JP2013074133A - Facility management system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce workload on maintenance operation of supplemental equipment by capturing the connection relation of the supplemental equipment connected to a substrate processing apparatus.SOLUTION: A facility management system includes a substrate processing apparatus, supplemental equipment related to the substrate processing apparatus and directly or indirectly connected to the substrate processing apparatus, a storage unit for storing at least information on the supplemental equipment collected from the supplemental equipment, and a display for presenting connection relation between the substrate processing apparatus and the supplemental equipment on the basis of information stored in the storage unit. The supplemental equipment is a cylinder cabinet for placing a gas cylinder therein and an exhaust system for exhausting gas and heat. The display links and presents connection relations between the substrate processing apparatus and the cylinder cabinet and between the substrate processing apparatus and the exhaust system.

Description

  The present invention relates to a system for managing incidental facilities of a substrate processing apparatus.

As one of the processing steps of a semiconductor device, there is a substrate processing step that performs processing such as oxidation processing, diffusion processing, and thin film generation on a substrate such as a silicon wafer, and the substrate processing apparatus is an apparatus that executes the substrate processing step. is there. The substrate processing apparatus defines an airtight processing chamber, and is provided with a processing furnace for processing a substrate at a time, a gas supply pipe for supplying a gas into the processing chamber, a gas exhaust pipe for exhausting the gas in the processing chamber, a processing It is comprised by components, such as the heat | fever exhaust pipe which exhausts the heat | fever in a furnace, and the valve | bulb which controls the flow of gas and heat.
An operator of the substrate processing apparatus can check the state of the components that constitute the substrate processing apparatus. For example, Patent Document 1 describes that maintenance safety is maintained by displaying a gas filling state in a gas pipe on a display of a substrate processing apparatus. Patent Document 2 describes a substrate processing apparatus. Describes that a recipe editing screen and a gas pattern screen are displayed.

FIG. 1 is a display example of a gas pattern screen. From the gas pattern screen of FIG. 1, nitrogen, hydrogen, oxygen, and liquid source gas X are supplied into the processing chamber after passing through the MFC, and the gas in the processing chamber is exhausted after passing through the scrubber (or without passing through the scrubber). It can be seen that the heat in the processing furnace is exhausted. However, it is difficult to grasp and maintain incidental facilities such as a gas cylinder as a gas supply source and an exhaust device as a gas and heat exhaust destination from the gas pattern screen of FIG.
Ancillary equipment related to the substrate processing apparatus is connected to only one substrate processing apparatus and is not necessarily used only by one substrate processing apparatus, but is connected to a plurality of substrate processing apparatuses, and a plurality of substrates. As a result of being shared by the processing apparatus, it is influenced by a plurality of substrate processing apparatuses. Therefore, when maintaining the components that constitute the substrate processing apparatus, the influence on other substrate processing apparatuses sharing the incidental equipment must be taken into consideration. Further, when maintaining the incidental facilities, it is necessary to estimate the influence on the incidental facilities and the substrate processing apparatus connected to the incidental facilities. For example, when the operator grasps the incidental equipment B connected to the substrate processing apparatus A and maintains the incidental equipment B, the operator grasps the other substrate processing apparatus C connected to the incidental equipment B, and the substrate processing apparatus C It is necessary to maintain the incidental equipment B in consideration of the influence of the incidental equipment B on the incidental equipment B.
As described above, it is very difficult for the operator to refer to the conventional gas pattern screen and grasp the incidental equipment connected to a certain substrate processing apparatus and maintain the components and incidental equipment constituting the substrate processing apparatus. However, the information to perform maintenance work safely was not provided sufficiently.

JP 2002-25918 A JP 2006-93494 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing system that reduces the load on maintenance work that must be performed while grasping incidental equipment connected to a substrate processing apparatus.

  A substrate processing system according to the present invention is based on a substrate processing apparatus, an auxiliary facility related to the substrate processing apparatus, a storage device that stores at least information related to the auxiliary facility, and information stored in the storage device. A display device for displaying a connection relationship between the substrate processing apparatus and the incidental equipment.

  ADVANTAGE OF THE INVENTION According to this invention, the connection relation of the incidental equipment relevant to a substrate processing apparatus and a substrate processing apparatus can be grasped | ascertained, and this can reduce the load concerning a maintenance operation | work and can ensure safety | security.

It is a display example of a gas pattern screen. It is a lineblock diagram of a substrate processing system concerning one embodiment of the present invention. It is a figure showing the outline of the substrate processing system concerning one embodiment of the present invention. It is a figure for demonstrating the connection relation of a substrate processing apparatus and incidental equipment. It is a figure for demonstrating a substrate processing apparatus roughly. It is a figure for demonstrating a substrate processing apparatus roughly. It is an example of the connection table stored in RDB in DB server. It is an example of the equipment table stored in RDB in DB server. It is an example of the chemical substance table stored in RDB in DB server. It is a flowchart which shows the operation | movement flow of DB server. It is a flowchart which shows the operation | movement flow of DB server. It is an example of a connection relation table. It is an example of a chemical substance table. It is an example of a connection relation figure.

