JP2013078839A5 - - Google Patents
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- Publication number
- JP2013078839A5 JP2013078839A5 JP2012214554A JP2012214554A JP2013078839A5 JP 2013078839 A5 JP2013078839 A5 JP 2013078839A5 JP 2012214554 A JP2012214554 A JP 2012214554A JP 2012214554 A JP2012214554 A JP 2012214554A JP 2013078839 A5 JP2013078839 A5 JP 2013078839A5
- Authority
- JP
- Japan
- Prior art keywords
- acrylate
- bis
- chemical mechanical
- polyol
- polishing pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 9
- 239000012948 isocyanate Substances 0.000 claims 7
- 239000000203 mixture Substances 0.000 claims 7
- 239000000126 substance Substances 0.000 claims 7
- 239000004970 Chain extender Substances 0.000 claims 6
- 229920005862 polyol Polymers 0.000 claims 6
- 150000003077 polyols Chemical class 0.000 claims 6
- 150000002513 isocyanates Chemical class 0.000 claims 5
- 125000000217 alkyl group Chemical group 0.000 claims 4
- 229920000768 polyamine Polymers 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical group OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims 3
- 239000003999 initiator Substances 0.000 claims 3
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 claims 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 claims 2
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 claims 2
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical group C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 claims 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 claims 2
- 150000002009 diols Chemical group 0.000 claims 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims 2
- -1 isocyanate modified urethane Chemical group 0.000 claims 2
- YZZTZUHVGICSCS-UHFFFAOYSA-N n-butan-2-yl-4-[[4-(butan-2-ylamino)phenyl]methyl]aniline Chemical compound C1=CC(NC(C)CC)=CC=C1CC1=CC=C(NC(C)CC)C=C1 YZZTZUHVGICSCS-UHFFFAOYSA-N 0.000 claims 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 claims 1
- UNVGBIALRHLALK-UHFFFAOYSA-N 1,5-Hexanediol Chemical compound CC(O)CCCCO UNVGBIALRHLALK-UHFFFAOYSA-N 0.000 claims 1
- PISLZQACAJMAIO-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine Chemical compound CCC1=CC(C)=C(N)C(CC)=C1N PISLZQACAJMAIO-UHFFFAOYSA-N 0.000 claims 1
- YZGMIRBFYCQNRH-UHFFFAOYSA-N 2-(2-hydroxyethyl)benzene-1,3-diol Chemical compound OCCC1=C(O)C=CC=C1O YZGMIRBFYCQNRH-UHFFFAOYSA-N 0.000 claims 1
- BSYVFGQQLJNJJG-UHFFFAOYSA-N 2-[2-(2-aminophenyl)sulfanylethylsulfanyl]aniline Chemical compound NC1=CC=CC=C1SCCSC1=CC=CC=C1N BSYVFGQQLJNJJG-UHFFFAOYSA-N 0.000 claims 1
- WTPYFJNYAMXZJG-UHFFFAOYSA-N 2-[4-(2-hydroxyethoxy)phenoxy]ethanol Chemical compound OCCOC1=CC=C(OCCO)C=C1 WTPYFJNYAMXZJG-UHFFFAOYSA-N 0.000 claims 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 claims 1
- YPACMOORZSDQDQ-UHFFFAOYSA-N 3-(4-aminobenzoyl)oxypropyl 4-aminobenzoate Chemical compound C1=CC(N)=CC=C1C(=O)OCCCOC(=O)C1=CC=C(N)C=C1 YPACMOORZSDQDQ-UHFFFAOYSA-N 0.000 claims 1
- VIOMIGLBMQVNLY-UHFFFAOYSA-N 4-[(4-amino-2-chloro-3,5-diethylphenyl)methyl]-3-chloro-2,6-diethylaniline Chemical compound CCC1=C(N)C(CC)=CC(CC=2C(=C(CC)C(N)=C(CC)C=2)Cl)=C1Cl VIOMIGLBMQVNLY-UHFFFAOYSA-N 0.000 claims 1
- VRIZVKXABXTVIV-UHFFFAOYSA-N 4-[(4-amino-3,5-diethylphenyl)methyl]-2,6-diethylaniline 4-[[4-amino-3,5-di(propan-2-yl)phenyl]methyl]-2,6-di(propan-2-yl)aniline Chemical compound C(C1=CC(=C(N)C(=C1)C(C)C)C(C)C)C1=CC(=C(N)C(=C1)C(C)C)C(C)C.C(C1=CC(=C(N)C(=C1)CC)CC)C1=CC(=C(N)C(=C1)CC)CC VRIZVKXABXTVIV-UHFFFAOYSA-N 0.000 claims 1
- FLNVGZMDLLIECD-UHFFFAOYSA-N 4-[(4-amino-3-methyl-5-propan-2-ylphenyl)methyl]-2-methyl-6-propan-2-ylaniline Chemical compound CC1=C(N)C(C(C)C)=CC(CC=2C=C(C(N)=C(C)C=2)C(C)C)=C1 FLNVGZMDLLIECD-UHFFFAOYSA-N 0.000 claims 1
- AOFIWCXMXPVSAZ-UHFFFAOYSA-N 4-methyl-2,6-bis(methylsulfanyl)benzene-1,3-diamine Chemical compound CSC1=CC(C)=C(N)C(SC)=C1N AOFIWCXMXPVSAZ-UHFFFAOYSA-N 0.000 claims 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 230000003796 beauty Effects 0.000 claims 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 238000005520 cutting process Methods 0.000 claims 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 239000004615 ingredient Substances 0.000 claims 1
