JP2013045893A5 - - Google Patents

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Publication number
JP2013045893A5
JP2013045893A5 JP2011182711A JP2011182711A JP2013045893A5 JP 2013045893 A5 JP2013045893 A5 JP 2013045893A5 JP 2011182711 A JP2011182711 A JP 2011182711A JP 2011182711 A JP2011182711 A JP 2011182711A JP 2013045893 A5 JP2013045893 A5 JP 2013045893A5
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JP
Japan
Prior art keywords
hole
electronic device
coating layer
cavity
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011182711A
Other languages
English (en)
Japanese (ja)
Other versions
JP5773153B2 (ja
JP2013045893A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011182711A priority Critical patent/JP5773153B2/ja
Priority claimed from JP2011182711A external-priority patent/JP5773153B2/ja
Publication of JP2013045893A publication Critical patent/JP2013045893A/ja
Publication of JP2013045893A5 publication Critical patent/JP2013045893A5/ja
Application granted granted Critical
Publication of JP5773153B2 publication Critical patent/JP5773153B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011182711A 2011-08-24 2011-08-24 電子装置およびその製造方法、並びに発振器 Expired - Fee Related JP5773153B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011182711A JP5773153B2 (ja) 2011-08-24 2011-08-24 電子装置およびその製造方法、並びに発振器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011182711A JP5773153B2 (ja) 2011-08-24 2011-08-24 電子装置およびその製造方法、並びに発振器

Publications (3)

Publication Number Publication Date
JP2013045893A JP2013045893A (ja) 2013-03-04
JP2013045893A5 true JP2013045893A5 (enExample) 2014-08-21
JP5773153B2 JP5773153B2 (ja) 2015-09-02

Family

ID=48009565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011182711A Expired - Fee Related JP5773153B2 (ja) 2011-08-24 2011-08-24 電子装置およびその製造方法、並びに発振器

Country Status (1)

Country Link
JP (1) JP5773153B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106687407B (zh) * 2014-06-16 2019-06-18 埃普科斯股份有限公司 微电子封装和制造微电子封装的方法
JP2016138778A (ja) 2015-01-27 2016-08-04 セイコーエプソン株式会社 電子デバイス、圧力センサー、高度計、電子機器および移動体
US10662055B2 (en) 2017-04-27 2020-05-26 Seiko Epson Corporation MEMS element, sealing structure, electronic device, electronic apparatus, and vehicle

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4808971B2 (ja) * 2005-01-13 2011-11-02 日本電信電話株式会社 微細構造体の製造方法
JP5207547B2 (ja) * 2009-04-06 2013-06-12 太陽誘電株式会社 電子デバイスおよびその製造方法

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