JP2013038283A - Electronic component attachment device and electronic component attachment method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component attachment device in which model change of the other substrate conveyance line is possible even during the attachment operation of electronic component on one substrate conveyance line in a dual line electronic component attachment device.SOLUTION: When the model of a substrate produced on any one of two substrate conveyance lines is changed, a CPU reads the pattern program data and the related component library data of a substrate being produced while changing the model from an external memory, rewrites the model data of a substrate conveyance line changing the model in a volatile memory, and does not rewrite the data under use by the other of two substrate conveyance lines when rewriting the data for operation based on the model data thus rewritten.

Description

  The present invention relates to an electronic component mounting apparatus of a dual transport line for mounting electronic components on a printed circuit board and an electronic component mounting method thereof.

Conventionally, from the viewpoint of productivity, two board transfer lines (dual transfer lines) are provided in parallel, and each of lane U (board transfer line U) and lane D (board transfer line D) transfers a printed board, The electronic component mounting apparatus of the dual conveyance line which mounts an electronic component on one board | substrate was used. In the following description, the printed circuit board is simply referred to as a substrate.
FIG. 13 is a diagram for explaining a dual transport line in a conventional electronic component mounting apparatus. Each of the two substrates PU and PD is transported by being sandwiched between rails provided in parallel called a pair of chutes. Components such as electronic components (hereinafter simply referred to as electronic components) are accommodated in the component supply areas A1 and A2.
In FIG. 13, the substrate PU is transported to the component mounting area by the fixed chute 13U and the movable chute 131 provided in parallel. FIG. 13 shows a state in which the board PU and the board PD are transferred to the respective component mounting areas. In the component mounting area, the board PU is mounted with electronic components. That is, the mounting head H1 sucks an electronic component from the component supply area A1 or A2, moves to the mounting position of the substrate PU in the component mounting area, and mounts the electronic component.
Similarly, the substrate PD is conveyed to the component mounting area by the fixed chute 13D and the movable chute 132 provided in parallel. In the component mounting area, the substrate PD is mounted with electronic components. That is, the mounting head H2 sucks an electronic component from the component supply area A1 or A2, moves to the mounting position of the substrate PD in the component mounting area, and mounts the electronic component.
In order to change the model, it is necessary to change the width of the lanes provided in parallel according to the size of the board to be changed.
Further, in order to stably mount the electronic component on the substrate, the substrate is supported from below by a number of backup pins. Similarly, it is necessary to replace the suction nozzle for mounting the electronic component in accordance with the substrate to be changed.
Furthermore, it is necessary to rewrite data related to the number of boards to be produced after changing the model and work equipment data (substrate suction nozzle data, lane width data related to transport, and backup pin arrangement coordinate data).

An example described in Patent Document 1 is known as an electronic component mounting technique for such a dual transport line.
Patent Document 1 discloses an electronic component mounting apparatus having a dual transport line in which two substrate transport lines are provided in parallel.
Patent Document 1 discloses an electronic component mounting apparatus that constitutes two board transfer lines with four chutes, which has a fixed chute that does not move and constitutes one end of the four chutes, By setting another substrate transport line that does not have a fixed chute composed of two movable chutes out of them to a position close to a component supply area that supplies electronic components to a substrate transported to the transport line, This is intended to improve productivity.

  Further, Patent Document 2 describes an operation that involves switching the substrate model when an operator presses a touch panel switch. That is, when the type of the board to be produced and the program name are selected by the worker, the CPU (Central Processing Unit) of the electronic component mounting apparatus reads the pattern program data of the new board model, and the model is switched. .

JP 2010-10436 A JP 2007-67050 A

In general, when a substrate is in production operation, first, work management is performed in a state where the electronic component mounting apparatus is stopped (a state where the substrate is not required upstream and mounting of the electronic component is stopped). The person selects the production model of the board to be produced from the model names of the plurality of boards displayed on the monitor. As a result, the model switching operation is performed, so that the model name is stored in the storage device, and the operation start switch is operated, based on the internal data (pattern program data, parts library data, etc.) related to the board of the selected production model. Thus, the substrate production operation is started.
In addition, in the electronic component mounting apparatus of the dual transport line described in Patent Document 1 and Patent Document 2 described above, the model of the other substrate transport line is changed while one of the two substrate transport lines is in operation. There is no description about the technology.
An object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting apparatus capable of changing the model of the other board transfer line even when one board transfer line is in the process of mounting an electronic component. It is to provide a method.

