JP2013047129A - Workpiece holding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a workpiece holding device capable of easily transferring a workpiece for a device performing measurement or processing.SOLUTION: This workpiece holding device 1 pinching and holding both end surfaces of a cylindrical workpiece W includes a pair of chuck parts 5, 5 pinching both end surfaces of the workpiece W. A U-shaped part 18 is formed for each of the pair of chuck parts 5, 5 so that not the inner surfaces of the end surfaces of the workpiece W but only the outer surfaces located outside the inner surfaces can be pinched. Accordingly, the U-shaped parts 18 of the pair of chuck parts 5, 5 can pinch the outer surfaces of the end surfaces of the workpiece W. When the workpiece W is transferred from the workpiece holding device 1 to the workpiece measuring device 19, not the outer surfaces of the end surfaces of the workpiece W but the inner surfaces are pinched by workpiece clamp shafts 21, 21 of the workpiece measuring device 19, and the workpiece W is thereby easily transferred from the workpiece holding device 1 to the workpiece measuring device 19.

Description

  The present invention relates to a workpiece holding device that holds a workpiece such as sapphire that is employed in an LED or the like, and more particularly, to a workpiece holding device that is suitable for transferring a workpiece to or from a device that performs measurement or processing.

  In the manufacture of sapphire substrates for LED light emitting devices, which have been rapidly widespread in recent years, in order to obtain a sapphire substrate, it is indispensable to cut sapphire into a required shape and measure the crystal orientation of sapphire. Technology to ensure that workpieces such as sapphire are transferred (delivered) to the measuring and processing equipment so that sapphire, which is a hard and brittle material, is expensive and will not be damaged. Is desired.

  By the way, when measuring the crystal orientation of cylindrical sapphire with a measuring device, sapphire is manually carried into a chucking mechanism provided in the measuring device, and both end faces of sapphire are sandwiched by the chucking mechanism, Measurement will be performed by rotating the sapphire in that state, but conventionally when the sapphire is carried into the measuring device, the diameter size of the sapphire being measured is about 2 to 3 inches. Since it was relatively small, there was a situation that sapphire was carried in and positioning was adjusted manually without inconvenience. And as a thing relevant to such a technique, the patent document 1 is disclosing the technique which hold | maintains the said workpiece | work by clamping the both end surfaces of a column-shaped workpiece | work, for example.

JP 2002-103218 A

  When the diameter size of a workpiece such as sapphire that is the object to be held is relatively small, such as 2 inches to 3 inches as in the past, the workpiece to be held may be relatively light, and the workpiece is held. The sapphire, which is a workpiece used for LEDs, has recently been about 6 to 8 inches in diameter. Larger sizes, such as larger sizes, are increasingly being adopted, and workpieces that become heavier with the increase in size are brought into measuring and processing equipment by human work. There was a fact that it has become difficult.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a workpiece holding device that can easily transfer workpieces to a device that performs measurement, processing, and the like.

The invention of the work holding device according to claim 1 comprises:
A work holding device for holding and holding both end faces of a cylindrical work,
A pair of chuck portions for sandwiching both end faces of the workpiece;
The chuck portion is formed with a U-shaped portion so that only the outer surface located outside the inner side surface, not the inner side surface located on the center side of the end surface of the workpiece, can be clamped.

The invention of the work holding device according to claim 2 is the invention according to claim 1,
One of the pair of chuck portions is provided so as to be slidable toward the other chuck portion.

The invention of the work holding device according to claim 3 is the invention according to claim 1 or 2,
The workpiece is sapphire that is subjected to measurement and processing of crystal orientation in a manufacturing stage of a sapphire substrate for an LED light emitting device.

  According to the present invention, not both the circumferential surface of a workpiece such as a cylindrical sapphire, but both flat end surfaces at both ends of the workpiece can be clamped by the chuck portion, so that the workpiece is relatively heavy. Can be securely held so as not to fall off. Therefore, for example, when the circumferential surface is chucked and held at two points instead of the both end faces of the workpiece, the holding is unstable and lacks stability because it is circular, but the cylindrical workpieces are parallel to each other. By clamping the end surfaces of the workpieces having a relationship, the workpiece can be stably held. Furthermore, since the outer surface located outside rather than the inner surface located on the center side of the end surface of the workpiece can be clamped by the U-shaped portion, the workpiece holding device is used for processing and measuring a workpiece such as sapphire. When transferring a workpiece to a device that performs measurement or processing from the workpiece, it is possible to deliver the workpiece by clamping the inner side surface located on the center side of the workpiece end surface with the workpiece clamp shaft provided in such a device. Become. Therefore, the delivery of the workpiece can be performed mechanically (automatically) rather than manually.

