JP2013026553A - Substrate holder maintenance device, substrate bonding device, substrate holder maintenance method, and bonded semiconductor device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem in which a substrate holder and a component provided to a substrate holder of a bonding device are deteriorated due to dusts adhering to the substrate holder, and heat, pressure or the like applied to the substrate holder.SOLUTION: The substrate holder maintenance device comprises: an index acquisition part which acquires a state of a predetermined index of a substrate holder which holds a substrate; an analysis part which analyze whether or not a state matches a preset maintenance condition; and a warning part which warns to prompt a maintenance when it is analyzed that the state matches the maintenance condition.

Description

  The present invention relates to a substrate holder maintenance device, a substrate bonding apparatus, a substrate holder maintenance method, and a bonded semiconductor device manufacturing method.

A bonding apparatus is known in which a pair of substrate holders holding a substrate are accurately aligned, overlapped, and heated and pressed to bond a pair of substrates (for example, see Patent Document 1). In the processing process of the bonding apparatus, the substrate is held by the substrate holder and is transported integrally.
[Prior art documents]
[Patent Literature]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2007-208031

  It is conceivable that the substrate holder in the laminating apparatus is deteriorated due to the dust, the applied heat, pressure, and the like due to continuous use. And degradation of the quality of the components provided in the substrate holder and the substrate holder itself may reduce the alignment accuracy of the substrate.

  In order to solve the above-described problem, the substrate holder maintenance device according to the first aspect of the present invention includes an index acquisition unit that acquires a predetermined index state of the substrate holder that holds the substrate, and a state that is set in advance. An analysis unit that analyzes whether or not the maintenance condition matches, and a warning unit that issues a warning that prompts maintenance when it is analyzed that the maintenance condition matches the state.

  In order to solve the above problem, a substrate holder maintenance method according to a second aspect of the present invention includes an index acquisition step for acquiring a predetermined index state of a substrate holder for holding a substrate, and the state is set in advance. An analysis step for analyzing whether or not the maintenance condition is met, and a warning step for issuing a warning for prompting maintenance when the maintenance condition and the state are analyzed to be matched.

  Moreover, in order to solve the said subject, the joining semiconductor device manufacturing method which concerns on the 3rd aspect of this invention is a joining step which joins the several board | substrate hold | maintained at each of several board | substrate holders, and several joined. A division step for dividing the substrate into a plurality of semiconductor devices, an index acquisition step for acquiring a predetermined index state of the substrate holder, and an analysis step for analyzing whether the state matches a preset maintenance condition And a warning step for issuing a warning for urging maintenance when it is analyzed that the maintenance condition matches the state.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a top view which shows roughly the whole structure of the bonding apparatus which concerns on 1st Embodiment. It is a perspective view which shows a mode that the lower substrate holder was looked down from upper direction. It is a perspective view which shows a mode that the lower substrate holder was looked up from the downward direction. It is a perspective view which shows a mode that the upper substrate holder was looked up from the downward direction. It is a perspective view which shows a mode that the upper substrate holder was looked down from upper direction. It is sectional drawing which shows the structure of a holder aligner roughly. It is sectional drawing which shows the structure of this aligner roughly. It is a block diagram which shows the system configuration | structure of a control part roughly. It is a flowchart which shows the flow of the management method of a substrate holder. It is a flowchart which shows the flow of the observation process with respect to the dust adhering to a board | substrate holder. It is the schematic which shows a mode that the holder aligner detects the dust adhering to a board | substrate holder. It is a flowchart which shows the flow of the observation process with respect to the adsorption | suction part of a substrate holder. It is a flowchart which shows the flow of the observation process with respect to the unevenness | corrugation of a substrate holder. It is a flowchart which shows the flow of the observation process with respect to the external shape of a substrate holder. It is a flowchart which shows the flow of a process of the other management method of a substrate holder. It is a flowchart which shows the flow of a process of the other management method of a substrate holder. It is a top view which shows roughly the whole structure of the bonding apparatus which concerns on 2nd Embodiment. It is a perspective view which shows a mode that the lower substrate holder was looked down from upper direction. It is a perspective view which shows a mode that the lower substrate holder was looked up from the downward direction. It is a perspective view which shows a mode that the upper substrate holder was looked up from the downward direction. It is a perspective view which shows a mode that the upper substrate holder was looked down from upper direction. It is a conceptual diagram which shows roughly the structure of the adsorption | suction control part which supplies electric power to the electrostatic adsorption part and electrostatic adsorption part of a substrate holder. It is sectional drawing which shows the structure of a holder aligner roughly. It is sectional drawing which shows the structure of this aligner roughly. It is a block diagram which shows the system configuration | structure of a control part roughly. It is a flowchart which shows the flow of the management method of a substrate holder. It is a conceptual diagram explaining other embodiment which detects the adsorption | suction state to the electrostatic attraction part of a board | substrate. It is the schematic which looked at the delivery port from the side surface direction.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a plan view schematically showing the overall structure of a bonding apparatus 100 according to the present embodiment. The bonding apparatus 100 bonds a plurality of substrates on which circuit patterns are formed by overlapping and heating and pressing so that electrodes to be bonded come into contact with each other.

  The bonding apparatus 100 includes an atmospheric environment unit 102 and a vacuum environment unit 202 that are formed inside a common housing 101. The atmospheric environment unit 102 has a control unit 110 and an EFEM (Equipment Front End Module) 112 facing the outside of the housing 101. Each element of each device included in the bonding apparatus 100 is obtained by performing integrated control and cooperative control by the control unit 110 that controls the entire bonding apparatus 100 and the control calculation unit provided for each element. Operate.

  The EFEM 112 includes three load ports 113, 114, 115 and a robot arm 116. A FOUP (Front Opening Unified Pod), which is a hermetically sealed substrate storage pod, is attached to each load port. The substrate 120 stored in the FOUP is taken in and out by the robot arm 116. The substrate 120 here is a single silicon wafer, a compound semiconductor wafer or the like on which a plurality of circuit patterns are already formed periodically. In addition, the loaded substrate 120 may be a laminated substrate that is already formed by laminating a plurality of wafers.

  The atmospheric environment unit 102 includes a spare aligner 130, a main aligner 140, a holder rack 150, and a separation mechanism 160, which are arranged inside the housing 101, respectively. The preliminary aligner 130 preliminarily aligns the substrate 120 so that when the substrate 120 is carried into the main aligner 140, the alignment mark of the substrate 120 is within the field of view of the microscope included in the aligner 140.

  The spare aligner 130 includes a substrate aligner 131, a holder aligner 134, and a substrate slider 138. The substrate aligner 131 includes a substrate table 132 and an observation unit 133. The substrate 120 is placed on the substrate table 132 by the robot arm 116. The observation unit 133 overlooks the substrate 120 placed on the substrate table 132 and detects the position and orientation of the substrate 120 by imaging the outline and notch of the substrate 120.

  The substrate aligner 131 refers to the position and orientation of the substrate 120 detected by the observation unit 133 and adjusts the position of the substrate 120 so that the substrate 120 falls within a predetermined range. In addition, the substrate aligner 131 adjusts the orientation of the substrate 120 so that the position of the notch becomes a predetermined position.

  The holder aligner 134 includes a holder table 135 and an observation unit 136. The substrate holder 300 transferred from the holder rack 150 is placed on the holder table 135. The observation unit 136 detects the position and orientation of the substrate holder 300 by overlooking the substrate holder 300 placed on the holder table 135 and imaging the outline of the substrate holder 300 and the cutouts provided on the outer periphery. . The holder aligner 134 refers to the position and orientation of the substrate holder 300 detected by the observation unit 136 and adjusts the position of the substrate holder 300 so that the substrate holder 300 falls within a predetermined range. Further, the holder aligner 134 adjusts the orientation of the substrate holder 300 so that the position of the notch is a predetermined position. The substrate holder 300 is divided into two types, a lower substrate holder 310 and an upper substrate holder 330.

  The substrate slider 138 conveys the substrate 120 whose position has been adjusted by the substrate aligner 131 from the substrate aligner 131 to the holder aligner 134. The substrate slider 138 places the substrate 120 on the substrate holder 300 whose position is adjusted by the holder aligner 134. The holder table 135 includes a power feeding terminal, and is connected to a power feeding terminal provided on the back surface of the substrate holder 300 to supply power to the substrate holder 300.

  The substrate holder 300 has an electrostatic chuck inside, and the electrostatic chuck electrostatically attracts the substrate 120 with electric power supplied from the holder aligner 134. As a result, the substrate holder 300 holds the substrate 120. The substrate 120 and the substrate holder 300 integrated by suction may be referred to as a “work”. The substrate 120 and the upper substrate holder 330 integrated by suction may be referred to as “upper workpiece”, and the substrate 120 and the lower substrate holder 310 integrated by suction may be referred to as “lower workpiece”. The workpiece formed by the preliminary aligner 130 is placed on the transfer port 174 by the robot arm 171 and is carried into the main aligner 140 by the robot arm 173.

  The aligner 140 serves as an overlay device that superimposes the substrate 120 held by the substrate holder 300 and the other substrate 120 held by another substrate holder 300. The aligner 140 causes the upper work and the lower work to face each other, and aligns and overlays a plurality of alignment marks formed on the substrate 120 of each work with high accuracy. The aligner 140 includes an upper stage 141, a lower stage 142, an upper microscope 143, a lower microscope 144, and an interferometer 145. The upper stage 141 is installed on the ceiling and holds the upper work downward. The lower stage 142 is configured to be movable in the XY plane direction, and holds the lower workpiece upward.

  The upper microscope 143 is installed adjacent to the upper stage 141 and observes the alignment marks on the substrate 120 held on the lower stage 142. The lower microscope 144 is installed on the lower stage 142 and observes the alignment marks on the substrate 120 held on the upper stage 141. The aligner 140 precisely aligns the two substrates 120 by accurately moving the lower stage 142 while monitoring the position by the interferometer 145. For example, the aligner 140 determines the positions of the upper and lower substrates 120 using a global alignment method or the like that statistically reduces the amount of misalignment between a plurality of alignment marks formed on the upper and lower substrates 120, respectively. After the alignment, the aligner 140 raises the lower work by the lower stage 142 to bring the bonding surfaces of the upper and lower substrates 120 into contact with each other and superimpose them.

  The two substrates 120 overlapped by the aligner 140 are sandwiched between the upper substrate holder 330 and the lower substrate holder 310. The two substrates 120 are temporarily fixed by a binding force between a permanent magnet provided on the upper substrate holder 330 and a magnetic material adsorber provided on the lower substrate holder 310. The combination of the upper substrate holder 330, the lower substrate holder 310, and the two substrates 120 sandwiched between them may be referred to as a “work pair”. The workpiece pair is transferred to the vacuum environment unit 202 by the robot arm 171 and the robot arm 172. The workpiece pair is heated and pressurized by a heating and pressing unit 240 described later, and the two substrates 120 are bonded.

  The holder rack 150 includes a storage shelf for storing one substrate holder 300 at each stage. The storage shelf includes a use shelf for storing the substrate holder 300 to be used and a retraction shelf for storing the substrate holder 300 to be stopped. For example, if the storage shelves have a total of 15 levels, 12 levels are used shelves and 3 levels are shelving shelves. The holder rack 150 includes a barcode reader 152 on the surface side where the substrate holder 300 is inserted and removed.

  Since the bonding apparatus 100 uses a plurality of substrate holders 300 in combination, the substrate holder 300 is identified by the management ID. On the substrate holder 300, a management sign including a barcode obtained by encoding a management ID is installed. In this embodiment, as an example of a management sign, a management plate 302 having a barcode printed on a plate formed of a material such as iron is installed on the surface of the substrate holder 300. The barcode reader 152 reads the barcode on the management plate 302 when the substrate holder 300 is carried in / out by the robot arm 172. The control unit 110 acquires the management ID read by the bar code reader 152 to identify the substrate holder 300 that has been carried into and out of the holder rack 150.

