WO2018037473A1

WO2018037473A1 - Laminated shaped object, shaping method, and terminal equipment

Info

Publication number: WO2018037473A1
Application number: PCT/JP2016/074460
Authority: WO
Inventors: 古市　浩朗; 太田　裕之; 司藤森; 桂司佐藤
Original assignee: 株式会社日立製作所
Priority date: 2016-08-23
Filing date: 2016-08-23
Publication date: 2018-03-01

Abstract

A laminated shaped object 10 formed by laminating and shaping resin layers comprises: a first resin part 21 formed by laminating a plurality of resin layers and having an opening part 13 with a cavity 13a formed therein; a second resin part 22 arranged in the opening part 13; and a third resin part 23 contacting the first resin part 21 and the second resin part 22. In addition, the third resin part 23 is made of a resin member having the same resin as that of the first resin part 21 as a main ingredient thereof, and the length of the third resin part 23 contacting the first resin part 21 in a direction in which the second resin part 22 and the third resin part 23 are arranged is at least equal to a thickness H of the thinnest part of an external wall of the first resin part 21 (the thickness of a single layer of the resin layer).

Description

Laminated molding, modeling method, and terminal device

The present invention relates to an additive manufacturing object, a forming method, and a terminal device.

Electronic parts used in outdoor environments are installed inside a resin or metal housing for waterproofing or moisture proofing, and then the housing openings or housings are sealed with resin packing or adhesive. The method to do is used a lot.

For example, as a method of irradiating a light beam to an inorganic or organic powder material and curing and laminating, a part of the uncured powder material is removed during the part manufacturing process, and the removed part is separated. Japanese Laid-Open Patent Publication No. 2000-190086 (Patent Document 1) discloses a method of embedding an embedding member manufactured in a process and then stacking a hardened layer by further irradiating a powder material with a light beam.

In addition, for a solar cell that has been formed in such a way that when the substrate is provided with uneven projections, depressions, steps or the like in advance and they are overlapped and joined, the internal space is shut off from the outside and sealed. A substrate (housing) is disclosed in Japanese Unexamined Patent Application Publication No. 2010-123556 (Patent Document 2).

JP 2000-190086 JP 2010-123556 A

The three-dimensional laminating method disclosed in Patent Document 1 is a method of repeatedly laminating a single powder and curing by irradiation with a light beam, and laminating layers having a thickness of about 0.1 mm per layer. For this reason, it is difficult to locally increase or decrease the lamination thickness. That is, the layered portion of the resulting layered object can only have a uniform layered structure in the stacking direction, and cannot have a structure partially formed by any layer thickness or stacking change in the stacking direction. For this reason, in order to embed a member manufactured in a separate process, it is necessary to stack and harden the powder material thereon and to stack it. In this case, in order to prevent the powder material from adhering to a device or the like installed inside the embedded member, it is necessary to incorporate the embedded member itself into a structure, for example, a box, and the embedded member itself is installed inside. It is larger than the apparatus, and a protective material such as a box is also required. As a result, the embedded member itself becomes large as a housing, and there is a problem that the structure becomes complicated.

Furthermore, in the above-mentioned Patent Document 1, a solder layer is formed in advance around the embedded member when an adhesive or sealant is injected and fixed between the portion from which the uncured powder material is removed and the embedded member. Also, a case where the solder is melted and fixed by heating the entire layered object is also disclosed. In this case, since different materials such as an adhesive and a sealing agent are injected, the thermal expansion coefficient of the embedded member and the joint as the entire housing are different, and the entire layered object as the housing is easily deformed thermally. There is a possibility.

Further, in the sealed casing described in Patent Document 2, the upper and lower two substrates are bonded with a sealing material or a bonding material that is a different material, and therefore the portion to be bonded becomes as long as the entire four sides of the substrate. The risk of leakage of the sealed state increases. Moreover, since they are joined with different materials, they have different coefficients of thermal expansion and may be easily thermally deformed.

An object of the present invention is to provide a technology that can easily and highly seal the internal space of a layered object that has been formed rapidly and flexibly in accordance with the shape of an object by a three-dimensional layered object manufacturing method. It is to provide. Moreover, it is providing the technique which can suppress a thermal deformation by sealing with the same material.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

Of the inventions disclosed in this application, the outline of typical ones will be briefly described as follows.

The layered object of the present invention includes a first member having an opening in which a resin layer is laminated and a cavity is formed therein, a second member disposed in the opening, and the first member And a third member that contacts the second member, and an arrangement direction of the third member and the second member at a portion where the third member and the first member are in contact with each other Is longer than the thickness of the single layer of the resin layer.

The terminal device according to the present invention includes a first member having an opening in which a resin layer is laminated and a cavity is formed therein, a sensor disposed in the cavity, and a second disposed in the opening. And the third member in contact with the first member and the second member, and the third member in a portion where the third member and the first member are in contact with each other The length of the second member in the arrangement direction is equal to or greater than the thickness of the single layer in the resin layer.

In the molding method of the present invention, (a) a resin powder is sintered with a laser whose position is controlled based on numerical data to form a plurality of thin layers, and the plurality of thin layers are laminated to form an interior of the opening. Removing the uncured resin powder to form a first resin portion having an opening including a cavity. Further, (b) after the step (a), a step of inserting and fixing a second resin portion pre-formed in the same cross-sectional shape as the cross-sectional shape of the opening into the opening of the first resin portion, (C) After the step (b), the same material as the first resin part so as to contact the second resin part at a position outside the second resin part in the opening of the first resin part. Disposing a powder comprising: Further, (d) after the step (c), the powder is melt-cured and brought into contact with the second resin part at a position outside the second resin part in the opening of the first resin part. Forming a third resin portion to seal the cavity of the first resin portion.