First, the substrate processing system 1 which concerns on one Embodiment of this invention is demonstrated using FIG.
As illustrated in FIG. 2, the terminal device 11-1 is connected to at least one of the substrate processing apparatuses 10-1, 10-2,. Here, the terminal device 11-1 is connected to the substrate processing apparatus 10-n. The terminal device 11-2 is connected to the substrate processing apparatuses 10-1, 10-2,..., 10-n via a network 13-1, such as an in-house LAN. The terminal device 11-3 is connected to the substrate processing apparatuses 10-1, 10-2,..., 10-n via a network 13-2 such as an external LAN or WAN.
The database server (DB server) 12-1 is connected to the substrate processing apparatuses 10-1, 10-2,..., 10-n via the network 13-1. The DB server 12-2 is connected to the substrate processing apparatuses 10-1, 10-2,..., 10-n via the network 13-2.

Although details of the substrate processing apparatuses 10-1, 10-2,..., 10-n will be described later, incidental facilities are connected to the substrate processing apparatuses 10-1, 10-2,. The
Ancillary facilities are connected to the substrate processing apparatuses 10-1, 10-2,... The incidental facility transmits management information related to the incidental facility to the DB servers 12-1 and 12-2.
More specifically, the management information related to the incidental equipment includes which port of which incidental equipment and which port of which incidental equipment (or substrate processing apparatus) supplied which gas, which substrate processing apparatus. Which port from which port of (or ancillary equipment) exhausted which gas to which port of which ancillary equipment, and which ancillary equipment from which port of which substrate processing apparatus (or ancillary equipment) It is information on which port the heat is exhausted.

The terminal devices 11-1 to 11-3 are general computers, and include an input device such as a keyboard and an output device such as a display.
The DB servers 12-1 and 12-2 include relational databases (RDB) 120-1 and 120-2, and store information transmitted from incidental facilities in the RDBs 120-1 and 120-2. As will be described later, the information transmitted from the incidental equipment is normalized and stored in the RDBs 120-1 and 120-2 as a plurality of tables. The DB servers 12-1 and 12-2 respond to requests from the terminal devices 11-1 to 11-3 based on a plurality of tables stored in the RDBs 120-1 and 120-2 and the incidental devices. A table (hereinafter referred to as “connection relation table”) indicating the connection relation of equipment is created and transmitted to the terminal devices 11-1 to 11-3. That is, the terminal devices 11-1 to 11-3 operate as clients of the DB servers 12-1 and 12-2 and acquire the connection relation table. The acquired connection relation table is displayed on the display of the terminal devices 11-1 to 11-3 and is referred to by the operators of the terminal devices 11-1 to 11-3. As will be described later, the connection relationship between the substrate processing apparatus 10 and the incidental equipment may be created in a format other than the table.

Here, n is an integer of 1 or more, and n does not always indicate the same number.
In the following drawings, substantially the same components are denoted by the same reference numerals.
Hereinafter, when any of a plurality of constituent parts such as “substrate processing apparatus 10-1 to 10-n” is indicated without being specified, it is simply abbreviated as “substrate processing apparatus 10” or the like. There is.

FIG. 3 is a diagram showing an outline of the substrate processing system 1 according to an embodiment of the present invention.
The substrate processing system 1 includes at least an auxiliary device such as a substrate processing device 10, a terminal device 11, a cylinder cabinet (C / C) 14, a gas use point (U / P) 16, an abatement device 17 and an exhaust device 18, and , RDB120. The substrate processing system 1 is different from the conventional substrate processing system in that it includes an auxiliary device and the RDB 120.
In FIG. 3, the terminal device 11 is connected to the substrate processing apparatus 10, but a group management system including at least one terminal device 11 may be connected to at least one of the substrate processing apparatuses 10. Further, as shown in FIG. 2, the RDB 120 may be provided in the DB server 12, or may be provided in the group management system, the substrate processing apparatus 10, or the like without providing the DB server 12. In FIG. 3, the connection relationship of the apparatuses constituting the substrate processing system 1 is simplified, but the actual connection relationship is often more complicated (see FIG. 4 for details).

