JP2013032942A - Manufacturing method of rotation detection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a rotation detection sensor which can shorten time required for a resin molding step of a case, and has higher flexibility in the design of a shape of a part on a connector portion side rather than an airtightness holding portion in the case.SOLUTION: In a case 30 of a shape having a connector portion 31 and an airtightness holding portion 32, one end 33a of a terminal 33 is positioned inside the connector portion 31, and the other end 33b of the terminal 33 is exposed from the airtightness holding portion 32 side of the case 30. The manufacturing method of a rotation detection sensor includes: a step of resin-molding the case 30 by using a mold; a step of joining a lead frame 11 which is an integrated component obtained by integrating a mold IC 10 and a magnet 20, and the terminal 33 exposed from the case 30; and a rein sealing step of sealing a joint part of the integrated components 10 and 20, the lead frame 11, and the terminal 33, and the airtightness holding portion 32 of the case 30 with sealing resin 40, by immersing them in liquid resin 41 and curing the resin.

Description

  The present invention relates to a method of manufacturing a rotation detection device.

  Conventionally, there are those disclosed in Patent Documents 1 and 2 as rotation detection devices that detect the number of rotations or the direction of rotation of a subject from a change in the resistance value of a magnetoresistive element.

  FIG. 13 shows the overall configuration of the rotation detection device described in Patent Document 1. The rotation detection device shown in FIG. 13 is, for example, a crank angle sensor that detects the crank angle of an engine of a vehicle, and is inserted into and fixed to the mounting hole 3 of the engine block 2. The rotation detection device includes an integrated part of the mold IC 10 and the hollow magnet 20, and a case J30 that accommodates the integrated part and forms the outer shape of the entire rotation detection device.

  The mold IC 10 and the hollow magnet 20 constitute a detection unit that detects the crank angle.

  The case J30 includes a connector portion 31 connected to an external terminal, and an airtight holding portion 32 that is fixed to the mounting hole 3 while maintaining airtightness when the integrated component is inserted into the mounting hole 3. It has.

  The connector part 31 is provided with a terminal 33 as a connection terminal inside the opening. The terminal 33 has a length that reaches the lead frame 11 of the mold IC 10 from the inside of the connector portion 31, and is electrically connected to the lead frame 11.

  The O-ring 34 for holding the air-tightness is attached to the outer surface of the air-tightness holding portion 32, and the air-tightness is held by the O-ring 34 being in close contact with the wall surface of the mounting hole 3.

  The case J30 has a fixing portion for fixing to the engine block 2 with a screw or the like, and a metal pipe 35 into which the screw or the like is inserted is attached to the fixing portion.

  The rotation detection device shown in FIG. 13 assembles the mold IC 10 and the hollow magnet 20 and accommodates them in the cap 36 to form an integrated part, and then joins the lead frame 11 and the terminal 33 of the mold IC 10 together. It is manufactured by integrally molding the case J30 by injection molding in a state where the mold is accommodated in the cavity of the mold.

  FIG. 14 shows the overall configuration of the rotation detection device described in Patent Document 2. This rotation detection device is obtained by changing the case forming the outer shape of the rotation detection device to a hollow structure with respect to the rotation detection device shown in FIG. In this rotation detection device, a cylindrical (hollow structure) case J40 whose one end is open and the other end is closed is resin-molded. After the lead frame 11 of the mold IC 10 and the terminal 33 are joined, the terminal from the mold IC 10 is connected to the terminal. It is manufactured by inserting up to 33 into the case J40.

JP 2006-17593 A JP 2004-226091 A

  In the method of manufacturing the rotation detection device described in Patent Document 1, as shown in FIG. 13, since the airtight holding portion 32 of the case J30 is thick, the resin is cooled and solidified in the resin molding process of the case. Takes a long time, and the time required for the resin molding process of the case becomes long.

  On the other hand, according to the manufacturing method of the rotation detection device described in Patent Document 2, the case J40 that forms the outer shape of the entire rotation detection device has a hollow structure, and the part from the mold IC 10 to the terminal 33 is inserted into the case J40. Since it did in this way, in the resin molding process of a case, the airtight holding | maintenance part 32 can be shape | molded as thinner than the manufacturing method of patent document 1. FIG. For this reason, the time for cooling and solidifying the resin can be shortened, and the time required for the resin molding process of the case can be shortened.

  However, in the manufacturing method described in Patent Document 2, the mounting hole 3 (see FIG. 13) when inserted and fixed in the portion of the case J40 closer to the connector part 31 than the airtight holding part 32, that is, the mounting hole 3. Therefore, there is a problem that the degree of freedom in designing the shape in the exposed portion is low. Specifically, in order to insert the joined terminal 33 and the molded IC 10 into the case J40 as they are without bending, the case J40 must extend linearly from one end side to the other end side. In addition, a portion of the case J40 closer to the connector portion 31 than the airtight holding portion 32 cannot be bent.

  In view of the above points, the present invention can shorten the time required for the resin molding process of the case, and in the case of the case closer to the connector part than the airtight holding part in the case as compared with the manufacturing method described in Patent Document 2. It is an object of the present invention to provide a method for manufacturing a rotation detection sensor having a high degree of freedom in shape design.

In order to achieve the above object, in the invention described in claim 1,
A case (30) having a shape having a connector part (31) and an airtight holding part (32), wherein one end (33a) of the terminal (33) is located inside the connector part (31) and the terminal ( A case (30) in which the other end (33b) of 33) is exposed on the airtight holding part (32) side of the case (30), and a resin molding step of the case for resin molding using a mold;
Preparing an integrated part (10, 20) in which a mold IC (10) and a magnet (20) are integrated;
Joining the lead frame (11) of the integrated component (10, 20) and the other end (33b) side of the terminal (33);
The joint parts of the integrated parts (10, 20), the lead frame (11) and the terminal (33) and the airtight holding part (32) of the case (30) are immersed in the liquid resin (41) and cured. Thus, a resin sealing step of sealing with a sealing resin (40) is performed.

