JP2013026445A - Connection structure between lower metal and upper metal - Google Patents
Connection structure between lower metal and upper metal Download PDFInfo
- Publication number
- JP2013026445A JP2013026445A JP2011159969A JP2011159969A JP2013026445A JP 2013026445 A JP2013026445 A JP 2013026445A JP 2011159969 A JP2011159969 A JP 2011159969A JP 2011159969 A JP2011159969 A JP 2011159969A JP 2013026445 A JP2013026445 A JP 2013026445A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- metal
- upper electrode
- lower electrode
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Connection Of Batteries Or Terminals (AREA)
Abstract
Description
本発明は、下部金属と該下部金属の上に配置される上部金属とを導電性を有する接続材により接続した下部金属と上部金属との接続構造に関する。 The present invention relates to a connection structure between a lower metal and an upper metal in which a lower metal and an upper metal disposed on the lower metal are connected by a conductive connecting material.
特許文献１には電極の接続構造が開示されている。詳しくは、半導体素子の上に導体ブロック（下部金属）が接合されるとともに導体ブロックの上に放熱板電極（上部金属）が配置されている。放熱板電極には、半田注入孔が設けられ、半田注入孔から注入された半田（接続材）で導体ブロックと放熱板電極とが接合されている。 Patent Document 1 discloses an electrode connection structure. Specifically, a conductor block (lower metal) is joined on the semiconductor element, and a radiator plate electrode (upper metal) is arranged on the conductor block. The heat dissipation plate electrode is provided with a solder injection hole, and the conductor block and the heat dissipation plate electrode are joined by solder (connection material) injected from the solder injection hole.
しかしながら、特許文献１では、放熱板電極に設けた半田注入孔から半田を供給して放熱板電極とその下に配置した導体ブロックとを半田付けする場合において、供給した半田を外部から観察することが困難であった。 However, in Patent Document 1, when solder is supplied from a solder injection hole provided in a heat sink electrode to solder the heat sink electrode and a conductor block disposed thereunder, the supplied solder is observed from the outside. It was difficult.
本発明は、上記課題を解決するためになされたものであって、その目的は、接続材を外部から容易に観察することができる下部金属と上部金属との接続構造を提供することにある。 The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a connection structure between a lower metal and an upper metal that allows a connection material to be easily observed from the outside.
上記目的を達成するために、請求項１に記載の発明は、下部金属と該下部金属の上に配置される上部金属とを導電性を有する接続材により接続した下部金属と上部金属との接続構造であって、前記下部金属及び前記上部金属の少なくとも一方において、少なくとも前記下部金属と前記上部金属との接続部位には、前記接続材が通過可能な通過部が複数設けられており、前記下部金属と前記上部金属とは、各通過部を通過した前記接続材により接続されていることを要旨とする。 In order to achieve the above object, the invention according to claim 1 is a connection between a lower metal and an upper metal in which a lower metal and an upper metal disposed on the lower metal are connected by a conductive connecting material. In at least one of the lower metal and the upper metal, the connection portion between the lower metal and the upper metal is provided with a plurality of passage portions through which the connecting material can pass, and the lower metal The gist is that the metal and the upper metal are connected by the connecting material that has passed through each passing portion.
この発明によれば、各通過部を通過した接続材が、各通過部を介して外部へ臨むため、接続材を外部から容易に観察することができる。また、各通過部を通過した接続材が各通過部から外部へ漏れ出た場合においても、各通過部から外部へ漏れ出た接続材を外部から容易に観察することができる。 According to this invention, since the connecting material that has passed through each passing portion faces the outside through each passing portion, the connecting material can be easily observed from the outside. Further, even when the connecting material that has passed through each passing portion leaks out from each passing portion, the connecting material that has leaked out from each passing portion can be easily observed from the outside.
請求項２に記載の発明は、請求項１に記載の発明において、前記下部金属及び前記上部金属の少なくとも一方において、前記接続部位とは異なる部位に応力吸収部が形成されていることを要旨とする。 The gist of the invention according to claim 2 is that, in the invention according to claim 1, at least one of the lower metal and the upper metal has a stress absorbing portion formed at a site different from the connection site. To do.
この発明によれば、例えば、応力吸収部を形成した金属に応力が加わったとしても、応力吸収部により応力が吸収され、下部金属と上部金属との接続部位に応力が加わり難くすることができる。 According to the present invention, for example, even if stress is applied to the metal in which the stress absorbing portion is formed, the stress is absorbed by the stress absorbing portion, and it is difficult to apply stress to the connection portion between the lower metal and the upper metal. .
請求項３に記載の発明は、請求項１又は請求項２に記載の発明において、前記接続材は半田であり、前記通過部は前記上部金属に設けられており、前記通過部は、前記上部金属の一部であるとともに半田付けし難い金属からなる第１通過部形成部と、前記上部金属の一部であるとともに半田付けし易い金属からなる第２通過部形成部とを組み合わせて形成され、前記第２通過部形成部の少なくとも一部は、前記第１通過部形成部と前記下部金属との間に配置されていることを要旨とする。 According to a third aspect of the present invention, in the first or second aspect of the present invention, the connecting material is solder, the passage portion is provided in the upper metal, and the passage portion is the upper portion. It is formed by combining a first passage portion forming portion made of a metal that is a part of a metal and difficult to solder and a second passage portion forming portion made of a metal that is a part of the upper metal and that is easy to solder. The gist of the invention is that at least a part of the second passage portion forming portion is disposed between the first passage portion forming portion and the lower metal.