- 230000000977 initiatory effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 229920001610 polycaprolactone Polymers 0.000 claims 1
- 239000004632 polycaprolactone Substances 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 229920005906 polyester polyol Polymers 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000003860 storage Methods 0.000 claims 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/248,123 US8512427B2 (en) | 2011-09-29 | 2011-09-29 | Acrylate polyurethane chemical mechanical polishing layer |
| US13/248,123 | 2011-09-29 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013078839A JP2013078839A (ja) | 2013-05-02 |
| JP2013078839A5 true JP2013078839A5 (https=) | 2015-08-20 |
| JP6073099B2 JP6073099B2 (ja) | 2017-02-01 |
Family
ID=47878728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012214554A Active JP6073099B2 (ja) | 2011-09-29 | 2012-09-27 | アクリレートポリウレタンケミカルメカニカル研磨層 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8512427B2 (https=) |
| JP (1) | JP6073099B2 (https=) |
| KR (1) | KR101929055B1 (https=) |
| CN (1) | CN103072099B (https=) |
| DE (1) | DE102012018523A1 (https=) |
| FR (1) | FR2980798B1 (https=) |
| TW (1) | TWI472546B (https=) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9238296B2 (en) * | 2013-05-31 | 2016-01-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer |
| US9238295B2 (en) * | 2013-05-31 | 2016-01-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical window polishing pad |
| US9233451B2 (en) * | 2013-05-31 | 2016-01-12 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical polishing pad stack |
| CN105408379B (zh) * | 2013-08-20 | 2019-02-01 | 陶氏环球技术有限责任公司 | 用于液压泵的聚氨基甲酸酯弹性密封件 |
| US9102034B2 (en) * | 2013-08-30 | 2015-08-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of chemical mechanical polishing a substrate |
| US20150065013A1 (en) * | 2013-08-30 | 2015-03-05 | Dow Global Technologies Llc | Chemical mechanical polishing pad |
| US20150059254A1 (en) * | 2013-09-04 | 2015-03-05 | Dow Global Technologies Llc | Polyurethane polishing pad |
| JP6365869B2 (ja) * | 2014-03-19 | 2018-08-01 | Dic株式会社 | ウレタン組成物及び研磨材 |
| US9259820B2 (en) * | 2014-03-28 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with polishing layer and window |
| US9064806B1 (en) * | 2014-03-28 | 2015-06-23 | Rohm and Haas Electronics Materials CMP Holdings, Inc. | Soft and conditionable chemical mechanical polishing pad with window |
| US9216489B2 (en) | 2014-03-28 | 2015-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
| US20150306731A1 (en) * | 2014-04-25 | 2015-10-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US9314897B2 (en) | 2014-04-29 | 2016-04-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
| US9333620B2 (en) | 2014-04-29 | 2016-05-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with clear endpoint detection window |
| JP7066608B2 (ja) * | 2015-09-25 | 2022-05-13 | シーエムシー マテリアルズ，インコーポレイティド | 化学機械的研磨パッド、基板を化学機械的に研磨する方法、及び化学機械的研磨パッドを製造する方法 |
| CN110167985A (zh) * | 2017-01-12 | 2019-08-23 | 巴斯夫欧洲公司 | 聚氨酯的物理性能改进 |
| US11179822B2 (en) * | 2017-08-31 | 2021-11-23 | Hubei Dinghui Microelectronics Materials Co., Ltd | Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing material |
| US10465097B2 (en) | 2017-11-16 | 2019-11-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Aliphatic UV cured polyurethane optical endpoint detection windows with high UV transparency for CMP polishing pads |
| JP7099827B2 (ja) * | 2018-01-26 | 2022-07-12 | ニッタ・デュポン株式会社 | 研磨パッド |
| KR102197481B1 (ko) * | 2019-06-27 | 2020-12-31 | 에스케이씨 주식회사 | 연마패드 및 이의 제조방법 |
| US12006442B2 (en) * | 2019-09-11 | 2024-06-11 | Applied Materials, Inc. | Additive manufacturing of polishing pads |
| US12122013B2 (en) | 2019-10-23 | 2024-10-22 | Sk Enpulse Co., Ltd. | Composition for polishing pad and polishing pad |