  The vacuum environment unit 202 includes a load lock chamber 220, a robot arm 230, and a plurality of heating and pressing units 240. The robot arm 230 conveys the held work pair between the load lock chamber 220 and the heating / pressurizing unit 240. The load lock chamber 220 has shutters 222 and 224 that open and close alternately on the atmosphere environment section 102 side and the vacuum environment section 202 side, and leaks the internal atmosphere of the atmosphere environment section 102 to the vacuum environment section 202 side. Instead, the work pair is carried into the vacuum environment unit 202. The robot arm 230 carries the work pair carried out from the load lock chamber 220 into one of the plurality of heating and pressing units 240. The heating and pressurizing unit 240 heats and presses the loaded work pair. When the work pair is heated and pressurized, the two sets of substrates 120 are permanently bonded. The two sets of substrates 120 bonded by the heating and pressing unit 240 may be collectively referred to as “bonded substrates”.

  The workpiece pair after substrate bonding is carried into the load lock chamber 220 by the robot arm 230 and carried into the atmospheric environment unit 102 by the robot arm 172. The robot arm 172 carries the workpiece pair into the separation mechanism 160. The separation mechanism 160 separates the bonded substrate attached to the substrate holder 300 from the substrate holder 300 by being heated and pressurized. The separated bonded substrate is placed on the lower substrate holder 310 without being adsorbed.

  After separating the bonded substrates, the separation mechanism 160 reads the barcode on the management plate 302 of the upper substrate holder 330 with the barcode reader 162 and notifies the control unit 110 of the management ID. After the upper substrate holder 330 is inverted by the robot arm 172, the robot substrate 171 is transported to the spare aligner 130 for mounting the next substrate 120. Next, the separation mechanism 160 reads the barcode on the management plate 302 of the lower substrate holder 310 and notifies the control unit 110 of the management ID. The lower substrate holder 310 on which the bonded substrate is mounted is transferred to the holder aligner 134 by the robot arm 171. The bonded substrate is accommodated in the FOUP by the robot arm 116. Then, the position of the lower substrate holder 310 is adjusted by the holder aligner 134 in order to mount the next substrate 120. Further, the bonding substrate is divided into individual dies by a dicing apparatus and packaged to form a bonding semiconductor device.

  FIG. 2 is a perspective view schematically showing a state in which the lower substrate holder 310 is looked down from above. FIG. 3 is a perspective view showing the same lower substrate holder 310 as viewed from below. The lower substrate holder 310 includes a holder main body 312, an adsorber 316, a leaf spring 318, and a power supply terminal 320, and has a disk shape whose diameter is slightly larger than that of the substrate 120 as a whole.

  The holder main body 312 includes a substrate holding surface 313 that holds the substrate 120, a notch 315 formed in the peripheral portion, and a groove 317. The substrate holding surface 313 has high flatness and is in close contact with the substrate 120. A through hole 314 is formed in the substrate holding surface 313 so as to penetrate the front and back of the holder main body 312.

  The adsorber 316 is made of a magnetic material. A plurality of adsorbers 316 are arranged on the outer peripheral side of the substrate holding surface 313. The leaf spring 318 is made of titanium. A plurality of leaf springs 318 are arranged on the outer peripheral side of the substrate holding surface 313 on the surface holding the substrate 120. The adsorber 316 is arranged on the leaf spring 318 so as to overlap. The adsorber 316 and the leaf spring 318 are arranged in a recessed region formed in the holder main body 312 so that the upper surface is located in the substantially same plane as the substrate holding surface 313. The power supply terminal 320 is embedded in the holder main body 312 on the back surface of the lower substrate holder 310. The lower substrate holder 310 electrostatically attracts the substrate 120 by receiving power supply through the power supply terminal 320.

  FIG. 4 is a perspective view showing the upper substrate holder 330 as viewed from below. FIG. 5 is a perspective view schematically showing the same upper substrate holder 330 as viewed from above. Elements common to the lower substrate holder 310 are denoted by the same reference numerals and description thereof is omitted. The upper substrate holder 330 includes a permanent magnet 336. The permanent magnet 336 is provided with a magnet cover made of a magnetic material, and is attached to the upper substrate holder 330 via the magnet cover. A plurality of permanent magnets 336 are arranged on the outer peripheral side of the substrate holding surface 313.

  The permanent magnet 336 is disposed at a position where the attractor 316 of the lower substrate holder 310 is corresponding, and is attracted when the lower substrate holder 310 and the upper substrate holder 330 are overlapped, so that the lower substrate holder 310 and the upper substrate holder 330 are attracted. Fix it. That is, the adsorber 316 and the permanent magnet 336 serve as an adsorbing unit that adsorbs and fixes the pair of substrate holders 300. The attracting surface of the permanent magnet 336 has a smaller area than the attracting surface of the attracting member 316 and is in contact with the central portion of the attracting surface of the attracting member 316.

  FIG. 6 is a cross-sectional view schematically showing the structure of the holder aligner 134. The holder aligner 134 includes a holder table 135 installed on a pedestal 137, an observation unit 136, and an illumination unit 410. The holder table 135 includes a vacuum suction unit 404, push-up pins 406, a load cell 407, and a power supply terminal 408. The vacuum suction unit 404 vacuum-sucks the back surface of the substrate holder 300 through a plurality of suction ports provided on the surface of the holder table 135.

  The push-up pin 406 is driven in the vertical direction and is inserted through the through hole 314 of the substrate holder 300. The substrate 120 is placed on the push-up pin 406 inserted through the through hole 314 by the substrate aligner 131. The holder aligner 134 places the substrate 120 on the substrate holder 300 by lowering the push-up pins 406 after placing the substrate 120. The power supply terminal 408 is connected to the power supply terminal 320 of the substrate holder 300 and supplies power to the substrate holder 300. The load cell 407 is provided on the push-up pin 406 and detects the pressure applied to the push-up pin 406.

  FIG. 7 is a cross-sectional view schematically showing the structure of the aligner 140. The lower stage 142 includes a lower mounting table 421, an elevating unit 422, a pedestal unit 423, a driving unit 424, and a base 425. A substrate holder 300 on which the substrate 120 is mounted is placed on the lower mounting table 421. The lower mounting table 421 holds the substrate holder 300 by vacuum suction. The elevating unit 422 moves the lower mounting table 421 up and down. The lower microscope 144 is installed on the lower mounting table 421. When the lower mounting table 421 moves up and down, the lower microscope 144 also moves up and down.

  The lower microscope 144 observes the substrate holder 300 placed on the upper stage 141 or the substrate 120 held on the substrate holder 300. The focus of the lower microscope 144 is fixed. The aligner 140 raises and lowers the lower mounting table 421 by the elevating unit 422 to focus the lower microscope 144 on the observation target surface. On the other hand, the upper microscope 143 observes the substrate holder 300 placed on the lower placement table 421 or the substrate 120 held by the substrate holder 300. Similar to the lower microscope 144, the focus of the upper microscope 143 is also fixed. The aligner 140 raises and lowers the lower mounting table 421 so that the upper microscope 143 is focused on the observation target surface.

  The pedestal part 423 is installed on the drive part 424. The drive unit 424 is installed on the base 425 and moves the pedestal unit 423 in the XY plane direction. Here, a processing flow for forming a work pair by superposing the upper work and the lower work will be described. First, the upper workpiece is carried into the aligner 140 by the robot arm 172. The upper work is reversed by the robot arm 172 and pressed against the upper stage 141 with the substrate holding surface 313 facing downward. The upper stage 141 sucks and holds the upper work.

  Next, the robot arm 172 places the lower work on the lower placement table 421. The aligner 140 raises and lowers the lower mounting table 421 to focus on the surface of the substrate 120 of the lower workpiece. The aligner 140 detects a plurality of alignment marks by imaging the surface of the substrate 120 of the lower workpiece with the upper microscope 143 while moving the lower mounting table 421 by the driving unit 424.

  Next, the aligner 140 images the surface of the substrate 120 of the upper workpiece with the lower microscope 144 while moving the lower mounting table 421 by the driving unit 424. Even when the substrate 120 of the upper workpiece is imaged, the aligner 140 focuses by moving the lower mounting table 421 up and down. Then, a plurality of alignment marks formed on the substrate 120 of the upper work are detected.

  The aligner 140 precisely aligns the positions of the substrates 120 based on the detected position information of the alignment marks of both the substrates 120. After the alignment is completed, the upper and lower substrates 120 are brought into contact by raising the lower mounting table 421. By this contact, the attractor 316 installed in the lower substrate holder 310 and the permanent magnet 336 installed in the upper substrate holder 330 act, and the two substrates 120 are sandwiched between the lower substrate holder 310 and the upper substrate holder 330. The The workpiece pair thus formed is carried out from the aligner 140 by the robot arm 172.

  FIG. 8 is a block diagram schematically showing the system configuration of the control unit 110. The bonding apparatus 100 according to the present embodiment executes a management process for managing the substrate holder 300 in addition to the bonding process for bonding the two substrates 120 described above. That is, the bonding apparatus 100 observes an index appearing on a predetermined appearance or the like of the substrate holder 300, and issues a warning prompting maintenance when the index state matches a predetermined maintenance condition.

  The control unit 110 includes a storage unit 502, a count unit 504, a drive control unit 506, an analysis unit 508, a warning unit 510, a display unit 512, an audio output unit 514, and a communication unit 516. The storage unit 502 stores, for example, the management ID of each substrate holder 300 as data required for executing the management process according to the present embodiment.

  The count unit 504 counts the number of times that the bonded substrate is formed. Here, the number of times the bonded substrate is carried out of the atmospheric environment unit 102 by the EFEM 112 is counted as the number of times the bonded substrate is formed. The drive control unit 506 controls each device in the bonding apparatus 100 to observe a predetermined index of the substrate holder 300 to acquire the index state. The acquired index state is stored in the storage unit 502.

  The analysis unit 508 analyzes whether or not the index state of the substrate holder 300 stored in the storage unit 502 matches a predetermined maintenance condition. The analysis unit 508 determines that the maintenance of the substrate holder 300 is necessary when the state of the index of the substrate holder 300 matches the maintenance condition, and determines that the maintenance is unnecessary when it does not match. The warning unit 510 issues a warning for prompting maintenance when the analysis unit 508 analyzes that the index state matches a predetermined maintenance condition. The display unit 512 is, for example, a liquid crystal display, and displays a warning that prompts maintenance under the control of the warning unit 510. The voice output unit is, for example, a speaker, and outputs a warning for prompting maintenance under the control of the warning unit 510. The communication unit 516 transmits data including a warning for urging maintenance to another device via the network according to the control of the warning unit 510.

  FIG. 9 is a flowchart showing a flow of management processing of the substrate holder 300 according to the present embodiment. In step S <b> 901, when the bonded substrate is unloaded from the atmospheric environment unit 102 by the EFEM 112, the count unit 504 counts up the number of bonded substrate unloads stored in the storage unit 502.

  In step S <b> 902, the drive control unit 506 determines whether or not the number of bonded substrates carried out is equal to a multiple of 1000. If the determination is affirmed, the process proceeds to step S903. If the determination is not affirmed, the process proceeds to step S904. In step S903, a process for observing dust adhering to the substrate holder 300 is executed.

  In step S904, the drive control unit 506 determines whether or not the number of bonded substrates carried out is equal to a multiple of 2000. If the determination is affirmed, the process proceeds to step S905. If the determination is not affirmed, the process proceeds to step S906. In step S905, an observation process of the suction part of the substrate holder 300 is executed.

  In step S906, the drive control unit 506 determines whether or not the number of bonded substrates carried out is equal to a multiple of 5000. If the determination is affirmed, the process proceeds to step S907. If the determination is not affirmed, the process proceeds to step S908. In step S908, the unevenness observation process of the substrate holder 300 is executed.

  In step S908, the drive control unit 506 determines whether or not the number of bonded substrates carried out is equal to a multiple of 10,000. If the determination is affirmed, the process proceeds to step S909. If the determination is not affirmed, the process proceeds to step S910. In step S909, the observation processing of the contour shape of the substrate holder 300 is executed. In step S910, it is determined whether the control unit 110 has received an end instruction from the user. If the determination is not positive, the process returns to step S901. If the determination is affirmative, this flow ends.