この発明によれば、第２通過部形成部が半田付けし易い金属であるため、各通過部を通過した半田は、第２通過部形成部の表面に沿って流れ易い。よって、第２通過部形成部と下部金属との間に半田が流れ込み、第２通過部形成部と下部金属とが半田付けされる。さらに、半田が各通過部を通過する途中で、第１通過部形成部と第２通過部形成部との間に流れ込み、第１通過部形成部と第２通過部形成部とが半田付けされる。その結果、半田付けし難い金属から形成された第１通過部形成部を、下部金属に対して容易に半田付けすることができる。 According to this invention, since the second passage portion forming portion is a metal that is easily soldered, the solder that has passed through each passage portion easily flows along the surface of the second passage portion forming portion. Therefore, solder flows between the second passage portion forming portion and the lower metal, and the second passage portion forming portion and the lower metal are soldered. Further, while the solder passes through each passing part, it flows between the first passing part forming part and the second passing part forming part, and the first passing part forming part and the second passing part forming part are soldered. The As a result, it is possible to easily solder the first passage portion forming portion formed of a metal that is difficult to solder to the lower metal.
この発明によれば、接続材を外部から容易に観察することができる。 According to this invention, the connecting material can be easily observed from the outside.
以下、本発明を具体化した一実施形態を図１及び図２にしたがって説明する。
図１に示すように、パワーモジュール１０は、電力変換装置としての車両用インバータとして用いられるとともに車両に搭載され、バッテリの直流電力を交流電力に変換して走行モータを駆動させるためのものである。
Hereinafter, an embodiment embodying the present invention will be described with reference to FIGS. 1 and 2.
As shown in FIG. 1, the power module 10 is used as a vehicle inverter as a power conversion device and mounted on a vehicle, and converts a DC power of a battery into an AC power to drive a traveling motor. .
パワーモジュール１０は、下部金属としての下部電極１１と、下部電極１１の上に配置される上部金属としての上部電極１２と、下部電極１１の上面１１ａに接合されるパワー素子１０ａとを有している。パワー素子１０ａは、例えばパワートランジスタやパワーダイオード等である。パワー素子１０ａは縦方向（上下方向）に電流が流れるようになっている。下部電極１１は銅よりなるとともに直方体形状をなし、その上面１１ａが水平となる状態で配置されている。下部電極１１はパワー素子１０ａと電気的に接続されている。下部電極１１と上部電極１２とは接続材としての半田２０により半田付けされている。 The power module 10 includes a lower electrode 11 as a lower metal, an upper electrode 12 as an upper metal disposed on the lower electrode 11, and a power element 10a joined to the upper surface 11a of the lower electrode 11. Yes. The power element 10a is, for example, a power transistor or a power diode. The power element 10a is configured to allow current to flow in the vertical direction (vertical direction). The lower electrode 11 is made of copper and has a rectangular parallelepiped shape, and is arranged with its upper surface 11a being horizontal. The lower electrode 11 is electrically connected to the power element 10a. The lower electrode 11 and the upper electrode 12 are soldered with solder 20 as a connecting material.
図２に示すように、上部電極１２は直線状に延びる網目状（メッシュ）をなしており、その一端側にアルミニウムよりなる第１通過部形成部１２ａを有している。第１通過部形成部１２ａは、直線状に延びる円棒１２１ａが複数本（本実施形態では７本）一定の間隔をあけてそれぞれ平行に配置されてなる。各円棒１２１ａの軸方向に沿った長さはそれぞれ同じ長さになっている。そして、第１通過部形成部１２ａは、下部電極１１との接合部位（接続部位）に配置される。また、上部電極１２は、第１通過部形成部１２ａよりも他端側にアルミニウムよりなる本体部１２ｂを有している。本体部１２ｂは、その全体に亘って四角形状の孔１２１ｂが複数形成されており、網目状になっている。各孔１２１ｂは、溶融した半田２０が通過可能になっている。第１通過部形成部１２ａと本体部１２ｂとは連なるように一体的に形成されている。本体部１２ｂは、孔１２１ｂが複数形成されているため、撓み易くなっている。 As shown in FIG. 2, the upper electrode 12 has a mesh shape (mesh) extending linearly, and has a first passage portion forming portion 12a made of aluminum on one end side thereof. The first passage portion forming portion 12a includes a plurality of circular rods 121a (seven in the present embodiment) extending in a straight line and arranged in parallel at a predetermined interval. The lengths along the axial direction of the respective rods 121a are the same. Then, the first passage part forming part 12 a is disposed at a joint part (connection part) with the lower electrode 11. The upper electrode 12 has a main body 12b made of aluminum on the other end side of the first passage forming portion 12a. The main body 12b has a plurality of quadrangular holes 121b formed throughout, and has a mesh shape. Each hole 121b allows molten solder 20 to pass through. The 1st passage part formation part 12a and the main-body part 12b are integrally formed so that it may continue. The main body 12b is easily bent because a plurality of holes 121b are formed.