C / C14 accommodates a gas cylinder. The U / P 16 accumulates and branches the gas pipes and relays the gas pipes. The detoxifying device 17 detoxifies the exhaust gas. The exhaust device 18 exhausts the gas exhausted from the substrate processing apparatus 10 and the abatement apparatus 17 to the outside of the factory.
Among these auxiliary devices, C / C 14 and U / P 16 are upstream (gas supply side) devices, and the abatement device 17 and exhaust device 18 are downstream (gas exhaust side) devices.
Other auxiliary devices include a gas cylinder and a liquid source container that directly supplies the liquid source to the substrate processing apparatus 10.

The RDB 120 stores information transmitted from the auxiliary device.
Information transmitted from the C / C 14 is information for remaining amount management (remaining amount management information), such as the pressure of a cylinder for supplying gas to the substrate processing apparatus 10 and the remaining amount of gas. . The information transmitted from the U / P 16 is information for flow rate management (flow rate management information), such as a gas flow rate. Information transmitted from the abatement apparatus 17 is information for pollution management (contamination management information), such as a flow rate and concentration of a certain substance, a flow rate ratio in the exhaust amount of a certain substance, and the like. The information transmitted from the exhaust device 18 is information for exhaust amount management (exhaust amount management information), for example, the amount of gas exhaust.

In the case where there is the liquid source container described above, the RDB 120 uses, as the remaining amount management information, for example, the pressure of the cylinder for the liquid source container to supply the liquid source to the substrate processing apparatus 10 and the remaining amount of the liquid source. Store.
In addition, when a device is attached to the auxiliary device, the RDB 120 stores information acquired by the device. For example, when a sensor is attached, the RDB 120 stores information acquired by the sensor. In addition, when an instrument for measuring a flow rate or an exhaust amount or a control device for controlling a flow rate or an exhaust amount is attached to the accessory device, the RDB 120 stores information acquired by the instrument or the control device.

Here, the various types of management described above (remaining amount management, flow rate management, contamination management, and exhaust amount management) are realized by executing programs in the DB server 12. In the program executed in the DB server 12, how pipes laid on the substrate processing apparatus 10 and pipes laid on the auxiliary equipment are connected (hereinafter referred to as “connection relationship between the substrate processing apparatus 10 and the auxiliary equipment”). )).
Although details of the program will be described later, when the DB server 12 is not provided and the group management system, the substrate processing apparatus 10, and the like include the RDB 120, the program may be executed by the group management system, the substrate processing apparatus 10, or the like. .

When the program is executed in the substrate processing system 1, the connection relationship between the substrate processing apparatus 10 and the incidental equipment is displayed using the information transmitted from the incidental apparatus. Safety can be improved.
In addition, according to the configuration of the substrate processing system 1, since it is possible to provide connection relations between the substrate processing apparatus 10 and incidental facilities to maintenance personnel who perform maintenance, in particular, gas leakage, apparatus failure, apparatus accidents, etc. This is effective when recovery processing is required immediately, such as when a problem occurs.

With reference to FIG. 4, the connection relation of the substrate processing apparatus 10 and incidental equipment will be described.
FIG. 4 is a diagram for explaining a connection relationship between the substrate processing apparatus 10 and the incidental equipment.
Here, each of the cylinder cabinet (C / C) 14, the gas cylinder (cylinder) 15, the gas use point (U / P) 16, the abatement device 17 and the exhaust device 18 is directly attached to the substrate processing apparatus 10 as ancillary equipment. Connected indirectly. The C / C 14 is connected to the substrate processing apparatus 10 via a U / P 16 (including U / P 16 connected in multiple stages), and the exhaust device 18 is connected to the substrate processing apparatus 10 via an abatement apparatus 17. . That is, the C / C 14 and the exhaust device 18 are indirectly connected to the substrate processing apparatus 10. Further, a part of the cylinder 15, the U / P 16 and the abatement apparatus 17 are directly connected to the substrate processing apparatus 10.
A cylinder 15 containing a gas such as N2, H2, and O2 is disposed in C / C14. Depending on the type of gas, the cylinder 15 may not be disposed at the C / C 14. For example, the cylinder 15 containing a gas such as a liquid source gas is not disposed in the C / C 14.
U / P 16 is a place where gas supply pipes, which will be described later, accumulate and branch.