  Also, when measuring and machining a workpiece, it is common to perform machining and measurement while rotating the workpiece with the center part of both end faces of the workpiece sandwiched. Since the chuck portion of the workpiece holding device of the present invention is configured not to clamp the inner side surface located on the center side of the end surface of the workpiece, the workpiece measuring device serving as a workpiece delivery destination and the workpiece machining device Then, the center side of the end surface of the workpiece can be immediately clamped, and the center side can be clamped and measurement and machining operations can be started quickly.

It is a top view which shows the state which is delivering the workpiece | work from the workpiece holding apparatus in this embodiment to the workpiece measuring apparatus, More specifically, in the state which clamped the workpiece | work with the workpiece clamp axis | shaft of the workpiece measuring apparatus. The state where the chuck part is retracted is shown. It is a side view which shows the state which is measuring with a contact-type displacement sensor, rotating the workpiece | work pinched | interposed by the workpiece clamp axis | shaft delivered from the workpiece holding apparatus to the workpiece | work measuring apparatus same as the above. It is a side view which shows the state which clamped both the end surfaces of the workpiece | work with a pair of chuck | zipper part of a workpiece holding apparatus. It is a side view which shows the state which clamped both the end surfaces of the workpiece | work with both a pair of chuck | zipper part of a workpiece | work holding | maintenance apparatus, and a pair of workpiece | work clamp axis | shaft of a workpiece | work measuring apparatus. When measuring the displacement of the workpiece and correcting the displacement of the workpiece based on the measurement result, the workpiece is transferred from the workpiece holding device to the workpiece measuring device, and the workpiece is transferred from the workpiece measuring device to the workpiece holding device. It is explanatory drawing which shows the operation | movement at the time of carrying out (delivery). When measuring the displacement of the workpiece and correcting the displacement of the workpiece based on the measurement result, the workpiece is transferred from the workpiece holding device to the workpiece measuring device, and the workpiece is transferred from the workpiece measuring device to the workpiece holding device. It is explanatory drawing which shows the operation | movement at the time of carrying out (delivery).

  The form for implementing this invention is demonstrated below. Of course, it goes without saying that the present invention can be easily applied to configurations other than those described in the embodiments without departing from the spirit of the invention.

  The workpiece holding device 1 of the present embodiment holds a workpiece W such as hard brittle materials such as sapphire, silicon, SIC, glass, rare earth magnets, and ceramic materials so as not to fall. Sapphire used as a sapphire substrate for LED light-emitting elements, and the workpiece W, which is the sapphire, has a cylindrical shape, a longitudinal length of 350 mm (or 350 mm or less), and a diameter of 4 inches to About 8 inches, it is a relatively large size compared to the conventional product.

  As shown in FIG. 1, the work holding device 1 includes a machine base 2 placed on a desk, a floor, or the like, and a rail 3 mounted on the machine base 2 has a longitudinal direction of the rail. A transport device 4 is provided so as to be movable back and forth (in the left-right direction shown in FIG. 1).

  The transport device 4 is provided with a pair of chuck portions 5 and 5 that face each other. The pair of chuck portions 5 and 5 are mounted on the guide bar 6 so as to face each other in the horizontal direction, and each of the chuck portions 5 and 5 is slidably provided toward the other chuck portion 5 facing each other. When both ends of the workpiece W are held by the pair of chuck portions 5 and 5, the chuck portions 5 and 5 are advanced toward the workpiece W while the workpiece W is disposed between the chuck portions 5 and 5. W is pinched. The chuck portions 5 and 5 are driven by a drive transmission mechanism including a pulley 11 and a drive transmission belt 12 using the electric motor 10 as a drive source. Driving is performed using a motor (not shown) as a drive source.