In the invention according to claim 2,
A case (30) having a shape having a connector part (31) and an airtight holding part (32), wherein one end (33a) of the terminal (33) is located inside the connector part (31) and the terminal ( A case (30) in which the other end (33b) of 33) is exposed on the airtight holding part (32) side of the case (30), and a resin molding step of the case for resin molding using a mold;
Preparing a mold IC (10);
Bonding the lead frame (11) of the mold IC (10) and the other end (33b) side of the terminal (33);
The joint part of the mold IC (10), the lead frame (11) and the terminal (33) and the airtight holding part (32) of the case (30) are immersed in a liquid resin (42) mixed with the raw material powder for magnet. A resin sealing step of sealing with a sealing resin (40) by curing the resin,
A step of magnetizing a portion (43) covering the mold IC (10) of the sealing resin (40) is performed.

  According to the first and second aspects of the invention, since the airtight holding portion is resin-sealed in the resin sealing step, the thickness of the airtight holding portion is set to the thickness of the sealing resin in the resin molding step of the case. The thickness can be reduced by subtracting the minutes, and the airtight holding portion can be formed thinner than before. For this reason, the time for cooling and solidifying the resin can be shortened, and the time required for the resin molding process of the case can be shortened.

  In addition, according to these, since the rotation detection device can be manufactured even if the shape of the portion closer to the connector portion than the hermeticity holding portion of the case is a linear shape or a bent shape, the rotation detection device can be manufactured. Compared with the manufacturing method, it can be said that the design freedom of the shape in the portion of the case closer to the connector portion than the airtight holding portion is high.

  By the way, normally, the magnet used for the rotation detection device is manufactured by magnetizing the molded body after resin molding using a resin mixed with the raw material powder for magnet, and the invention according to claim 2. Therefore, the resin molding process for manufacturing this magnet can be omitted.

In invention of Claim 3,
A case (30) having a connector part (31) and an airtight holding part (32), the airtight holding part (32) having a hollow part (32b), and one end of a terminal (33) ( Case (30) in which 33a) is located inside the connector portion (31) and the other end (33b) of the terminal (33) is exposed on the airtight holding portion (32) side is resin-molded using a mold Resin molding process,
Preparing an integrated part (10, 20) in which a mold IC (10) and a magnet (20) are integrated;
Joining the lead frame (11) of the integrated component (10, 20) and the other end (33b) side of the terminal (33);
The joint between the integrated part (10, 20) and the lead frame (11) and the terminal (33) is covered with a sheet-like resin (51) and is closely adhered, thereby sealing with a sealing resin (50). A resin sealing step is performed.

In the invention according to claim 4,
A case (30) having a connector part (31) and an airtight holding part (32), the airtight holding part (32) having a hollow part (32b), and one end of a terminal (33) ( Case (30) in which 33a) is located inside the connector portion (31) and the other end (33b) of the terminal (33) is exposed on the airtight holding portion (32) side is resin-molded using a mold Resin molding process,
Preparing a mold IC (10);
Bonding the lead frame (11) of the mold IC (10) and the other end (33b) side of the terminal (33);
Covering the joints of the mold IC (10) and the lead frame (11) with the terminal (33) with a sheet-like resin (52) mixed with magnet raw material powder, and sealing the sealing resin (50) A resin sealing step of sealing with,
A step of magnetizing a portion (53) covering the mold IC (10) of the sealing resin (50) is performed.

  According to the third and fourth aspects of the invention, since the case is resin-molded with the airtight holding portion having a hollow structure, the airtight holding portion can be formed with a thinner wall than in the past in the resin molding step of the case. For this reason, the time for cooling and solidifying the resin can be shortened, and the time required for the resin molding process of the case can be shortened.

  In addition, according to these, since the rotation detection device can be manufactured even if the shape of the portion closer to the connector portion than the hermeticity holding portion of the case is a linear shape or a bent shape, the rotation detection device can be manufactured. Compared with the manufacturing method, it can be said that the design freedom of the shape in the portion of the case closer to the connector portion than the airtight holding portion is high.

  By the way, normally, the magnet used for the rotation detection device is manufactured by magnetizing this molded body after resin molding using a resin mixed with magnet raw material powder. Therefore, the resin molding process for manufacturing this magnet can be omitted.

In the invention according to claim 5,
A case (30) having a connector part (31) and an airtight holding part (32), the airtight holding part (32) having a hollow part (32b), and one end of a terminal (33) ( Case (30) in which 33a) is located inside the connector portion (31) and the other end (33b) of the terminal (33) is exposed on the airtight holding portion (32) side is resin-molded using a mold Resin molding process,
A step of preparing a bottomed cylindrical resin cap (60) containing a mold IC (10) and a magnet (20);
Bonding the lead frame (11) of the mold IC (10) and the other end (33b) side of the terminal (33);
Joining the lead frame (11) and the terminal (33) by joining the case (30) and the cap (60) in a state where the cap (60) is put on the hollow part (32b) of the case (30). And a step of sealing the portion.

  According to this, since the case is resin-molded with the airtight holding portion as a hollow structure, the airtight holding portion can be formed thinner than in the conventional case in the resin molding step of the case. For this reason, the time for cooling and solidifying the resin can be shortened, and the time required for the resin molding process of the case can be shortened.

  Further, according to this, since the rotation detecting device can be manufactured even if the shape of the portion closer to the connector portion than the airtight holding portion of the case is a linear shape or a bent shape, the rotation detection device can be manufactured. Compared with the manufacturing method, it can be said that the design freedom of the shape in the portion of the case closer to the connector portion than the airtight holding portion is high.

In the invention described in claim 5, for example, as described in claim 6, the cap (60) is put on the hollow portion (32b) of the case (30), and the case (30), the cap (60), And after contacting the lead frame (11) and the terminal (33),
The step of joining the lead frame (11) and the terminal (33) and the step of joining the case (30) and the cap (60) can be performed simultaneously by ultrasonic welding.

In the invention according to claim 5, for example, as described in claim 7, the cap (60) is put on the hollow portion (32 b) of the case (30), and the case (30) and the cap (60 ) And at the same time, the lead frame (11) and the terminal (33) are connected by fitting the connector portions (71, 72) provided in the lead frame (11) and the terminal (33), respectively. After performing the process of joining,
A step of joining the case (30) and the cap (60) by ultrasonic welding or laser welding can be performed.

Further, in the invention described in claim 5, for example, as described in claim 8, the cap (60) is put on the hollow portion (32b) of the case (30), and the case (30) and the cap (60 ) And the lead frame (11) and the terminal (33),
The step of joining the lead frame (11) and the terminal (33) by laser welding and the step of joining the case (30) and the cap (60) by ultrasonic welding or laser welding can be performed separately.