Among the inventions disclosed in the present application, the effects obtained by typical ones will be briefly described as follows.

¡The internal space of the three-dimensional layered object can be easily sealed and airtight.

It is a perspective view which shows an example of the external appearance structure of the three-dimensional layered object based on Embodiment 1 of this invention. FIG. 2 is a cross-sectional view taken along the line A-A ′ of the three-dimensional layered object shown in FIG. 1. It is sectional drawing which shows the modeling method of the 1st member of the three-dimensional layered object shown in FIG. It is sectional drawing which shows the processing method of the inner wall of the 1st member of the three-dimensional layered object shown in FIG. It is sectional drawing which shows the method of fixing a 2nd member to the opening part of the 1st member of the three-dimensional layered object shown in FIG. It is sectional drawing which shows the method of fixing a 3rd member to the opening part of the 1st member of the three-dimensional layered object shown in FIG. It is sectional drawing which shows the state completed by fixing the 3rd member to the opening part of the 1st member of the three-dimensional layered object shown in FIG. It is sectional drawing which shows an example of the structure of the three-dimensional layered object based on Embodiment 2 of this invention. It is sectional drawing which shows an example of the lead terminal embedding structure which is a three-dimensional lamination-molded article concerning Embodiment 3 of this invention. It is sectional drawing which shows an example of the structure which provided the thermoelectric conversion element in the three-dimensional laminate modeling thing which concerns on Embodiment 4 of this invention. It is sectional drawing which shows an example of the structure which provided the thermoelectric conversion element in the three-dimensional laminate modeling thing which concerns on Embodiment 5 of this invention. It is sectional drawing which shows an example of the structure which provided the solar panel in the three-dimensional layered object which concerns on Embodiment 6 of this invention. It is sectional drawing which shows the method of installing a sensor inside the 1st member of the three-dimensional layered object shown in FIG. It is sectional drawing which shows the method of fixing a solar panel and a 3rd member in the inside of the 1st member of the three-dimensional laminate modeling thing shown in FIG. It is sectional drawing which shows an example of the structure which fixes a solar panel with the 5th member in the three-dimensional layered object based on Embodiment 7 of this invention. It is sectional drawing which shows an example of the lead wire embedding structure of the three-dimensional layered object based on Embodiment 8 of this invention.

In the following embodiments, the description of the same or similar parts will not be repeated in principle unless particularly necessary.

Further, in the following embodiment, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments, but they are not irrelevant to each other unless otherwise specified. The other part or all of the modifications, details, supplementary explanations, and the like are related.

Also, in the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), particularly when clearly indicated and when clearly limited to a specific number in principle, etc. Except, it is not limited to the specific number, and it may be more or less than the specific number.

Further, in the following embodiments, the constituent elements (including element steps) are not necessarily indispensable unless otherwise specified and clearly considered essential in principle. Needless to say.

Further, in the following embodiments, regarding constituent elements and the like, when “consisting of A”, “consisting of A”, “having A”, and “including A” are specifically indicated that only those elements are included. It goes without saying that other elements are not excluded except in the case of such cases. Similarly, in the following embodiments, when referring to the shapes, positional relationships, etc. of the components, etc., the shapes are substantially the same unless otherwise specified, or otherwise apparent in principle. And the like are included. The same applies to the above numerical values and ranges.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof will be omitted. Further, even a plan view may be hatched for easy understanding of the drawing.

(Embodiment 1)
FIG. 1 is a perspective view showing an example of the external structure of a three-dimensional layered object according to Embodiment 1 of the present invention, and FIG. 2 is cut along the line AA ′ of the three-dimensional layered object shown in FIG. It is sectional drawing. 3 to 7 are cross-sectional views illustrating the procedure of the method for forming the three-dimensional layered object shown in FIG.

Hereinafter, the structure of the three-dimensional layered object 10 of the first embodiment and the modeling method will be described.

A three-dimensional layered object (also referred to as a three-dimensional layered sealing structure) 10 is formed by three-dimensional layered object modeling (generally often referred to as a three-dimensional printer), and employs a powder bed fusion bonding method. Yes. The powder bed fusion bonding method is, for example, a laser or the like that selectively forms the shape of a thinly spread thermoplastic powder resin having a particle size of about 0.1 mm or less, such as PA12 (Polyamid12, nylon resin). , And the resin is melted and cured to form a shaped object having a thickness of about 0.1 mm, and a three-dimensional shaped object is formed by sequentially repeating the lamination.

In the above powder bed fusion bonding method, since the uncured resin powder supports the lower surface of the structure at the time of modeling, a support material that supports the structure is unnecessary, and the next resin is layered on the uncured resin. Is possible.