  As shown in FIGS. 2 to 4, the tip side of each of the chuck portions 5, 5 is an upper plate portion 15, a lower plate portion 16, and an arc provided between the upper plate portion 15 and the lower plate portion 16. The upper plate portion 15 and the lower plate portion 16 which have a portion 17 and are provided in parallel are integrally connected by a circular arc portion 17 to be formed in a U shape, and an inner side of the U shape portion 18 will be described later. The ends of cylindrical workpiece clamp shafts 21 and 21 configured in the workpiece measuring device 20 are inserted, and the workpiece clamp shafts 21 and 21 are larger than the diameter X of the opening 22 at the tips of the chuck portions 5 and 5. The work clamp shafts 21, 21 can be arranged in the U-shaped portion 18 through the opening 22.

  As shown in FIG. 1, the two (a pair of) work clamp shafts 21 and 21 configured in the work measuring device 19 are rotatably provided so that their axes are on the same axis. Although not shown, the work clamp shafts 21 and 21 are driven forward and backward in the same manner as the forward and backward directions of the chuck portions 5 and 5 using a motor as a drive source. Then, both end surfaces of the cylindrical workpiece W disposed between the pair of workpiece clamp shafts 21 and 21 can be clamped by the tip surfaces of the workpiece clamp shafts 21 and 21, and the clamped workpiece W is the workpiece clamp shaft. The workpiece clamp shafts 21 and 21 are rotated by being driven by a motor (not shown) as a drive source while being held by the rollers 21 and 21.

  In addition, the workpiece measuring device 19 includes a contact-type displacement sensor 25 whose one end is in contact with the circumferential surface of the workpiece W held by the workpiece clamp shafts 21 and 21, and rotates the workpiece clamp shafts 21 and 21. Then, by rotating the workpiece W held by the workpiece clamp shafts 21 and 21 by 360 degrees or the like, the contact-type displacement sensor 25 causes the shaft center (center) of the workpiece clamp shafts 21 and 21 ( Center) deviation can be measured.

  Here, after the workpiece W is carried (delivered) from the workpiece holding device 1 to the workpiece measuring device 19 and the displacement of the position of the workpiece W is measured by the workpiece measuring device 19, the workpiece W is transferred from the workpiece measuring device 19 to the workpiece holding device 1. 5 (a) to (i) in FIG. 5 and FIG. 6 for the operation when the workpiece holding device 1 corrects the positional deviation of the workpiece W based on the measurement result measured by the workpiece measuring device 19. ). First, the chuck portions 5 and 5 of the workpiece holding device 1 hold and hold the outer portions of both end faces of the workpiece W (the state shown in FIGS. 5A and 3), and then the workpiece holding device 1 is conveyed. The apparatus 4 is moved forward to transfer the workpiece W held by the chuck portions 5 and 5 to the vicinity of the workpiece measuring device 19 installed in the traveling direction ((b) of FIG. 5).

  Next, the work clamp shafts 21 and 21 of the work measuring device 19 sandwich and hold the inner portions of both end faces of the work W ((c) in FIG. 5). In this state, the workpiece W is sandwiched and held by both the chuck portions 5 and 5 of the workpiece holding device 1 and the workpiece clamp shafts 21 and 21 of the workpiece measuring device 19 (FIG. 5C and FIG. 4). State).

  Next, the chuck parts 5 and 5 of the work holding device 1 are opened and retracted to release the holding of the work W by the chuck parts 5 and 5 of the work holding device 1, whereby the work measuring device 19 is moved from the work holding device 1. The workpiece is transferred (delivered) ((d) in FIG. 5).

  Subsequently, the displacement sensor head 25a at the tip of the contact-type displacement sensor 25 configured in the workpiece measuring device 19 is brought into contact with the outer circumferential surface (circumferential surface) of the workpiece W ((e) in FIG. 5). The work clamp shafts 21 and 21 are rotated 360 degrees, and the displacement of the axis of the work W with respect to the axis of the work clamp shafts 21 and 21 is measured by the contact displacement sensor 25.

  Next, the contact-type displacement sensor 25 is moved backward to displace the displacement sensor head 25a from the workpiece W ((f) in FIG. 6), and the position where the deviation is the largest among the deviations is the workpiece holding device 1 side. The workpiece W is rotated so as to become ((g) of FIG. 6).

  Next, the workpiece W clamped by the workpiece clamp shafts 21 and 21 is also clamped by the chuck portions 5 and 5 ((h) in FIG. 6), and then the workpiece clamp shafts 21 and 21 are retracted and the workpiece clamp shaft 21 is moved backward. , 21 is released ((i) in FIG. 6). Then, based on the result of measurement by the workpiece measuring device 19 (the shift of the axis of the workpiece W with respect to the axis of the workpiece clamp shafts 21 and 21), the position of the axis of the workpiece W is the position of the axis of the workpiece clamp shafts 21 and 21. Since the conveying device 4 is moved in the horizontal direction so as to approach the position and the displacement is corrected, thereby making it possible to place the workpiece W at a predetermined position, as a result, processing means (cutting, polishing, grinding) It is possible to efficiently process the workpiece W by a processing apparatus that performs the above.