  In order to solve the above problems, an electronic component mounting apparatus according to the present invention includes two substrate transfer lines provided in parallel on the front side and the back side, and further provided on the front side and further on the back side of the two substrate transfer lines. Component supply area, a plurality of mounting heads for adsorbing electronic components from the component supply area and mounting electronic components on printed circuit boards on the two substrate transfer lines, and the two substrate transfer lines, the component supply area In the electronic component mounting apparatus having the control device for controlling the mounting head, the control device is provided in a nonvolatile memory for storing a program related to control of the electronic component mounting apparatus and each of the substrates on the two substrate transfer lines. A volatile memory for storing operation data for mounting electronic components and model data for each of the two board transfer lines; and CP And when the CPU changes the model of the board produced on one of the two board conveyance lines, the pattern program data of the board produced by changing the model from the external memory and the related component library When reading data, rewriting the model data of the substrate transfer line for changing the model in the volatile memory, and rewriting the operation data based on the rewritten model data, the other substrate transfer of the two substrate transfer lines The first feature is that the line does not rewrite data in use.

  In the electronic component mounting apparatus according to the first feature of the present invention, the second feature is that the volatile memory is a RAM.

  In the electronic component mounting apparatus according to the first feature of the present invention, a third feature is that the nonvolatile memory is a ROM.

  In the electronic component mounting apparatus according to the first aspect of the present invention, the CPU is based on the rewritten model data when changing the model of a board produced on one of the two board transfer lines. When rewriting the operation data, it is fourth not to rewrite data related to the operations of both of the two substrate transfer lines among the data being used by the other substrate transfer line of the two substrate transfer lines. It is characterized by.

  In the electronic component mounting apparatus according to the first aspect of the present invention, the plurality of mounting heads simultaneously apply electronic components to a substrate on one of the two substrate transfer lines under the control of the control device. The fifth feature is that it is attached.

  The electronic component mounting method of the present invention includes two substrate transfer lines provided in parallel on the front side and the back side, component supply areas provided further on the front side and further on the back side of the two substrate transfer lines, and the component A plurality of mounting heads for picking up electronic components from the supply area and mounting electronic components on each of the printed circuit boards on the two substrate transfer lines, and control for controlling the two substrate transfer lines, the component supply area, and the mounting head In the electronic component mounting method of an electronic component mounting apparatus having an apparatus, a pattern program for a substrate produced by changing the model from an external memory when changing the model of a substrate produced on one of the two substrate conveyance lines Read the data and related parts library data, and change the model of the board transfer line to change the model in the volatile memory. A sixth feature is that when the operation data is rewritten based on the rewritten model data, the other substrate transport line of the two substrate transport lines does not rewrite data in use. .

  In the electronic component mounting method of the present invention, when rewriting the operation data based on the rewritten model data, when changing the model of the board to be produced on any one of the two board transfer lines, A seventh feature is that data relating to operations of both of the two substrate transfer lines is not rewritten out of data in use by the other substrate transfer line of the two substrate transfer lines.

  According to the present invention, in the electronic component mounting apparatus of the dual transport line, the electronic component mounting apparatus and the electronic component mounting capable of changing the model of the other lane while one lane (board transport line) is mounting the electronic component. The method can be realized.

1 is a schematic plan view of an embodiment of an electronic component mounting apparatus for a dual transport line according to the present invention. It is a block diagram which shows the structure of the control apparatus of one Example of the electronic component mounting apparatus of the dual conveyance line of this invention. It is a figure which shows board | substrate information data. It is a figure which shows mounting data. It is a figure which shows board | substrate information data. It is a figure which shows adsorption nozzle arrangement | positioning data. It is a figure which shows parts library data. It is a figure for demonstrating the dual conveyance line in FIG. It is a figure for demonstrating the change of the data for operation | movement at the time of the model change in the electronic mounting apparatus of the conventional dual conveyance line. It is a figure for demonstrating in detail about the data for operation | movement of the electronic component mounting apparatus of a dual conveyance line. It is a figure for demonstrating the change of the operation data at the time of the model change in one Example of the electronic mounting apparatus of the dual conveyance line of this invention. It is a flowchart for demonstrating the process at the time of rewriting the data for operation | movement of one Example of the electronic component mounting apparatus of the dual conveyance line of this invention. It is a figure for demonstrating the dual conveyance line in the conventional electronic component mounting apparatus.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
The embodiments described below are for explanation, and do not limit the scope of the present invention. Accordingly, those skilled in the art can employ embodiments in which these elements or all of the elements are replaced with equivalent ones, and these embodiments are also included in the scope of the present invention.
In addition, in the following description of each drawing including FIG. 13 already described, the same reference numerals are given to components having a common function, and the description will be omitted.