Further, in the invention described in claim 5, for example, as described in claim 9, a terminal (33) having a shape that can be expanded and contracted is used.
After performing the process of joining the lead frame (11) and the terminal (33) in a state where the terminal (33) is extended and the case (30) and the cap (60) are separated from each other,
After the terminal (33) is contracted, the case (30) and the cap (60) are brought into contact with each other, and then the case (30) and the cap (60) are joined by ultrasonic welding or laser welding. .

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

It is sectional drawing of the rotation detection apparatus in 1st Embodiment. It is a perspective view which shows the manufacturing process of the rotation detection apparatus of FIG. FIG. 3 is a cross-sectional view showing a manufacturing process of the rotation detecting device following FIG. 2. It is sectional drawing which shows the manufacturing process of the rotation detection apparatus in 2nd Embodiment. It is sectional drawing which shows the manufacturing process of the rotation detection apparatus in 3rd Embodiment. It is sectional drawing which shows the manufacturing process of the rotation detection apparatus in 4th Embodiment. It is sectional drawing which shows the manufacturing process of the rotation detection apparatus in 5th Embodiment. It is sectional drawing which shows the manufacturing process of the rotation detection apparatus in 5th Embodiment. It is sectional drawing which shows the manufacturing process of the rotation detection apparatus in 5th Embodiment. It is sectional drawing which shows the manufacturing process of the rotation detection apparatus in 6th Embodiment. It is sectional drawing which shows the manufacturing process of the rotation detection apparatus in 7th Embodiment. It is sectional drawing which shows the manufacturing process of the rotation detection apparatus in 8th Embodiment. It is sectional drawing of the conventional rotation detection apparatus. It is sectional drawing of the conventional rotation detection apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
FIG. 1 shows the overall configuration of the rotation detection device 1 of the present embodiment. The rotation detection device 1 of this embodiment is a crank angle sensor that detects the crank angle of the vehicle engine, and is inserted and fixed in the mounting hole 3 of the engine block 2 in the same manner as the conventional rotation detection device shown in FIG. It is what is done.

  The rotation detection apparatus 1 according to the present embodiment includes a mold IC 10, a hollow magnet 20, a case 30, and a sealing resin (mold resin) 40.

  In the mold IC 10, an IC chip (not shown) including a magnetoresistive (MRE) element is mounted on a lead frame 11, and a part of the lead frame 11 and the IC chip are covered with a mold resin 12. .

  The IC chip and the lead frame 11 are electrically connected by a bonding wire (not shown). Each lead part 11a, 11b, 11c which comprises a power supply terminal, an output terminal, and a ground terminal among the lead frames 11 is exposed from the mold resin 12 (refer FIG. 2 mentioned later). The lead frame 11 is made of a metal such as Cu, and the mold resin 12 is made of an epoxy resin or the like.

  The hollow magnet 20 is a magnet that applies a bias magnetic field to the magnetoresistive element of the IC chip, and has a hollow shape having a through hole 21 in the center. The hollow magnet 20 is a plastic magnet that is injection-molded by mixing a raw material powder (magnetic powder) for magnets such as ferrite and a resin. The mold IC 10 is inserted into the through hole 21 of the hollow magnet 20, and the hollow magnet 20 is attached to the outer surface of the mold IC 10.

  The case 30 has a connector part 31 and an airtight holding part 32, and a terminal 33 is arranged inside them. The connector part 31 and the airtight holding part 32 have the same purpose as the connector part 31 and the airtight holding part 32 of the rotation detecting device shown in FIG. The connector portion 31 has a cylindrical shape with one end opened and the other end closed, and the end 33 a side of the terminal 33 is exposed inside the connector portion 31. On the outer surface of the airtight holding portion 32, a groove portion 32a for attaching the O-ring 34 is formed.

  The case 30 of the present embodiment is formed by resin molding so that the connector portion 31 and the airtight holding portion 32 are continuous, and is a shape that exposes the other end 33b of the terminal 33, and the mold IC 10 and the hollow magnet 20 is not accommodated.

  Similarly to the rotation detection device shown in FIG. 13, a metal pipe 35 into which a screw or the like for fixing the case 30 to the engine block is inserted is attached to the case 30.

  And the other end 33b side of the terminal 33 and the lead frame 11 of the mold IC 10 are joined.

  The sealing resin 40 is a resin that covers and seals the mold IC 10, the hollow magnet 20, the joint portion between the lead frame 11 and the terminal 33, and the airtight holding portion 32 of the case 30. Thus, the airtight holding part 32 of the case 30 is covered with the sealing resin 40, and the O-ring 34 is attached to the outside of the sealing resin 40.

  The case 30 and the sealing resin 40 are made of a thermoplastic resin such as PPS, PBT, or PA66, and are made of the same resin. Note that the case 30 and the sealing resin 40 may be made of different resins.

  The rotation detection device 1 in the present embodiment detects the rotation speed and rotation direction of the subject, and in this embodiment, the crank angle, from the change in the resistance value of the magnetoresistive element due to the change in the bias magnetic field. Since this detection principle is widely known as disclosed in Patent Document 1 and the like, its description is omitted here.

  Next, a method for manufacturing the rotation detection device 1 will be described.

  2A and 2B and FIGS. 3A to 3C show a manufacturing process of the rotation detection device 1. FIG.

  As shown in FIG. 2A, a mold IC 10 and a hollow magnet 20 are respectively prepared, and as shown in FIG. 2B, the mold IC 10 and the hollow magnet 20 are assembled to form an integrated part. At this time, the mold IC 10 and the hollow magnet 20 are fixed by press-fitting the mold IC 10 into the through hole 21 of the hollow magnet 20, or the mold IC 10 is inserted into the through hole 21 of the hollow magnet 20 and temporarily fixed with an adhesive. To do. Alternatively, after the mold IC 10 is inserted into the through hole 21 of the hollow magnet 20, the mold IC 10 and the hollow magnet 20 may be fixed by resin molding in a state where they are accommodated in a mold. Further, the hollow magnet 20 may be integrally formed in a state where the mold IC 10 is disposed inside the mold.

