JP2013089868A5 - - Google Patents

Download PDF

Info

Publication number
JP2013089868A5
JP2013089868A5 JP2011230884A JP2011230884A JP2013089868A5 JP 2013089868 A5 JP2013089868 A5 JP 2013089868A5 JP 2011230884 A JP2011230884 A JP 2011230884A JP 2011230884 A JP2011230884 A JP 2011230884A JP 2013089868 A5 JP2013089868 A5 JP 2013089868A5
Authority
JP
Japan
Prior art keywords
metal film
conductive
forming
film
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011230884A
Other languages
English (en)
Japanese (ja)
Other versions
JP5882669B2 (ja
JP2013089868A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011230884A priority Critical patent/JP5882669B2/ja
Priority claimed from JP2011230884A external-priority patent/JP5882669B2/ja
Publication of JP2013089868A publication Critical patent/JP2013089868A/ja
Publication of JP2013089868A5 publication Critical patent/JP2013089868A5/ja
Application granted granted Critical
Publication of JP5882669B2 publication Critical patent/JP5882669B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011230884A 2011-10-20 2011-10-20 配線基板の製造装置及び配線基板の製造方法 Expired - Fee Related JP5882669B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011230884A JP5882669B2 (ja) 2011-10-20 2011-10-20 配線基板の製造装置及び配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011230884A JP5882669B2 (ja) 2011-10-20 2011-10-20 配線基板の製造装置及び配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2013089868A JP2013089868A (ja) 2013-05-13
JP2013089868A5 true JP2013089868A5 (cg-RX-API-DMAC7.html) 2014-12-04
JP5882669B2 JP5882669B2 (ja) 2016-03-09

Family

ID=48533467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011230884A Expired - Fee Related JP5882669B2 (ja) 2011-10-20 2011-10-20 配線基板の製造装置及び配線基板の製造方法

Country Status (1)

Country Link
JP (1) JP5882669B2 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6321906B2 (ja) * 2013-01-16 2018-05-09 昭和電工株式会社 導電パターン形成用基板及び導電パターン形成基板、並びにその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002344115A (ja) * 2001-05-16 2002-11-29 Matsushita Electric Ind Co Ltd 成膜方法及びプリント基板の製造方法
JP4219822B2 (ja) * 2003-01-14 2009-02-04 シャープ株式会社 配線材料、配線基板及びその製造方法並びに表示パネル
JP2005262598A (ja) * 2004-03-18 2005-09-29 Asahi Kasei Corp 積層体およびその製造方法
JP2006135278A (ja) * 2004-10-08 2006-05-25 Toppan Printing Co Ltd プリント配線板用絶縁樹脂フィルム及びそれを用いたプリント配線板

Similar Documents

Publication Publication Date Title
JP2015527481A5 (cg-RX-API-DMAC7.html)
WO2011126706A3 (en) Printable materials and methods of manufacture thereof
JP2009006727A5 (cg-RX-API-DMAC7.html)
JP2010534413A5 (cg-RX-API-DMAC7.html)
FR2911806B1 (fr) Fil electrode pour electroerosion
JP2015109449A5 (cg-RX-API-DMAC7.html)
JP2014172178A5 (cg-RX-API-DMAC7.html)
TW200626747A (en) Selective placement of carbon nanotubes on oxide surfaces
JP2017163169A5 (ja) 複層ワイヤ
HK1209950A1 (en) Circuit board multi-functional hole system and method
MY168809A (en) Multiplayer film for multi-purpose inkjet systems
JP2013247036A5 (cg-RX-API-DMAC7.html)
TWI561373B (zh) 附載體銅箔、使用其之覆銅積層板、印刷配線板、印刷電路板及印刷配線板之製造方法
JP2017502513A5 (cg-RX-API-DMAC7.html)
JP2015019107A5 (cg-RX-API-DMAC7.html)
RU2019127639A (ru) Способ изготовления ламинированного элемента
JP2014526807A5 (cg-RX-API-DMAC7.html)
JP2012251240A5 (cg-RX-API-DMAC7.html)
WO2015188990A3 (en) Process for producing organic-inorganic laminates
JP2013089868A5 (cg-RX-API-DMAC7.html)
JP2016041574A5 (cg-RX-API-DMAC7.html)
JP2012166506A5 (cg-RX-API-DMAC7.html)
Kim et al. Electrochemical migration of Ag nanoink patterns controlled by atmospheric-pressure plasma
JP2013193092A5 (ja) はんだ材料
JP2009059648A5 (cg-RX-API-DMAC7.html)