  FIG. 1 is a schematic plan view of an embodiment of an electronic component mounting apparatus according to the present invention. 100 is an electronic component mounting apparatus, 3 is a component supply area provided on the front side and the back side of the electronic component mounting apparatus 100, 5a is a fixed chute, 5b, 5c and 5d are movable chutes, 7 is a delivery section, and 8 is movable. Rail for moving left and right of chute, 9 for rail for vertical movement, 11 for mounting head body, 16 for mounting head, 19 for component recognition camera, LU, LD, RU and RD for block, P for substrate, U and D for substrate transport Line 200 is a control device.

In FIG. 1, an electronic component mounting apparatus 100 constituting a board assembly mounting line is provided with a transport device (not shown) that transports a substrate P as a substrate on the upstream side and the downstream side. A component supply area 3 for supplying electronic components is disposed on the front side and the back side across the transport device, and a pair of beams that can be moved in one direction (Y direction) by a driving source. A plurality of (for example, twelve) holding members, which are suction members, are detachably provided, and a mounting head 16 that is movable and rotatable by each drive source in a direction along each beam is provided. .
In the electronic component mounting apparatus 100 of FIG. 1, two blocks LU and LD on the upper left and lower sides, and two blocks RU and RD on the upper and lower sides on the right are divided into a total of four blocks (the reference numerals are basically described only in the LU block). And a control device 200. Each block is provided with a component supply area 3, a mounting head 16, a mounting head body 11, and a component recognition camera 19.

  In the component supply area 3, for example, a number of well-known tape feeders are provided. Further, a mounting head 16 is fixed to the mounting head body 11 and moves on a left / right moving rail 8 formed of a motor such as a linear motor. In addition, the component recognition camera 19 images the suction holding state of the component being sucked by the suction nozzle in order to correct the position of the suction nozzle of each mounting head 16 when the component recognition camera 19 is mounted on the substrate P.

The left and right blocks are respectively provided with vertical movement rails 9. The vertical movement rail 9 is composed of a motor such as a linear motor, and moves the mounting head body 11 common to the upper and lower blocks up and down. Further, in the center, there are four chutes 5a, 5b, 5c and 5d for transporting the substrate P. The upper two chutes 5c and 5d pass the substrate transport line U for the upper block and the lower two chutes 5a and 5b constitutes a substrate transport line D for the lower block. The substrate P is distributed by the delivery unit 7 and carried into the substrate transport line U or D. The four chutes 5a, 5b, 5c and 5d are provided in parallel to the front and rear (front side and back side) in parallel to the X direction. The component supply area 3 is provided on the nearer side and the far side of the two board transfer lines U and D.
The substrate P is transported from the carry-in port to the carry-out port by moving each carry belt by a carry motor attached to each chute 5a, 5b, 5c, and 5d.

FIG. 8 is a diagram for explaining a dual transport line in the electronic component mounting apparatus of FIG. Each of the two substrates PU and PD is transported by being sandwiched between rails provided in parallel called a pair of chutes. Components supply areas A1 and A2 contain components such as electronic components (hereinafter simply referred to as electronic components).
In FIG. 8, the substrate PU is conveyed to the component mounting area by the movable chute 5c and the movable chute 5d provided in parallel. FIG. 8 shows a state in which the board PU and the board PD are transferred to the respective component mounting areas. In the component mounting area, the board PU is mounted with electronic components. That is, the mounting head H1 sucks an electronic component from the component supply area A1 or A2, moves to the mounting position of the substrate PU in the component mounting area, and mounts the electronic component.
Similarly, the substrate PD is conveyed to the component mounting area by the fixed chute 5a and the movable chute 5b provided in parallel. In the component mounting area, the substrate PD is mounted with electronic components. That is, the mounting head H2 sucks an electronic component from the component supply area A1 or A2, moves to the mounting position of the substrate PD in the component mounting area, and mounts the electronic component.
In the embodiment of the electronic component mounting apparatus 100 of FIG. 1, the left and upper blocks are divided into two blocks LU and LD, and the upper right and lower blocks are two blocks RU and RD. An electronic component mounting apparatus provided with two blocks of LU and LD may be used.