  On the other hand, as shown in FIG. 3A, resin molding of the case 30 is performed (resin molding process of the case). Here, the connector part 31 and the airtight holding part 32 are continuously formed by injection molding (insert molding) in a state where the terminal 33 is disposed in the inside (cavity) of the molding die, and the terminal is provided in the inside thereof. The case 30 in which the 33 is arranged and integrated is formed.

  In the case 30, the other end 33 b side of the terminal 33 opposite to the one end 33 a on the connector 31 side is exposed on the airtight holding portion 32 side. Further, the outer diameter dimension of the airtight holding portion 32 in the case 30 is smaller than the finished dimension in consideration of the thickness of the sealing resin 40.

  Thereafter, the other end 33 b side of the terminal 33 exposed from the case 30 is joined to the lead frame 11 of the mold IC 10. At this time, both are joined by welding, heat caulking, or the like.

  Subsequently, as shown in FIGS. 3B and 3C, an integrated part of the mold IC 10 and the hollow magnet 20, a joint portion of the lead frame 11 and the terminal 33, and an airtight holding portion 32 of the case 30. A step of resin sealing is performed.

  That is, as shown in FIG. 3B, after the integrated parts of the mold IC 10 and the hollow magnet 20 to the airtight holding part 32 are immersed in the liquid resin 41 (dipping), they are shown in FIG. As described above, the sealing resin 40 is formed by taking out from the liquid resin 41 and cooling to cure the resin. The liquid resin 41 used at this time is obtained by heating the resin constituting the sealing resin 40 to make it liquid.

  In this way, by immersing in the liquid resin 41 and curing the resin, it is possible to coat from the integrated part of the mold IC 10 and the hollow magnet 20 to the airtight holding part 32 with a resin layer having a uniform thickness. At this time, the temperature, immersion time, etc. of the liquid resin 41 are adjusted so that the outer diameter of the airtight holding part 32 covered with the sealing resin 40 becomes a dimension according to the size of the mounting hole 3 of the engine block 2. adjust. In other words, the outer diameter of the airtight holding portion 32 covered with the sealing resin 40 can be arbitrarily adjusted by adjusting the temperature of the liquid resin 41, the immersion time, and the like, and adjusting the thickness of the sealing resin 40. Can be changed to dimensions.

  Further, when the integrated part of the mold IC 10 and the hollow magnet 20 is taken out from the liquid resin 41, the liquid resin 41 hangs down, and the sealing resin 40 is below the integrated part of the mold IC 10 and the hollow magnet 20. Therefore, as shown in FIG. 3C, an excessively long portion is cut before the resin is cured so as to have a desired neck length L1. Instead of cutting, immediately after taking out from the liquid resin 41, a jig (mold) is attached to the integrated part of the mold IC 10 and the hollow magnet 20 so that the sealing resin does not extend below the integrated part. ) May be fixed.

  In this way, the rotation detection device 1 shown in FIG. 1 is manufactured.

  As described above, in this embodiment, the integrated component of the mold IC 10 and the hollow magnet 20 is sealed with the sealing resin 40 different from the case 30. Specifically, in the resin molding process of the case, the case 30 having the connector part 31 and the airtight holding part 32 and having the terminal 33 inside is molded with resin, and in the resin sealing process, the mold IC is molded. From the integrated part of the hollow magnet to the airtight holding portion 32 of the case 30 is immersed in a liquid resin 41 and cured with resin, thereby sealing the resin.

  For this reason, according to this embodiment, since the resin sealing process is performed including the airtight holding part 32 of the case 30 in the resin sealing process, the thickness of the airtight holding part 32 is sealed in the resin molding process of the case. The thickness can be obtained by subtracting the thickness of the resin 40, and the airtight holding portion 32 of the case 30 can be resin-molded so as to be thinner than before. Therefore, the time for cooling and solidifying the resin can be shortened, and the time required for the resin molding process of the case can be shortened.

  In the present embodiment, in the resin molding process of the case, as shown in FIG. 3A, the terminal 33 is linear, and the connector portion 31 and the airtight holding portion 32 are arranged in a straight line. Although the case 30 is formed, the rotation detection device can be manufactured even if the portion closer to the connector portion 31 than the airtight holding portion 32 is changed to a bent shape.

  Therefore, the rotation detection device manufacturing method of the present embodiment is more flexible in designing the shape of the case 30 in the portion closer to the connector portion 31 than the airtight holding portion 32 in comparison with the manufacturing method described in Patent Document 2. Can be said to be expensive.

  By the way, as a manufacturing method different from the present embodiment, it is conceivable to perform the resin sealing step of the present embodiment by resin molding using a mold.

  However, since the mold is expensive, the use of the mold increases the product cost. Further, in resin molding using a mold, an integrated part of the mold IC 10 and the magnet 20 and the case 30 must be set inside the mold, which is troublesome.

  On the other hand, according to this embodiment, resin sealing can be performed without using a mold. As a result, an increase in product cost due to the use of the mold can be avoided. In addition, according to the present embodiment, since the resin is simply immersed in the liquid resin 41 and cured, it is less time-consuming than the case where the integrated parts 10 and 20 and the case 30 are set in the mold and resin molding is performed. In addition, the number of resin seals that can be sealed in a single resin sealing process is greater when the resin is cured by dipping in a liquid resin than when a mold is used.

(Second Embodiment)
4A to 4D show a manufacturing process of the rotation detecting device according to this embodiment. In the present embodiment, the resin sealing process is different from the manufacturing process of the rotation detecting device in the first embodiment, and this difference will be described below.

  In the resin molding process of the case, as shown in FIG. 4A, the connector part 31 and the airtight holding part 32 have a continuous shape, as in the first embodiment, and the terminal 33 is placed inside them. The integrated case 30 is molded. The case 30 has a shape having a hollow portion 32b inside the airtight holding portion 32, and the outer diameter of the airtight holding portion 32 is a finished size. In the case 30, one end 33 a of the terminal 33 is exposed inside the connector portion 31, the other end 33 b side of the terminal 33 is positioned in the hollow portion 32 b of the airtight holding portion 32, and the other end 33 b of the terminal 33 is the case. 30 is exposed at the airtight holding portion 32 side.

