield case (not shown).

【0017】これにより、図4の回路図に示すインダク
タL1が導体パターン111a、インダクタL2が導体パタ
ーン112a、インダクタL3が導体パターン113aによって
それぞれ構成され、コンデンサC1が導体パターン130,
131 、コンデンサC2が導体パターン130,132 、コンデ
ンサC3が導体パターン130,133 によってそれぞれ構成
される。
As a result, the inductor L1 shown in the circuit diagram of FIG. 4 is constituted by the conductor pattern 111a, the inductor L2 is constituted by the conductor pattern 112a, the inductor L3 is constituted by the conductor pattern 113a, and the capacitor C1 is constituted by the conductor pattern 130,
131, the capacitor C2 is composed of the conductor patterns 130 and 132, and the capacitor C3 is composed of the conductor patterns 130 and 133, respectively.

【0018】前述の構成によれば、中心導体を積層基板
11の各層111 〜113 に導体パターンによって印刷形成
しているので、中心導体の交差角度を120度均等に設
定することができ、設定精度が向上すると共に、積層基
板11には中心導体のみを印刷して作成し、高い形成位
置精度を必要とするスルーホールや静電容量形成用電極
を形成していないので、厳密な位置決め及び電極面積調
整の煩雑さが解消される。
According to the above-mentioned structure, since the central conductor is formed by printing on each of the layers 111 to 113 of the laminated substrate 11 by the conductor pattern, the intersecting angles of the central conductor can be set uniformly at 120 degrees, and the setting accuracy can be set. In addition, since only the central conductor is printed on the laminated substrate 11 to form a through hole or an electrode for forming a capacitance, which requires high forming position accuracy, strict positioning and an electrode area are required. The complexity of adjustment is eliminated.

【0019】また、積層基板11を重ねた誘電体基板1
3の表面にはコンデンサの電極を構成する導体パターン
131 〜133 が露出されるので、組立製造後に導体パター
ン131 〜133 のトリミングを行うことによりコンデンサ
の静電容量の調整を容易に行うことができ、素子特性の
調整を行うことができる。
Further, the dielectric substrate 1 in which the laminated substrate 11 is laminated
Conductor pattern that constitutes the electrode of the capacitor on the surface of 3
Since 131 to 133 are exposed, the capacitance of the capacitor can be easily adjusted by trimming the conductor patterns 131 to 133 after assembly and production, and the element characteristics can be adjusted.

【0020】さらに、本実施例のサーキュレータの主た
る構成部品は、積層基板11、フェライトコア12、誘
電体基板13、導体板14及び永久磁石であり、従来よ
りも部品点数を低減でき、コストの低下及び素子の小型
化を図ることができる。
Further, the main constituent parts of the circulator of this embodiment are the laminated substrate 11, the ferrite core 12, the dielectric substrate 13, the conductor plate 14 and the permanent magnet, and the number of parts can be reduced as compared with the prior art, and the cost is reduced. Also, the size of the element can be reduced.

【0021】尚、本実施例では非可逆回路素子としてサ
ーキュレータ素子を構成したが、これに限定されること
はなく、周知のようにアイソレータ素子も抵抗体を付加
するだけでほぼ同様に構成することができ、同様の効果
を得ることができる。
In this embodiment, the circulator element is formed as the non-reciprocal circuit element, but the present invention is not limited to this, and as is well known, the isolator element may be formed in substantially the same manner only by adding a resistor. The same effect can be obtained.

【0022】また、本実施例の構成及び各部品の形状は
一例であり、これに限定されることはなく、用途に応じ
て適宜変形しても良い。
Further, the configuration of this embodiment and the shape of each component are merely examples, and the present invention is not limited to this, and may be appropriately modified according to the application.

【0023】[0023]

【発明の効果】以上説明したように本発明によれば、3
つの中心導体は積層基板の各層に導体パターンによって
形成されるので、中心導体の交差角度の精度が向上する
と共に、積層基板には中心導体のみを印刷して作成する
ため、スルーホール接続や静電容量設定等の厳密な位置
ぎめ及び電極面積調整の煩雑さが解消される。また、積
層基板を乗せたコンデンサ形成基板の表面にはコンデン
サの少なくとも一方の電極が露出されトリミング可能と
なるので、製造後に前記コンデンサの静電容量の調整を
容易に行うことができ、素子特性の微調整を行うことが
できる。さらに、前記積層基板、コンデンサ形成基板及
び磁性体から素子を構成できるので、従来よりも部品点
数を低減でき、コストの低下及び素子の小型化を図るこ
とができる。
As described above, according to the present invention, 3
Since one center conductor is formed by a conductor pattern on each layer of the laminated board, the accuracy of the crossing angle of the center conductor is improved, and since only the center conductor is printed on the laminated board, through-hole connection and electrostatic Strict positioning such as capacitance setting and complexity of electrode area adjustment are eliminated. Further, since at least one electrode of the capacitor is exposed on the surface of the capacitor forming substrate on which the laminated substrate is placed and trimming can be performed, it is possible to easily adjust the capacitance of the capacitor after manufacturing, and Fine adjustments can be made. Further, since the element can be constituted by the laminated substrate, the capacitor forming substrate and the magnetic material, the number of parts can be reduced as compared with the conventional case, and the cost and the size of the element can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例のサーキュレータを示す構成
FIG. 1 is a configuration diagram showing a circulator according to an embodiment of the present invention.