  As described above, according to the workpiece holding device 1 of the present embodiment, each of the pair of chuck portions 5 and 5 is positioned outside the inner side surface instead of the inner side surface located on the center side of the end surface of the workpiece W. A U-shaped portion 18 is formed so that only the outer surface can be clamped, and one chuck portion 5 of the pair of chuck portions 5 and 5 is provided so as to be slidable toward at least the other chuck portion 5. It is. Thereby, not the circumferential surface of the workpiece W such as a cylindrical sapphire, but both flat end surfaces at both ends of the workpiece W can be sandwiched between the chuck portions 5 and 5, so that the workpiece W which is relatively heavy. Even so, it can be reliably held so as not to drop off. Therefore, for example, when the circumferential surface of the cylindrical workpiece W is chucked and held at two points instead of the both end surfaces of the workpiece, the holding is unstable due to the circular shape and lacks stability. However, the work W can be stably held by sandwiching the end faces of the work W having a parallel relationship with each other with the U-shaped chuck portions 5 and 5 of the work holding device 1. Furthermore, since the outer surface located outside rather than the inner surface located on the center side of the end surface of the workpiece W can be clamped by the U-shaped portion 18, in order to process and measure the workpiece W such as sapphire, When the workpiece W is delivered from the workpiece holding device 1 to a measurement or processing device for measuring the workpiece W, the workpiece clamping shafts 19 and 19 provided in the device are positioned on the center side of the end surface of the workpiece W. The workpiece W can be delivered by sandwiching the inner side surface. Therefore, it is possible to deliver the workpiece mechanically (automatically) rather than manually.

  Furthermore, when measuring or processing the workpiece W, the measurement or processing may be performed while rotating the workpiece W in a state where the center portion inside rather than the outer surface of both ends of the workpiece is sandwiched. Although it is generally large, the chuck portions 5 and 5 of the workpiece holding device 1 of the present embodiment are configured so as not to sandwich the inner surface located on the center side of the end surface of the workpiece W. In the workpiece measuring device 19 that is the delivery destination of the workpiece W and the machining device that processes the workpiece W, the center side of the end face of the workpiece W can be clamped immediately, and measurement and machining operations can be quickly performed by clamping the center side. Can start.

  As mentioned above, although an example of the present invention has been described as an example, the present invention is not limited to the above example, and various modifications can be made. For example, in the present embodiment, the pair of chuck portions 5 and 5 are provided so as to be slidable with respect to the workpiece W disposed therebetween, but any one can be used as long as the workpiece W can be clamped. Only one chuck portion 5 may be slidably provided. In that case, the structure of the slide mechanism can be simplified, and the cost can be reduced. Further, although a processing apparatus that processes the workpiece W is not shown, it may be configured in the workpiece holding apparatus 1 or the workpiece measuring apparatus 19 or may be provided separately from these apparatuses.

DESCRIPTION OF SYMBOLS 1 Work holding device 2 Machine stand 3 Rail 4 Conveying device 5 Chuck part 6 Guide bar 10 Electric motor 11 Pulley 12 Drive transmission belt 15 Upper plate part 16 Lower plate part 17 Arc part 18 U-shaped part 19 Work measuring device 21 Work clamp Shaft 22 Opening 25 Contact displacement sensor 25a Displacement sensor head W Workpiece (Sapphire)
X diameter

Claims (3)

A work holding device for holding and holding both end faces of a cylindrical work,
A pair of chuck portions for sandwiching both end faces of the workpiece;
A workpiece holding device, wherein a U-shaped portion is formed in the chuck portion so that only an outer surface located outside the inner side surface, not an inner side surface located on the center side of the end surface of the workpiece, can be clamped.   The workpiece holding apparatus according to claim 1, wherein any one of the pair of chuck portions is slidable toward the other chuck portion.   The work holding apparatus according to claim 1, wherein the work is sapphire whose crystal orientation is measured and processed in a manufacturing stage of a sapphire substrate for an LED light emitting element.

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