JP2013026465A - 電子デバイス - Google Patents
電子デバイス Download PDFInfo
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- JP2013026465A JP2013026465A JP2011160262A JP2011160262A JP2013026465A JP 2013026465 A JP2013026465 A JP 2013026465A JP 2011160262 A JP2011160262 A JP 2011160262A JP 2011160262 A JP2011160262 A JP 2011160262A JP 2013026465 A JP2013026465 A JP 2013026465A
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Abstract
【解決手段】金からなるワイヤ6が接続されるパッド電極1を備えた電子デバイス10であって、パッド電極1は、AlまたはAl合金からなる下地電極1aと、下地電極1a上のTiまたはCrからなる中間膜1bと、中間膜1b上のワイヤ6が接続されるAu膜1cとが順に積層されてなる。
【選択図】図1
Description
本実施形態の電子デバイス10は、図1に示すように、金からなるワイヤ6が接続されるパッド電極1を備えている。電子デバイス10のパッド電極1は、Al合金からなる下地電極1aと、下地電極1a上のTiまたはCrからなる中間膜1bと、中間膜1b上のワイヤ6が接続されるAu膜1cとが順に積層されている。
図5に示す電子デバイス10は、実施形態1の電子デバイス10のパッド電極1の構成以外は、略同一の構造としている。本実施形態の電子デバイス10は、AlまたはAl合金からなる下地電極1aと、Mo、Ta、Tiのいずれか1種またはTiN、TaN、MoNのいずれか1種から構成される中間膜1bと、Au膜1cとが順に形成されている。また、本実施形態の電子デバイス10は、下地電極1aと中間膜1bとの間および中間膜1bとAu膜1aとの間には、Cr膜1baが形成されている。なお、実施形態1と同様の構成要素については、同一の符号を付して説明を適宜省略している。
本実施形態の電子デバイス10は、図5に示す実施形態2の電子デバイス10と略同一の構造としている。本実施形態の電子デバイス10は、実施形態2の電子デバイス10のパッド電極1における特定の中間膜1bの代わりに、Mo、Ta、Crのいずれか1種またはTiN、TaN、MoNのいずれか1種からなる中間膜1bを用いている。同様に、本実施形態の電子デバイス10は、実施形態2の電子デバイス10のパッド電極1における下地電極1aと中間膜1bとの間および中間膜1bとAu膜1cとの間にCr膜1baを備える代わりに、Ti膜を備えている。なお、実施形態2と同様の構成要素については、同一の符号を付して説明を適宜省略している。
1a 下地電極
1b 中間膜
1ba Cr膜
1c Au膜
6 ワイヤ
10 電子デバイス
Claims (3)
- 金からなるワイヤまたは金からなるバンプが接続されるパッド電極を備えた電子デバイスであって、
前記パッド電極は、AlまたはAl合金からなる下地電極と、該下地電極上のTiまたはCrからなる中間膜と、該中間膜上の前記ワイヤまたは前記バンプが接続されるAu膜とが順に積層されてなることを特徴とする電子デバイス。 - 金からなるワイヤまたは金からなるバンプが接続されるパッド電極を備えた電子デバイスであって、
前記パッド電極は、AlまたはAl合金からなる下地電極と、Mo、Ta、Tiのいずれか1種またはTiN、TaN、MoNのいずれか1種からなる中間膜と、前記ワイヤまたは前記バンプが接続されるAu膜とが順に形成されており、前記下地電極と前記中間膜との間および前記中間膜と前記Au膜との間には、Cr膜が備えられてなることを特徴とする電子デバイス。 - 金からなるワイヤまたは金からなるバンプが接続されるパッド電極を備えた電子デバイスであって、
前記パッド電極は、AlまたはAl合金からなる下地電極と、Mo、Ta、Crのいずれか1種またはTiN、TaN、MoNのいずれか1種からなる中間膜と、前記ワイヤまたは前記バンプが接続されるAu膜とが順に形成されており、前記下地電極と前記中間膜との間および前記中間膜と前記Au膜との間には、Ti膜が備えられてなることを特徴とする電子デバイス。
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JP2011160262A JP2013026465A (ja) | 2011-07-21 | 2011-07-21 | 電子デバイス |
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JP2011160262A JP2013026465A (ja) | 2011-07-21 | 2011-07-21 | 電子デバイス |
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JP2013026465A true JP2013026465A (ja) | 2013-02-04 |
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JP2011160262A Withdrawn JP2013026465A (ja) | 2011-07-21 | 2011-07-21 | 電子デバイス |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10211173B1 (en) | 2017-10-25 | 2019-02-19 | Mitsubishi Electric Corporation | Semiconductor device and manufacturing method thereof |
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2011
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10211173B1 (en) | 2017-10-25 | 2019-02-19 | Mitsubishi Electric Corporation | Semiconductor device and manufacturing method thereof |
DE102018210725A1 (de) | 2017-10-25 | 2019-04-25 | Mitsubishi Electric Corporation | Halbleitervorrichtung und zugehöriges Herstellungsverfahren |
DE102018210725B4 (de) | 2017-10-25 | 2023-07-06 | Mitsubishi Electric Corporation | Halbleitervorrichtung und zugehöriges Herstellungsverfahren |
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