  Then, after joining the other end 33b side of the terminal 33 and the lead frame 11 of the mold IC 10, as shown in FIGS. 4B to 4D, an integrated component of the mold IC 10 and the hollow magnet 20 and the lead A step of resin-sealing the joining portion of the frame 11 and the terminal 33 and the terminal 33 inside the airtight holding portion 32 is performed.

  That is, as shown in FIG. 4 (b), the integrated part of the mold IC 10 and the hollow magnet 20 is pressed against the central portion of the thermoplastic resin sheet 51 that has been heated in advance, so that FIG. As shown, the sheet 51 is bent to bring the end of the sheet 51 into contact with the outer surface of the airtight holding section 32.

  The sheet 51 is preliminarily resin-molded into a sheet shape, and is of a size that can wrap from the integrated component of the mold IC 10 and the hollow magnet 20 to the terminal 33 inside the airtight holding portion 32, For example, the planar shape is circular.

  Subsequently, as shown in FIG. 4D, the integrated space is decompressed (evacuated) from the connector portion 31 through the gap between the case 30 and the terminal 33, so that the integrated component Then, the sheet 51 is brought into close contact with the lead frame 11 and the terminal 33 to form the sealing resin 50. At this time, the sheet 51 located on the outer surface of the airtight holding portion 32 is sucked inside the airtight holding portion 32.

  Then, the contact part of case 30 and the edge part of sealing resin 50 enclosed with the broken line in FIG.4 (d) is joined by seam welding, laser welding, etc. FIG. Thereby, the integrated components 10 and 20, the lead frame 11, and the terminal 33 are resin-sealed, and airtightness is maintained.

  As described above, also in this embodiment, the integrated component of the mold IC 10 and the hollow magnet 20 is sealed with the sealing resin 50 different from the case 30. Specifically, in the resin molding process of the case, the case 30 has a connector portion 31 and an airtight holding portion 32, the airtight holding portion 32 has a hollow portion 32b, and has a terminal 33 inside. In the resin sealing step, the sealing resin 50 formed by covering and attaching the integrated part of the mold IC 10 and the hollow magnet 20 to the terminal 33 exposed from the case 30 with a sheet-like resin 51. It is supposed to be sealed with.

  Therefore, according to the present embodiment, in the resin molding process of the case, since the case 30 is resin-molded with the airtight holding part 32 as a hollow structure, the resin molding is performed with the airtight holding part 32 of the case 30 thinner than before. it can. For this reason, the time for cooling and solidifying the resin can be shortened, and the time required for the resin molding process of the case can be shortened.

  Also in this embodiment, as in the first embodiment, the rotation detection device can be manufactured even if the portion of the case 30 closer to the connector portion 31 than the airtight holding portion 32 is changed to a bent shape. . Therefore, the rotation detection device manufacturing method of the present embodiment is more flexible in designing the shape of the case 30 in the portion closer to the connector portion 31 than the airtight holding portion 32 in comparison with the manufacturing method described in Patent Document 2. Can be said to be expensive.

  Also in this embodiment, since the molded IC 10 and the hollow magnet 20 can be resin-sealed without using a mold from the integrated part of the mold IC 10 and the hollow magnet 20 to the terminal 33 exposed from the case 30, similarly to the first embodiment. There is an effect that an increase in product cost due to the use of the mold can be avoided.

(Third embodiment)
FIGS. 5A and 5B show a manufacturing process of the rotation detection device according to this embodiment. In the present embodiment, a part of the manufacturing process of the rotation detecting device in the first embodiment is changed. Hereinafter, differences from the first embodiment will be described.

  In the present embodiment, only the mold IC 10 is prepared without using the hollow magnet 20. Then, the terminal 33 of the case 30 having the shape shown in FIG. 3A and the lead frame 11 of the mold IC 10 are joined.

  Thereafter, as shown in FIG. 5A, after the mold IC 10 to the airtight holding portion 32 are immersed in the liquid resin 42 mixed with the magnet raw material powder (magnetic powder), as shown in FIG. 5B. Then, the sealing resin 40 is formed by taking it out from the liquid resin 42 and cooling it to cure the resin.

  Thereafter, the portion 43 of the sealing resin 40 that covers the mold IC 10 is magnetized. As a result, the portion 43 of the sealing resin 40 that covers the mold IC 10 is caused to function as a magnet that applies a bias magnetic field to the magnetoresistive element.

  According to this embodiment, since the case 30 having the same shape as that of the first embodiment is formed, the same effect as that of the first embodiment can be obtained, and further, the following effect can be obtained. That is, when the hollow magnet 20 is used, the hollow magnet 20 is manufactured by magnetizing the molded body after resin molding using a resin mixed with magnet raw material powder. The resin molding process for manufacturing the hollow magnet 20 can be omitted.

(Fourth embodiment)
6A to 6C show a manufacturing process of the rotation detection device according to this embodiment. The present embodiment is obtained by changing a part of the manufacturing process of the rotation detection device in the second embodiment, and the difference will be described below.

  In the present embodiment, only the mold IC 10 is prepared without using the hollow magnet 20. Then, the terminal 33 of the case 30 having the shape shown in FIG. 4A and the lead frame 11 of the mold IC 10 are joined.

  Thereafter, as shown in FIG. 6 (a), by using a thermoplastic resin sheet 52 mixed with magnet raw material powder (magnetic powder), the mold IC10 is pressed against the center of the sheet 52 preheated, As shown in FIG. 6B, the sheet 52 is bent so that the end of the sheet 52 comes into contact with the outer surface of the airtight holding unit 32.

  Subsequently, as shown in FIG. 6C, by reducing the pressure (evacuating) the internal space wrapped with the sheet 52, the sheet 52 is brought into close contact with the mold IC 10, the lead frame 11, and the terminal 33. The sealing resin 50 is formed, and the contact portion between the case 30 and the end portion of the sealing resin 50 surrounded by a broken line in FIG.

  Thereafter, the portion 53 of the sealing resin 50 covering the mold IC 10 is magnetized. As a result, the portion 53 of the sealing resin 50 that covers the mold IC 10 is caused to function as a magnet that applies a bias magnetic field to the magnetoresistive element.

  According to the present embodiment, the case 30 having the same shape as that of the second embodiment is formed, so that the same effect as that of the second embodiment is achieved and the following effect is further achieved. That is, when the hollow magnet 20 is used, the hollow magnet 20 is manufactured by magnetizing the molded body after resin molding using a resin mixed with magnet raw material powder. The resin molding process for manufacturing the hollow magnet 20 can be omitted.