As shown in FIG. 4, the substrate processing apparatus 10-1 includes a cylinder 15-1 disposed in the C / C 14-1 and a cylinder 15- disposed in the C / C 14-2 via the U / P 16-1. 2 and the cylinder 15-4 are directly connected. In addition, an exhaust device 18-2 is connected to the substrate processing apparatus 10-1 via an abatement apparatus 17-2.
The substrate processing apparatus 10-2 is connected to the cylinder 15-1 arranged in the C / C 14-1 and the cylinder 15-2 arranged in the C / C 14-2 via the U / P 16-1. A cylinder 15-2 arranged in the C / C 14-2 is connected via the U / P 16-3. Moreover, the exhaust apparatus 18-2 is connected to the substrate processing apparatus 10-2 via the detoxifying apparatus 17-1.
The substrate processing apparatus 10-3 is connected to the cylinder 15-2 arranged in the C / C 14-2 and the cylinder 15-3 arranged in the C / C 14-3 via the U / P 16-2. The cylinder 15-2 arranged in the C / C 14-2 is connected via the U / P 16-3, and the cylinder 15-5 is directly connected. Further, an exhaust device 18-3 is connected to the substrate processing apparatus 10-3 via a detoxifying device 17-3.
As described above, the connection relationship between the substrate processing apparatus 10 and the incidental facilities is that the connection from the incidental facility to the substrate processing apparatus 10 (or the incidental facility) and the connection from the substrate processing apparatus 10 (or the incidental facility) to the incidental facility. Combined and complicated.

5 and 6 are diagrams for schematically explaining the substrate processing apparatus 10 shown in FIG. 2 and the like.
As shown in FIG. 5, a cassette stage 102 that delivers a cassette 101 to and from an external transfer device (not shown) is provided on the front side inside the housing 100 of the substrate processing apparatus 10. A cassette transporter 103 is provided behind the cassette stage 102, and a cassette shelf 104 for storing the cassettes 101 is provided behind the cassette transporter 103. Further, a reserve cassette shelf 105 for storing the cassette 101 is provided above the cassette stage 102, and a clean unit 106 is provided above the reserve cassette shelf 105. The clean unit 106 distributes clean air inside the housing 100.

A processing furnace 107 is provided above the rear portion of the housing 100. Below the processing furnace 107, a boat elevator 109 that raises and lowers the boat 108 between the inside and outside of the processing furnace 107 is provided. The boat 108 mounts the wafers 110 and holds the wafers 110 horizontally in multiple stages. A seal cap 111 for closing the lower end of the processing furnace 107 is attached to the boat elevator 109. The seal cap 111 supports the boat 108 vertically.
Between the boat elevator 109 and the cassette shelf 104, a wafer transfer machine 112 for transferring the wafer 110 is provided. Next to the boat elevator 109, a furnace port shutter 113 is provided for hermetically closing the lower end of the processing furnace 107. The furnace port shutter 113 can block the lower end of the processing furnace 107 when the boat 108 is outside the processing furnace 107.

  The cassette 101 loaded with the wafer 110 is carried into the cassette stage 102 from an external transfer device (not shown), and then transferred from the cassette stage 102 to the cassette shelf 104 or the spare cassette shelf 105 by the cassette transfer device 103. The cassette shelf 104 includes a transfer shelf 114 that stores the cassette 101 to be transferred by the wafer transfer device 112. When the cassette transfer device 103 transfers the cassette 101 to the transfer shelf 114, the wafer transfer device 112 transfers the cassette 101 from the transfer shelf 114 to the boat 108.

When a predetermined number of wafers 110 are transferred to the boat 108, the boat elevator 109 carries the boat 108 into the processing furnace 107, and the seal cap 111 hermetically closes the processing furnace 107. Inside the processing furnace 107 which is hermetically closed, a gas is supplied and a predetermined process is performed on the wafer 110.
When the predetermined processing on the wafer 110 is completed, the wafer 110 is transferred by a procedure reverse to the above procedure. That is, the wafer 110 is transferred from the boat 108 to the cassette 101 of the transfer shelf 114 by the wafer transfer device 112 and is carried out of the casing 100 by an external transfer device (not shown).

As shown in FIG. 6, the processing furnace 107 is formed by a processing chamber 116 formed by a seal cap 111 and a reaction tube 115 and a heater 117.
The reaction tube 115 is a reaction vessel that is provided inside the heater 117 and heat-treats the wafer 110. The reaction tube 115 is closed at the lower end with a seal cap 111 and hermetically with an O-ring 118.
A boat 108 is provided on the seal cap 111 via a quartz cap 119 that holds the boat 108. The boat 108 is carried into the processing furnace 107 through the opening at the lower end of the processing furnace 107. The wafer 110 carried into the processing furnace 107 is heated to a predetermined temperature by the heater 117. One end of a thermal exhaust pipe 120 that exhausts heat generated by the heater 117 is connected to the processing furnace 107. The other end of the thermal exhaust pipe 120 is connected to the exhaust device 18 via a valve 121.