  FIG. 10 is a flowchart showing the flow of observation processing for dust adhering to the substrate holder 300 in step S903 shown in FIG. FIG. 11 is a schematic diagram showing how the holder aligner 134 detects dust adhering to the substrate holder 300. In step S <b> 1001, the drive control unit 506 controls the apparatus in the bonding apparatus 100 to store all the used substrate holders 300 in the use rack of the holder rack 150. Specifically, first, the drive control unit 506 stops carrying the substrate 120 into the atmospheric environment unit 102 by the EFEM 112. The drive control unit 506 stores the used substrate holder 300 in the holder rack 150 after completing the bonding process for the substrates 120 already carried into the bonding apparatus 100.

  In step S <b> 1002, the substrate holder 300 is unloaded from the holder rack 150 and loaded into the holder aligner 134 under the control of the drive control unit 506. The holder rack 150 reads the management plate 302 when the substrate holder 300 is unloaded and notifies the control unit 110 of the management ID. The substrate holder 300 carried into the holder aligner 134 is placed on the holder table 135.

  In step S1003, the holder aligner 134 observes dust adhering to the substrate holding surface 313. The holder aligner 134 is an example of an index acquisition unit. In this case, for example, the holder aligner 134 acquires an observation image by a dark field method of observing scattered light of light that is obliquely applied to the observation target surface. First, the illumination unit 410 irradiates the surface of the substrate holder 300 with the inspection illumination light 414 at a shallow incident angle. The observation unit 136 is installed at a position where it does not receive the specularly reflected light 415 from the surface of the substrate holder 300 that has been irradiated with the inspection illumination light 414, for example, at a position facing the substrate holder 300 on the ceiling of the holder aligner 134. The

  When the dust 416 exists on the substrate holder 300, the inspection illumination light 414 irradiated on the dust 416 is irregularly reflected. A part of the scattered light 417 that is irregularly reflected light enters the observation unit 136. The holder aligner 134 detects the position and size of the dust 416 by performing image processing on a captured image including the scattered light 417 incident on the observation unit 136. Then, the holder aligner 134 transmits data indicating the detected position and size of the dust 416 to the control unit 110. The control unit 110 stores data indicating the received position and size of the dust 416 in the storage unit 502.

  In step S1004, the analysis unit 508 refers to the data stored in the storage unit 502 and analyzes whether or not the degree of dust adhesion exceeds a predetermined standard adhesion degree. The analysis unit 508 calculates the ratio of dust to the area of the substrate holding surface 313 as the degree of dust adhesion. The reference adhesion degree is set in advance by the user as a numerical value such that the proportion of dust is 0.01%, for example, and is stored in the storage unit 502.

  Here, the ratio of dust to the area of the substrate holding surface 313 is calculated as the degree of dust adhesion, but the number of dust may be used as the degree of adhesion. The calculation load can be reduced by setting the number of dusts as the degree of adhesion. If it is analyzed by the analysis unit 508 that the degree of dust adhesion exceeds the reference adhesion degree, the process proceeds to step S1005.

  In step S <b> 1005, the substrate holder 300 is unloaded from the holder aligner 134 and stored in the retreat shelf of the holder rack 150 according to the control of the drive control unit 506. The holder rack 150 notifies the control unit 110 of the shelf number of the evacuation shelf in which the substrate holder 300 is stored. In step S1006, the warning unit 510 displays on the display unit 512 the management ID notified in step S1002, the shelf number of the evacuation shelf notified in step S1005, and a warning prompting the removal of dust from the substrate holder 300.

  If it is analyzed in step S1004 that the degree of dust adhesion does not exceed the reference degree of adhesion, the process proceeds to step S1007. In step S <b> 1007, the substrate holder 300 is stored in the use shelf of the holder rack 150 according to the control of the drive control unit 506. In step S1008, control unit 110 determines whether there is an unprocessed substrate holder 300 or not. If the determination is affirmative, the process moves to step S1002 and the unprocessed substrate holder 300 is carried into the holder aligner 134. If the determination is not affirmative in step S1008, the process ends.

  If a large amount of dust adheres to the substrate holding surface 313, the electrostatic attraction force of the substrate 120 to the substrate holder 300 is weakened, and the substrate 120 may be displaced during the transfer of the workpiece. Then, when the positions of the substrate holder 300 and the substrate 120 are shifted, the alignment accuracy of the substrate 120 is lowered, resulting in poor bonding. In addition, the heating and pressing by the heating and pressing unit 240 is not uniformly transmitted to the substrates 120 due to the presence of dust, and unevenness occurs in the bonding between the substrates 120.

  However, in the present embodiment, since the substrate holder 300 whose dust adhesion degree exceeds the reference adhesion degree is retracted to the retreat shelf of the holder rack 150 and is no longer used, the alignment accuracy due to dust is reduced, and the heating and pressing accuracy is reduced. Can be suppressed. Further, the user can know from the display on the display unit 512 that the dust on the substrate holder 300 needs to be removed, the management ID of the substrate holder 300 that has been discontinued, and the shelf number of the evacuation shelf, and can easily start maintenance work. be able to. Here, an example has been described in which the warning unit 510 displays a warning for prompting dust removal, but the warning unit 510 may display a warning for prompting replacement of the substrate holder 300.

  Note that the warning displayed on the display unit 512 is deleted when the corresponding substrate holder 300 is carried out of the retreat shelf of the holder rack 150. Specifically, the holder rack 150 detects that the substrate holder 300 has been unloaded from the retreat shelf, and notifies the control unit 110 of the shelf number. Then, the control unit 110 that has received the notification performs control so as to end the display of the warning corresponding to the notified shelf number.

  In the flowchart shown in FIG. 10 described above, instead of detecting dust on the substrate holding surface 313, control may be performed so that dust on the management plate 302 is detected. The management plate 302 is installed on the same surface as the substrate holding surface 313 of the substrate holder 300, and the amount of dust attached to the management plate 302 has a positive correlation with the amount of dust attached to the substrate holding surface 313. Therefore, when the amount of dust adhering to the management plate 302 is large, a warning is given because the amount of dust adhering to the substrate holding surface 313 is expected to be large. Since the management plate 302 has a small area with respect to the substrate holding surface 313, an improvement in processing speed for detecting dust can be expected.

  FIG. 12 is a flowchart showing the flow of the observation process for the suction portion of the substrate holder 300 in step S905 shown in FIG. Here, the observation process of the adsorber 316 that is the adsorbing portion of the lower substrate holder 310 will be described as an example. In step S1201, the substrate holder 300 is stored in the holder rack 150 according to the same process as described in step S1001. When the substrate holder 300 is already stored in the holder rack 150, the process proceeds to step S1202.

  In step S <b> 1202, the substrate holder 300 is unloaded from the holder rack 150 and loaded into the main aligner 140 under the control of the drive control unit 506. The holder rack 150 reads the management plate 302 when the substrate holder 300 is unloaded and notifies the control unit 110 of the management ID. The substrate holder 300 carried into the aligner 140 is placed on the lower placement table 421.

  In step S1203, the aligner 140 detects a difference in thickness between the suction surface central portion of the suction element 316 and the suction surface peripheral portion which is a region other than the central portion of the suction surface. That is, the aligner 140 is an example of an index acquisition unit that observes the shape of the adsorber 316. First, the aligner 140 moves the lower mounting table 421 so that the central portion of the suction surface of the suction element 316 falls within the imaging field of view of the upper microscope 143. The aligner 140 moves the lower mounting table 421 up and down to focus on the center of the suction surface.

  Next, the aligner 140 moves the lower mounting table 421 so that the periphery of the suction surface falls within the imaging field of view of the upper microscope 143. Then, the aligner 140 moves the lower mounting table 421 up and down to focus on the periphery of the suction surface, and detects the amount of vertical movement of the lower mounting table 421 as a difference in thickness between the suction surface center and the suction surface periphery. .

  The attracting surface of the adsorber 316 has a diameter larger than that of the permanent magnet 336, and the central portion comes into contact with the permanent magnet 336 when attracting the permanent magnet 336. Therefore, the center part of the adsorber 316 is worn by repeating the adsorption. Therefore, the aligner 140 detects the amount of wear by detecting the difference in thickness between the central portion of the suction surface and the peripheral portion of the suction surface. The aligner 140 notifies the control unit 110 of the detected wear amount.

  In step S1204, the analysis unit 508 analyzes whether or not the wear amount of the adsorber 316 exceeds the reference wear amount. The reference wear amount is set in advance by the user as a numerical value that is approximately twice the thickness tolerance of the adsorber 316 and stored in the storage unit 502. When the analysis unit 508 analyzes that the wear amount of the adsorber 316 exceeds the reference wear amount, the process proceeds to step S1205.

  In step S <b> 1205, the substrate holder 300 is unloaded from the main aligner 140 and stored in the retreat shelf of the holder rack 150 according to the control of the drive control unit 506. The holder rack 150 notifies the control unit 110 of the shelf number of the evacuation shelf in which the substrate holder 300 is stored. In step S1206, the warning unit 510 displays on the display unit 512 the management ID notified in step S1202, the shelf number of the evacuation shelf notified in step S1205, and a warning prompting the replacement of the adsorber 316 of the substrate holder 300. .

  If it is determined in step S1204 that the wear amount of the adsorber 316 does not exceed the reference wear amount, the process proceeds to step S1207. In step S <b> 1207, the substrate holder 300 is stored in the use shelf of the holder rack 150 under the control of the drive control unit 506. In step S1208, control unit 110 determines whether there is an unprocessed substrate holder 300 or not. If the determination is affirmative, the process moves to step S1202, and the unprocessed substrate holder 300 is carried into the aligner 140. If the determination is not affirmative, the process ends.

  When the amount of wear of the adsorber 316 increases, the lower substrate holder 310 and the upper substrate holder 330 are not uniformly adsorbed, and the substrate 120 may be displaced during the transfer of the workpiece. However, in this embodiment, since the substrate holder 300 in which the wear amount of the adsorber 316 exceeds the reference wear amount is retracted to the retreat shelf of the holder rack 150 and is not used, the displacement of the substrate 120 can be suppressed. Further, the user can know from the display on the display unit 512 that the adsorber 316 needs to be replaced, the management ID of the substrate holder 300 that has been discontinued, and the shelf number of the evacuation shelf, so that the maintenance work can be started easily. be able to. Here, an example in which the warning unit 510 displays a warning that prompts replacement of the adsorber 316 has been described, but the warning unit 510 may display a warning that prompts replacement of the substrate holder 300.

  For the permanent magnet 336 of the upper substrate holder 330, the same processing as the flowchart described above is executed except for step S1203 and step S1204. Steps S1203 and S1204 having different processing contents will be described below. In step S1203, the aligner 140 observes the permanent magnet 336 and detects the amount of wear of the permanent magnet 336. The aligner 140 previously stores the vertical position of the lower mounting table 421 as a reference position when focusing on the attracting surface of the permanent magnet 336 in a state where there is no wear.

  Then, the aligner 140 moves the lower mounting table 421 so that the attracting surface of the permanent magnet 336 is within the imaging field of view of the upper microscope 143 with respect to the upper substrate holder 330 to be observed mounted on the lower mounting table 421. Let Next, the aligner 140 moves the lower mounting table 421 up and down to detect a position in the vertical direction of the lower mounting table 421 while focusing on one place in the attracting surface of the permanent magnet 336. The aligner 140 detects the amount of wear of the permanent magnet 336 by comparing the detected vertical position of the lower mounting table 421 with a previously stored reference position. In addition, although the example which focused on one place in the attraction | suction surface of the permanent magnet 336 was given and demonstrated here, the several vertical position of the lower mounting base 421 is detected focusing on several places, and the value is set. The average value may be used as the detection value.

