JP2013065621A5 - - Google Patents

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Publication number
JP2013065621A5
JP2013065621A5 JP2011202126A JP2011202126A JP2013065621A5 JP 2013065621 A5 JP2013065621 A5 JP 2013065621A5 JP 2011202126 A JP2011202126 A JP 2011202126A JP 2011202126 A JP2011202126 A JP 2011202126A JP 2013065621 A5 JP2013065621 A5 JP 2013065621A5
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JP
Japan
Prior art keywords
plating layer
wiring pattern
layer
roughened
light emitting
Prior art date
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Application number
JP2011202126A
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English (en)
Japanese (ja)
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JP2013065621A (ja
JP5844101B2 (ja
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Priority to JP2011202126A priority Critical patent/JP5844101B2/ja
Priority claimed from JP2011202126A external-priority patent/JP5844101B2/ja
Publication of JP2013065621A publication Critical patent/JP2013065621A/ja
Publication of JP2013065621A5 publication Critical patent/JP2013065621A5/ja
Application granted granted Critical
Publication of JP5844101B2 publication Critical patent/JP5844101B2/ja
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JP2011202126A 2011-09-15 2011-09-15 発光装置用の配線基板、発光装置及び発光装置用配線基板の製造方法 Active JP5844101B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011202126A JP5844101B2 (ja) 2011-09-15 2011-09-15 発光装置用の配線基板、発光装置及び発光装置用配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011202126A JP5844101B2 (ja) 2011-09-15 2011-09-15 発光装置用の配線基板、発光装置及び発光装置用配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2013065621A JP2013065621A (ja) 2013-04-11
JP2013065621A5 true JP2013065621A5 (ko) 2014-09-11
JP5844101B2 JP5844101B2 (ja) 2016-01-13

Family

ID=48188892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011202126A Active JP5844101B2 (ja) 2011-09-15 2011-09-15 発光装置用の配線基板、発光装置及び発光装置用配線基板の製造方法

Country Status (1)

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JP (1) JP5844101B2 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6266907B2 (ja) * 2013-07-03 2018-01-24 新光電気工業株式会社 配線基板及び配線基板の製造方法
KR102148845B1 (ko) * 2013-12-12 2020-08-27 엘지이노텍 주식회사 인쇄회로기판
KR20150074421A (ko) * 2013-12-24 2015-07-02 엘지이노텍 주식회사 인쇄회로기판 및 이를 포함하는 발광 장치
JP6316731B2 (ja) 2014-01-14 2018-04-25 新光電気工業株式会社 配線基板及びその製造方法、並びに半導体パッケージ
US9799812B2 (en) 2014-05-09 2017-10-24 Kyocera Corporation Light emitting element mounting substrate and light emitting device
JP2016051797A (ja) * 2014-08-29 2016-04-11 大日本印刷株式会社 積層体、積層体を用いた配線基板の製造方法、配線基板、および配線基板を備える実装基板の製造方法
JP6555907B2 (ja) * 2015-03-16 2019-08-07 アルパッド株式会社 半導体発光装置
EP3400762A4 (en) * 2016-01-08 2019-08-14 Lilotree, L.L.C. PCB SURFACE COATING, METHOD OF USE AND ARRANGEMENTS OBTAINED THEREFROM
JP6924642B2 (ja) * 2017-07-19 2021-08-25 スタンレー電気株式会社 半導体発光素子アレイ、及び、半導体発光装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5559795A (en) * 1978-10-30 1980-05-06 Nippon Electric Co Printed circuit board and method of manufacturing same
SG102588A1 (en) * 2000-08-03 2004-03-26 Inst Materials Research & Eng A process for modifying chip assembly substrates
JP2004055624A (ja) * 2002-07-16 2004-02-19 Murata Mfg Co Ltd 基板の製造方法
JP4674120B2 (ja) * 2005-06-06 2011-04-20 京セラＳｌｃテクノロジー株式会社 配線基板およびその製造方法
JP2010182865A (ja) * 2009-02-05 2010-08-19 Nitto Denko Corp 配線回路基板の製造方法
TWI501432B (zh) * 2009-07-17 2015-09-21 Denki Kagaku Kogyo Kk Ｌｅｄ晶片接合體、ｌｅｄ封裝、及ｌｅｄ封裝之製造方法

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