A plurality of types of gases are supplied to the processing chamber 116 via the gas supply pipe 122. Here, four types of gases, nitrogen, hydrogen, oxygen, and liquid source gas X are supplied.
For example, nitrogen is supplied from the cylinder 15-1 disposed in the C / C 14-1 to the processing chamber 116 through the gas supply pipe 122 via the mass flow controller (MFC) 123-1 and the valve 124-1. Is done. Hydrogen is supplied from the cylinder 15-2 arranged in the C / C 14-2 to the processing chamber 116 through the gas supply pipe 122 through the MFC 123-2 and the valve 124-2. Oxygen is supplied from the cylinder 15-3 disposed in the C / C 14-3 through the gas supply pipe 122 to the processing chamber 116 via the MFC 123-3 and the valve 124-3. The liquid source gas X is supplied from the cylinder 15-4 not arranged in the C / C 14 through the gas supply pipe 122 to the processing chamber 116 via the MFC 123-4 and the valve 124-4.

A boat 108 is provided in the center of the reaction tube 115, and the boat 108 can enter and exit the reaction tube 115 by a boat elevator 109. Further, the processing furnace 107 is provided with a boat rotation mechanism 125 that rotates the boat 108 held by the quartz cap 119. When the boat 108 is rotated by the boat rotation mechanism 125, the uniformity of processing on the wafer 110 can be maintained.
One end of a gas exhaust pipe 126 that exhausts the gas in the processing chamber 116 is connected to the processing chamber 116. The other end of the gas exhaust pipe 126 is connected to the exhaust device 18 via the valve 121 (or via the valve 121 and the abatement device 17).

FIG. 7 is an example of a table stored in the RDB 120 of FIG. The RDB 120 stores a connection table 19, an equipment table 20, and a chemical substance table 21.
7A is an example of the connection table 19, FIG. 7B is an example of the equipment table 20, and FIG. 7C is an example of the chemical substance table 22.

As shown in FIG. 7A, the connection table 19 includes a connection ID column 190, a connection source facility ID column 191, a connection source port number column 192, a connection destination facility ID column 193, a connection destination port number column 194, and a chemical substance ID column 195. And a record (here, six records) including these data items.
The connection ID column 190 stores a connection ID for identifying a connection between devices. The connection source facility ID column 191 stores a facility ID for identifying the connection source facility. The connection source port number column 192 stores the port number of the connection source equipment. The connection destination equipment ID column 193 stores an equipment ID for identifying the connection destination equipment. The connection destination port number column 194 stores a facility ID for identifying a connection destination facility. The chemical substance ID column 195 stores chemical substance IDs for identifying chemical substances.

As shown in FIG. 7B, the equipment table 20 is composed of columns such as equipment ID column 200, equipment name column 201 and equipment type column 202, and records including these data items (here, eight records). .
The equipment ID column 200 is associated with the connection source equipment ID column 191 and the connection destination equipment ID column 193 of FIG. 7A. By providing the equipment ID column in association with each other in this way, the equipment table 20 can be associated with the connection table 19 in FIG. 7A. The equipment name column 201 stores the name of the equipment. The equipment type column 202 stores the equipment type.
The reason why the numbers with parentheses are added to the equipment names is to distinguish the equipment names. The equipment type being an evaluation device means that it becomes a base point when creating a connection relation table. Here, it is assumed that the connection processing table is created with the substrate processing apparatus as an evaluation apparatus and the substrate processing apparatus as a base point. It goes without saying that other devices such as an abatement device can be used as the evaluation device.

As shown in FIG. 7C, the chemical substance table 21 includes a chemical substance ID column 210, a chemical substance name column 211, an English name column 212, a chemical formula column 213, a hazard column 214, a first aid column 215, and the like. The record includes four data items (here, four records).
The chemical substance ID column 210 is associated with the chemical substance ID column 195 of FIG. 7A. Thus, by providing the chemical substance ID column in association with each other, the chemical substance table 21 can be associated with the connection table 19 in FIG. 7A. The chemical substance name column 211 stores the names of chemical substances. The English name column 212 stores English names of chemical substances. The chemical formula column 213 stores chemical formulas of chemical substances. The hazard column 214 stores hazards of chemical substances. The first aid column 215 stores chemical first aid.

FIG. 8 is a flowchart showing an operation flow of the DB server 12. Each step in FIG. 8 is executed by a program stored in the DB server 12.
When the terminal device 11 in FIG. 2 transmits a request to create a connection relation table, the DB server 12 starts a program and creates a connection relation table based on a plurality of tables (table in FIG. 7) stored in the RDB 120. create. The created connection relationship table is transmitted to the terminal device 11 and displayed.
The DB server 12 may start the program when communication between the substrate processing apparatus 10 and the terminal apparatus 11 is established. Further, the program may be stored in another apparatus such as the substrate processing apparatus 10, and in this case, a connection relation table is created in the other apparatus. The created connection relationship table may be displayed on another device, or may be displayed on both the other device and the terminal device 11.