  Note that the dual drive line electronic component mounting apparatus of the present invention of FIGS. 1 and 8 employs an overdrive motion system. In the left block in which the blocks LU and LD of the electronic component mounting apparatus 100 of the overdrive motion method are combined, the mounting heads 16 (the mounting heads H1 and H2 in FIG. 8) provided in the left block are respectively front and rear (front side). Electronic components can be adsorbed freely from the component supply area 3 (component supply areas A1 and A2 in FIG. 8) on the side and back side, and each adsorption head 16 can be simultaneously mounted on the same substrate. Similarly, in the right block including the blocks RU and RD, each mounting head 16 provided in the right block can freely pick up electronic components from the front and rear (front and back) component supply areas 3. The suction heads 16 can be simultaneously mounted on the same substrate.

In the embodiment shown in FIG. 1, the lowermost chute 5a among the four chutes provided in parallel is the reference fixed chute, and the remaining three chutes 5b, 5c and 5d move up and down (Y direction). It is a possible movable chute. The movable chutes 5b, 5c and 5d are independently driven by a motor (not shown) attached to each chute and move up and down (Y direction) on a movable chute moving rail (not shown).
Each chute 5a, 5b, 5c, and 5d has a board backup part (not shown) that supports the board P when the components are mounted on each board positioning part (not shown).
As shown in FIG. 8 or FIG. 13, the combination of the fixed chutes and the movable chutes is a case where one is a fixed chute and the remaining is a movable chute, and two are fixed chutes and the remaining is a movable chute for each movable chute. In addition, all of them may be movable chutes.

  The transport device is disposed in the middle part before and after the electronic component mounting apparatus 100, and the substrate P supplied from the delivery unit 7 for mounting the electronic components sucked and held by the suction nozzles of the mounting heads 6 is provided. The board positioning part for positioning and fixing the board P, and the delivery part 7 for transferring the board P to which the electronic component is mounted in the board positioning part from the upstream side apparatus to the downstream side apparatus. The delivery unit 7 and the substrate positioning unit are composed of a pair of conveyors whose intervals can be adjusted in accordance with the width (width in the direction orthogonal to the conveyance direction) PW of the substrate P.

  The component supply area 3 is composed of a component supply unit that is detachably arranged in parallel on the apparatus main body of the electronic component mounting apparatus 100 and supplies various electronic components one by one to the component take-out portion (component suction position). The This component supply unit is equipped with a storage tape that covers a large number of electronic components with cover tapes that are stored at regular intervals in each storage section consisting of recesses in the carrier tape. By peeling the cover tape, electronic components are supplied one by one to the component extraction position of the component supply unit, and are extracted from each storage portion by the suction nozzle of the mounting head 6.

Each mounting head 6 is provided inside each beam so as to face each other, and moves above the component pick-up position of the component supply unit in the component P and the component P in the component supply area 3 on the substrate positioning portion of the transfer device.
The component recognition camera 19 images the electronic component sucked and held by the suction nozzle, and the substrate recognition camera images a recognition mark for confirming the position of the substrate P to correct the position of the electronic component and the position of the substrate. Get the image. The control device 200 performs image processing on the acquired image, controls each device of the electronic component mounting apparatus 100, and corrects the position where the electronic component is mounted.

FIG. 2 is a block diagram illustrating a configuration of a control device 200 for control related to electronic component mounting of the electronic component mounting device 100. 21 is a CPU (Central Processing Unit), 22 is a ROM (Read Only Memory), 23 is a RAM (Random Access Memory), 24 is a bus line, 25 is a monitor, 26 is a touch panel switch, 27 is an interface, 28 is a drive circuit, 12 is a substrate recognition camera, 13 is a Y-direction motor, 14 is an X-direction motor, 17 is a vertical axis motor, 18 is a θ-axis motor, 29 is a recognition processing device, 30 is an external memory, 31 is a management PC (Personal Computer) It is.
The CPU 21 includes a control unit, a determination unit, and a check processing unit, and comprehensively controls each element (each device) of the electronic component mounting apparatus 100. The electronic component mounting apparatus 100 includes a ROM 22 and a RAM 23 as a second storage device. The ROM 22 stores a program related to the control of the CPU 21, and the RAM 23 stores various data for each model to be produced. The CPU 21, ROM 22 and RAM 23 are connected via a bus line 24.
Further, a monitor 25 as a display device for displaying an operation screen and the like, and a touch panel switch 26 as an input unit formed on the display screen of the monitor 25 are connected to the CPU 21 via an interface 27. In addition, a Y direction motor 13, an X direction motor 14, a vertical axis motor 17, and a θ axis motor 18 are connected to the CPU 21 via a drive circuit 28 and an interface 27.