First, the structure of the three-dimensional laminated sealing structure (hereinafter, also simply referred to as a layered product) 10 shown in FIG. 1 and its modeling method will be described. The layered object 10 is melted by laying a powder layer of a thermoplastic resin having a layer thickness H of about 0.1 mm in the XY plane and irradiating a laser beam 31 (see FIG. 2) on a location based on CAD data. In this structure, the cured layers are sequentially laminated in the + direction of the Z-axis to form the first resin portion (first member) 21. Then, a horizontal hole type cavity is formed in the middle of the lamination of the first resin portion 21, that is, inside the first resin portion 21 shown in FIG. 2, and the third resin portion (third member) is formed in the opening 13. 23 is formed and has a structure with a lid. Further, as shown in FIG. 1, the bottom surface 26 of the first resin portion 21 is shaped to fit the surface of the object 11, for example, a cylindrical pipe, and is formed in the fixing hole 12a or the fixing hole 12b. It can be fixed with screws or strings.

Specifically, as shown in FIG. 2, the first resin portion (first member) 21 is formed by stacking a plurality of thin resin layers having a stacking thickness H of about 0.1 mm by three-dimensional stacking. In the middle of the lamination, a horizontal hole type cavity (opening 13 having a cavity 13a formed therein) is provided. A sensor 42 mounted on a substrate (circuit board) 41, an IC (Integrated Circuit), a battery, and the like are provided inside (cavity portion 13a), and a wireless antenna 43 and the like are installed above the sensor 42. Here, the sensor 42 is connected to the wireless antenna 43 for detecting temperature, vibration, acceleration, and the like, and has a function of transmitting a sensor signal to the outside via the first resin portion 21. . The case that covers and protects the sensor 42 and the antenna 43 for wireless transmission with the outside has a configuration formed by the first resin portion 21 made of resin. In addition, first, a second resin portion (second member) 22 shaped in advance is placed (arranged) in the opening 13 as a plug, and the inside of the cavity (cavity portion 13a) is temporarily sealed. Thereafter, the outer portion of the second resin portion 22 in the opening portion 13 is fixed by the third resin portion 23 to fully seal the cavity portion 13a.

Therefore, the third resin portion (third member) 23 is in contact with both the first resin portion 21 and the second resin portion 22.

Hereinafter, the procedure of the modeling method of the layered object 10 that is a three-dimensional layered encapsulated structure will be described in detail with reference to FIGS. 3 to 7 showing cross sections AA ′ crossing the first resin portion 21 of FIG. To do. 2 to 7, the object 11 is omitted.

First, as shown in FIG. 3, the first resin portion 21 has a powder layer of a thermoplastic resin having a lamination thickness H of about 0.1 mm in the XY (see FIG. 1) plane, and CAD data (numerical data). ), A layer obtained by irradiating a position-controlled laser beam 31 with a laser scan 32 and melting and hardening (sintering) the layer is sequentially laminated in the + direction of the Z axis. During the lamination of the first resin portion 21, that is, inside the first resin portion 21 (the hollow portion 13a inside the opening portion 13 in FIG. 2), the powder 24 that is not melted and solidified by the laser beam 31 (uncured) Leave the part as it is. Further, the bottom surface 26 of the first resin portion 21 is shaped as the sensor 42 of FIG. 2 according to the surface shape of the measurement object and customized as an attachment surface.

Next, as shown in FIG. 4, the powder 24 in FIG. 3 inside the first resin portion 21 is uncured, and is therefore scraped with a rod-like member such as a needle. That is, the uncured powder 24 in the opening 13 and the cavity 13a is removed. The powder 24 remaining on the inner wall 25 is blown away by air blow, or the same resin powder is removed by blasting with air or the like to form a horizontal hole type hollow portion (opening portion 13 where the hollow portion 13a is formed). Since the inner wall 25 of the hollow portion (opening 13 and hollow portion 13a) is a surface obtained by melting and hardening the powder 24, the outermost powder 24 may be peeled off. When the sensor 42 installed in the cavity 13a wants to avoid contact with the powder 24, the inner wall 25 is impregnated and cured with a liquid adhesive or the like to form a thin resin film, and the powder 24 on the surface of the inner wall 25 is formed. It is also possible to prevent detachment. Furthermore, when the above impregnation is performed, moisture and water vapor are less likely to permeate than in the case of only the first resin portion 21, so that the airtightness of the cavity portion 13 a can be improved and the waterproof and moisture proof property is improved. You can also.

Then, as shown in FIG. 5, a sensor 42, an IC, a battery, and the like mounted on the substrate 41 are arranged in the cavity 13 a in the opening 13 of the first resin portion 21, and further, a wireless communication device is disposed above the sensor 42. An antenna 43 and the like are installed. Thereafter, the second resin part 22 shaped in advance with a dimension (same cross-sectional shape) that is the same as the cross-sectional shape of the opening part 13 and can be press-fitted in the opening part 13 is installed as a plug for the hollow part 13a (insertion 51).・ Fix it. The second resin portion 22 is made of the same material as the first resin portion 21 (material having the same resin as a main component), but does not need to have the same laminated structure as the first resin portion 21, and is formed by extrusion or the like. It may be what was done. Further, when it is desired to reduce the humidity in the hollow portion 13a in order to prevent condensation, the second resin portion 22 may be press-fitted by replacing with dry air or nitrogen gas. As described above, the inside of the cavity 13a in the laminated structure is temporarily sealed.

