JP2013076641A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of controlling an IC packaged in an IC socket at a desired temperature without using another device and capable of measuring the characteristics of the IC from outside even during temperature control.SOLUTION: An IC socket 51 capable of packaging ICs (integrated circuits) 21-23 includes: a bottom plate part 1 arranged opposite to a bottom part of each of the ICs 21-23 being ICs packaged in the IC socket 51; a cover part 2 arranged on the bottom plate part 1, covering the side part of each of the packaged ICs 21-23 and having an aperture hole 2a for exposing the upper part of each of the packaged ICs 21-23 formed thereon; and first heating/heat absorption parts 3, 4a, 4b, 5a, 5b, 5c each integrated into the bottom plate part 1 and brought into contact with the bottom part of each of the packaged ICs 21-23 to heat/absorb heat of the packaged ICs.

Description

  The present invention relates to an IC socket capable of mounting an IC (Integrated Circuit).

  A test for measuring characteristics under an emergency temperature is generally performed on an IC created as a product or a test product. Such measurement of IC characteristics may be performed using an IC socket on which an IC can be mounted, as disclosed in Patent Document 1, for example.

JP 09-045824 A

  Here, as a method of measuring IC characteristics under high temperature, (1) IC temperature is measured after IC temperature is raised in advance with a heater or the like and mounted on the IC socket. (2) IC socket with IC mounted To measure the IC characteristics by raising the temperature in the chamber and (3) measuring the IC characteristics while blowing hot air directly to the IC mounted on the IC socket with a dryer or the like. Can be considered.

  However, when carrying out (1) to (3), apart from the IC socket, other devices such as a heater, a chamber and a dryer are required, and a space for placing other devices is required. In addition, (1) has a problem that the temperature changes while measuring the IC characteristics. In addition to the measurement using the IC socket, even when trying to analyze and measure by bringing the measuring needle into contact with the IC during temperature control, the inside of the chamber is hermetically sealed to maintain airtightness. Therefore, (3) has a problem that it is difficult to measure because the measuring needle is blown by the hot air and shakes. Further, regarding (2), since it is necessary to increase the wiring length from the IC socket to the jig, there is a problem that the influence of the wiring length cannot be ignored during measurement.

  Therefore, the present invention has been made in view of the above-described problems, and it is possible to control the IC mounted on the IC socket to a desired temperature without using other devices, and to control externally even during temperature control. An object of the present invention is to provide a technique capable of measuring the characteristics of an IC.

  An IC socket according to the present invention is an IC socket in which an IC (Integrated Circuit) can be mounted, and a bottom plate portion disposed opposite to a bottom portion of the mounted IC as the IC mounted on the IC socket, Mounted on the side surface of the mounting IC, and provided with an opening hole that exposes the top of the mounting IC, and is incorporated in the bottom plate, and is heated in contact with the bottom of the mounting IC. A first heating / endothermic part that absorbs heat;

  According to the present invention, since the first heating / heat absorption unit incorporated in the bottom plate is provided, the temperature of the mounted IC can be controlled to a desired temperature without using another device. Further, since the first heating / heat absorption unit contacts and heats the mounting IC, the temperature of the mounting IC can be accurately controlled. Further, since the opening hole is provided in the lid portion, the characteristics of the mounted IC can be measured from the outside through the opening hole even during temperature control.

2 is a cross-sectional view showing a configuration of an IC socket according to Embodiment 1. FIG. 2 is a cross-sectional view showing a configuration of an IC socket according to Embodiment 1. FIG. 3 is a plan view showing a configuration of an IC socket according to Embodiment 1. FIG. 2 is a cross-sectional view showing a configuration of an IC socket according to Embodiment 1. FIG. 3 is a plan view showing a configuration of an IC socket according to Embodiment 1. FIG. 6 is a cross-sectional view showing a configuration of an IC socket according to Embodiment 2. FIG. 6 is a cross-sectional view showing a configuration of an IC socket according to Embodiment 3. FIG. 3 is a plan view showing a configuration of an IC socket according to Embodiment 1. FIG. 3 is a plan view showing a configuration of an IC socket according to Embodiment 1. FIG. 3 is a plan view showing a configuration of an IC socket according to Embodiment 1. FIG. 6 is a cross-sectional view showing a configuration of an IC socket according to Embodiment 3. FIG. 6 is a cross-sectional view showing a configuration of an IC socket according to Embodiment 3. FIG. 6 is a cross-sectional view showing a configuration of an IC socket according to Embodiment 3. FIG. 6 is a cross-sectional view showing a configuration of an IC socket according to Embodiment 3. FIG. 6 is a cross-sectional view showing a configuration of an IC socket according to Embodiment 3. FIG.