(Fifth embodiment)
7A, 7B, 8, 9A, and 9B show a manufacturing process of the rotation detection device according to the present embodiment. The present embodiment is obtained by changing a part of the manufacturing process of the rotation detection device in the second embodiment, and the difference will be described below.

  As shown in FIGS. 7A and 7B, an integrated part of the mold IC 10 and the hollow magnet 20 is accommodated in a bottomed cylindrical resin cap 60. FIGS. 7A and 7B are a perspective view and a cross-sectional view, respectively, of a cap 60 that houses an integrated part.

  Specifically, after the mold IC 10 and the hollow magnet 20 are assembled into an integrated part, the integrated part and the cap 60 are integrally formed using a mold. As described above, instead of simultaneously performing the resin molding of the cap 60 and the housing of the integrated component in the cap 60, the integrated component may be accommodated in the cap 60 after the cap 60 is resin-molded.

  Here, the reason why the integrated component is housed in the cap 60 is to complete the component as a component of the detection unit. When the detection unit is inspected before completion of the rotation detection device in the state accommodated in the cap 60, the inspection after completion of the rotation detection device can be completed by a simple inspection such as a continuity inspection. In addition, the shape of the case 30 of the rotation detecting device is changed depending on the type of engine to be attached, etc. However, the case where the integrated component is accommodated in the cap 60 is related to the type of engine to be attached. Instead, they can be common parts.

  On the other hand, as shown in FIG. 8, the case 30 is resin-molded (case resin molding step). Here, as in the second embodiment, the connector 30 and the airtight holding portion 32 have a continuous shape, and the case 30 in which the terminal 33 is integrated is formed. The case 30 has a shape having a hollow portion 32b inside the airtight holding portion 32, and the outer diameter of the airtight holding portion 32 is a finished size. Further, inside the airtight holding portion 32, a part 32c of the case 30 extends in the extending direction of the terminal 33, and the part 32c of the case 30 covers a part excluding the other end 33b of the terminal 33. . Further, the case 30 is provided with a fitting portion 37 that fits the cap 60 at the end of the airtight holding portion 32.

  Subsequently, the terminal 33 of the case 30 and the lead frame 11 of the mold IC 10 are joined, and the integrated part of the mold IC 10 and the hollow magnet 20 and the joint portion of the lead frame 11 and the terminal 33 are sealed.

  Specifically, as illustrated in FIG. 9A, the case 30 and the cap 60 are brought into contact with each other by covering the hollow portion 32 b of the hermetic sealing portion 32 of the case 30 with the cap 60. At this time, the end portion of the cap 60 is fitted to the fitting portion 37 of the case 30 while the terminal 33 and the lead frame 11 are in contact with each other.

  Subsequently, as shown in FIG. 9B, the portions surrounded by the broken lines are joined by ultrasonic welding. That is, the joining of the contact portion between the terminal 33 and the lead frame 11 and the joining of the contact portion between the case 30 and the cap 60 are simultaneously performed by ultrasonic welding. In this ultrasonic welding, the ultrasonic wave irradiated from the outside reaches the contact part, and the contact part vibrates and generates heat, thereby welding the contact part.

  By performing this ultrasonic welding, even when the contact portion between the terminal 33 and the lead frame 11 is covered with the cap 60 and the case 30, the terminal 33 and the lead frame 11 can be joined. Further, by making the resin constituting the case 30 and the resin constituting the cap 60 the same resin, the resin crystallizes at the joint between the case 30 and the cap 60 by ultrasonic welding, and complete sealing can be achieved. .

  Thus, in the present embodiment, in the resin molding process of the case, the connector portion 31 and the airtight holding portion 32 are included, and the airtight holding portion 32 has the hollow portion 32b, and the terminal 33 is provided inside. After the case 30 having resin is molded with resin, the hollow portion 32b is covered with a cap 60 to seal the integrated part of the mold IC 10 and the hollow magnet 20 to the terminal 33 exposed from the case 30.

  Therefore, according to the present embodiment, in the resin molding process of the case, since the case 30 is resin-molded with the airtight holding part 32 as a hollow structure, the resin molding is performed with the airtight holding part 32 of the case 30 thinner than before. it can. For this reason, the time for cooling and solidifying the resin can be shortened, and the time required for the resin molding process of the case can be shortened.

  Also in this embodiment, as in the first embodiment, the rotation detection device can be manufactured even if the portion of the case 30 closer to the connector portion 31 than the airtight holding portion 32 is changed to a bent shape. . Therefore, the rotation detection device manufacturing method of the present embodiment is more flexible in designing the shape of the case 30 in the portion closer to the connector portion 31 than the airtight holding portion 32 in comparison with the manufacturing method described in Patent Document 2. Can be said to be expensive.

(Sixth embodiment)
10A to 10C show a manufacturing process of the rotation detecting device in the present embodiment. In this embodiment, a part of the manufacturing process of the rotation detecting device in the fifth embodiment is changed, and only this difference will be described below.

  In this embodiment, as shown in FIGS. 10A and 10B, the cap 60 is put on the hollow portion 32 b of the case 30 so that the case 30 and the cap 60 are brought into contact with each other, and at the same time, the lead frame 11 and the terminal 33. The lead frames 11 and the terminals 33 are mechanically joined to each other by fitting the connector portions 71 and 72 provided at the respective tips. As the connector portions 71 and 72, a general male and female connector structure can be used.

  Then, as shown in FIG.10 (c), the contact part of case 30 and the cap 60 enclosed with the broken line is joined by ultrasonic welding similarly to 5th Embodiment. In addition, as a method for joining the case 30 and the cap 60, laser welding can be employed instead of ultrasonic welding. In this laser welding, the contact portion is irradiated with laser light to weld the contact portion. If the case 30 and the cap 60 are made of a thermoplastic resin such as PPS or PBT, the case 30 and the cap 60 are attached. It is possible to transmit the laser to reach the contact portion between them.

  In this manner, the terminal 33 and the lead frame 11 can be joined and the case 30 and the cap 60 can be joined. Also in this embodiment, since the case 30 having the same shape as that of the fifth embodiment is formed, the same effect as that of the fifth embodiment is obtained.