Next, as shown in FIG. 6, the same resin as the first resin portion 21 and the second resin portion 22 is located outside the second resin portion 22 installed in the opening 13 of FIG. 5 of the first resin portion 21. The powder 24 is embedded (arranged) in contact with the second resin portion 22. The powder 24 is locally heated and melted and cured by a heating light 52 or a laser beam (not shown). Then, the third resin portion 23 is formed in contact with the second resin portion 22 at a position outside the second resin portion 22 in the opening 13 of the first resin portion 21. Thereby, the opening 13 and the cavity 13a of the first resin portion 21 are sealed by the third resin portion 23. As shown in FIG. 7, the third resin portion 23 is made of the same material as the first resin portion 21 (material having the same resin as a main component), but is different from the first resin portion 21 in a laminated structure. It may be a structure that is not laminated. Further, the third resin portion 23 is not shaped in advance like the second resin portion 22, and the shape of the inner wall 25 shown in FIG. 4 of the first resin portion 21 is used to heat and melt the powder 24. Accordingly, it is possible to cure by closely adhering at the time of melting, thereby achieving the main sealing with further improved airtightness. Here, the second resin portion 22 also plays a role of damming the powder 24 before being cured by the third resin portion 23 so that the powder 24 does not adhere to the sensor 42 or the like installed in the cavity portion 13a. Since the second resin portion 22 is press-fitted into the opening portion 13, the powder 24 can be prevented from entering the cavity portion 13a.

The contact length L3 of the third resin portion 23 with the first resin portion 21 is the wall thickness d of the thinnest wall portion of the first resin portion 21 (the thickness of the thinnest portion of the outer wall of the first resin portion 21). ) It is desirable to set the above (contact length L3 ≧ wall thickness d). In general, moisture and water vapor are more likely to permeate and penetrate from the joint between the resins than directly through the resin wall, so the length of the joint (here, the contact length L3) is equal to or greater than the resin wall thickness d. This avoids concentration of permeation into the joint. Moreover, since the 1st resin part 21 is modeled by a three-dimensional lamination system, the thinnest wall thickness d which can be modeled becomes the lamination thickness H in principle, and in other words, the contact length L3 ≧ the lamination thickness H. Is also possible. That is, the length L3 of the arrangement direction (direction along the Y direction in FIG. 7) of the third resin portion 23 and the second resin portion 22 in a portion where the third resin portion 23 and the first resin portion 21 are in contact with each other is It is more than the thickness H of the single layer in a resin layer (L3> = H). Further, assuming that the third resin portion 23 leaks, the contact length L2 of the second resin portion 22 with the first resin portion 21 is also equal to or greater than the wall thickness d of the thinnest wall portion of the first resin portion 21 ( Needless to say, it is desirable to set the contact length L2 ≧ wall thickness d). That is, the length L2 of the arrangement direction (direction along the Y direction in FIG. 7) of the third resin portion 23 and the second resin portion 22 at the portion where the second resin portion 22 and the first resin portion 21 are in contact with each other is It is desirable to set the thickness to the thickness of the thinnest part of the outer wall of the first resin portion 21 (wall thickness d or single layer thickness H).

The sealing of the internal space (hollow part 13a) of the three-dimensional layered object can be facilitated and airtight by the layered object 10 of the first embodiment and the modeling method thereof. That is, the sealing performance inside the three-dimensional layered object can be improved. Specifically, it becomes possible to incorporate the sensor 42 inside the three-dimensional layered object and seal the sensor 42 with a resin casing having high airtightness.

That is, the internal space (hollow portion 13a) is plugged with the second resin portion 22, and then the outside is sealed with the third resin portion 23 (contact length L3 ≧ wall thickness d), thereby causing a leak path. Can be secured for a longer time, and the airtightness of the cavity 13a can be improved.

Furthermore, since the powder can be cured little by little by forming the third resin portion 23 by melting and curing the powder 24, the sealing can be facilitated and the sealing performance can be further improved. it can.

In other words, in order to utilize a modeling object that is modeled quickly and flexibly in accordance with the shape of the object by the three-dimensional additive manufacturing method as a housing for waterproofing or moisture-proofing, the internal space (cavity part) of the modeling object The sealing of 13a) can be facilitated and airtight. Moreover, the thermal deformation in the layered object 10 can be suppressed by sealing with the same resin material.

Further, by sealing the internal space (cavity portion 13a) of the layered object 10 with the second resin portion 22 and the third resin portion 23, the structure of the layered object 10 is simplified and the size of the layered object 10 is reduced. Can be achieved.

Furthermore, the cost of the layered object 10 can be reduced by facilitating the sealing of the layered object 10.

In addition, according to the first embodiment, a sensor terminal (terminal device) in which the sensor 42 is embedded and sealed in the hollow portion 13a of the layered object 10 can be realized. As the sensor 42, temperature, humidity, acceleration ( Sensing such as vibration) can be realized. Collecting these sensor terminals, attaching them to equipment and workers in the factory, and collecting and analyzing sensor data from them in the cloud such as a server wirelessly or wiredly, collecting highly durable sensor data System construction is also possible.

(Embodiment 2)
FIG. 8 is a cross-sectional view showing an example of the structure of the three-dimensional layered object according to Embodiment 2 of the present invention. The layered object 10a by three-dimensional lamination shown in FIG. 8 is similar to FIG. 2 in addition to the second resin part 22 and the third resin part 23. 4 member) 29 is provided. The fourth resin portion 29 is in contact with the first resin portion 21 and the second resin portion 22 and is embedded in the first resin portion 21. In the first embodiment, it is assumed that the second resin portion 22 is press-fitted into the opening portion 13. However, depending on the shape of the opening portion 13, it is difficult to achieve a press-fit dimension relationship, and the second resin portion 22 is in the Y-axis direction. It may move to. In this case, a hole is also provided in a direction (Z-axis direction) different from the press-fitting direction (Y-axis + direction), and the fourth resin portion 29 is formed by a method of filling and melting and solidifying the powder in the same manner as described above. As a result, the position of the second resin portion 22 can be fixed. That is, the second resin portion 22 is wedged by the fourth resin portion 29.

