JP2013070018A5 - - Google Patents

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Publication number
JP2013070018A5
JP2013070018A5 JP2012061826A JP2012061826A JP2013070018A5 JP 2013070018 A5 JP2013070018 A5 JP 2013070018A5 JP 2012061826 A JP2012061826 A JP 2012061826A JP 2012061826 A JP2012061826 A JP 2012061826A JP 2013070018 A5 JP2013070018 A5 JP 2013070018A5
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JP
Japan
Prior art keywords
bonding
temperature
start temperature
semiconductor element
semiconductor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012061826A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013070018A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012061826A priority Critical patent/JP2013070018A/ja
Priority claimed from JP2012061826A external-priority patent/JP2013070018A/ja
Priority to KR20147008956A priority patent/KR20140070584A/ko
Priority to PCT/JP2012/005668 priority patent/WO2013035337A1/ja
Priority to US14/239,479 priority patent/US20140217608A1/en
Priority to CN201280043286.0A priority patent/CN103782379A/zh
Priority to DE201211003759 priority patent/DE112012003759T5/de
Publication of JP2013070018A publication Critical patent/JP2013070018A/ja
Publication of JP2013070018A5 publication Critical patent/JP2013070018A5/ja
Withdrawn legal-status Critical Current

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JP2012061826A 2011-09-09 2012-03-19 半導体モジュール及びその製造方法 Withdrawn JP2013070018A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012061826A JP2013070018A (ja) 2011-09-09 2012-03-19 半導体モジュール及びその製造方法
KR20147008956A KR20140070584A (ko) 2011-09-09 2012-09-06 반도체 모듈, 회로기판
PCT/JP2012/005668 WO2013035337A1 (ja) 2011-09-09 2012-09-06 半導体モジュール、回路基板
US14/239,479 US20140217608A1 (en) 2011-09-09 2012-09-06 Semiconductor module, circuit board
CN201280043286.0A CN103782379A (zh) 2011-09-09 2012-09-06 半导体模块，电路基板
DE201211003759 DE112012003759T5 (de) 2011-09-09 2012-09-06 Halbleitermodul, Schaltungs-Substrat

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011197069 2011-09-09
JP2011197069 2011-09-09
JP2012061826A JP2013070018A (ja) 2011-09-09 2012-03-19 半導体モジュール及びその製造方法

Publications (2)

Publication Number Publication Date
JP2013070018A JP2013070018A (ja) 2013-04-18
JP2013070018A5 true JP2013070018A5 (enExample) 2015-03-05

Family

ID=48475309

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012061802A Pending JP2013070017A (ja) 2011-09-09 2012-03-19 半導体モジュール及びその製造方法
JP2012061826A Withdrawn JP2013070018A (ja) 2011-09-09 2012-03-19 半導体モジュール及びその製造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2012061802A Pending JP2013070017A (ja) 2011-09-09 2012-03-19 半導体モジュール及びその製造方法

Country Status (1)

Country Link
JP (2) JP2013070017A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111108594B (zh) * 2017-09-28 2024-03-19 京瓷株式会社 电子元件搭载用基板及电子装置
WO2024150303A1 (ja) * 2023-01-11 2024-07-18 三菱電機株式会社 パワーモジュール

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