  In step S1204, the analysis unit 508 analyzes whether the wear amount of the permanent magnet 336 exceeds the reference wear amount. The reference wear amount is set in advance by the user as a numerical value that is approximately double the thickness tolerance of the permanent magnet 336, for example, and stored in the storage unit 502. If the analysis unit 508 analyzes that the wear amount of the permanent magnet 336 exceeds the reference wear amount, the process proceeds to step S1205.

  FIG. 13 is a flowchart showing the flow of the observation process for the unevenness of the substrate holder 300 in step S907 shown in FIG. Here, an example in which the unevenness of the substrate holding surface 313 is observed will be described. In step S1301, the substrate holder 300 is stored in the holder rack 150 by the same process as described in step S1001.

  In step S <b> 1302, the substrate holder 300 is unloaded from the holder rack 150 and loaded into the main aligner 140 under the control of the drive control unit 506. The holder rack 150 reads the management plate 302 when the substrate holder 300 is unloaded and notifies the control unit 110 of the management ID. The substrate holder 300 carried into the aligner 140 is placed on the lower placement table 421.

  In step S1303, the aligner 140 observes the unevenness of the substrate holding surface 313. That is, the aligner 140 may be an example of an index acquisition unit that observes the unevenness of the substrate holder 300 as an index. The aligner 140 acquires the unevenness state of the observation target surface from the focus information at the time of acquiring the observation image. First, the aligner 140 focuses on the substrate holding surface 313 by moving the lower mounting table 421 up and down while observing the substrate holding surface 313 with the upper microscope 143.

  Then, the aligner 140 moves the lower mounting table 421 in the radial direction of the substrate holder 300 by the driving unit 424. When the substrate holding surface 313 is uneven, the focal point is shifted as the substrate is moved. Therefore, the aligner 140 focuses by moving the lower mounting table 421 up and down. The aligner 140 detects the amount of movement of the lower mounting table 421 in the vertical direction as a height difference between the convex portion and the concave portion. Then, the aligner 140 transmits data indicating the height difference to the control unit 110. The control unit 110 stores the received data indicating the height difference in the storage unit 502.

  In step S1304, the analysis unit 508 refers to the data indicating the height difference stored in the storage unit 502 and analyzes whether the height difference between the convex portion and the concave portion exceeds a predetermined reference height difference. To do. The reference height difference is set in advance by the user as a numerical value that is approximately twice as large as the tolerance of flatness of the substrate holding surface 313, for example, and stored in the storage unit 502. When the analysis unit 508 analyzes that the height difference between the convex portion and the concave portion exceeds the reference height difference, the process proceeds to step S1305.

  In step S <b> 1305, the substrate holder 300 is unloaded from the main aligner 140 and stored in the retreat shelf of the holder rack 150 according to the control of the drive control unit 506. The holder rack 150 notifies the control unit 110 of the shelf number of the evacuation shelf in which the substrate holder 300 is stored. In step S1306, the warning unit 510 displays the management ID notified in step S1302, the shelf number of the evacuation shelf notified in step S1305, and a warning for prompting polishing of the substrate holding surface 313 on the display unit 512.

  If it is determined in step S1304 that the height difference between the convex portion and the concave portion does not exceed the reference height difference, the process proceeds to step S1307. In step S <b> 1307, the substrate holder 300 is stored in the use shelf of the holder rack 150 under the control of the drive control unit 506. In step S1308, control unit 110 determines whether there is an unprocessed substrate holder 300 or not. If the determination is affirmative, the process moves to step S3202, and the unprocessed substrate holder 300 is carried into the aligner 140. If the determination is not affirmative, the process ends.

  If the substrate holding surface 313 is uneven, the electrostatic adsorption force of the substrate 120 to the substrate holder 300 is weakened, and the substrate 120 may be displaced during the transfer of the workpiece. Then, when the positions of the substrate holder 300 and the substrate 120 are shifted, it is considered that poor bonding occurs due to a decrease in alignment accuracy of the substrate 120. It is also conceivable that the heating and pressing by the heating and pressing unit 240 is not uniformly transmitted to the substrate 120 due to the presence of irregularities, and unevenness occurs in the bonding.

  However, according to the present embodiment, since the substrate holder 300 in which the height difference between the convex portion and the concave portion of the substrate holding surface 313 exceeds the reference height difference is retracted to the retraction shelf of the holder rack 150 and is no longer used, A decrease in alignment accuracy and a decrease in heating and pressing accuracy can be suppressed. Further, the user can know from the display on the display unit 512 that maintenance by polishing the substrate holding surface 313, the management ID of the substrate holder 300 that has been discontinued, and the shelf number of the evacuation shelf can be easily maintained. You can get started. Here, an example in which the warning unit 510 displays a warning that prompts polishing of the substrate holding surface 313 has been described, but the warning unit 510 may display a warning that prompts replacement of the substrate holder 300.

  In the flowchart shown in FIG. 13 described above, control may be performed so as to detect unevenness of the management plate 302 instead of detecting unevenness of the substrate holding surface 313. The management plate 302 is provided in the substrate holder 300 and is exposed to the same environment as the substrate holder 300 such as heating by the heating and pressing unit 240. Therefore, when the substrate holding surface 313 is uneven, the management plate 302 can be similarly uneven. Therefore, in the present embodiment, by detecting the uneven state of the management plate 302, the uneven state of the substrate holding surface 313 is predicted and a warning is given. Since the management plate 302 has a smaller area than the substrate holding surface 313, an improvement in processing speed for detecting the uneven state can be expected.

  In the flowchart shown in FIG. 13 described above, an example in which the unevenness state of the substrate holding surface 313 is directly observed by the aligner 140 to acquire the unevenness state has been described. On the other hand, the uneven state of the substrate holding surface 313 may be obtained indirectly from the suction state of the substrate 120 with respect to the substrate holder 300.

  The drive control unit 506 indirectly acquires the uneven state of the substrate holding surface 313 from the suction state of the substrate 120 with respect to the substrate holder 300 by controlling the holder aligner 134. The holder aligner 134 acquires the unevenness state of the substrate holding surface 313 in accordance with the control of the drive control unit 506 according to the following processing flow.

  First, the holder aligner 134 places the substrate 120 on the substrate holder 300 to be observed placed on the holder table 135 and electrostatically attracts the substrate 120. Next, the push-up pin 406 is raised until the substrate 120 is separated from the substrate holder 300, and the pressure applied to the push-up pin 406 by the load cell 407 is detected. The detected pressure represents the adsorption state of the substrate 120 as a state in which the substrate 120 is strongly adsorbed as the pressure is high, and a state in which the substrate 120 is weakly adsorbed as the pressure is low.

  The holder aligner 134 notifies the control unit 110 of data indicating the detected pressure. The control unit 110 stores the received data in the storage unit 502. Then, the analysis unit 508 analyzes whether or not the pressure indicated by the data stored in the storage unit 502 exceeds the reference pressure. As a result of the analysis, if it is determined that the reference pressure is not exceeded, the warning unit 510 issues a warning that prompts polishing.

  FIG. 14 is a flowchart showing the flow of the observation process for the contour shape of the substrate holder 300 in step S909 shown in FIG. In step S1401, the substrate holder 300 is stored in the holder rack 150 according to the same process as described in step S1001.

  In step S1402, the substrate holder 300 is unloaded from the holder rack 150 and loaded into the holder aligner 134. The holder rack 150 reads the management plate 302 when the substrate holder 300 is unloaded and notifies the control unit 110 of the management ID. The substrate holder 300 carried into the holder aligner 134 is placed on the holder table 135.

  In step S1403, the holder aligner 134 images the contour shape of the substrate holder 300 and transmits the image data to the control unit 110. That is, the holder aligner 134 is an example of an index acquisition unit that observes at least a part of the shape of the substrate holder 300 as an index. The control unit 110 stores the received imaging data in the storage unit 502.

  In step S <b> 1404, the analysis unit 508 compares the imaging data stored in the storage unit 502 with image data indicating the reference shape of the substrate holder 300 stored in the storage unit 502. Then, the analysis unit 508 analyzes whether or not the substrate holder 300 has a chip exceeding the allowable chip size. If it is determined that there is a chip exceeding the allowable chip size, the process proceeds to step S1405.

  In step S <b> 1405, the substrate holder 300 is unloaded from the holder aligner 134 and stored in the retreat shelf of the holder rack 150 according to the control of the drive control unit 506. The holder rack 150 notifies the control unit 110 of the shelf number of the evacuation shelf in which the substrate holder 300 is stored. In step S1406, the warning unit 510 displays the management ID notified in step S1402, the shelf number of the evacuation shelf notified in step S1405, and a warning for prompting replacement of the holder main body 312 of the substrate holder 300 on the display unit 512. .

  If it is analyzed in step S1404 that there is no chip exceeding the allowable chip size, the process proceeds to step S1407. In step S <b> 1407, the substrate holder 300 is stored in the use shelf of the holder rack 150 according to the control of the drive control unit 506. In step S1408, the control unit 110 determines whether there is an unprocessed substrate holder 300 or not. If the determination is affirmative, the process moves to step S1402, and the unprocessed substrate holder 300 is carried into the holder aligner 134. If the determination is not affirmative in step S1408, the process ends.

  When there is a chip in the substrate holder 300, another chip may be generated from the chipped portion and adhere to the apparatus in the bonding apparatus 100, thereby possibly damaging the apparatus. Moreover, there is a possibility that the holder main body 312 will break based on the chipping. However, in the present embodiment, since the substrate holder 300 having a chip exceeding the allowable chip size is retracted to the retreat shelf of the holder rack 150 and is no longer used, the generation of further chips can be suppressed. Further, the user can know from the display on the display unit 512 that the holder body 312 needs to be replaced, the management ID of the substrate holder 300 that has been discontinued, and the shelf number of the evacuation shelf, and can easily start maintenance work. Can do. Here, an example in which the warning unit 510 displays a warning that prompts replacement of the holder main body 312 has been described, but the warning unit 510 may display a warning that prompts replacement of the substrate holder 300.

  In the flowchart shown in FIG. 14, instead of observing the contour shape of the substrate holder 300, the shape of the notch 315 of the substrate holder 300 may be observed. In the holder main body 312, it is considered that the notch 315 is particularly likely to be chipped. Therefore, by setting the observation target to the notch 315, the processing range can be increased by narrowing the observation range, and the occurrence of the defect can be detected efficiently.

  FIG. 15 is a flowchart showing a flow of processing of another management method of the substrate holder 300. This flow is executed in parallel with the bonding process of the substrate 120. This flow starts processing when the substrate holder 300 is carried into the holder aligner 134. In step S <b> 1501, the holder aligner 134 images the management plate 302 and transmits the imaging data to the control unit 110. The control unit 110 stores the received imaging data in the storage unit 502. In step S1502, the analysis unit 508 analyzes the imaging data stored in the storage unit 502, and detects the bar code space and the bar contrast value.

  In step S1503, the analysis unit 508 determines whether the contrast value detected in step S1502 exceeds the reference contrast value. The reference contrast value is set in advance by the user and stored in the storage unit 502. If it is determined in step S1503 that the value has been exceeded, this flow ends. In step S1504, the substrate holder 300 whose contrast value of the management plate 302 does not exceed the reference contrast value is controlled by the drive control unit 506 after the bonding process of the substrate 120 using the substrate holder 300 is completed. It is stored in the retreat shelf of the holder rack 150. The holder rack 150 notifies the control unit 110 of the shelf number of the evacuation shelf in which the substrate holder 300 is stored.

  In step S1505, the warning unit 510 displays the management ID acquired in step S1501, the shelf number of the evacuation shelf notified in step S1504, and a warning for cleaning the substrate holder 300 on the display unit 512. Then, this flow ends.

  In the flowchart shown in FIG. 15, an example in which the contrast value of the barcode is detected has been described. However, when the barcode reading error rate is detected and the reading error rate does not exceed the reference value, cleaning is performed. You may comprise so that the warning to urge may be performed. In the flowchart shown in FIG. 15, an example in which the reading status of the management plate 302 is inspected by the holder aligner 134 has been described. However, the reading status may be inspected by the bar code reader 162 of the separation mechanism 160.