Here, the contact length L4 of the fourth resin portion 29 with the first resin portion 21 is set to be not less than the wall thickness d of the thinnest wall portion of the first resin portion 21 (contact length L4 ≧ wall thickness d). This is desirable as in the first embodiment. The contact length L4 ≧ the thinnest portion d ′ of the wall thickness may be set, or the contact length L4 ≧ the thickness H of the single layer of the resin layer may be set.

Thereby, it is possible to prevent the second resin portion 22 from moving, and it is possible to further increase the airtightness of the hollow portion 13a of the first resin portion 21.

(Embodiment 3)
FIG. 9 is a cross-sectional view showing an example of a lead terminal embedded structure which is a three-dimensional layered object according to Embodiment 3 of the present invention.

9, the layered object 10b by three-dimensional lamination has a substrate (circuit board) 41 disposed in the cavity 13a of the first resin portion 21 and the substrate 41 in the cavity 13a. However, it is assumed that the sensor signal is drawn out by wire instead of wirelessly. Here, a lead terminal 27, which is a lead wire, is connected to the right end of the substrate 41, and the lead terminal 27 is drawn to the outside of the first resin portion 21 through a terminal resin portion 28 provided in the first resin portion 21. Yes. That is, one end of the lead terminal 27 connected to the substrate 41 is drawn out and arranged outside the cavity portion 13 a via the terminal resin portion 28 that is a part of the first resin portion 21. As with the third resin portion 23, the terminal resin portion 28 is filled with powder inside the hole, and is locally heated and melted and cured with a heating light 52 or a laser beam (not shown) shown in FIG. It is a thing.

Here, when the terminal resin portion 28 is not provided with a portion corresponding to the second resin portion 22 that functions as a plug of powder, the powder before solidifying the terminal resin portion 28 is contained in the cavity portion 13a. There is a possibility of getting in. When the powder enters, the powder may be removed by suction or the like before sealing with the second resin portion 22 and the third resin portion 23. The portion corresponding to the powder plug of the second resin portion 22 is It is not always necessary. Further, the contact length L8 of the terminal resin portion 28 with the first resin portion 21 may be set to be equal to or greater than the wall thickness d of the thinnest wall portion of the first resin portion 21 (contact length L8 ≧ wall thickness d). What is desirable is the same as in the second embodiment. That is, the length L8 of the terminal resin portion 28 that is a part of the first resin portion 21 covering the lead terminal 27 is equal to or greater than the wall thickness d of the thinnest wall portion of the first resin portion 21 (contact length L8 ≧ wall thickness). It is desirable to set to d). Or it is good also as said contact length L8> thickness H of the single layer of a resin layer.

Thereby, even in the layered object 10b in which the lead terminal 27 connected to the substrate 41 is drawn to the outside, the airtightness of the cavity portion 13a of the first resin portion 21 can be increased.

(Embodiment 4)
FIG. 10 is a cross-sectional view showing an example of a structure in which a thermoelectric conversion element is provided in a three-dimensional layered object according to Embodiment 4 of the present invention.

A layered object 110 by three-dimensional lamination shown in FIG. 10 is a layer obtained by laying a thermoplastic resin powder layer having a lamination thickness H of about 0.1 mm as described above and irradiating a laser beam (not shown) to melt and harden. Are sequentially laminated in the + direction of the Z-axis to form the first resin portion 121. And in the left half (side where the fins 171 are not arranged) of the layered object 110 by three-dimensional lamination in FIG. A heat-insulating cavity 191 is formed, and a sensor-embedded cavity 192 is formed above it.

On the other hand, a thermoelectric conversion element 161 capable of generating electric power by utilizing a temperature difference and a fin 171 connected to one end thereof are incorporated in the right half (side on which the fin 171 is disposed) of the three-dimensional layered object 110. Shape into a shape that can be done. A sensor 142 and its substrate 41 are installed in the left-side half sensor-containing cavity 192 and are sealed with the second resin portion 122 and the third resin portion 123 in the same manner as described above. The thermoelectric conversion element 161 on the right half has a structure that can be installed in contact with the measurement object 111 and the fins 171.

That is, one end of the lead wire 127 connected to the substrate 41 installed in the hollow portion 192 of the layered object 110 is connected to the power generation device 165. In the fourth embodiment, the power generation device 165 is a thermoelectric conversion module having a thermoelectric conversion element 161.

As an actual measurement form, for example, the bottom surface 26 of the three-dimensional layered object 110 is formed in a shape that fits the surface of the object 111 that is a pipe, and can be fixed to the object 111 with a screw or the like. . When the pipe (the object 111) is hot, the high temperature side 162 of the thermoelectric conversion element 161 is protruded slightly outward from the bottom surface 26 of the layered object 110 so that the object 111 is easily contacted. That is, the mounting surface 162a on the high temperature side 162 of the thermoelectric conversion module is flush with the bottom surface 26 of the first resin portion 121, or protrudes from the bottom surface 26 of the first resin portion 121 so as to easily contact the object 111. It is like that.