The CPU 21 includes an external memory 30 as a first storage device, a microcomputer, and the like, and is connected to a management PC 31 that performs overall management of each board assembly work apparatus constituting the board assembly / mounting line.
The external memory 30 stores pattern program data for moving the electronic component mounting apparatus 100 for each type of board P to be produced. Each pattern program data includes the size in the X direction and the size in the Y direction of the board P. Board information data (see FIG. 3) composed of thickness, presence / absence of board recognition, etc., X coordinate, Y coordinate and angle information in the board P for each mounting order (step number), and component supply Mounting data composed of unit arrangement numbers (see FIG. 4), component arrangement data (FIG. 5), which is information on the type of each electronic component corresponding to the arrangement number on the feeder base of each component supply unit, which mounting Which kind of suction nozzle 5 (nozzle ID) is mounted at which position (indicated by the nozzle number) of the head 6 (head 1 is the front mounting head, head 2 is the back). Or and the like nozzle arrangement data (see FIG. 6) showing a.

  Furthermore, the external memory 30 stores component library data (see FIG. 7) relating to the characteristics of the electronic component for each electronic component type (component ID). In other words, the component library data includes, for example, data for each component ID, such as sizes in the X direction and the Y direction, and suction positions for taking out electronic components in the component supply unit.

When the electronic component mounting apparatus 100 newly starts production, the lane width, the backup pin, and the suction nozzle are exchanged, and the CPU 21 of the control apparatus 200 reads the above-described data on the production model from the external memory 30 ( Pattern program data and component library data), and for each of the board transfer line U and the board transfer line D, the contents of the data are converted into a format used for control of the apparatus to create model data DU and model data DD, and the RAM 23 To save. After that, while the mounting operation is stopped, (1) data dependent on the model data DU, (2) data dependent on the model data DD, and (3) parts supply common to both (including flux unit and recycling conveyor) The operation data E is created from the data depending on the work equipment data such as nozzles and stored in the RAM 23. Then, the CPU 21 starts mounting the electronic component from the RAM 23 based on the operation data E such as designating which position the mounting head actually moves in the apparatus and in what order. The production operation (mounting of electronic components) may be performed based not only on the operation data E but also on the model data DU or DD as necessary. Since the model data DU and DD are each collected as one file, they cannot be changed when production operation is performed using the files.
Note that the RAM 23 is not limited to the RAM, and may be a memory such as a volatile memory that operates at high speed and can be directly accessed by the CPU 21. The ROM 22 need not be limited to the ROM, and may be any non-volatile memory that is relatively difficult to rewrite and can retain stored contents even when the power is turned off.

  Further, the case where one of the models is changed during production will be described with reference to an embodiment in which the board to which components are mounted on the board transfer line U is changed to the board PU. When changing the model of a board on which a component is mounted on the board transfer line U to the board PU, the CPU 21 of the control device 200 reads out the pattern program data of the board to be produced by changing the model from the external memory 30 and related component library data, The model data of the board before the change of the RAM 23 is rewritten to the model data DU of the board PU produced after the model change. After rewriting, the CPU 21 creates and rewrites the operation data excluding the items used for the current component mounting operation on the other board transfer line D, based on the model data DU. save. When the rewriting of the operation data E is completed for all items that depend on the model data DU, the CPU 21 performs the electronic operation on the substrate PU on the substrate transfer line U based on the operation data E in the RAM 23. Start mounting parts.

For example, here, the data that causes a pause during creation or rewriting of the operation data depends on the production of the substrate PU of the substrate transport line U during the model change. (1) Data that depends on the model data DU Rather, (3) when the operation data is created and rewritten from data dependent on the work equipment data common to both. Therefore, when the CPU 21 creates and rewrites the operation data from the data dependent on the work equipment data common to both (3), the CPU 21 uses the operation data for the data referred to by the one substrate transport line in operation. Do not create or rewrite data.
As a result, even if one substrate transfer line is in operation (mounting operation), it is possible to change the model of the other substrate transfer line without stopping the operation (production) of that substrate transfer line. Efficiency is improved.