  When the contrast value of the management plate 302 is lower than the reference contrast value and when the reading error rate exceeds the reference reading error rate, there is a high possibility that the management plate 302 is contaminated. When the management plate 302 is contaminated, there is a high possibility that the entire substrate holder 300 is contaminated. Therefore, in this embodiment, when the contrast value of the management plate 302 is lower than the reference value and when the reading error rate exceeds the reference value, the use of the substrate holder 300 on which the management plate 302 is installed is stopped. Then, a warning for prompting cleaning of the substrate holder 300 is given. Here, an example in which the warning unit 510 displays a warning that prompts the cleaning of the substrate holder 300 has been described, but the warning unit 510 may display a warning that prompts the replacement of the substrate holder 300.

  FIG. 16 is a flowchart showing the flow of processing of the management method of the substrate holder 300 when the management plate 302 is formed of a material whose color changes with time as an example of a material with aging. This flow is executed in parallel with the bonding process of the substrate 120. This flow starts processing when the substrate holder 300 is carried into the holder aligner 134.

  In step S <b> 1601, the holder aligner 134 images the external shape of the substrate holder 300 and the notch 315, images the management plate 302, and transmits the imaging data to the control unit 110. The control unit 110 stores the received imaging data in the storage unit 502. In step S1602, the analysis unit 508 extracts color information of the management plate 302 with reference to the imaging data stored in the storage unit 502. For example, when a material whose color gradually becomes blue as time passes is used as the material of the management plate 302, blue density information is extracted.

  In step S1603, the analysis unit 508 calculates the time by referring to the correspondence table of the time and blue density information stored in the storage unit 502. In step S1504, with reference to the correspondence table of the adsorber 316, the leaf spring 318, the permanent magnet 336, the power supply terminal 320 and the respective replacement times stored in the storage unit 502, the time and the time calculated in step S1503 are exchanged. It is determined whether there is a part that matches the time. If the analysis unit 508 determines that the replacement time of any part of the substrate holder 300 matches, the process proceeds to step S1605.

  In step S1605, according to the control of the drive control unit 506, the substrate holder 300 in which one of the parts matches the replacement time is placed in the holder rack 150 after the bonding process of the substrate 120 using the substrate holder 300 is completed. Store in the shelves. The holder rack 150 notifies the control unit 110 of the shelf number of the evacuation shelf in which the substrate holder 300 is stored. In step S1606, the warning unit 510 displays on the display unit 512 a warning that includes the management ID notified in step S1501 and the shelf number notified in step S1605, and prompts the replacement of the part that matches the replacement time in step S1504. .

  In the correspondence table of time and replacement time stored in the storage unit 502, for example, a period of half a year as the replacement time of the leaf spring 318 and the power supply terminal 320 and one year as the replacement time of the permanent magnet 336 are registered by the user. When the analysis unit 508 analyzes that the elapsed time is nine months, the warning unit 510 issues a warning that prompts maintenance of the leaf spring 318 and the power supply terminal 320.

  Here, the management plate 302 is formed of a material with aging and the time is calculated from the aging of the management plate 302. However, the target is not limited to the management plate 302, and the target is not limited to the substrate holder 300. Other parts may be used. That is, the magnet cover of the permanent magnet 336, the leaf spring 318, or the power supply terminal 320 may be formed of a material with aging, and the aging may be calculated by observing the aging of these parts. good.

  In the above-described embodiment, the warning unit 510 has been described with an example in which a warning is displayed on the display unit 512. However, the warning unit 510 may be configured to output a warning via the voice output unit 514. Still further, data including a warning may be transmitted to a computer installed in a management company of the substrate holder 300. By informing the management company that the substrate holder 300 requires maintenance, the replacement substrate holder 300 can be quickly provided.

  Further, in the above-described embodiment, an example in which the maintenance condition is whether the state of the predetermined index of the substrate holder 300 reaches a state requiring maintenance, for example, whether the adhesion degree of dust exceeds the reference adhesion degree or the like. Explained. However, the present invention is not limited to this, and the maintenance condition may be the remaining number of times of use until a state requiring maintenance is reached.

  Here, when observing dust adhering to the substrate holder 300 as an index, a case will be described as an example in which a maintenance condition is set such that the remaining number of times of use until reaching a state requiring maintenance is within 10 times. First, dust attached to the substrate holder 300 is observed by the holder aligner 134, and data indicating the size and position of the dust is transmitted to the control unit 110 and stored in the storage unit 502.

  Next, the analysis unit 508 refers to the data indicating the size and position of the dust stored in the storage unit 502, and the degree of dust adhesion exceeds the reference adhesion degree when the substrate holder 300 is used again and again. Analyze. The analysis unit 508 performs analysis by referring to the dust adhesion tendency data stored in the storage unit 502 and indicating how much the degree of dust adhesion increases when used once for each substrate holder 300. The dust adhesion tendency data is created for each substrate holder 300 by measuring in advance the degree of dust adhesion when used any number of times.

  Then, as a result of analysis by the analysis unit 508, when it is analyzed that the reference adhesion degree is exceeded due to use within 10 more times, the warning unit 510 displays a warning including the remaining number of use until the maintenance time on the display unit 512. To do. By giving the warning as described above, the user can know in advance that the substrate holder 300 is in a state requiring maintenance. Here, the remaining number of uses until the state requiring maintenance is described as an example, but the remaining time until reaching the state requiring maintenance may be used.

  FIG. 17 is a plan view schematically showing the overall structure of the bonding apparatus 100 according to the second embodiment. Elements common to those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted. The aligner 140 according to the second embodiment includes an observation unit 146 fixed to the ceiling. The delivery port 174 includes an observation unit 182.

  FIG. 18 is a perspective view schematically showing a state in which the lower substrate holder 360 according to the second embodiment is looked down from the information. FIG. 19 is a perspective view showing the same lower substrate holder 360 as viewed from below. Elements common to FIGS. 2 and 3 are denoted by the same reference numerals, and description thereof is omitted. The lower substrate holder 360 includes power supply terminals 321, 322, and 323 and an electrostatic chucking unit 324 (see FIG. 22).

  The power supply terminal 321 and the power supply terminal 322 are arranged close to each other, and the power supply terminal 322 is arranged outside the power supply terminal 321 in the circumferential direction. Further, a power supply terminal 323 is arranged apart from these. Each of the power supply terminals 321, 322, and 323 is arranged in pairs, and is connected to a voltage source that applies a positive voltage and a voltage source that applies a negative voltage, respectively. Then, a potential difference is generated between the lower substrate holder 310 and the substrate 120 to attract the substrate 120 to the lower substrate holder 310. The electrostatic adsorption may be a monopolar method.

  The three pairs of power supply terminals 321, 322, and 323 are used together when delivering the substrate holder 300. For example, when transferring power from a robot arm that supplies power to the power supply terminal 321 to another robot arm, the power supply terminal of the other robot arm is first brought into contact with the power supply terminal 322. Then, after the power supply to the power supply terminal 321 is stopped, the power supply to the power supply terminal 322 is started, so that the substrate holder 300 is delivered between the robot arms.

  FIG. 20 is a perspective view schematically showing a state in which the upper substrate holder 370 is looked down from above. FIG. 21 is a perspective view showing the same upper substrate holder 370 as viewed from below. Elements common to FIGS. 4 and 5 are denoted by the same reference numerals, and description thereof is omitted. The upper substrate holder 370 includes rear side terminals 332 and 334 and placement side terminals 342, 344 and 346. The placement side terminal 344 and the placement side terminal 346 are arranged close to each other, and the placement side terminal 346 is arranged on the outer side in the circumferential direction than the placement side terminal 344. Further, a placement-side terminal 342 is disposed apart from these.

  Each of the back-side terminals 332 and 334 and the placement-side terminals 342, 344, and 346 are arranged in pairs, and are connected to a power source that applies a positive voltage and a power source that applies a negative voltage, respectively. As a result, a potential difference is generated between the upper substrate holder 330 and the substrate 120, and the substrate 120 is attracted to the upper substrate holder 370. The electrostatic adsorption may be a monopolar method.

  The placement side terminal 342 faces the groove 317 of the lower substrate holder 360 when the upper substrate holder 370 and the lower substrate holder 360 face each other. Accordingly, the push-up pin protruding from the back side of the lower substrate holder 360 toward the upper substrate holder 370 passes through the groove 317 and contacts the placement side terminal 342.

  FIG. 22 is a conceptual diagram illustrating the configuration of the electrostatic chucking unit of the substrate holder 300 and the chucking control unit 350 that supplies electric power to the electrostatic chucking unit. FIG. 22 shows an example in which the substrate 120 is attracted to the lower substrate holder 360, but the present invention can also be applied to the case where the substrate 120 is attracted to the upper substrate holder 370. The lower substrate holder 360 includes an electrostatic attraction unit 324 including two electrodes 325 and an electrode 326. The electrode 325 and the electrode 326 are connected to a power supply terminal included in the holder table 135 or the transfer robot arm through one of three pairs of power supply terminals 321, 322, and 323, respectively.

  The adsorption control unit 350 includes variable voltage sources 354 and 355, ammeters 356 and 357, and a control unit 352. The variable voltage source 354 applies a negative DC voltage to the electrode 325. The variable voltage source 355 applies a positive DC voltage to the electrode 326. The electrode 325 and the electrode 326 to which voltage is applied induce static electricity in the lower substrate holder 360 and the substrate 120 and attract the substrate 120 to the lower substrate holder 360.

  Ammeters 356 and 357 measure the leakage current. When a voltage is applied to the electrode 325 and the electrode 326, a slight leakage current is generated. This leakage current varies depending on the state of adsorption of the substrate 120 to the lower substrate holder 310. That is, the leakage current decreases as the substrate 120 is accurately arranged with respect to the substrate holding surface 313 of the lower substrate holder 310, and the leakage current increases as the substrate 120 is displaced with respect to the substrate holding surface 313. Therefore, the state of adsorption of the substrate 120 of the lower substrate holder 360 is determined by detecting the leakage current.

  FIG. 23 is a cross-sectional view schematically showing the structure of the holder aligner 134 according to the second embodiment. In FIG. 23, an example in which the substrate 120 is placed on the lower substrate holder 360 will be described. The holder aligner 134 includes a holder table 135 and an observation unit 136 installed on a pedestal 137. The holder table 135 includes a vacuum suction unit 404, push-up pins 406, and a power supply terminal 408. The vacuum suction unit 404 vacuum-sucks the back surface of the lower substrate holder 360 via a plurality of suction ports provided on the surface of the holder table 135.

  The push-up pin 406 is driven in the vertical direction and is inserted through the through hole 314 of the lower substrate holder 310. The substrate 120 whose position and orientation are adjusted by the substrate aligner 131 is placed on the push-up pin 406 inserted through the through hole 314. The holder aligner 134 places the substrate 120 on the lower substrate holder 360 by lowering the push-up pins 406 after placing the substrate 120.

  The power supply terminal 408 is connected to the power supply terminal 322 of the lower substrate holder 360 and supplies power to the lower substrate holder 360. The observation unit 136 observes the substrate holder 300 and the substrate 120 placed on the holder table 135 and transmits image data including the entire image of the lower substrate holder 360 and the substrate 120 to the control unit 118.

  FIG. 24 is a cross-sectional view schematically showing the structure of the aligner 140 according to the second embodiment. Elements common to those in FIG. 7 are assigned the same reference numerals and description thereof is omitted. The observation unit 146 observes the substrate holder 300 and the substrate 120 mounted on the lower mounting table 421 and transmits image data including the entire image of the substrate holder 300 and the substrate 120 to the control unit 118.

  Here, a processing flow for forming a work pair by superposing the upper work and the lower work will be described. The upper work is first loaded into the aligner 140 by the robot arm 172 and placed on the lower placing table 421. Next, the aligner 140 observes the upper substrate holder 330 and the substrate 120 by the observation unit 146 and transmits image data including the entire image of the substrate holder 300 and the substrate 120 to the control unit 118.