Meanwhile, the low temperature side 163 is brought into contact with the fins 171 cooled by the wind 181. Further, the sensor 142 is insulated by the hollow portion 191 and has a structure that is not easily affected by the high-temperature object 111. The thermoelectric conversion element 161 can generate electric power according to a temperature difference generated by the heat flow 164 between the high temperature side 162 and the low temperature side 163, and power is supplied to the sensor 142 via the lead wire 127. As described above, it is possible to obtain a sensor signal without power supply from the outside due to power generation at a temperature difference.

According to the layered object 110 having the thermoelectric conversion module according to the fourth embodiment, since the substrate 41 in the layered object 110 is connected to the power generation device 165, the sensor 142 is wirelessly controlled without a battery. can do.

(Embodiment 5)
FIG. 11 is a cross-sectional view showing an example of a structure in which a thermoelectric conversion element is provided on a three-dimensional layered object according to Embodiment 5 of the present invention. As in FIG. 10 of the fourth embodiment, in FIG. 11, the left half of the three-dimensional laminate structure 210 is a sensor built-in structure, and the right half is a structure for a thermoelectric conversion element. On the left half (the side where the fins 271 are not disposed), a sensor-embedded cavity 292 is formed in the first resin portion 221 at the stage where the resin layer is formed by laminating the resin layer. The cavity portion 291 for heat insulation is formed. The sensor 242 and the substrate 41 are installed in the sensor built-in cavity 292 and sealed with the second resin portion 222 and the third resin portion 223.

On the other hand, the thermoelectric conversion element 261 on the right half (the side on which the fins 271 are arranged) has a structure that can be installed in contact with the measurement object 211 and the fins 271.

That is, one end of the lead wire 227 connected to the substrate 41 installed in the hollow portion 292 of the layered object 210 is connected to the power generation device 265. In the fifth embodiment, the power generation device 265 is a thermoelectric conversion module having a thermoelectric conversion element 261.

As an actual measurement mode, for example, the bottom surface 26 of the three-dimensional layered object 210 is formed in a shape that fits the surface of the object 211 that is a pipe, and can be fixed to the object 211 with a screw or the like. . When the pipe (the object 211) is low temperature, the low temperature side 263 of the thermoelectric conversion element 261 is slightly protruded from the bottom surface 26 of the layered object 210 so that the object 211 is easily contacted. That is, the mounting surface 263a on the low temperature side 263 of the thermoelectric conversion module is flush with the bottom surface 26 of the first resin portion 221 or protrudes from the bottom surface 26 of the first resin portion 221 to easily contact the object 211. It is like that.

Meanwhile, the high temperature side 262 is brought into contact with the fins 271 heated by the wind 281. The sensor 242 is insulated by the hollow portion 291 and has a structure that is not easily affected by the high-temperature wind 281. The thermoelectric conversion element 261 can generate electric power according to the temperature difference generated by the heat flow 264 between the high temperature side 262 and the low temperature side 263, and power is supplied to the sensor 242 via the lead wire 227. As described above, even if the state of the temperature difference between the object and the ambient air is reversed, the sensor signal can be obtained by self-power generation with no external power supply as described above.

According to the layered object 210 having the thermoelectric conversion module of the fifth embodiment, the substrate 41 in the layered object 210 is connected to the power generation device 265 in the same manner as the layered object 110 of the fourth embodiment. Therefore, the sensor 242 can be wirelessly controlled without using a battery.

(Embodiment 6)
FIG. 12 is a cross-sectional view showing an example of a structure in which a solar panel is provided on a three-dimensional layered object according to Embodiment 6 of the present invention. FIGS. 13 and 14 are cross-sectional views showing a method of installing a sensor inside the first member of the three-dimensional layered object shown in FIG. 12, or a method of fixing the solar panel and the third member. is there.

First, as shown in FIG. 13, the layered object 310a by three-dimensional lamination in FIG. 12 is formed by sequentially laminating a layer of melt-cured powder by laser irradiation as shown in FIG. In this structure, a stepped circuit space 371 and a panel space 372 are formed. A sensor 342 is installed in the circuit space 371 in the lower recess of the three-dimensional layered object 310a, and a lead wire for connecting to the solar panel (also referred to as a solar power generation panel) 361 shown in FIG. 327a is a prepared structure. A panel space 372 in the upper recess shown in FIG. 13 is a larger space than the solar panel 361 in FIG. Then, as shown in FIG. 14, a solar panel 361 as a second member is installed in the panel space 372 of the upper concave portion shown in FIG. 13, and the surrounding gap 373 is filled with the resin powder 24 Then, it is melted and cured by irradiating the laser beam 31 to form a third resin portion 323a and a third resin portion 323a ′ shown in FIG. 12, and the solar panel 361 is sealed.

That is, in the layered object 310a, as shown in FIG. 12, the solar panel 361 (second member) is arranged at the center of the panel space 372 in FIG. 13 which is the opening of the first resin portion 321a. Yes. Each of the third resin portion 323a and the third resin portion 323a 'is in contact with the inner peripheral wall 372a of the panel space 372 of the first resin portion 321a and the outer peripheral portion of the solar panel 361.

As an actual measurement mode, as shown in FIG. 12, the solar panel 361 receives light such as illumination at the sensor installation location, and can generate power, and power is supplied to the sensor 342 via the lead wire 327a. As described above, a sensor signal can be obtained by ambient light even in a state where there is no external power supply.