  The recognition processing device 29 is connected to the CPU 21 via the interface 27, performs recognition processing of images acquired by the board recognition camera 12 and the component recognition camera 19, and outputs the processing result to the CPU 21. For example, the CPU 21 performs a recognition process (calculation of the amount of displacement of the electronic component sucked and held by the suction nozzle 18 or the position of the substrate P positioned) by the image captured by the board recognition camera 12 or the component recognition camera 19. The instruction is output to the recognition processing device 29, and the recognition processing result is received from the recognition processing device 29.

The model change of the electronic component mounting apparatus 100 can be performed by, for example, reading the barcode of the board P that has been carried in by the barcode reader, and automatically detecting and switching the barcode.
Further, for example, when the management PC 31 or the host computer transmits a board change control signal to the CPU 21 of the electronic component mounting apparatus 100 via the bus line 24 or the like, the CPU 21 of the electronic component mounting apparatus 100 executes the model change. .
Furthermore, in addition to the method described above, the operator can also change the model manually. For example, when the operator gives an instruction to change the model from the touch panel switch 26 or an input device such as a keyboard (or reads the data corresponding to the model name information or the program name of the substrate P using a barcode reader), The CPU 21 activates a model change program via the interface 27 and causes the monitor 25 to display a model change operation screen. The worker changes the model of the operation screen of the monitor 25 by operating an input device such as a touch panel switch 26 or a keyboard.

In order to change the model of the electronic component mounting apparatus, it is necessary to replace the lane width, the backup pin, the suction nozzle, and the like as described in the prior art.
Furthermore, it is necessary to rewrite the data related to the number of boards to be produced and the work equipment data (substrate suction nozzle data, lane width data related to transfer, backup pin arrangement coordinate data, etc.) after changing the model. is there.
However, as will be described with reference to FIG. 9 below, in the conventional electronic component mounting apparatus of the dual transfer line, the model of the other lane is changed while one lane (substrate transfer line) is continuing production (during operation). Could not do.

  FIG. 9 is a diagram for explaining the change of the operation data when the model is changed in the conventional electronic device for dual transport line. 91 is operation data (E) stored in the RAM 23, 92 is model data, 92 U is model data (DU) of the substrate transport line U, 92 D is model data (DD) of the substrate transport line U, and 95 is a model change. Pattern program data of the substrate to be performed (the pattern program data 95 is selected from those stored in the external memory 30), 96 is component arrangement data of the pattern program data 95, and 97 is mounting data of the pattern program data 95. In addition, the pattern program data 95 includes nozzle ID data, substrate information data, and the like.

In FIG. 9, each time the model is changed, the CPU 21 of the control device reads the pattern program data 95 of the model of the board to be changed from the external memory 30 and rewrites the model data 92. However, the model data 92 is created as one file in which the two substrate transfer lines U and D are collected. Accordingly, even if the model of the substrate on one of the dual transport lines is changed, the common model data 92 is changed (rewritten).
Further, after the model data 92 is rewritten, the CPU 21 rewrites the data of the operation data (E) 91 based on the rewritten model data 92. In this case, if the data of the operation data 91 is rewritten during the mounting operation of the electronic component mounting apparatus, the data related to the component currently mounted cannot be used during the rewriting. For this reason, the apparatus stops. For example, even if the CPU 21 attempts to read the data being rewritten in the model data 92 of the RAM 23 in order to perform the mounting operation, the data being rewritten cannot be read. As a result, the CPU 21 determines that there is no such data, and temporarily stops the operation of the electronic component mounting apparatus.

When a pause in operation during production occurs, the worker first checks the cause of the pause, and takes countermeasures according to factors such as part shortage, pattern program data and part library data errors. When this countermeasure is taken, the CPU 21 performs a check corresponding to the cause of the temporary stop, determines that the countermeasure has been taken, and resumes production.
The production schedule is preferably performed as planned. However, the occurrence of such a temporary stop significantly detracts from the production schedule, so the conventional electronic component mounting device stops the mounting operation when changing the model of the board on one of the board transfer lines, and changes the model. Had to do.
In the present invention, even if one substrate transport line is in operation, it is possible to change the model of the other substrate transport line, and the dual transport in which the operation is not temporarily stopped even while the operation data (E) 91 is rewritten. A line electronic mounting device is realized.