<Embodiment 1>
FIG. 1 is a cross-sectional view showing a configuration of an IC socket 51 according to Embodiment 1 of the present invention. As shown in FIG. 1, the IC socket 51 includes a bottom plate portion 1, a lid portion 2, and a heating element 3 (first heating / heat absorption portion), so that an IC can be mounted. Here, it is assumed that the IC mounted on the IC socket 51 is an SOP (Small Outline Package) type IC 21 having a substantially Z-shaped lead pin 21a as shown in FIG.

  The bottom plate portion 1 is disposed to face the bottom surface (bottom portion) of the IC 21 (hereinafter referred to as “mounting IC 21”) mounted on the IC socket 51. The bottom plate portion 1 has conductive pins 1a that come into contact with the lead pins 21a of the mounting IC 21 that are arranged to face each other. The characteristics of the mounting IC 21 are usually measured through the conductive pins 1a.

  The lid portion 2 is placed on the bottom plate portion 1 and covers the side surface (side portion) of the mounting IC 21. The lid 2 is provided with an opening hole 2a that exposes the upper surface (upper part) of the mounting IC 21. In the present embodiment, it is possible to measure the characteristics of the mounting IC 21 separately from the normal measurement by bringing the measuring needle into contact with the mounting IC 21 (here, the lead pin 21a) through the opening hole 2a. ing. The lid 2 is configured to cover the lead pin 21a of the mounting IC 21 as long as the measuring needle can be brought into contact with the mounting IC 21 from the outside through the opening hole 2a.

  The heating element 3 is incorporated in the bottom plate portion 1 and heats in contact with the bottom surface (bottom portion) of the mounting IC 21. In the present embodiment, the heat generation of the heating element 3 is controlled based on the temperature between the heating element 3 and the mounting IC 21. As a configuration for realizing such control, here, a temperature detection unit (not shown) made of an element having thermal dependency such as a thermocouple or a diode, and a temperature detected by the temperature detection unit (here, the heating element 3). And a temperature control unit (not shown) for controlling the heat generation of the heating element 3 based on the temperature between the mounting IC 21 and the mounting IC 21. If the detected temperature is higher than a predetermined set temperature, the heat generation of the heat generating element 3 is controlled to be small. If the detected temperature is lower than the set temperature, the heat generated by the heat generating element 3 is increased. Be controlled. Thereby, the temperature of the mounting IC 21 is controlled to a desired temperature.

  According to the IC socket 51 according to the present embodiment as described above, since the heating element 3 incorporated in the bottom plate portion 1 is provided, it is not necessary to use another device (a large facility such as a dryer or a thermostatic bath). The temperature of the mounting IC 21 can be controlled to a desired temperature. Thereby, an apparatus space can be made small. In addition, since the heating element 3 is heated in contact with the mounting IC 21, the temperature of the mounting IC 21 can be accurately controlled. In addition, since the opening 2a is provided in the lid 2, even during temperature control, the characteristics of the mounting IC 21 can be measured by bringing a measuring needle into contact with the mounting IC 21 from the outside through the opening 2a.

  In the above description, the first heating / heat-absorbing part is the heating element 3, but the present invention is not limited to this.

  For example, as shown in FIGS. 2 and 3, the first heating / heat-absorbing unit transmits the heat from the heating element 4 a disposed outside the lid 2 in a plan view and the heat of the heating element 4 a to the bottom surface of the mounting IC 21. You may comprise from the heat path | route part 4b. In this case, if the temperature between the heat transfer path portion 4b and the mounting IC 21 is higher than the set temperature, the heat generation of the heating element 4a is controlled to be small, and if the temperature is lower than the set temperature. The heating element 4a is controlled to increase the heat generation. According to the configuration as described above, the installation area of the IC socket 51 is somewhat increased, but since it is possible to provide a large-sized heating element 4a, it is possible to expect good temperature controllability.