As shown in FIG. 8A, in step 100 (S100), the facility table 20 in FIG. 7B is accessed to determine whether there is a record whose facility type is an evaluation device. If there is a record, the process proceeds to step 102. If there is no record, the process ends.
In step 102 (S102), the number of records whose equipment type is the evaluation device is set in CNT1. Thereafter, the processing of steps 104 to 146 is repeated by the number of CNT1 in ascending order of equipment ID included in this record.

In step 104 (S104), the equipment ID and equipment name are extracted from the record whose equipment type is the evaluation device.
In step 106 (S106), the connection table 19 in FIG. 7A is accessed, and it is determined whether there is a record in which the equipment ID extracted in step 104 is stored in the connection destination equipment ID. If there is a record, the process proceeds to step 108, and if there is no record, the process proceeds to step 126.
In step 106, it is determined whether or not the evaluation device is a connection destination of another device such as an incidental facility, that is, whether or not there is a connection between the upstream incidental facility and the evaluation device. The processing of steps 108 to 124 is to create a connection between the upstream side equipment and the evaluation device (connection from the auxiliary equipment to the evaluation device). The processing of steps 126 to 142 is performed by the evaluation device and the downstream side equipment. A connection of equipment (connection from the evaluation device to ancillary equipment) is created.

In step 108 (S108), the number of records in which the equipment ID extracted in step 104 is stored in the connection destination equipment ID is set in CNT2. Thereafter, the processing of steps 110 to 124 is repeated by the number of CNTs 2 in ascending order of connection ID included in this record. In step 108, the number of upstream side equipment directly connected to the evaluation apparatus is set to CNT2.
In step 110 (S110), the connection source equipment ID is extracted from the record in which the equipment ID extracted in step 104 is stored in the connection destination equipment ID. In step 110, the incidental equipment on the upstream side directly connected to the evaluation apparatus is specified.

In step 112 (S112), the equipment table 20 is accessed, and the equipment type corresponding to the connection source equipment ID extracted in step 110 (or step 116) is determined. If the equipment type is U / P, the process proceeds to step 114. If the equipment type is C / C and a cylinder, the process proceeds to step 118.
When the process proceeds from step 110 to step 112, the type of ancillary equipment on the upstream side that is directly connected to the evaluation apparatus is determined. When the process returns from step 116 to step 112, it is indirectly connected to the evaluation apparatus. The type of incidental equipment on the upstream side is determined.
In step 114 (S114), the equipment name corresponding to the connection source equipment ID taken out in step 110 (or step 116) is taken out while the equipment table 20 is being accessed.

In step 116 (S116), the connection table 19 is accessed, and the connection source equipment ID is extracted from the record in which the connection source equipment ID extracted in step 110 (or the latest step 116) is stored in the connection destination equipment ID. The process returns to step 112.
In step 116, the incidental equipment on the upstream side that is indirectly connected to the evaluation device is specified. When step 116 is executed for the first time, an upstream incidental facility directly connected to the evaluation device is identified as an upstream incidental facility. The upstream side equipment that is indirectly connected to the upstream side equipment that is directly connected is specified.

In step 118 (S118), the facility name and chemical substance ID corresponding to the connection source facility ID retrieved in step 110 (or step 116) are retrieved while accessing the facility table 20.
In step 120 (S120), the chemical substance table 21 of FIG. 7C is accessed, and the chemical substance name corresponding to the chemical substance ID extracted in step 118 is extracted. The English name, chemical formula, hazard, and first aid measures corresponding to the chemical substance ID extracted in step 118 may be extracted together.
In step 122 (S122), CNT2 is decremented.
In step 124 (S124), it is determined whether or not CNT2 is zero. If it is 0, the process proceeds to step 126. If it is not 0, the process returns to step 110.

As shown in FIG. 8B, in step 126 (S126), the connection table 19 in FIG. 7A is accessed, and it is determined whether there is a record in which the equipment ID extracted in step 104 is stored in the connection source equipment ID. . If there is a record, the process proceeds to step 128. If there is no record, the process proceeds to step 144.
In step 126, it is determined whether or not the evaluation apparatus is a connection source of other apparatuses such as incidental facilities, that is, whether or not there is a connection between the evaluation apparatus and the downstream incidental facilities.
In step 128 (S128), the number of records in which the equipment ID extracted in step 104 is stored in the connection source equipment ID is set in CNT3. Thereafter, the processing of steps 130 to 142 is repeated by the number of CNT3 in ascending order of connection ID included in this record. In step 128, the number of downstream side equipment directly connected to the evaluation device is set to CNT3.

