JP2013056461A5 - - Google Patents

Download PDF

Info

Publication number
JP2013056461A5
JP2013056461A5 JP2011195721A JP2011195721A JP2013056461A5 JP 2013056461 A5 JP2013056461 A5 JP 2013056461A5 JP 2011195721 A JP2011195721 A JP 2011195721A JP 2011195721 A JP2011195721 A JP 2011195721A JP 2013056461 A5 JP2013056461 A5 JP 2013056461A5
Authority
JP
Japan
Prior art keywords
driven
linear motor
gap
mold
predetermined value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011195721A
Other languages
English (en)
Japanese (ja)
Other versions
JP5774420B2 (ja
JP2013056461A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011195721A priority Critical patent/JP5774420B2/ja
Priority claimed from JP2011195721A external-priority patent/JP5774420B2/ja
Priority to TW101129528A priority patent/TWI558534B/zh
Priority to KR1020120097977A priority patent/KR101395415B1/ko
Priority to CN201210326492.4A priority patent/CN102990883B/zh
Publication of JP2013056461A publication Critical patent/JP2013056461A/ja
Publication of JP2013056461A5 publication Critical patent/JP2013056461A5/ja
Application granted granted Critical
Publication of JP5774420B2 publication Critical patent/JP5774420B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011195721A 2011-09-08 2011-09-08 射出成形機 Expired - Fee Related JP5774420B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011195721A JP5774420B2 (ja) 2011-09-08 2011-09-08 射出成形機
TW101129528A TWI558534B (zh) 2011-09-08 2012-08-15 Injection molding machine
KR1020120097977A KR101395415B1 (ko) 2011-09-08 2012-09-05 사출성형기
CN201210326492.4A CN102990883B (zh) 2011-09-08 2012-09-05 注射成型机

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011195721A JP5774420B2 (ja) 2011-09-08 2011-09-08 射出成形機

Publications (3)

Publication Number Publication Date
JP2013056461A JP2013056461A (ja) 2013-03-28
JP2013056461A5 true JP2013056461A5 (enExample) 2013-12-05
JP5774420B2 JP5774420B2 (ja) 2015-09-09

Family

ID=47920248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011195721A Expired - Fee Related JP5774420B2 (ja) 2011-09-08 2011-09-08 射出成形機

Country Status (4)

Country Link
JP (1) JP5774420B2 (enExample)
KR (1) KR101395415B1 (enExample)
CN (1) CN102990883B (enExample)
TW (1) TWI558534B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6144212B2 (ja) * 2014-01-17 2017-06-07 住友重機械工業株式会社 射出成形機および射出成形方法
JP6552933B2 (ja) * 2015-09-29 2019-07-31 住友重機械工業株式会社 射出成形機
JP6505580B2 (ja) * 2015-11-10 2019-04-24 住友重機械工業株式会社 射出成形機
US11426901B2 (en) * 2018-04-18 2022-08-30 Kosmek Ltd. Magnetic clamp device
CN116175904B (zh) * 2023-02-07 2024-07-23 东莞市百硕精密模具有限公司 一种汽车塑件的成型模具
CN117261084B (zh) * 2023-10-09 2024-06-25 连云港同欣泡塑新材料有限公司 一种能够快速换模的泡塑塑料发泡机

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW205018B (enExample) * 1990-11-30 1993-05-01 Toshiba Machine Co Ltd
US5322430A (en) * 1992-01-30 1994-06-21 Toshiba Kikai Kabushiki Kaisha Mold clamping device in injection molding machine
JPH0663954A (ja) * 1992-08-24 1994-03-08 Mitsubishi Heavy Ind Ltd 型開閉機構
JP3469068B2 (ja) * 1997-11-18 2003-11-25 住友重機械工業株式会社 型締装置
JP4021815B2 (ja) * 2003-07-10 2007-12-12 住友重機械工業株式会社 型締装置
US20070158875A1 (en) * 2004-03-19 2007-07-12 Sumitomo Heavy Industries, Ltd. Mold-clamping apparatus and method of adjusting mold thickness
US20070264382A1 (en) * 2004-09-27 2007-11-15 Sumitomo Heavy Industries, Ltd. Mold-Clamping Apparatus
JP4828179B2 (ja) * 2005-08-25 2011-11-30 東芝機械株式会社 型締装置
KR100768329B1 (ko) * 2006-07-10 2007-10-18 한국기계연구원 미세 표면 구조물 성형 금형
JP4949479B2 (ja) * 2007-09-28 2012-06-06 住友重機械工業株式会社 型締装置及び型締制御方法
JP5465586B2 (ja) * 2009-04-22 2014-04-09 住友重機械工業株式会社 型締装置

Similar Documents

Publication Publication Date Title
JP2013056461A5 (enExample)
JP2017502228A5 (enExample)
EP2730398A3 (en) Apparatus for molding core of vacuum insulation panel and vacuum insulation panel manufactured thereby
MX2016006940A (es) Placa de acero en blanco, metodo de produccion y dispositivo de produccion de la misma y metodo de produccion de un producto formado por prensado usando una placa de acero en blanco.
ATE495001T1 (de) Formsystemklemme
MX2013003043A (es) Sistema para sujetar las apofisis espinosas, y usos del mismo.
JP2011100997A5 (ja) 半導体装置
WO2009154696A3 (en) Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal lines
WO2011031431A3 (en) Semiconductor devices with field plates
JP2011216780A5 (enExample)
BR112014009871A2 (pt) ataque químico seletivo de uma matriz compreendendo nanofios de prata
JP2010114441A5 (enExample)
AR098040A1 (es) Placa de yeso, método para fabricarla y montaje en una pared
WO2014074554A3 (en) Stacked actuator apparatus, system, and method
JP2015528408A5 (enExample)
EP2172357A3 (de) Vorrichtung zur Steuerung des Luftdurchsatzes eines Lufteinlasses
CL2007003882A1 (es) Un metodo para desmoldado de laminas metalicas electrodepositadas de una placa de catodo con metal depositado en las superficies; un dispositivo de flexion utilizado para el desmoldado de laminas metalicas.
WO2013097981A3 (de) Vorrichtung zum halten einer maschinenkomponente in einer elektrischen maschine sowie elektrische maschine
JP2010152182A5 (enExample)
WO2014122151A3 (en) Lithographic apparatus
JP2013072435A5 (enExample)
JP2011228680A5 (ja) Ｓｏｉ基板の作製方法、および半導体基板の作製方法
ES2490390A1 (es) Método de fabricación de una tuerca por embutición progresiva de un fleje laminar metálico y tuerca resultante
WO2015034366A3 (en) A method for manufacturing a ceramic roof tile provided with a solar panel
AR087056A1 (es) Dispositivo adaptador para compresor lineal y compresor provisto de dicho dispositivo