  After the observation by the observation unit 146, the upper work is reversed by the robot arm 172, and is pressed against the upper stage 141 with the substrate holding surface 313 facing downward. The upper stage 141 sucks and holds the upper work. Next, the robot arm 172 places the lower work on the lower placement table 421. The aligner 140 performs the same processing as that of the upper workpiece, and transmits image data including the entire image of the substrate 120 and the lower substrate holder 310 to the control unit 118. The aligner 140 detects a plurality of alignment marks by imaging the surface of the substrate 120 of the lower workpiece with the upper microscope 143 while moving the lower mounting table 421 by the driving unit 424.

  Next, the aligner 140 images the surface of the substrate 120 of the upper workpiece with the lower microscope 144 while moving the lower mounting table 421 by the driving unit 424. Then, a plurality of alignment marks formed on the substrate 120 of the upper work are detected. The aligner 140 precisely aligns the positions of the substrates 120 based on the detected position information of the alignment marks of both the substrates 120. After the alignment is completed, the lower work table 421 is raised to bring the lower work substrate 120 into contact with the upper work substrate 120. Due to the contact between the lower work and the upper work, the adsorber 316 installed on the lower board holder 310 and the permanent magnet 336 installed on the upper board holder 330 act, so that the two boards 120 become the lower board holder 310 and the upper board. It is clamped by the holder 330. The workpiece pair thus formed is carried out from the aligner 140 by the robot arm 172.

  FIG. 25 is a block diagram schematically showing the system configuration of the control unit 118. The bonding apparatus 100 according to the present embodiment executes a management process for detecting the physical characteristics of the substrate holder 300 and managing the substrate holder 300 in parallel with the bonding process of the substrate 120 described above. In other words, the bonding apparatus 100 detects the suction state of the substrate to the electrostatic suction unit 324, determines the maintenance time of the electrostatic suction unit 324 based on the detected suction state, and based on the determined maintenance time. A warning that prompts maintenance of the electrostatic attraction unit 324 is given.

  The control unit 118 includes a storage unit 602, a drive control unit 604, a warning unit 610, a display unit 612, an audio output unit 614, and a communication unit 616. The storage unit 602 stores, for example, the management ID of the substrate holder 300 as data required for executing the management process according to the present embodiment.

  The drive control unit 604 includes a detection unit 606 and a determination unit 608. The detection unit 606 controls each device in the bonding apparatus 100 to detect the suction state of the substrate 120 on the electrostatic suction unit 324. The determination unit 608 analyzes the suction state detected by the detection unit 606 and determines the maintenance time of the electrostatic suction unit 324. The warning unit 610 issues a warning that prompts maintenance of the electrostatic attraction unit 324 according to the maintenance timing of the electrostatic attraction unit 324 determined by the determination unit 608.

  The display unit 612 displays a warning that prompts maintenance of the electrostatic attraction unit 324 according to the control of the warning unit 610. The sound output unit 614 outputs a warning that prompts maintenance of the electrostatic attraction unit 324 according to the control of the warning unit 610. The communication unit 616 transmits data including a warning urging maintenance of the electrostatic attraction unit 324 to another device via the network according to the control of the warning unit 610.

  FIG. 26 is a flowchart illustrating an embodiment of a management process for managing the electrostatic attraction unit 324. The processing of each step in this flowchart is executed according to the control of the control unit 118. This flowchart starts when the robot arm 116 carries the substrate 120 into the atmospheric environment unit 102. In step S2601, the robot arm 116 carries the substrate 120 into the substrate aligner 131. The position and orientation of the substrate 120 are adjusted by the substrate aligner 131.

  In step S2602, the robot arm 171 and the robot arm 172 carry the substrate holder 300 out of the holder rack 150 and carry it into the holder aligner 134. Here, when the substrate holder 300 is unloaded from the holder rack 150, the barcode reader 152 reads the management plate 302 and transmits the management ID to the control unit 118. The control unit 118 stores the management ID in the storage unit 602. The position and orientation of the substrate holder 300 are adjusted by the holder aligner 134.

  In step S 2603, the substrate slider 138 places the substrate 120 on the substrate holder 300. The substrate 120 and the substrate holder 300 are adjusted by the substrate aligner 131 and the holder aligner 134 so that the notch 122 is disposed at a predetermined position with respect to the position of the notch 315. For example, the cutout 315 is adjusted to be positioned on a straight line connecting the center of the substrate 120 and the notch 122. Other arrangements are possible as long as the relative positions of the notch 122 and the notch 315 can be detected. After the substrate 120 is placed on the substrate holder 300, the holder aligner 134 supplies power to the electrostatic attraction unit 324 of the substrate holder 300 via the power supply terminal 408. The substrate holder 300 electrostatically attracts the substrate 120.

  In step S2604, the detection unit 606 detects the relative positional relationship between the substrate 120 and the substrate holder 300 as the first state. The detection unit 606 first observes the substrate 120 and the substrate holder 300 by the observation unit 136 of the holder aligner 134. Then, the detection unit 606 stores image data including the entire image of the substrate 120 and the substrate holder 300 in the storage unit 602.

  Next, the detection unit 606 calculates the coordinates of the center point of the substrate 120 and the center point of the substrate holder 300 by performing image processing on the image data stored in the storage unit 602. Then, the detection unit 606 detects the relative coordinates of the center point as the first positional deviation amount between the substrate 120 and the substrate holder 300. Further, the detection unit 606 detects an angle formed by a straight line connecting the center point of the substrate 120 and the notch 122 and a straight line connecting the center point of the substrate holder 300 and the notch 315 as the first angular deviation amount. Then, the detection unit 606 stores the detected first positional deviation amount and first angular deviation amount in the storage unit 602 as the first state.

  In step S2605, the robot arm 171 and the robot arm 173 carry the workpiece into the aligner 140. In the robot arm 173, the aligner 140 places a work on the lower placing table 421. In step S2606, the detection unit 606 detects the relative positional relationship between the substrate 120 and the substrate holder 300 as the second state. The detection unit 606 first observes the substrate 120 and the substrate holder 300 by the observation unit 146 of the aligner 140. Then, the detection unit 606 stores image data including the entire image of the substrate 120 and the substrate holder 300 in the storage unit 602.

  Next, the detection unit 606 calculates the coordinates of the center point of the substrate 120 and the center point of the substrate holder 300 by performing image processing on the image data stored in the storage unit 602. Then, the detection unit 606 detects the relative coordinates of the center point as the second positional deviation amount between the substrate 120 and the substrate holder 300. The detection unit 606 detects the angle formed by the straight line connecting the center point of the substrate 120 and the notch 122 and the straight line connecting the center point of the substrate holder 300 and the notch 315 as the second angular deviation amount. Then, the detection unit 606 stores the detected second positional deviation amount and second angular deviation amount in the storage unit 602 as the second state.

  In step S2607, the detection unit 606 determines the difference between the first state and the second state stored in the storage unit 602, that is, the difference between the first positional deviation amount and the second positional deviation amount, and the first angle. A difference between the deviation amount and the second angular deviation amount is detected. Then, the detection unit 606 stores the detected difference in the storage unit 602 as a change amount of the shift between the first state and the second state.

  In step S2608, the determination unit 608 determines whether or not the deviation change amount detected in step S2607 exceeds a predetermined allowable deviation amount. For example, when the two substrates 120 are overlapped, the allowable deviation amount is a submicron for each of the misalignment amount and the angular deviation amount of the center point as a deviation amount at which the positions of the through electrodes formed on the substrate 120 are not aligned. Preset by the user in units.

  The determination unit 608 determines that it is the maintenance time of the electrostatic attraction unit 324 when the variation amount of the deviation exceeds the allowable deviation amount. If it is determined by the determination unit 608 that the deviation change amount exceeds the allowable deviation amount, the process proceeds to step S2609. In step S2609, after the bonding process of the substrate 120 using the substrate holder 300 determined to be the maintenance time of the electrostatic attraction unit 324 is completed, the robot arm 173 places the substrate holder 300 on the retreat shelf of the holder rack 150. Store. At this time, the holder rack 150 notifies the control unit 118 of the shelf number of the evacuation shelf in which the substrate holder 300 is stored.

  In step S2610, the warning unit 610 displays on the display unit 612 a management ID of the substrate holder 300 stored in the evacuation shelf, the shelf number of the evacuation shelf notified in step S2609, and a warning prompting maintenance of the electrostatic chuck 324. indicate. And the process of this flowchart is complete | finished.

  In many areas in the bonding apparatus 100, the substrate holder 300 is transported while holding the substrate 120 by electrostatic attraction. When the electrostatic attraction unit 324 is deteriorated, the electrostatic attraction force is weakened, and the substrate 120 may be displaced during conveyance. And when position shift arises between the board | substrate holder 300 and the board | substrate 120, the joining defect generate | occur | produces because the alignment precision of the board | substrate 120 falls.

  However, in the present embodiment, since the substrate holder 300 in which the deviation exceeding the allowable deviation amount occurs due to the conveyance from the holder aligner 134 to the main aligner 140 is retracted to the retreat shelf of the holder rack 150 and the use is stopped, the alignment is performed. A decrease in accuracy can be suppressed. Further, the user can know from the display on the display unit 612 that the electrostatic chucking unit 324 of the substrate holder 300 requires maintenance, the management ID of the substrate holder 300 that has been discontinued, and the shelf number of the evacuation shelf. Maintenance work can be started immediately. Here, an example in which the warning unit 610 displays a warning that prompts maintenance of the electrostatic attraction unit 324 has been described, but the warning unit 510 may display a warning that prompts replacement of the substrate holder 300. .

  The warning displayed on the display unit 612 is erased by the control unit 118 when the corresponding substrate holder 300 is unloaded from the retraction shelf of the holder rack 150. Specifically, the holder rack 150 detects that the substrate holder 300 has been unloaded from the evacuation shelf, and notifies the control unit 118 of the shelf number. Upon receiving the notification, the control unit 118 performs control so as to end the display of the warning corresponding to the notified shelf number.

  In the flowchart shown in FIG. 26 described above, the second state, which is the relative positional relationship between the substrate 120 and the substrate holder 300, has been described as an example of detection by the aligner 140 in step S2606. It may be detected. The delivery port 174 observes the work conveyed from the preliminary aligner 130 by the observation unit 182. Then, the delivery port 174 transmits image data including the entire image of the work to the control unit 118.

  Then, the detection unit 606 detects the second state from the image data observed by the delivery port 174, and detects a difference from the first state. As described above, when the second state is detected by the delivery port 174 and the change amount of the deviation exceeds the allowable deviation amount, the workpiece is stored in the retreat shelf without being carried into the aligner 140. You may control. Before carrying the substrate holder 300 in which the electrostatic chucking unit 324 has deteriorated into the main aligner 140 by detecting the second state with the transfer port 174 installed while the workpiece is transferred from the holder aligner 134 to the main aligner 140. Can be transported to the shelves. Therefore, the processing speed can be increased as compared with the case of carrying in the aligner 140 and then transporting it to the retreat shelf.

  In the flowchart shown in FIG. 26, it is determined that the maintenance time has come when the difference between the first state and the second state, i.e., the amount of deviation that occurs during conveyance from the holder aligner 134 to the main aligner 140 exceeds the allowable deviation amount. Explained with an example. As another embodiment, an example will be described in which the maintenance time is determined based on the frequency of occurrence of an adsorption error in which the deviation detected by the detection unit 606 exceeds a predetermined allowable deviation amount.

  When determining the maintenance time based on the occurrence frequency of the suction error, the storage unit 602 creates a correspondence table that associates the management ID of the substrate holder 300, the number of times of use, and the number of times that the change amount of deviation exceeding the allowable deviation amount occurs by the detection unit 606 Remember. Then, the determination unit 608 refers to the correspondence table stored in the storage unit 602 and determines the maintenance time of the electrostatic attraction unit 324.

  The determination unit 608 calculates the occurrence frequency of the suction error when the substrate holder 300 is used a predetermined number of times, and determines that the maintenance time is approaching as the occurrence frequency is higher. For example, when the substrate holder 300 is used 1000 times, the determination unit 608 determines that the maintenance time has been reached when the occurrence frequency of the suction error exceeds 0.3%, and determines 0.1% If it has exceeded, it is determined that the remaining number of use until the maintenance time is 100 times.