In step 130 (S130), the connection destination equipment ID is extracted from the record in which the equipment ID extracted in step 104 is stored in the connection source equipment ID. In step 130, the downstream side equipment directly connected to the evaluation apparatus is specified.
In step 132 (S132), the equipment table 20 of FIG. 7B is accessed, and the equipment type corresponding to the connection destination equipment ID extracted in step 130 (or step 136) is determined. If the equipment type is an abatement device, the process proceeds to step 134. If the equipment type is an exhaust device, the process proceeds to step 138.
When the process proceeds from step 130 to step 132, the type of the downstream incidental equipment directly connected to the evaluation apparatus is determined. When the process returns from step 136 to step 132, it is indirectly connected to the evaluation apparatus. The type of incidental equipment on the downstream side is determined.

In step 134 (S134), the equipment name corresponding to the connection destination equipment ID taken out in step 128 is taken out while the equipment table 20 is being accessed.
In step 136 (S136), the connection table 19 is accessed, the connection destination equipment ID is extracted from the record in which the connection destination equipment ID extracted in step 128 is stored in the connection source equipment ID, and the process returns to step 132.
In step 136, the downstream incidental equipment indirectly connected to the evaluation apparatus is specified. When step 136 is executed for the first time, the downstream ancillary equipment connected directly to the evaluation apparatus is identified as the downstream ancillary equipment, and if the process has already passed through step 136, the evaluation apparatus The downstream side equipment that is indirectly connected to the downstream side equipment that is directly connected is specified.

In step 138 (S138), the equipment name corresponding to the connection destination equipment ID taken out in step 130 (or step 136) is taken out while the equipment table 20 is being accessed.
In step 140 (S140), CNT3 is decremented.
In step 142 (S142), it is determined whether or not CNT3 is zero. If it is 0, the process proceeds to step 144. If it is not 0, the process returns to step 130.

In step 144 (S144), CNT1 is decremented.
In step 146 (S146), it is determined whether or not CNT1 is zero. If it is 0, the process ends. If it is not 0, the process returns to step 104.
If the device that created the connection relationship table (creating device) is different from the device that displays the connection relationship table (display device), the creating device sends the connection relationship table to the display device, and the creating device is the same as the display device In this case, the creation apparatus displays the connection relation table on a display or the like.

FIG. 9 is an example of a connection relationship table created by executing the flowchart of FIG. Here, the connection relation table is created using the substrate processing apparatus (1) as an evaluation apparatus, but the connection relation table can also be created using another apparatus such as incidental equipment as an evaluation apparatus.
As shown in FIG. 9, the connection relation table is composed of a part (shaded part) indicating a connection from the incidental equipment to the evaluation apparatus and a part (remaining part) indicating a connection from the evaluation apparatus to the auxiliary equipment. Become.
The shaded portion is the equipment name extracted in step 104 in FIG. 8A, the CNT2 set in step 108, the equipment name extracted in step 114, the number of times of returning from step 116 to step 112, and extracted in step 118. It is created using the equipment name and the chemical substance name extracted in step 120.
The remaining portion is created using the CNT3 set in step 128 of FIG. 8B, the equipment name extracted in step 134, and the equipment name extracted in step 138.
The DB server 12 in FIG. 2 has been described as creating a connection relation table using various information and transmitting it to the terminal device 11 in FIG. 2. However, the DB server 12 transmits various information to the group management system. The group management system may create a connection relationship table using various types of information.

In addition, in step 120 of FIG. 8A, when a chemical substance name, an English name, a chemical formula, a hazard, and an emergency measure are taken out, a chemical substance table may be created together. For example, the chemical substance table shown in FIG. 10 may be displayed by clicking “nitrogen” among the chemical substances in the connection relationship table of FIG. The chemical substance table may be displayed on a different screen from the connection relation table, or may be displayed on the same screen.
Furthermore, although the connection relationship table has been described as being created, a connection relationship diagram may be created. FIG. 11 is an example of a connection relationship diagram. Similar to the connection relationship table, the connection relationship diagram includes a portion indicating a connection from the incidental equipment to the evaluation device and a portion indicating a connection from the evaluation device to the auxiliary facility, and can be created in the same manner as the connection relationship table. . Here, the connection relation table is created using the substrate processing apparatus (1) as an evaluation apparatus, but the connection relation table can also be created using another apparatus such as incidental equipment as an evaluation apparatus.

Hereinafter, the effects produced by the present invention will be described.
Conventionally, a lot of time is required for the maintenance of the incidental equipment. In the present invention, the time required for the maintenance of the incidental equipment is shortened by displaying the connection relation between the substrate processing apparatus 10 and the incidental equipment on the operation screen. can do.
While confirming the connection relationship between the substrate processing apparatus 10 and incidental equipment on the operation screen for the chemical substance supplied into the reaction path or the chemical substance discharged from the reaction furnace, grasp the harmfulness of the chemical substance. Since measures for chemical substances can be taken, it is possible to quickly respond to emergencies such as gas leaks, equipment failures, and incidental equipment failures.
The information transmitted from the incidental equipment (information relating to the incidental equipment) is normalized, so that it can be used by the most popular RDBMS (Relational DBMS) among DBMSs (DataBase Management System) and can be handled universally. it can. Therefore, even if the number of incidental facilities increases with the complexity of substrate processing, and the connection relationship between the substrate processing apparatus 10 and incidental facilities becomes complicated, it is possible to cope with it.