  For example, as shown in FIGS. 4 and 5, the first heating / heat-absorbing part absorbs heat (cools) the heat-radiating part 5 a such as a heat sink disposed outside the lid part 2 in plan view and the bottom surface of the mounting IC 21. ), And a heat transfer path portion 5c that transfers heat from the Peltier device 5b to the heat radiating portion 5a. In this case, if the temperature between the Peltier element 5b and the mounting IC 21 is higher than the set temperature, the heat absorption of the Peltier element 5a is controlled to be larger. If the temperature is lower than the set temperature, the Peltier element is controlled. Control is performed so that the heat generation of the element 5a is reduced. According to the configuration as described above, the same effect as described above can be realized in the measurement of the IC characteristics on the low temperature side.

  The heating element (such as the heating element 3) described above is made of a nichrome wire or the like, and is a resistance heating element that is electrically easy to control the temperature, or heat generation that does not require a power source and that undergoes a reaction such as iron oxidation. Use your body.

<Embodiment 2>
FIG. 6 is a cross-sectional view showing the configuration of the IC socket 51 according to Embodiment 2 of the present invention. In the description of the IC socket 51 according to the present embodiment, the same or similar components as those described in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 6, the IC socket 51 according to the present embodiment includes a heating element 6 (second heating / heat absorption part) that is incorporated in the lid part 2 and heats the side surface of the mounting IC 21. Yes. In FIG. 6, the heating element 6 is not in contact with the mounting IC 21, but is not limited to this. For example, the heating element 6 may be in contact with the mounting IC 21 as long as the measuring needle can be brought into contact with the mounting IC 21 from the outside through the opening hole 2a.

  According to such an IC socket 51 according to the present embodiment, the side surface of the mounting IC 21 can also be heated, so that the temperature of the mounting IC 21 can be accurately controlled.

  Note that the heat generation of the heating element 6 may be controlled uniformly with the heat generation of the heating element 3, or may be controlled independently. In the above description, the second heating / heat absorption part is the heating element 6, but a configuration including a Peltier element instead of the heating element 6 may be used.

<Embodiment 3>
FIG. 7 is a cross-sectional view showing the configuration of the IC socket 51 according to Embodiment 3 of the present invention. In the description of the IC socket 51 according to the present embodiment, the same or similar components as those described in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  As shown in this figure, the IC socket 51 according to the present embodiment is provided in a part of the opening 2a of the lid 2 and is heated in contact with the upper surface of the mounting IC 21 (first heating element 11). 3 heating / endothermic part) has been added. That is, the heating element 11 is provided in the opening hole 2a in a state where the opening hole 2a through which the measuring needle from the outside can pass is not completely closed. Note that the heating element 11 may be provided connected to the lid 2 so as to surround the entire periphery of the opening hole 2a in plan view as shown in FIG. 8, or as shown in FIG. 9 and FIG. It may be provided connected to the lid portion 2 so as to surround a part of the opening hole 2a as viewed from above.

  According to such an IC socket 51 according to the present embodiment, the upper surface of the mounting IC 21 can also be heated, so that the temperature of the mounting IC 21 can be accurately controlled. Moreover, since the airtightness of the space between the baseplate part 1 and the cover part 2 improves, temperature controllability can be made favorable. In general, the upper side of the IC socket 51 has fewer design restrictions than the lower side, so that it is possible to provide a large-sized heating element 11. Therefore, the IC socket 51 according to the present embodiment can be expected to realize good temperature controllability. Note that the heat generation of the heat generating element 11 may be controlled uniformly with the heat generation of the heat generating element 3, or may be controlled independently.

  In the above description, the third heating / heat-absorbing part is the heating element 11, but the present invention is not limited to this. For example, as shown in FIG. 11, the third heating / heat absorption unit includes a heating element 12 a disposed above the mounting IC 21, and a heat transfer path unit 12 b (heat transfer unit) that transfers the heat of the heating element 12 a to the upper surface of the mounting IC 21. ). According to such a configuration, since it is possible to use a larger-sized heating element 12a, it is possible to expect good temperature controllability. Note that, for example, a part of the heating element 12a protrudes from the outline of the bottom plate part 1 and the lid part 2 as in the case where the size of the heating element 12a in plan view is larger than that of the bottom plate part 1 and the lid part 2. There may be.

