JP2013074041A5 - - Google Patents

Download PDF

Info

Publication number
JP2013074041A5
JP2013074041A5 JP2011211062A JP2011211062A JP2013074041A5 JP 2013074041 A5 JP2013074041 A5 JP 2013074041A5 JP 2011211062 A JP2011211062 A JP 2011211062A JP 2011211062 A JP2011211062 A JP 2011211062A JP 2013074041 A5 JP2013074041 A5 JP 2013074041A5
Authority
JP
Japan
Prior art keywords
groove structure
printing
ink
recess
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011211062A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013074041A (ja
JP5838692B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011211062A priority Critical patent/JP5838692B2/ja
Priority claimed from JP2011211062A external-priority patent/JP5838692B2/ja
Publication of JP2013074041A publication Critical patent/JP2013074041A/ja
Publication of JP2013074041A5 publication Critical patent/JP2013074041A5/ja
Application granted granted Critical
Publication of JP5838692B2 publication Critical patent/JP5838692B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011211062A 2011-09-27 2011-09-27 Ｃｍｏｓ半導体装置の製造方法 Expired - Fee Related JP5838692B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011211062A JP5838692B2 (ja) 2011-09-27 2011-09-27 Ｃｍｏｓ半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011211062A JP5838692B2 (ja) 2011-09-27 2011-09-27 Ｃｍｏｓ半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2013074041A JP2013074041A (ja) 2013-04-22
JP2013074041A5 true JP2013074041A5 (pl) 2014-07-17
JP5838692B2 JP5838692B2 (ja) 2016-01-06

Family

ID=48478303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011211062A Expired - Fee Related JP5838692B2 (ja) 2011-09-27 2011-09-27 Ｃｍｏｓ半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP5838692B2 (pl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6334216B2 (ja) * 2014-03-14 2018-05-30 京セラ株式会社 半導体粒子ペースト
JP6530591B2 (ja) * 2014-07-25 2019-06-12 旭化成株式会社 フレキシブル回路デバイス及びそれを備える筋電位測定装置
JP6492523B2 (ja) * 2014-10-21 2019-04-03 凸版印刷株式会社 有機半導体薄膜トランジスタ素子
CN107104188A (zh) * 2017-04-20 2017-08-29 上海幂方电子科技有限公司 有机互补型非门器件的制备方法
KR20230061522A (ko) * 2020-09-07 2023-05-08 주식회사 다이셀 실장 구조체, led 디스플레이 및 실장 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7244626B2 (en) * 2004-06-30 2007-07-17 Motorola, Inc. Semiconductor devices shared element(s) apparatus and method
KR100634327B1 (ko) * 2005-04-13 2006-10-13 한국기계연구원 롤-투-롤 윤전인쇄방식을 이용한 전자소자의 제조방법 및그 제조장치
JP4729963B2 (ja) * 2005-04-15 2011-07-20 パナソニック株式会社 電子部品接続用突起電極とそれを用いた電子部品実装体およびそれらの製造方法
JP2008159812A (ja) * 2006-12-22 2008-07-10 Sharp Corp 半導体層形成装置および半導体層形成方法
JP2008166016A (ja) * 2006-12-27 2008-07-17 Toppan Printing Co Ltd 有機機能性素子の製造方法
JP2009130165A (ja) * 2007-11-26 2009-06-11 Sanyo Electric Co Ltd Ｃｍｏｓ半導体装置
JP2010212587A (ja) * 2009-03-12 2010-09-24 Ricoh Co Ltd 有機薄膜トランジスタ、有機薄膜トランジスタの製造方法、有機薄膜トランジスタアレイ及び表示装置
JP5587636B2 (ja) * 2010-03-01 2014-09-10 富士紡ホールディングス株式会社 研磨パッド
JP2011187750A (ja) * 2010-03-09 2011-09-22 Ricoh Co Ltd 有機薄膜トランジスタの製造方法、有機薄膜トランジスタレイの製造方法及び表示装置の製造方法

Similar Documents

Publication Publication Date Title
Hu et al. Functional inks and printing of two-dimensional materials
Gao et al. Inkjet printing wearable electronic devices
JP2013074041A5 (pl)
Buga et al. A review on materials and technologies for organic large‐area electronics
Ma et al. Seriography‐guided reduction of graphene oxide biopapers for wearable sensory electronics
MX2016005353A (es) Dispositivos microfluidicos digitales impresos, metodos de uso y fabricacion de los mismos.
WO2008105804A3 (en) Organic optoelectronic device electrodes with nanotubes
JP2012042947A5 (pl)
TWI688614B (zh) 墨水調配物
Ng et al. Patterning of graphene with tunable size and shape for microelectrode array devices
CN102169960A (zh) 一种柔性电子器件薄膜晶体管的制备方法
Song et al. Facile approach to fabricating stretchable organic transistors with laser-patterned Ag nanowire electrodes
WO2010082724A3 (ko) 표면처리된 잉크젯 프린트용 기판
Kim et al. Direct micro/nano metal patterning based on two-step transfer printing of ionic metal nano-ink
JP2010087533A5 (pl)
RU2015145537A (ru) Способ печати и печатное устройство
JP2010510091A5 (pl)
KR20140038141A (ko) 평탄화된 인쇄전자소자 및 그 제조 방법
BRPI0718766A2 (pt) Impressão flexográfica com cura durante a transferência para o substrato
Kim et al. Simple, fast, and scalable reverse-offset printing of micropatterned copper nanowire electrodes with sub-10 μm resolution
JP5838692B2 (ja) Ｃｍｏｓ半導体装置の製造方法
KR101364593B1 (ko) 그래핀 필름의 패터닝 방법
TW201410802A (zh) 反向印刷用導電性墨水及薄膜電晶體之製造方法、以及以該製造方法形成之薄膜電晶體
KR101573052B1 (ko) 나노 물질 패턴의 제조방법
JP2013091251A5 (pl)