(Seventh embodiment)
FIGS. 11A to 11C show a manufacturing process of the rotation detection device according to this embodiment. In this embodiment, a part of the manufacturing process of the rotation detecting device in the fifth embodiment is changed, and only this difference will be described below.

  As shown in FIGS. 11A and 11B, the cap 60 is put on the hollow portion 32b of the hermetic sealing portion 32 of the case 30 so that the case 30 and the cap 60 are brought into contact with each other, and the terminal 33 and the lead frame. 11 is contacted, and the contact portion between the case 30 and the cap 60 surrounded by a broken line in FIG. 11B is joined by ultrasonic welding or laser welding.

  Subsequently, as shown in FIG. 11C, the contact portion between the terminal 33 and the lead frame 11 surrounded by a broken line is joined by laser welding. Note that the terminal 33 and the lead frame 11 may be joined before the case 30 and the cap 60 are joined.

  In this manner, the terminal 33 and the lead frame 11 can be joined and the case 30 and the cap 60 can be joined. Also in this embodiment, since the case 30 having the same shape as that of the fifth embodiment is formed, the same effect as that of the fifth embodiment is obtained.

  Further, according to the present embodiment, ultrasonic welding or laser welding of the case 30 and the cap 60 and laser welding of the terminal 33 and the lead frame 11 are performed separately, so that each welding is performed with different energy (power). It can be carried out. Therefore, the energy of the laser irradiated for welding the lead frame 11 and the terminal 33 can be made larger than the energy of the laser irradiated for welding the case 30 and the cap 60. The terminal 33 can be securely joined.

(Eighth embodiment)
12A to 12C show a manufacturing process of the rotation detecting device in the present embodiment. In this embodiment, a part of the manufacturing process of the rotation detecting device in the fifth embodiment is changed, and only this difference will be described below.

  In the present embodiment, a terminal 33 having a shape that can expand and contract (spring property) is used. Specifically, as shown in FIG. 12A, the terminal 33 located in the hollow portion 32 b of the case 30 has bent portions 81, 82, 83, and the bent portions 81, 82, 83 are bent. By stretching, the terminal 33 can be expanded and contracted. When the terminal 33 is extended, the other end 33 b of the terminal 33 protrudes from the case 30.

  Then, as shown in FIG. 12B, the lead frame 11 and the terminal 33 are joined together with the terminal 33 extended and the case 30 and the cap 60 separated. At this time, the portions surrounded by a broken line are joined by welding, heat caulking, ultrasonic welding, laser welding, or the like.

  Subsequently, as shown in FIG. 12C, the case 30 and the cap 60 are brought into contact with each other while the bent portions 81, 82, and 83 are bent to contract the terminal 33 and the case 30 and the cap 60 are brought into contact with each other. Join by sonic welding or laser welding.

  In this manner, the terminal 33 and the lead frame 11 can be joined and the case 30 and the cap 60 can be joined. Also in this embodiment, since the case 30 having the same shape as that of the fifth embodiment is formed, the same effect as that of the fifth embodiment is obtained.

  In addition, according to the present embodiment, the terminal 33 and the lead frame 11 are securely joined by giving the terminal 33 elasticity (spring property), and then the case 30 and the cap 60 are joined. be able to.

(Other embodiments)
(1) In the first and third embodiments, the airtight holding portion 32 of the case 30 is not in a shape having a hollow portion, but the shape of the case 30 is changed to the airtight holding portion 32 as in the second embodiment. It is good also as a shape which has the hollow part 32b.

  (2) In each of the embodiments described above, the rotation detection device of the present invention is applied to a crank angle sensor. However, the rotation detection device of the present invention is a subject that rotates a cam angle sensor, a vehicle speed sensor, a wheel speed sensor, or the like. It can be applied to those that detect the number of rotations or the direction of rotation.

1 Rotation detection device 10 Mold IC
DESCRIPTION OF SYMBOLS 11 Lead frame 20 Hollow magnet 30 Case 31 Connector part 32 Airtight holding | maintenance part 33 Terminal 40 Sealing resin 41 Liquid resin 42 Liquid resin which mixed the raw material powder for magnets 50 Sealing resin 51 Sheet-like resin 52 Raw material for magnets 52 Sheet-like resin mixed with powder 60 Cap 71 Terminal connector 72 Lead frame connector

Claims (9)