  When the determination unit 608 determines that the maintenance time has been reached, the control unit 118 stores the substrate holder 300 in the retraction shelf after the bonding process of the substrate 120 using the target substrate holder 300 is completed. Control. The warning unit 610 displays the management ID of the target substrate holder 300, the shelf number of the evacuation shelf, and a warning for prompting maintenance of the electrostatic chucking unit 324 on the display unit 612.

  On the other hand, when the determination unit 608 determines the remaining number of uses until the maintenance time, the control unit 118 continues to use the target substrate holder 300 without storing it in the retreat shelf. Then, the warning unit 610 displays a warning including the management ID of the target substrate holder 300 and the remaining number of times of use until the maintenance time on the display unit 612.

  As described above, when the maintenance timing of the electrostatic chucking unit 324 is determined according to the frequency of occurrence of the chucking error and the warning unit 610 gives a warning, the user knows the maintenance time in advance and can prepare for the maintenance. In addition, instead of displaying a warning including the remaining number of times of use until the maintenance time on the display unit 612, the warning unit 610 has reached the maintenance time of the electrostatic chuck 324 when the remaining number of times of use has been used. Control may be performed so that a warning including the effect is displayed on the display unit 612.

  Further, the determination unit 608 may determine the remaining use time instead of the remaining use count until the maintenance time. When the determination unit 608 determines the remaining usage time, the warning unit 610 displays a warning including the remaining usage time until the maintenance time on the display unit 612. Similarly to the case where the remaining usage count is determined, the warning unit 610 displays the warning including the remaining usage time, and when the remaining usage time has elapsed, the maintenance time of the electrostatic attraction unit 324 comes. Control may be performed so that a warning including the effect is displayed on the display unit 612.

  In the flowchart shown in FIG. 26 described above, the warning unit 610 has been described as an example of displaying a warning on the display unit 612. However, the warning unit 610 may be configured to output the warning via the voice output unit 614. . By providing a warning to the user by voice output, it is possible to notify the warning to a user who does not pay attention to the display unit 612, and a quicker response can be expected. Still further, data including a warning may be transmitted to a computer installed in a management company of the substrate holder 300. By informing the management company that the electrostatic chucking unit 324 of the substrate holder 300 requires maintenance, for example, the replacement substrate holder 300 can be quickly provided.

  Further, in step S2605 of the flowchart shown in FIG. 26, when the workpiece is transferred from the preliminary aligner 130 to the main aligner 140, the control unit 118 transfers the workpiece with a larger acceleration than the normal transfer, thereby You may comprise so that an electrostatic attraction force may be test | inspected. For example, every time the substrate holder 300 is used 100 times, the control unit 118 transports the workpiece with a large acceleration. Then, the control unit 118 detects the amount of deviation between the substrate 120 and the substrate holder 300 in the holder aligner 134 and the change in the amount of deviation between the substrate 120 and the substrate holder 300 in the present aligner 140 to determine the maintenance time. If a displacement occurs when a large acceleration is applied, the user can be warned that the maintenance time is approaching.

  FIG. 27 is a conceptual diagram showing another embodiment for detecting the state of adsorption of the substrate 120 to the electrostatic adsorption unit 324. In the embodiment shown in FIG. 27, the suction state of the substrate 120 is detected when the workpiece formed by the preliminary aligner 130 is transferred to the robot arm 173 via the transfer port 174 according to the control of the control unit 118. FIG. 28 is a schematic view of the delivery port 174 shown in FIG. 27 as viewed from the side. Here, an example will be described in which the robot arm 172 that has unloaded the lower workpiece formed by the spare aligner 130 is transferred to the robot arm 173 via the transfer port 174.

  The lower workpiece formed by the preliminary aligner 130 is conveyed by the robot arm 172 to above the delivery port 174. The transfer port 174 includes three push-up pins 183, 184, 185, and holds the lower work by raising the push-up pins 183, 184, 185. Power supply terminals are provided at the tips of the push-up pins 183 and 184 and come into contact with the power supply terminals 321 of the lower substrate holder 360.

  The delivery port 174 further includes three push-up pins 186, 187 and 188, and the push-up pins 186, 187 and 188 are lifted to penetrate the through hole 314 of the lower substrate holder 360 to remove the substrate 120 from the substrate holder 300. Once separated. The attracting force due to the residual magnetic field is released by the separation.

  Then, the substrate 120 is placed on the lower substrate holder 360 by lowering the push-up pins 186, 187 and 188, and power is supplied from the power supply terminals of the push-up pins 183 and 184. The lower substrate holder 360 that is supplied with power electrostatically attracts the substrate 120. At this time, the transfer port 174 observes the substrate 120 and the lower substrate holder 360 by the observation unit 182, and detects the displacement amount and the displacement direction of the substrate 120 with respect to the lower substrate holder 360 as the first displacement information. The delivery port 174 transmits the detected first deviation information to the control unit 118. The control unit 118 stores the first deviation information in the storage unit 602.

  Next, the robot arm 173 is positioned below the lower substrate holder 360. The delivery port 174 lowers the push-up pins 183, 184, 185 after stopping the power supply to the power supply terminals of the push-up pins 183, 184. By lowering, the lower substrate holder 360 is placed on the robot arm 173. The power supply terminal 323 formed on the back surface of the lower substrate holder 360 and the power supply terminal 175 provided at the base of the robot arm 173 are in contact with each other.

  The transfer port 174 raises the push-up pins 186, 187 and 188 again to separate the substrate 120 from the substrate holder 300. The delivery port 174 lowers the push-up pins 186, 187 and 188 to place the substrate 120 on the lower substrate holder 360, and then supplies power to the lower substrate holder 360 through the power supply terminal 175. At this time, the transfer port 174 observes the substrate 120 and the lower substrate holder 360 by the observation unit 182 and detects the amount of displacement and the direction of displacement of the substrate 120 with respect to the lower substrate holder 360 as second displacement information. The delivery port 174 transmits the detected second deviation information to the control unit 118. The control unit 118 stores the second shift information in the storage unit 602.

  Next, the detection unit 606 detects whether or not the first deviation amount and the second deviation amount stored in the storage unit 602 exceed the allowable deviation amount. When the detection unit 606 detects that the first deviation amount and the second deviation amount do not exceed the allowable deviation amount, the determination unit 608 determines that the maintenance time has not yet been reached. On the other hand, when the detection unit 606 detects that the first deviation amount and the second deviation amount exceed the allowable deviation amount and the deviation directions also match, the determination unit 608 determines that the electrostatic adsorption unit 324 Judge that the maintenance time has been reached.

  For example, when power is supplied to the power supply terminal 321 and when power is supplied to the power supply terminal 323, the electrode 326 is deteriorated as compared with the electrode 325 when the substrate 120 is shifted to the electrode 325 side of the lower substrate holder 360. There is a possibility. Further, when the substrate 120 is shifted to the electrode 326 side of the lower substrate holder 360, the electrode 325 may be deteriorated as compared with the electrode 326. Accordingly, the determination unit 608 determines that the maintenance time for the electrode 325 or the electrode 326 has been reached.

  On the other hand, when the detection unit 606 detects that the first shift amount and the second shift amount exceed the allowable shift amount and the shift directions do not match, the determination unit 608 determines that the power supply terminal 321 or It is determined that the maintenance time 323 is reached. For example, when power is supplied to the power supply terminal 321 and when power is supplied to the power supply terminal 323, when the substrate 120 is shifted in a different direction with respect to the lower substrate holder 360, not the electrodes 325 and 326 but the power supply terminal 321. Alternatively, the power supply terminal 323 may be deteriorated. Therefore, the determination unit 608 is configured to determine that the maintenance time of the power supply terminal 321 or the power supply terminal 323 has been reached.

  When the determination unit 608 determines that the maintenance time of the electrodes 325 and 326 of the electrostatic attraction unit 324 has been reached, the warning unit 610 ends with the management ID, The display unit 612 displays a shelf number of the evacuation shelf and a warning prompting maintenance of the electrostatic chuck unit 324. On the other hand, when the warning unit 610 determines that the maintenance time of the power supply terminals 321 and 323 of the electrostatic attraction unit 324 is reached by the determination unit 608, after the joining process is completed and stored in the retraction shelf, A management ID, a shelf number of the evacuation shelf, and a warning prompting maintenance of the power supply terminals 321 and 323 are displayed on the display unit 512. Here, an example in which the state of adsorption of the substrate 120 to the electrostatic adsorption unit 324 is detected by the transfer port 174 has been described, but the detection may be performed by a dedicated detection device.

  In the embodiment shown in FIG. 27, an example in which the state of adsorption of the substrate 120 to the electrostatic adsorption unit 324 is detected by sequentially applying voltage to the power supply terminal 321 and the power supply terminal 323 of the lower substrate holder 360 will be described. I explained, but not limited to it. The suction state may be detected by simultaneously applying a voltage to the power supply terminal 321 and the power supply terminal 323. An embodiment in which a voltage is simultaneously applied to the power supply terminal 321 and the power supply terminal 323 will be described below.

  First, the control unit 118 places the robot arm 173 below the lower work with the lower work mounted on the push-up pins 183, 184, 185. In the control unit 118, the tip ends of the push-up pins 183 and 184 are in contact with the power supply terminal 321 of the lower substrate holder 360, and the power supply terminal 175 of the robot arm 173 is in contact with the power supply terminal 323 of the lower substrate holder 360. Push the push-up pins 183, 184, 185 down to the position. Next, the control unit 118 supplies power to the lower substrate holder 360 simultaneously from the power supply terminals and the power supply terminals 175 provided at the tips of the push-up pins 183 and 184.

  Here, there is no potential difference if there is no difference between the resistance value from the power supply terminal 321 side and the resistance value from the power supply terminal 323 side. However, when the power supply terminal 321 or the power supply terminal 323 is deteriorated, a difference occurs in the resistance value. Therefore, a voltage source that supplies power to the power supply terminal 321 or a voltage source that supplies power to the power supply terminal 323 Reverse current flows through The control unit 118 detects the deterioration of the power supply terminal 321 or the power supply terminal 323 by detecting the reverse current. When the control unit 118 detects that the power feeding terminal 321 or the power feeding terminal 323 is deteriorated, the warning unit 510 displays a warning for prompting maintenance of the power feeding terminal 321 or the power feeding terminal 323 on the display unit 512.

  In the embodiment shown in FIG. 27, the example in which the suction state of the substrate 120 to the electrostatic suction unit 324 is detected by the delivery port 174 has been described. However, the suction state may be detected by the separation mechanism 160. The separation mechanism 160 pushes up a part of the outer periphery of the substrate holder 300 with a protruding pin when separating the bonded substrate from the substrate holder 300 that is sucked and fixed to the mounting stage. When the separation mechanism 160 is configured to detect the suction state, the separation mechanism 160 measures the reaction force received by the ejection pin and stores it in the storage unit 602 in association with the management ID of the substrate holder 300.