In the case of FIG. 12, it is possible to seal the sensor 342 with the solar panel 361 itself and the third resin portion 323a and the third resin portion 323a ′ around the solar panel 361, and the installation and assembly of the sensor 342 can be easily performed. There are benefits. The contact length L3 ′ between the solar panel 361, the third resin portion 323a and the third resin portion 323a ′ is equal to or greater than the wall thickness d of the thinnest wall portion of the first resin portion 321a (contact length L3 ′). It is desirable to set ≧ wall thickness d) as described above.

Moreover, since the material of the solar panel 361 is mainly glass or Si, it has a low coefficient of thermal expansion of about 3 to 10 ppm / K. On the other hand, since the first resin part 321a has a high coefficient of thermal expansion of 50 to 100 ppm / K, the difference in the coefficient of thermal expansion from the solar panel 361 is large, and stress due to thermal stress is applied to the sealing part of the solar panel 361. The probability that it occurs around the entire periphery and becomes the leak path 381 shown in FIG. 12 increases. For this reason, in the structure of the layered object 310a of the sixth embodiment, an inorganic substance such as glass fiber is added to the powder constituting the first resin portion 321a, the third resin portion 323a, and the third resin portion 323a ′, and the heat The expansion coefficient can be lowered to, for example, about 20 to 50 ppm / K. As a result, stress due to thermal stress can be reduced, and sealing reliability can be improved.

(Embodiment 7)
FIG. 15: is sectional drawing which shows an example of the structure which fixes a solar panel with the 5th member in the three-dimensional layered object based on Embodiment 7 of this invention. In the structure shown in FIGS. 12 to 14, only the third resin portion 323a and the third resin portion 323a ′ are formed in the gap 373 around the solar panel 361. However, in FIG. First, a fifth resin portion (fifth member) 325a and a fifth resin portion 325a ′, which are preliminarily shaped with a size that can be press-fitted, are installed in the gap 373 (see FIG. 13) around as a plug. That is, the layered object 310a shown in the seventh embodiment includes a fifth resin portion (fifth member) 325a and a fifth resin arranged so as to surround the outer peripheral portion of the solar panel (second member) 361. Part (fifth member) 325a ′. The third resin portion (third member) 323a and the third resin portion 323a ′ are respectively a first resin portion (first member) 321a, a solar panel (second member) 361, and a fifth resin portion. (Fifth member) 325a and fifth resin portion (fifth member) 325a ′ are in contact.

The fifth resin portion 325a and the fifth resin portion 325a ′ are made of the same material as that of the first resin portion 321a. However, unlike the first resin portion 321a, the fifth resin portion 325a and the fifth resin portion 325a ′ are not required to have a laminated structure. It may be what was done. Furthermore, you may embed the powder 24 of the same resin as the 1st resin part 321a in the clearance gap 373 shown in FIG. The powder 24 is locally heated and melted and cured by the heating light 52 shown in FIG. 6 or the laser light 31 shown in FIG. 14 to form the third resin portion 323a and the third resin portion 323a '. The third resin portion 323a and the third resin portion 323a ′ are not shaped in advance like the fifth resin portion 325a and the fifth resin portion 325a ′, but are used for heating and melting and curing the powder 24. According to the shape of the inner wall of the gap 373, it can be adhered and cured at the time of melting, and a sealing structure with further improved airtightness can be obtained.

(Embodiment 8)
FIG. 16 is a cross-sectional view showing an example of a lead wire embedded structure of a three-dimensional layered object according to Embodiment 8 of the present invention. In the structure shown in FIG. 16, a solar panel (second member) 361 is installed in a panel space 372 that is a recess (second opening) in the upper half portion of the layered object 310b by three-dimensional lamination. The periphery is sealed with a third resin portion 323b. In addition, in the lower half of the layered object 310b, a side hole type cavity 392 is provided independently of the recess for the solar panel 361 (panel space 372), as in FIG. A sensor 342 is installed therein, and the cavity portion 392 is sealed with the second resin portion 322a and the third resin portion 323c.

In other words, the first resin portion (first member) 321b has a cavity portion 392 that is a first opening portion and a panel space 372 that is a second opening portion, and the opening portion 393 of the cavity portion 392 includes The second resin portion (second member) 322a and the third resin portion (third member) 323c are sequentially arranged from the inside toward the outside with respect to the planar direction of the first resin portion 321b. That is, the hollow portion 392 is sealed by the second resin portion 322a and the third resin portion 323c. On the other hand, in the panel space 372, a solar panel 361 is disposed at the center with respect to the plane direction, and further, outside the solar panel 361, the outer peripheral part of the solar panel 361 and the inner peripheral wall 372 a of the panel space 372. The 3rd resin part (3rd member) 323b which contacts is arranged. The solar panel 361 and the sensor 342 mounted on the substrate 41 are connected by a lead wire 327b sealed with a terminal resin portion 328.

Here, the terminal resin portion 328 does not use a portion corresponding to the second resin portion that functions as a plug of powder, but the powder before solidifying the terminal resin portion 328 enters the inside of the cavity portion 392. there is a possibility. Therefore, when powder enters, the powder may be removed by suction or the like before sealing with the second resin portion 322a and the third resin portion 323c, and the portion corresponding to the powder plug of the second resin portion Is not necessarily required.

As an actual measurement mode, light such as illumination at the sensor installation location is received by the solar panel 361 and power generation is possible. Electric power is supplied to the sensor 342 via the lead wire 327b, and as in FIG. Even when there is no power supply from the sensor, it is possible to obtain a sensor signal by ambient light.