An IC chip having a magnetoresistive element and a lead frame (11) electrically connected to the IC chip, and a part of the lead frame (11) and the IC chip are covered with a resin (12). Mold IC (10),
A magnet (20) for applying a bias magnetic field to the magnetoresistive element;
When the mold IC (10) and the magnet (20) are inserted into the mounting hole (3), the airtight holding part (32) fixed to the mounting hole (3) while maintaining airtightness. )When,
In a method of manufacturing a rotation detection device comprising a connector portion (31) having a terminal (33) electrically connected to the lead frame (11),
A case (30) having a shape having the connector part (31) and the airtight holding part (32), wherein one end (33a) of the terminal (33) is located inside the connector part (31). In addition, the case (30) in which the other end (33b) of the terminal (33) is exposed on the airtight holding part (32) side of the case (30) is molded with a mold using a mold. Process,
Preparing an integrated part (10, 20) in which the mold IC (10) and the magnet (20) are integrated;
Joining the lead frame (11) of the integrated part (10, 20) and the other end (33b) side of the terminal (33);
The integrated part (10, 20), the joint between the lead frame (11) and the terminal (33) and the airtight holding part (32) of the case (30) are made into a liquid resin (41). A method of manufacturing a rotation detecting device, comprising performing a resin sealing step of sealing with a sealing resin (40) by dipping and curing the resin. An IC chip having a magnetoresistive element and a lead frame (11) electrically connected to the IC chip, and a part of the lead frame (11) and the IC chip are covered with a resin (12). Mold IC (10),
A magnet (20) for applying a bias magnetic field to the magnetoresistive element;
When the mold IC (10) and the magnet (20) are inserted into the mounting hole (3), the airtight holding part (32) fixed to the mounting hole (3) while maintaining airtightness. )When,
In a method of manufacturing a rotation detection device comprising a connector portion (31) having a terminal (33) electrically connected to the lead frame (11),
A case (30) having a shape having the connector part (31) and the airtight holding part (32), wherein one end (33a) of the terminal (33) is located inside the connector part (31). In addition, the case (30) in which the other end (33b) of the terminal (33) is exposed on the airtight holding part (32) side of the case (30) is molded with a mold using a mold. Process,
Preparing the mold IC (10);
Bonding the lead frame (11) of the mold IC (10) and the other end (33b) side of the terminal (33);
The mold IC (10), the joint between the lead frame (11) and the terminal (33), and the airtight holding part (32) of the case (30) are liquid resin in which magnet raw material powder is mixed. A resin sealing step of sealing with a sealing resin (40) by immersing in (42) and curing the resin;
And a step of magnetizing a portion (43) of the sealing resin (40) covering the mold IC (10). An IC chip having a magnetoresistive element and a lead frame (11) electrically connected to the IC chip, and a part of the lead frame (11) and the IC chip are covered with a resin (12). Mold IC (10),
A magnet (20) for applying a bias magnetic field to the magnetoresistive element;
When the mold IC (10) and the magnet (20) are inserted into the mounting hole (3), the airtight holding part (32) fixed to the mounting hole (3) while maintaining airtightness. )When,
In a method of manufacturing a rotation detection device comprising a connector portion (31) having a terminal (33) electrically connected to the lead frame (11),
A case (30) having a shape having a connector part (31) and an airtight holding part (32), the airtight holding part (32) having a hollow part (32b), and the terminal (33 The case (30) in which one end (33a) of the terminal (33) is located inside the connector part (31) and the other end (33b) of the terminal (33) is exposed on the airtight holding part (32) side, A resin molding process of a case for resin molding using a mold;
Preparing an integrated part (10, 20) in which the mold IC (10) and the magnet (20) are integrated;
Joining the lead frame (11) of the integrated part (10, 20) and the other end (33b) side of the terminal (33);
By covering the integrated parts (10, 20) and the lead frame (11) and the terminal (33) with a sheet-like resin (51) and bringing them into close contact with each other, a sealing resin (50) is used. A method for manufacturing a rotation detecting device, comprising performing a resin sealing step of sealing. An IC chip having a magnetoresistive element and a lead frame (11) electrically connected to the IC chip, and a part of the lead frame (11) and the IC chip are covered with a resin (12). Mold IC (10),
A magnet (20) for applying a bias magnetic field to the magnetoresistive element;
When the mold IC (10) and the magnet (20) are inserted into the mounting hole (3), the airtight holding part (32) fixed to the mounting hole (3) while maintaining airtightness. )When,
In a method of manufacturing a rotation detection device comprising a connector portion (31) having a terminal (33) electrically connected to the lead frame (11),
A case (30) having a shape having a connector part (31) and an airtight holding part (32), the airtight holding part (32) having a hollow part (32b), and the terminal (33 The case (30) in which one end (33a) of the terminal (33) is located inside the connector part (31) and the other end (33b) of the terminal (33) is exposed on the airtight holding part (32) side, A resin molding process of a case for resin molding using a mold;
Preparing the mold IC (10);
Bonding the lead frame (11) of the mold IC (10) and the other end (33b) side of the terminal (33);
A sealing resin is obtained by covering and closely bonding the joints of the mold IC (10) and the lead frame (11) with the terminal (33) with a sheet-like resin (52) mixed with magnet raw material powder. A resin sealing step of sealing in (50);
And a step of magnetizing a portion (53) of the sealing resin (50) covering the mold IC (10). An IC chip having a magnetoresistive element and a lead frame (11) electrically connected to the IC chip, and a part of the lead frame (11) and the IC chip are covered with a resin (12). Mold IC (10),
A magnet (20) for applying a bias magnetic field to the magnetoresistive element;
When the mold IC (10) and the magnet (20) are inserted into the mounting hole (3), the airtight holding part (32) fixed to the mounting hole (3) while maintaining airtightness. )When,
In a method of manufacturing a rotation detection device comprising a connector portion (31) having a terminal (33) electrically connected to the lead frame (11),
A case (30) having a shape having a connector part (31) and an airtight holding part (32), the airtight holding part (32) having a hollow part (32b), and the terminal (33 The case (30) in which one end (33a) of the terminal (33) is located inside the connector part (31) and the other end (33b) of the terminal (33) is exposed on the airtight holding part (32) side, A resin molding process of a case for resin molding using a mold;
A step of preparing a bottomed cylindrical resin cap (60) containing the mold IC (10) and the magnet (20);
Bonding the lead frame (11) of the mold IC (10) and the other end (33b) side of the terminal (33);
The lead frame (11) and the cap (60) are joined by joining the case (30) and the cap (60) in a state where the cap (60) is put on the hollow portion (32b) of the case (30). And a step of sealing the joint with the terminal (33). The cap (60) is put on the hollow portion (32b) of the case (30) to bring the case (30) and the cap (60) into contact with each other, and the lead frame (11) and the terminal (33). )
The step of joining the lead frame (11) and the terminal (33) and the step of joining the case (30) and the cap (60) are simultaneously performed by ultrasonic welding. A method for manufacturing the rotation detection device according to claim 5. The cap (60) is put on the hollow part (32b) of the case (30) to bring the case (30) and the cap (60) into contact with each other, and at the same time, the lead frame (11) and the terminal ( 33) After performing the step of joining the lead frame (11) and the terminal (33) by fitting the connector portions (71, 72) provided in each of the above,
The method for manufacturing a rotation detecting device according to claim 5, wherein the step of joining the case (30) and the cap (60) by ultrasonic welding or laser welding is performed. The cap (60) is put on the hollow portion (32b) of the case (30) to bring the case (30) and the cap (60) into contact with each other, and the lead frame (11) and the terminal (33). )
The step of joining the lead frame (11) and the terminal (33) by laser welding and the step of joining the case (30) and the cap (60) by ultrasonic welding or laser welding are performed separately. The method of manufacturing a rotation detecting device according to claim 5. Using the terminal (33) having an expandable shape,
A step of joining the lead frame (11) and the terminal (33) with the terminal (33) extended and the case (30) and the cap (60) separated from each other; After
The step of bringing the case (30) and the cap (60) into contact with each other while the terminal (33) is contracted, and then joining the case (30) and the cap (60) by ultrasonic welding or laser welding. The method for manufacturing a rotation detecting device according to claim 5, wherein:

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