  Also, for example, as shown in FIG. 12, the third heating / heat absorbing part absorbs (cools) the heat radiating part 13a such as a heat sink disposed above the mounting IC 21 and the upper surface of the mounting IC 21 and transfers the heat to the heat radiating part. And a Peltier element 13b applied to 13a. According to such a configuration, the same effect as described above can be realized in measurement of IC characteristics on the low temperature side. For example, a part of the heat radiating part 13a protrudes from the outline of the bottom plate part 1 or the cover part 2 as in the case where the size of the heat radiating part 13a in plan view is larger than that of the bottom plate part 1 or the cover part 2. There may be.

  For example, as shown in FIG. 13, the third heating / heat-absorbing unit is configured to dissipate heat from the heat-dissipating part 14 a such as a heat sink disposed above the mounting IC 21, a Peltier element 14 b that absorbs heat, and the upper surface of the mounting IC 21. It may be comprised from the heat-transfer path | route part 14c (heat-transfer part) transmitted to 14b. According to such a configuration, it is possible to provide a Peltier element 14b having a larger size, so that it is possible to expect good temperature controllability. For example, as in the case where the size of the heat radiation part 14a and the Peltier element 14b in plan view is larger than that of the bottom plate part 1 and the cover part 2, the heat radiation part 14a and a part of the Peltier element 14b are It may protrude from the outline of the part 2.

  In the above description, both the bottom surface and the top surface of the mounting IC 21 are heated or endothermic (cooled), but one of them may be heated and the other endothermic (cooled).

  14 and 15 are cross-sectional views showing application examples of the IC socket 51 according to the present embodiment. In FIG. 14 and FIG. 15, the illustration of the lid 2 and the like is omitted for convenience. In FIG. 14, a DIP type IC 22 having a substantially L-shaped lead pin 22 a is shown as an IC mounted on the IC socket 51. FIG. 15 shows a transfer mold type power semiconductor module type IC 23 having a substantially L-shaped lead pin 23a and molded by transfer molding as an IC mounted on the IC socket 51.

  The IC socket 51 according to the present embodiment can be applied to the ICs 22 and 23 in the same manner as the IC 21. Therefore, the same effect as described above can be obtained. In particular, the transfer mold type power semiconductor module type IC 23 generates heat by the built-in power chip, but by heating / absorbing heat by the IC socket 51, the IC characteristics can be measured in a short time. . That is, the test time can be shortened.

  It should be noted that within the scope of the present invention, the embodiments can be freely combined or the embodiments can be omitted as appropriate.

  DESCRIPTION OF SYMBOLS 1 Bottom plate part, 2 cover part, 2a opening hole, 3, 6, 11, 12a Heat generating body, 12b, 14c Heat-transfer path | route part, 14b Peltier element, 21,23 IC, 51 IC socket.

Claims (6)

IC socket that can mount IC (Integrated Circuit),
A bottom plate portion disposed opposite to the bottom portion of the mounting IC which is the IC mounted on the IC socket;
A lid portion placed on the bottom plate portion, covering a side portion of the mounting IC, and provided with an opening hole for exposing an upper portion of the mounting IC;
An IC socket comprising a first heating / heat-absorbing part that is incorporated in the bottom plate part and that heats / absorbs heat in contact with the bottom part of the mounted IC. The IC socket according to claim 1,
An IC socket, further comprising a second heating / heat-absorbing part that is incorporated in the lid part and heats / absorbs a side part of the mounted IC. The IC socket according to claim 1 or 2,
An IC socket, further comprising a third heating / heat-absorbing part that is provided in a part of the opening of the lid and that heats / heat-absorbs in contact with the upper part of the mounted IC. The IC socket according to claim 3,
The third heating / endothermic part is
A heating element;
An IC socket, comprising: a heat transfer section that transfers heat of the heating element to an upper portion of the mounting IC. The IC socket according to claim 3,
The third heating / endothermic part is
A Peltier element that absorbs heat;
An IC socket, comprising: a heat transfer section that transfers heat of the upper part of the mounted IC to the Peltier element. An IC socket according to any one of claims 1 to 5,
The IC is an IC socket including a transfer mold type power semiconductor module type IC.

Images