In the case of the layered object 310b of FIG. 16, it becomes possible to seal the sealing part of the solar panel 361 and the sealing part of the sensor 342 independently of each other, compared to the layered object 310a of FIG. The leak path 382 with respect to the sensor 342 can be designed to be long, whereby the layered object 310b has an advantage that the sealing reliability can be further enhanced.

As described above, also in the eighth embodiment, it is possible to improve the sealing performance inside the layered object 310b by three-dimensional lamination.

Note that the present invention is not limited to the above-described embodiment, and includes various modifications. For example, the above-described embodiment has been described in detail for easy understanding of the present invention, and is not necessarily limited to one having all the configurations described.

Further, a part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment. . Moreover, it is also possible to add, delete, and replace other configurations for a part of the configuration of each embodiment. In addition, each member and relative size which were described in drawing are simplified and idealized in order to demonstrate this invention clearly, and it becomes a more complicated shape on mounting.

10, 10a, 110, 210, 310a, 310b Laminated

object

11, 111, 211 Object 13 Opening part

13a Cavity part

21, 121, 221, 321a, 321b First resin part (first member)
22, 122, 222, 322a Second resin part (second member)
23, 123, 223, 323a, 323a ', 323b, 323c Third resin portion (third member)
325a, 325a ′ fifth resin portion (fifth member)
29 4th resin part (4th member)
41 Board (circuit board)
42, 142, 242, 342

Sensor

161, 261

Thermoelectric conversion element

191, 192, 291, 292, 392 Cavity 361 Solar panel (second member)
372 Panel space (opening)

Claims

A layered product in which resin layers are laminated,
A first member having an opening in which the resin layer is laminated and a cavity is formed inside;
A second member disposed in the opening;
A third member that contacts the first member and the second member;
Have
The length of the arrangement direction of the third member and the second member at the portion where the third member and the first member are in contact is equal to or greater than the thickness of the single layer in the resin layer. Modeled object.
In the layered object according to claim 1,
The layered object in which the length in the arrangement direction of the portion where the third member and the first member are in contact is equal to or greater than the thickness of the thinnest portion of the outer wall of the first member.
In the layered object according to claim 1,
The third member is a layered object formed of a resin member whose main component is the same resin as the first member.
In the layered object according to claim 1,
The second member is a layered object formed of a resin member whose main component is the same resin as the first member.
In the layered object according to claim 1,
The second member is a resin member mainly composed of the same resin as the first member,
The layered object having a length in the arrangement direction of a portion where the second member and the first member are in contact is equal to or greater than a thickness of a thinnest portion of the outer wall of the first member.
In the layered object according to claim 1,
The layered object has a fourth member that contacts the first member and the second member, and the fourth member is embedded in the first member.
In the layered object according to claim 1,
A circuit board is disposed in the cavity,
One end of the lead wire connected to the circuit board is disposed outside the cavity through a part of the first member,
The part of the first member that covers the lead wire has a thickness that is equal to or greater than the thickness of the thinnest part of the outer wall of the first member.
In the layered object according to claim 7,
The one end of the lead wire is a layered object that is connected to a power generation device.
In the layered object according to claim 8,
The power generation device is a thermoelectric conversion module,
The mounting surface on the high temperature side or the low temperature side of the thermoelectric conversion module is a layered object that protrudes from the same plane as the bottom surface of the first member or the bottom surface of the first member.
In the layered object according to claim 1,
Having the second member at the center of the opening of the first member;
The third model is a layered object that is in contact with an inner peripheral wall of the opening of the first member and an outer peripheral part of the second member.
In the layered object according to claim 10,
Having a fifth member arranged to surround the outer periphery of the second member;
The third member is a layered object that is in contact with the first member, the second member, and the fifth member.
In the layered object according to claim 10 or 11,
The second member is a layered object that is a solar panel.
In the layered object according to claim 1,
The first member has a first opening and a second opening,
In the first opening, the second member and the third member are sequentially arranged from the inside to the outside with respect to the planar direction of the first member,
In the second opening, a solar panel is disposed in the center with respect to the planar direction, and further, on the outside of the solar panel, an outer peripheral part of the solar panel and an inner peripheral wall of the second opening A layered object in which the third member in contact with is arranged.
A first member having an opening in which a resin layer is laminated and a cavity is formed inside;
A sensor disposed in the cavity;
A second member disposed in the opening;
A third member that contacts the first member and the second member;
Have
The length in the arrangement direction of the third member and the second member of the portion where the third member and the first member are in contact is equal to or greater than the thickness of the single layer in the resin layer. machine.
(A) The resin powder is sintered with a laser whose position is controlled based on numerical data to form a plurality of thin layers, and the plurality of thin layers are laminated to form an uncured resin powder inside the opening. Removing the first resin part having the opening including the cavity by removing,
(B) After the step (a), a step of inserting and fixing a second resin portion that has been previously molded into the same cross-sectional shape as the cross-sectional shape of the opening in the opening of the first resin portion;
(C) After the step (b), the same material as the first resin part so as to contact the second resin part at a position outside the second resin part in the opening of the first resin part Arranging the powder comprising:
(D) After the step (c), the powder is melt-cured and brought into contact with the second resin part at a position outside the second resin part in the opening of the first resin part. A step of sealing the cavity of the first resin portion by forming a resin portion;
A molding method.