FIG. 10 is a diagram for explaining the operation data 91 in detail. 101 is a data area related to the substrate transfer line D, 102 is a data area related to the substrate transfer line U, and 103 is a data area related to both the substrate transfer lines D and U.
As shown in FIG. 10, the operation data 91 includes data areas 101, 102, and 103. The CPU 21 reads necessary data from the data area 102 related to the board transfer line U and the data area 103 related to both the board transfer lines D and U when components are mounted on the board transfer line U. The data in area 111 is not used. Similarly, the CPU 21 reads out necessary data from the data area 101 related to the board transfer line D and the data area 103 related to both the board transfer lines D and U when components are mounted on the board transfer line D. The data in the data area 102 related to is not used.

Therefore, the dual transfer line electronic component mounting apparatus 100 of the present invention divides the conventional model data 92 into the model data (DU) 112U of the board transfer line U and the model data (DD) 112D of the board transfer line U. File.
Further, the electronic component mounting apparatus 100 of the dual transport line according to the present invention is such that only the data related to the model data whose model has been changed is rewritten.
Furthermore, the electronic component mounting apparatus 100 of the dual transport line according to the present invention is such that the operation data is not rewritten with respect to the data that the CPU 21 is currently using for the mounting operation. The data in use is rewritten when the CPU 21 finishes using the mounting operation.

  FIG. 11 is a diagram for explaining the change of the operation data when the model is changed in the dual loading line electronic mounting apparatus 100 of the present invention. 112U is model data (DU) of the substrate transfer line U, and 112D is model data (DD) of the substrate transfer line U. The same elements as those in FIG. 10 are denoted by the same reference numerals and will not be described.

In FIG. 11, the case where one of the models is changed during production will be described with reference to an embodiment in which the board to which components are mounted on the board transfer line U is changed to the board PU.
Each time the model is changed, the CPU 21 of the control device 200 reads the pattern program data 95 of the model of the board to be changed from the external memory 30 and rewrites the model data 112U. The model data 112U does not include model data of the other substrate transport line D that is in operation. Therefore, in the case of changing the model of the substrate on one substrate transfer line of the dual transfer line, the model data relating to the other substrate transfer line is not changed (not rewritten).
Further, after the model data 112U is rewritten, the CPU 21 rewrites the data of the operation data (E) 91 based on the rewritten model data 112U. In this case, if the data of the operation data 91 is rewritten during the component mounting operation of the electronic component mounting apparatus 100, the data related to the currently mounted component cannot be used during the rewriting. For this reason, the apparatus stops. For example, even if the CPU 21 attempts to read the data currently being rewritten in the model data 112U of the RAM 23 in order to perform the component mounting operation, the data being rewritten cannot be read. As a result, the CPU 21 determines that there is no such data, and temporarily stops the operation of the electronic component mounting apparatus.
Therefore, in the present invention, the CPU 21 preselects data necessary for performing the component mounting operation in the operation data, and when the data is used for the mounting operation, the data is not rewritten and another rewriting is necessary. Rewrite processing for important data. Then, after the mounting operation using the data is completed, rewriting related to the data is performed.
Conventionally, the operation data and the model data are kernel space memories. However, in the present invention, the operation data is a kernel space memory and the model data is a user space memory.

FIG. 12 shows an example of a dual transfer line electronic component mounting apparatus according to an embodiment of the present invention, in order to change the model when one of the board transfer lines is being produced and the board of the other board transfer line is changed. 7 is a flowchart for explaining a process of a CPU 21 when rewriting operation data based on the model data rewritten by
In step S11, operation data to be rewritten is selected.
Next, in step S12, a time required for rewriting the selected data is calculated.
In step S13, it is determined whether or not the data selected in step S12 is used for the mounting operation (driving) within the calculated time. If it is not used within the time (No), the process proceeds to step S14. If it is used within the time (Yes), the process proceeds to step S16.
In step S14, the operation data is rewritten.
In step S15, it is determined whether or not rewriting has been completed for all data related to the model change of the operation data. If all of them are finished (Yes), the rewriting process is finished, and if not finished yet (No), the process proceeds to Step S11.
In step S16, the order of rewriting the data is changed last (if there is still data to be rewritten) or waits for a predetermined time (if there is only this data to be rewritten). Migrate to

  According to the above-described embodiment, in the electronic component mounting apparatus of the dual transport line, even if one substrate transport line is in operation (production), the other substrate is not stopped without stopping the substrate transport line in operation. The transfer line model can be changed. As a result, it is possible to improve the production efficiency and realize an easy-to-use dual transport line electronic component mounting apparatus.