In the present invention, the substrate processing apparatus 10 is configured as, for example, a semiconductor manufacturing apparatus that performs a method of manufacturing a semiconductor device (IC). The present invention can also be applied to an apparatus that performs the above.
Examples of the film forming process performed in the substrate processing apparatus 10 include a process for forming a CVD, PVD, oxide film, and nitride film, and a process for forming a film containing a metal.
Further, in the present embodiment, the substrate processing apparatus is described as the vertical processing apparatus 10, but the present invention can be similarly applied to a single wafer apparatus, and these apparatuses may be mixed. Furthermore, the present invention can be similarly applied to an exposure apparatus, a lithography apparatus, a coating apparatus, and the like.

  Next, other preferred embodiments of the present invention will be additionally described, but it goes without saying that the present invention is not limited to the following description.

Preferably, a substrate processing apparatus, an auxiliary facility connected directly or indirectly to the substrate processing apparatus, a storage device for storing information collected from the auxiliary facility, the substrate processing apparatus, and the auxiliary equipment And a display device for displaying the connection relationship.
Preferably, the incidental facility is a cylinder cabinet in which a gas cylinder is disposed, and the display device displays a connection relationship between the substrate processing apparatus and the cylinder cabinet.
Preferably, the incidental facility is an exhaust device that exhausts gas and heat, and the display device displays a connection relationship between the substrate processing apparatus and the exhaust device.
Preferably, the incidental equipment is a cylinder cabinet in which a gas cylinder is disposed and an exhaust device for exhausting gas and heat, and the display device is connected to the substrate processing apparatus and the cylinder cabinet, and the substrate processing apparatus and The connection relationship of the exhaust device is linked and displayed.

Preferably, the ancillary equipment includes at least one of a cylinder cabinet in which a gas cylinder is arranged, an exhaust device for exhausting gas and heat, a gas use point at which gas pipes are integrated and branched, and an abatement device for removing gas. The display device displays a connection relationship between the substrate processing apparatus and at least one of the apparatuses.
Preferably, the ancillary equipment includes at least one of a cylinder cabinet in which a gas cylinder is arranged, an exhaust device for exhausting gas and heat, a gas use point at which gas pipes are integrated and branched, and an abatement device for removing gas. The display device displays a connection relationship between the at least two devices.

Preferably, the incidental facility transmits, as information regarding the incidental facility, the connection destination facility and the operation to the connection destination facility, and the connection source facility and the operation from the connection source facility to the storage device. .
Preferably, the display device includes, based on information stored in the storage device, a connection destination facility, a connection source facility, a connection destination facility, and a connection source facility of the substrate processing apparatus and the incidental facilities. Create a connection table including chemical substances to be exchanged, an equipment table including equipment names and equipment types of the substrate processing apparatus and the incidental equipment, and a chemical substance table including names and properties of the chemical substances, the connection table, Based on the equipment table and the chemical substance table, a connection relation table indicating a connection relation between the substrate processing apparatus and the incidental equipment is created.

  Preferably, first storage means for storing information transmitted from the substrate processing apparatus for processing the substrate, and second storage means for storing information transmitted from the supply side auxiliary equipment and the exhaust side auxiliary equipment. And, based on the information stored in the first storage means and the second storage means, the substrate processing apparatus, a cylinder cabinet that is an auxiliary equipment on the supply side and that accommodates a gas cylinder, and the supply side Use point which is an auxiliary facility for collecting and branching gas pipes and relaying the pipes, an abatement device for excluding exhaust gas which is an auxiliary facility for the exhaust side, and an auxiliary side for the exhaust side Display means for displaying a connection relationship between at least two consecutive apparatuses among the exhaust apparatuses that exhaust the exhaust gas from the abatement apparatus.

  Preferably, the display unit displays a connection relationship between the devices based on a connection table, an equipment table, and a chemical substance table.

DESCRIPTION OF SYMBOLS 1 Substrate processing system 10 Substrate processing apparatus 11 Terminal apparatus 12 DB server 13 Network 14 C / C
15 cylinder 16 U / P
17 Detoxifying device 18 Exhaust device 19 Connection table 20 Equipment table 21 Chemical substance table

Claims (1)

A substrate processing apparatus;
Incidental equipment related to the substrate processing apparatus;
A storage device for storing at least information on the incidental facilities;
A substrate processing system comprising: a display device that displays a connection relationship between the substrate processing apparatus and the incidental equipment based on information stored in the storage device.

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