【図2】従来例のサーキュレータを示す構成図FIG. 2 is a configuration diagram showing a conventional circulator.

【図3】従来例における中心導体とフェライトの包囲構
成を示す図
FIG. 3 is a diagram showing a surrounding structure of a central conductor and ferrite in a conventional example.

【図4】サーキュレータを示す回路図FIG. 4 is a circuit diagram showing a circulator.

【図5】従来のサーキュレータの他の例を示す構成図FIG. 5 is a configuration diagram showing another example of a conventional circulator.

【図6】従来例における積層基板を示す構成図FIG. 6 is a configuration diagram showing a laminated substrate in a conventional example.

【図7】本発明の一実施例における積層基板を示す構成
FIG. 7 is a configuration diagram showing a laminated substrate in one embodiment of the present invention.

【符号の説明】[Explanation of symbols]

11…積層基板、111 〜113 …シート、111a,112a,113a
…導体パターン(中心導体)、114 〜119 …電極、12
…フェライトコア、13…誘電体基板、13a…開口
部、131 〜133 …導体パターン(コンデンサ用の電
極)、134 〜136 …導体パターン(接続用のランド)、
14…導体板。
11 ... Laminated substrate, 111-113 ... Sheet, 111a, 112a, 113a
... Conductor pattern (center conductor), 114 to 119 ... Electrodes, 12
... Ferrite core, 13 ... Dielectric substrate, 13a ... Opening, 131-133 ... Conductor pattern (electrode for capacitor), 134-136 ... Conductor pattern (land for connection),
14 ... Conductor plate.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 120度で交差する3つの中心導体から
なる中心導体部と、該中心導体部に対面する磁性体と、
前記各中心導体の他端に接続された複数のコンデンサと
を備えた非可逆回路素子において、 少なくとも3層を有し、各層に前記中心導体を構成する
導体パターンが形成されると共に、周縁部の所定位置に
前記導体パターンの端部に接続された電極が形成された
所定面積の積層基板と、 前記積層基板よりも広い所定面積を有し、前記積層基板
よりも狭い所定面積の開口部が形成されると共に、表面
に前記各コンデンサの少なくとも一方の電極を構成する
導体パターンが形成され、且つ前記開口部の周囲所定位
置に前記積層基板の電極に接続される接続用導体パター
ンが形成されたコンデンサ形成基板とを設け、 前記コンデンサ形成基板の開口部上に前記積層基板を重
ねて積層基板の電極と前記接続用導体パターンとを接続
すると共に、 前記積層基板に対面して前記開口部に前記磁性体を配置
してなることを特徴とする非可逆回路素子。
1. A central conductor portion composed of three central conductors intersecting at 120 degrees, and a magnetic body facing the central conductor portion.
A nonreciprocal circuit device including a plurality of capacitors connected to the other end of each of the central conductors, wherein the nonreciprocal circuit element has at least three layers, and a conductor pattern forming the central conductor is formed in each layer and A laminated substrate having a predetermined area in which electrodes connected to the end of the conductor pattern are formed at a predetermined position, and an opening having a predetermined area wider than the laminated substrate and smaller than the laminated substrate are formed. And a conductor pattern that forms at least one electrode of each capacitor is formed on the surface, and a connection conductor pattern that is connected to the electrode of the laminated substrate is formed at a predetermined position around the opening. A formation substrate, the laminated substrate is overlaid on the opening of the capacitor formation substrate to connect the electrode of the laminated substrate and the conductive pattern for connection, and A nonreciprocal circuit device, wherein the magnetic material is arranged in the opening so as to face a layer substrate.
JP5156890A 1993-06-28 1993-06-28 Irreversible circuit element Withdrawn JPH0715213A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5156890A JPH0715213A (en) 1993-06-28 1993-06-28 Irreversible circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5156890A JPH0715213A (en) 1993-06-28 1993-06-28 Irreversible circuit element

Publications (1)

Publication Number Publication Date
JPH0715213A true JPH0715213A (en) 1995-01-17

Family

ID=15637636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5156890A Withdrawn JPH0715213A (en) 1993-06-28 1993-06-28 Irreversible circuit element

Country Status (1)

Country Link
JP (1) JPH0715213A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020042570A (en) * 2002-04-29 2002-06-05 박우식 Soldering method of ferrite core on pcb and the pcb having soldered the ferrite core by the method
US6888432B2 (en) 2002-02-15 2005-05-03 Murata Manufacturing Co., Ltd. Laminated substrate, method of producing the same, nonreciprocal circuit element, and communication device
CN112952329A (en) * 2021-02-07 2021-06-11 湖北师范大学 Coplanar waveguide type microwave ferrite circulator, preparation method and design method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6888432B2 (en) 2002-02-15 2005-05-03 Murata Manufacturing Co., Ltd. Laminated substrate, method of producing the same, nonreciprocal circuit element, and communication device
KR20020042570A (en) * 2002-04-29 2002-06-05 박우식 Soldering method of ferrite core on pcb and the pcb having soldered the ferrite core by the method
CN112952329A (en) * 2021-02-07 2021-06-11 湖北师范大学 Coplanar waveguide type microwave ferrite circulator, preparation method and design method

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