| TWI851930B (zh) * | 2020-10-19 | 2024-08-11 | 美商Ｃｍｃ材料有限責任公司 | 用於化學機械拋光墊之可uv固化樹脂 |
| KR102488115B1 (ko) * | 2020-11-06 | 2023-01-12 | 에스케이엔펄스 주식회사 | 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법 |
| KR102488112B1 (ko) * | 2020-11-06 | 2023-01-12 | 에스케이엔펄스 주식회사 | 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법 |
| CN114434318B (zh) * | 2020-11-06 | 2024-06-14 | Sk恩普士有限公司 | 抛光垫及其制备方法以及使用其的半导体器件的制造方法 |
| US11679531B2 (en) | 2021-10-13 | 2023-06-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad and preparation thereof |
| US12220784B2 (en) | 2021-10-13 | 2025-02-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad and preparation thereof |
| US12528152B2 (en) * | 2022-06-02 | 2026-01-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP pad having ultra expanded polymer microspheres |
| US12544958B2 (en) * | 2022-06-02 | 2026-02-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making low specific gravity polishing pads |
| US20230406984A1 (en) * | 2022-06-15 | 2023-12-21 | Cmc Materials Llc | Uv-curable resins for chemical mechanical polishing pads |
| CN115415931B (zh) * | 2022-07-26 | 2024-03-15 | 安徽禾臣新材料有限公司 | 一种半导体加工用化学机械抛光垫 |
| CN117247739B (zh) * | 2023-09-20 | 2026-03-17 | 上海宗易工贸有限公司 | 一种半导体晶片抛光材料及其制备方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4057431A (en) | 1975-09-29 | 1977-11-08 | The Goodyear Tire & Rubber Company | Ethylenically polyurethane unsaturated composition |
| US4721751A (en) | 1987-03-26 | 1988-01-26 | Ppg Industries, Inc. | Polyurea-polyurethane acrylate dispersions |
| US4855184A (en) | 1988-02-02 | 1989-08-08 | Minnesota Mining And Manufacturing Company | Radiation-curable protective coating composition |
| US5341799A (en) | 1991-12-23 | 1994-08-30 | Hercules Incorporated | Urethane polymers for printing plate compositions |
| US5965460A (en) | 1997-01-29 | 1999-10-12 | Mac Dermid, Incorporated | Polyurethane composition with (meth)acrylate end groups useful in the manufacture of polishing pads |
| EP1011919B1 (en) * | 1997-08-06 | 2004-10-20 | Rodel Holdings, Inc. | Method of manufacturing a polishing pad |
| US6477926B1 (en) * | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
| CN100496896C (zh) | 2000-12-01 | 2009-06-10 | 东洋橡膠工业株式会社 | 研磨垫 |
| US7097549B2 (en) * | 2001-12-20 | 2006-08-29 | Ppg Industries Ohio, Inc. | Polishing pad |
| JP4576095B2 (ja) * | 2003-04-24 | 2010-11-04 | 東洋インキ製造株式会社 | 両面粘着シート及び研磨布積層体 |
| US20050171224A1 (en) | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
| JP4475404B2 (ja) * | 2004-10-14 | 2010-06-09 | Ｊｓｒ株式会社 | 研磨パッド |
| KR20060099398A (ko) * | 2005-03-08 | 2006-09-19 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 | 수계 연마 패드 및 제조 방법 |
| TWI372108B (en) * | 2005-04-06 | 2012-09-11 | Rohm & Haas Elect Mat | Method for forming a porous reaction injection molded chemical mechanical polishing pad |
| US7169030B1 (en) | 2006-05-25 | 2007-01-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US7371160B1 (en) * | 2006-12-21 | 2008-05-13 | Rohm And Haas Electronic Materials Cmp Holdings Inc. | Elastomer-modified chemical mechanical polishing pad |
| US7438636B2 (en) * | 2006-12-21 | 2008-10-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| JP2008221367A (ja) * | 2007-03-09 | 2008-09-25 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
| US8540893B2 (en) * | 2008-08-04 | 2013-09-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and methods relating thereto |
-
2011
- 2011-09-29 US US13/248,123 patent/US8512427B2/en active Active
-
2012
- 2012-09-19 DE DE102012018523A patent/DE102012018523A1/de not_active Withdrawn
- 2012-09-21 TW TW101134644A patent/TWI472546B/zh active
- 2012-09-27 CN CN201210370017.7A patent/CN103072099B/zh active Active
- 2012-09-27 FR FR1259142A patent/FR2980798B1/fr not_active Expired - Fee Related
- 2012-09-27 JP JP2012214554A patent/JP6073099B2/ja active Active
- 2012-09-28 KR KR1020120108610A patent/KR101929055B1/ko active Active
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