  The detection unit 606 refers to the change in the reaction force stored in the storage unit 602 and detects the adsorption state of the substrate to the electrostatic adsorption unit 324. That is, the detection unit 606 detects that the electrostatic attraction force 324 has deteriorated when the reaction force starts to decrease with time. In the bonding process of the substrate 120, the adsorption state can be detected by a short process of measuring the reaction force received by the ejecting pin by the separation mechanism 160, so that the throughput of the entire bonding process due to the detection of the adsorption state is reduced. Can be suppressed.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

DESCRIPTION OF SYMBOLS 100 Bonding apparatus, 101 Case, 102 Air environment part, 110 Control part, 112 EFEM, 113, 114, 115 Load port, 116 Robot arm, 118 Control part, 120 Substrate, 122 Notch, 130 Spare aligner, 131 Substrate aligner , 132 substrate table, 133 observation unit, 134 holder aligner, 135 holder table, 136 observation unit, 137 base, 138 substrate slider, 140 aligner, 141 upper stage, 142 lower stage, 143 upper microscope, 144 lower microscope, 145 interference Total, 146 Observation unit, 150 Holder rack, 152 Bar code reader, 160 Separation mechanism, 162 Bar code reader, 171, 172, 173 Robot arm, 174 Delivery port, 175 Power supply terminal, 18 Observation unit, 183, 184, 185, 186, 187, 188 Push-up pin, 202 Vacuum environment unit, 220 Load lock chamber, 222, 224 Shutter, 230 Robot arm, 240 Heating and pressing unit, 300 Substrate holder, 302 Management plate , 310 Lower substrate holder, 312 Holder body, 313 Substrate holding surface, 314 Through hole, 315 Notch, 316 Adsorber, 317 Groove, 318 Leaf spring, 320, 321, 322, 323 Feed terminal, 324 Electrostatic adsorption portion, 325 326 Electrode, 330 Upper substrate holder, 332, 334 Back side terminal, 336 Permanent magnet, 342, 344, 346 Placement side terminal, 350 Adsorption control unit, 352 Control unit, 354, 355 Variable voltage source, 356, 357 Current 360 lower substrate holder 370 Upper substrate holder, 404 Vacuum suction part, 406 Push-up pin, 407 Load cell, 408 Power supply terminal, 410 Illumination part, 414 Inspection illumination light, 415 Regular reflection light, 416 Dust, 417 Scattered light, 421 Lower mounting table, 422 Lifting Unit, 423 base unit, 424 drive unit, 425 base, 502 storage unit, 504 count unit, 506 drive control unit, 508 analysis unit, 510 warning unit, 512 display unit, 514 audio output unit, 516 communication unit, 602 storage unit 604 Drive control unit 606 detection unit 608 determination unit 610 warning unit 612 display unit 614 audio output unit 616 communication unit

Claims (50)

An index acquisition unit that acquires a predetermined index state of the substrate holder that holds the substrate;
An analysis unit that analyzes whether the state matches a preset maintenance condition;
A substrate holder maintenance device comprising: a warning unit that issues a warning for prompting maintenance when it is analyzed that the maintenance condition matches the state.   The substrate holder maintenance apparatus according to claim 1, wherein the index acquisition unit observes unevenness at a predetermined location of the substrate holder as an index, and acquires an uneven state as the state.   The substrate holder maintenance apparatus according to claim 2, wherein the index acquisition unit observes the unevenness of a holding surface that holds the substrate among the substrate holders as an index.   The said index acquisition part is a substrate holder maintenance apparatus of Claim 3 which acquires the said unevenness | corrugation from the focus information at the time of observation image acquisition.   The substrate holder maintenance device according to claim 3, wherein the index acquisition unit acquires the unevenness along a radial direction of the holding surface.   The substrate holder maintenance apparatus according to claim 3, wherein the index acquisition unit acquires the unevenness state of the holding surface from an adsorption state of the substrate on the holding surface.   The substrate holder maintenance apparatus according to claim 3, wherein the warning unit issues a warning that prompts polishing of the holding surface as the maintenance.   The substrate holder maintenance apparatus according to claim 2, wherein the index acquisition unit observes the unevenness of a management sign for managing the substrate holder provided on the substrate holder as an index.   The substrate holder maintenance apparatus according to claim 8, wherein the analysis unit determines a maintenance timing of a holding surface that holds the substrate among the substrate holders based on the observed analysis result of the unevenness.   10. The substrate according to claim 2, wherein the analysis unit analyzes whether the observed unevenness exceeds a reference height difference between a convex portion and a concave portion set in advance as the maintenance condition. Holder maintenance device.   The substrate holder maintenance apparatus according to claim 1, wherein the index acquisition unit observes dust adhering to the substrate holder as an index.   The substrate holder maintenance apparatus according to claim 11, wherein the index acquisition unit observes the dust attached to a holding surface that holds the substrate among the substrate holders as an index.   12. The substrate holder maintenance apparatus according to claim 11, wherein the index acquisition unit observes the dust adhering to a surface of a management sign that manages the substrate holder provided on the substrate holder as an index.   The substrate holder maintenance apparatus according to claim 11, wherein the index acquisition unit observes the dust adhering to an adsorption surface of an adsorption unit that adsorbs the substrate holders as an index.   The substrate holder maintenance according to any one of claims 11 to 14, wherein the analysis unit analyzes whether or not the observed adhesion degree of the dust exceeds a reference adhesion degree set in advance as the maintenance condition. apparatus.   The said parameter | index acquisition part observes the said dust with the observation image acquired by the dark field method which observes the scattered light of the light which hits the observation object surface from diagonally. Substrate holder maintenance device.   The substrate holder maintenance device according to any one of claims 11 to 16, wherein the warning unit issues a warning prompting the removal of dust of the index as the maintenance. The index acquisition unit observes a reading situation when reading a management sign for managing the substrate holder provided in the substrate holder as an index,
The substrate holder maintenance apparatus according to claim 1, wherein the analysis unit analyzes whether the observed reading situation matches a reference reading situation set in advance as the maintenance condition.   19. The substrate holder maintenance apparatus according to claim 18, wherein the reading status is at least one of a reading error rate when reading the management mark and a contrast value of the read management mark.   20. The substrate holder maintenance apparatus according to claim 18, wherein the warning unit issues a warning for prompting cleaning of the substrate holder as the maintenance. The index acquisition unit observes at least a part of the shape of the substrate holder as an index,
The substrate holder maintenance apparatus according to claim 1, wherein the analysis unit analyzes whether or not the observed shape exceeds a difference from a reference shape preset as the maintenance condition.   The analysis unit extracts whether or not the observed shape includes a chip of the substrate holder, and when the chip is extracted, whether or not the size of the chip that is allowed as the difference is exceeded. The board | substrate holder maintenance apparatus of Claim 21 to analyze.   23. The substrate holder maintenance apparatus according to claim 22, wherein the warning unit issues a warning prompting replacement of the main body of the substrate holder as the maintenance. The index acquisition unit observes the shape of the adsorption unit that adsorbs the substrate holders,
The substrate holder maintenance apparatus according to claim 21, wherein the analysis unit analyzes whether or not a reference wear amount determined as the difference is exceeded.   25. The substrate holder maintenance apparatus according to claim 24, wherein the warning unit issues a warning prompting replacement of at least the suction unit as the maintenance. The index acquisition unit is formed of a material with aging, and observes aging of members installed on the substrate holder as an index,
The analysis unit calculates time from the observed secular change of the member, and is determined in advance as the maintenance condition and stored in association with the time. The substrate holder maintenance apparatus according to claim 1, which analyzes whether or not they match.   27. The substrate holder maintenance apparatus according to claim 26, wherein the member is a leaf spring that is provided in the substrate holder and constitutes an adsorption portion that adsorbs the substrate holders.   27. The substrate holder maintenance apparatus according to claim 26, wherein the member is a magnet cover that is provided in the substrate holder and covers a permanent magnet that constitutes an attracting portion that attracts the substrate holders.   27. The substrate holder maintenance apparatus according to claim 26, wherein the member is a power supply terminal provided to the substrate holder.   27. The substrate holder maintenance apparatus according to claim 26, wherein the member is a management mark provided on the substrate holder for managing the substrate holder.   31. The substrate holder maintenance apparatus according to claim 26, wherein the warning unit issues a warning that prompts maintenance of a portion that matches the replacement time.   32. The substrate holder maintenance device according to claim 1, wherein the warning unit displays a warning for prompting the maintenance on a display device. The analysis unit analyzes a maintenance time of at least one part of the substrate holder based on the state acquired by the index acquisition unit,
33. The substrate holder according to claim 32, wherein the warning unit displays at least one of a remaining time until the maintenance time analyzed by the analysis unit or a remaining use count until the maintenance time as a warning for prompting the maintenance. Maintenance device.   The substrate holder according to any one of claims 1 to 33, wherein the warning unit accommodates the substrate holder in a holder rack that accommodates the substrate holder when it is analyzed that the maintenance condition matches the state. Maintenance device. The index acquisition unit includes a detection unit that detects an adsorption state of the substrate to the electrostatic adsorption unit of the substrate holder having an electrostatic adsorption unit that electrostatically adsorbs a substrate as the state of the index,
The analysis unit includes a determination unit that determines a maintenance time of the electrostatic adsorption unit based on the adsorption state,
The substrate holder maintenance apparatus according to claim 1, wherein the warning unit issues a warning that prompts maintenance of the electrostatic attraction unit based on the maintenance time determined by the determination unit. The detection unit detects the suction state based on a deviation between the substrate sucked by the electrostatic suction unit and the substrate holder,
36. The substrate holder maintenance apparatus according to claim 35, wherein the determination unit determines the maintenance time based on a frequency of occurrence of an adsorption error in which a deviation detected by the detection unit exceeds a predetermined allowable deviation.   37. The substrate holder maintenance device according to claim 35 or 36, wherein the detection unit detects the suction state by switching power supply to a plurality of power supply terminals provided in the substrate holder.   38. The substrate holder maintenance apparatus according to claim 37, wherein the detection unit switches the power supply during delivery when the substrate holder is transported. The detection unit includes a first state that is a relative positional relationship between the substrate and the substrate holder, which is observed by a first observation unit provided in a mounting device that mounts the substrate on the substrate holder; Detecting a difference in a second state, which is a relative positional relationship between the substrate and the substrate holder, observed by a second observation unit provided in a superimposing apparatus that superimposes the substrate and another substrate; Detecting a change in displacement of the substrate holder;
36. The substrate holder maintenance apparatus according to claim 35, wherein the determination unit determines a maintenance time of the electrostatic attraction unit based on a detected change in deviation.   36. The substrate holder maintenance apparatus according to claim 35, wherein the detection unit detects the adsorption state based on a current value supplied to the electrostatic adsorption unit.   The detection unit detects the suction state while transporting the substrate and the substrate holder from a placement device for placing the substrate on the substrate holder to an overlay device for superimposing the substrate and another substrate. The substrate holder maintenance device according to any one of claims 35 to 40.   While the detection unit conveys the substrate and the substrate holder from a superposition device that superimposes the substrate and another substrate to a pressurization device that pressurizes the superposed substrate and the other substrate, 41. The substrate holder maintenance device according to claim 35, wherein the suction state is detected.   43. The substrate holder maintenance device according to claim 35, wherein the warning unit displays a warning for prompting the maintenance on a display device.   44. The warning unit according to claim 43, wherein the warning unit displays at least one of a remaining time until the maintenance time determined by the determination unit or a remaining number of times of use until the maintenance time as a warning for prompting the maintenance. Substrate holder maintenance device.   45. The substrate holder maintenance according to any one of claims 35 to 44, wherein the warning unit accommodates the substrate holder in a holder rack that accommodates the substrate holder in accordance with the maintenance time determined by the determination unit. apparatus.   46. The substrate holder maintenance apparatus according to claim 1, wherein the warning unit outputs a warning for prompting the maintenance.   47. The substrate holder maintenance apparatus according to any one of claims 1 to 46, wherein the warning unit transmits data including a warning prompting the maintenance to another apparatus. A substrate holder maintenance device according to any one of claims 1 to 47,
A substrate bonding apparatus comprising: a bonding unit that bonds a plurality of substrates held by each of a plurality of substrate holders. An index acquisition step of acquiring a predetermined index state of the substrate holder holding the substrate;
An analysis step for analyzing whether the state matches a preset maintenance condition;
A substrate holder maintenance method comprising: a warning step for issuing a warning for urging maintenance when it is analyzed that the maintenance condition matches the state. A bonding step of bonding a plurality of substrates held by each of the plurality of substrate holders;
A dividing step of dividing the plurality of bonded substrates into a plurality of semiconductor devices;
An index acquisition step of acquiring a predetermined index state of the substrate holder;
An analysis step for analyzing whether the state matches a preset maintenance condition;
A bonded semiconductor device manufacturing method comprising: a warning step for issuing a warning for prompting maintenance when it is analyzed that the maintenance condition matches the state.

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