Industrial application fields

The present invention is not limited to an electronic component mounting apparatus of a dual transport line, but can be applied to a semiconductor manufacturing apparatus that uses a dual transport line.
Further, the number of transport lines need not be two, and can be applied if it is two or more.

  3: parts supply area, 5a: fixed chute, 5b, 5c, 5d: movable chute, 7: delivery part, 8: rail for moving left and right movable chute, 9: rail for vertical movement, 11: mounting head body, 12: substrate Recognition camera, 13: Y direction motor, 14: X direction motor, 16: Mounting head, 17: Vertical axis motor, 18: θ axis motor, 19: Component recognition camera, 21: CPU, 22: ROM, 23: RAM, 24: Bus line, 25: Monitor, 26: Touch panel switch, 27: Interface, 28: Drive circuit, 29: Recognition processing device, 30: External memory, 31: Management PC, 100: Electronic component mounting device, 200: Control 91, data for operation, 92: model data, 92U: model data DU, 92D: model data DD, 9 : Pattern program data, 106: component arrangement data, 107: mounting data, 101: data area related to the board transfer line D, 102: data area related to the board transfer line U, 103: data common to the board transfer lines D and U Area, 112U: model data (DU) of substrate transport line U, 112D: model data (DD) of substrate transport line U, 131, 132: movable chute, 13U, 13D: fixed chute, LU, LD, RU, RD: Block, P, PU, PD: Board, U, D: Board transport line, A1, A2: Component supply area, H1, H2: Mounting head.

Claims (7)

Two substrate transfer lines provided in parallel on the front side and the back side, component supply areas provided further on the front side and further on the back side of the two substrate transfer lines, and electronic components are adsorbed from the component supply area In an electronic component mounting apparatus having a plurality of mounting heads for mounting electronic components on printed circuit boards on one substrate transport line, and the two substrate transport lines, the component supply area, and a control device for controlling the mounting head,
The control device includes a non-volatile memory for storing a program related to control of the electronic component mounting device, operation data for mounting electronic components on each of the substrates on the two substrate transfer lines, and the two substrate transfer lines. It has a volatile memory that stores each model data and a CPU,
The CPU reads out the pattern program data and related component library data of the board to be produced by changing the model from an external memory when changing the model of the board to be produced on one of the two board transportation lines, When the model data of the board transfer line to be changed in the volatile memory is rewritten and the operation data is rewritten based on the rewritten model data, the other board transfer line of the two board transfer lines is in use. An electronic component mounting apparatus characterized by not rewriting the data.   2. The electronic component mounting apparatus according to claim 1, wherein the volatile memory is a RAM.   2. The electronic component mounting apparatus according to claim 1, wherein the nonvolatile memory is a ROM.   2. The electronic component mounting apparatus according to claim 1, wherein the CPU performs the operation data based on the rewritten model data when changing the model of a board to be produced on one of the two board transfer lines. 3. Electronic component mounting, wherein data relating to the operation of both of the two substrate transfer lines is not rewritten among data in use by the other substrate transfer line of the two substrate transfer lines apparatus.   2. The electronic component mounting apparatus according to claim 1, wherein the plurality of mounting heads simultaneously mount electronic components on a substrate of one of the two substrate transfer lines under the control of the control device. An electronic component mounting device. Two substrate transfer lines provided in parallel on the front side and the back side, component supply areas provided further on the front side and further on the back side of the two substrate transfer lines, and electronic components are adsorbed from the component supply area Electronic component mounting apparatus having a plurality of mounting heads for mounting electronic components on each printed circuit board on one substrate transport line, and the two substrate transport lines, the component supply area, and a control device for controlling the mounting head In the mounting method,
When changing the model of a board to be produced on one of the two board transfer lines, the pattern program data and related component library data of the board to be produced by changing the model are read from an external memory, and the volatile memory When the model data of the substrate transfer line to be changed is rewritten, and the operation data is rewritten based on the rewritten model data, the other substrate transfer line of the two substrate transfer lines is rewritten. An electronic component mounting method characterized by not performing the above.   7. The electronic component mounting method according to claim 6, wherein, when the model of a board produced on one of the two board transfer lines is changed, the operation data is rewritten based on the rewritten model data. An electronic component mounting method, wherein data relating to operations of both of the two substrate transfer lines is not rewritten among data in use by the other substrate transfer line of the two substrate transfer lines.

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