また、上部電極１２は、第１通過部形成部１２ａの各円棒１２１ａに対して直交し、且つ一定の間隔をあけてそれぞれ平行に配列された複数（本実施形態では７本）の第２通過部形成部１２ｃを有している。各第２通過部形成部１２ｃは円棒状をなすとともに銅よりなる。そして、各第２通過部形成部１２ｃは、各円棒１２１ａの上下を交互に通過するようにして折り曲げられながら、各円棒１２１ａに対して織り込まれた状態で、各第１通過部形成部１２ａの各円棒１２１ａに一体的に組み付けられている。よって、各第２通過部形成部１２ｃの一部は、第１通過部形成部１２ａと下部電極１１との間に配置されている。 The upper electrode 12 has a plurality (seven in this embodiment) of second electrodes that are orthogonal to the respective rods 121a of the first passage forming portion 12a and arranged in parallel with a certain interval. It has a passage forming part 12c. Each 2nd passage part formation part 12c makes a round bar shape, and consists of copper. And each 2nd passage part formation part 12c is the state where each 1st passage part formation part was woven with respect to each circle 121a, being bent so that it may pass above and below each circle 121a alternately. It is assembled | attached integrally to each circular rod 121a of 12a. Therefore, a part of each second passage portion forming portion 12 c is disposed between the first passage portion forming portion 12 a and the lower electrode 11.
そして、第１通過部形成部１２ａの各円棒１２１ａと各第２通過部形成部１２ｃとを組み合わせることで、上部電極１２における下部電極１１との接合部位には、四角形状の孔１２ｈが複数形成されている。各孔１２ｈは、溶融した半田２０が通過可能になっている。本実施形態では、複数の孔１２ｈが、半田２０が通過する通過部として機能する。 Then, by combining each of the circular rods 121a of the first passage portion forming portion 12a and each of the second passage portion forming portions 12c, a plurality of rectangular holes 12h are formed at the joint portion of the upper electrode 12 with the lower electrode 11. Is formed. Each hole 12h allows molten solder 20 to pass through. In the present embodiment, the plurality of holes 12h function as a passing portion through which the solder 20 passes.
図１に示すように、各孔１２ｈを通過して各第２通過部形成部１２ｃと下部電極１１との間に流れ込んだ半田２０により、各第２通過部形成部１２ｃと下部電極１１とが半田付けされている。また、各孔１２ｈを通過する途中で第１通過部形成部１２ａの各円棒１２１ａと各第２通過部形成部１２ｃとの間に流れ込んだ半田２０により、第１通過部形成部１２ａの各円棒１２１ａと各第２通過部形成部１２ｃとが半田付けされている。よって、下部電極１１と上部電極１２とが半田２０により半田付けされている。 As shown in FIG. 1, each second passage portion forming portion 12 c and the lower electrode 11 are caused by the solder 20 flowing between each second passage portion forming portion 12 c and the lower electrode 11 through each hole 12 h. Soldered. Further, each of the first passage portion forming portions 12a is caused by the solder 20 flowing between the respective rods 121a of the first passage portion forming portions 12a and the respective second passage portion forming portions 12c while passing through the respective holes 12h. The circular rod 121a and each second passage portion forming portion 12c are soldered. Therefore, the lower electrode 11 and the upper electrode 12 are soldered by the solder 20.
さらに、下部電極１１と上部電極１２との接合部位は、各孔１２ｈから上部電極１２の上方へ漏れ出た半田２０により覆われている。よって、第１通過部形成部１２ａの各円棒１２１ａ及び各第２通過部形成部１２ｃは、半田２０の内部に埋め込まれ、半田２０が各円棒１２１ａ及び各第２通過部形成部１２ｃと絡み付いた状態になっている。このようにして、本実施形態の下部電極１１と上部電極１２との接合構造（接続構造）が形成されている。 Further, the joint portion between the lower electrode 11 and the upper electrode 12 is covered with the solder 20 leaking upward from the respective holes 12 h to the upper electrode 12. Therefore, each circular rod 121a and each second passage portion forming portion 12c of the first passage portion forming portion 12a are embedded in the solder 20, and the solder 20 is connected to each circular rod 121a and each second passage portion forming portion 12c. It is in a tangled state. In this way, the junction structure (connection structure) between the lower electrode 11 and the upper electrode 12 of the present embodiment is formed.
次に、本実施形態のパワーモジュール１０における下部電極１１と上部電極１２との半田付け工程を説明しながら、本実施形態の作用について説明する。
図２に示すように、まず、下部電極１１の上面１１ａにパワー素子１０ａが接合されたものを用意する。また、各第２通過部形成部１２ｃを、第１通過部形成部１２ａの各円棒１２１ａの上下を交互に通過するように折り曲げながら、各円棒１２１ａに対して織り込むようにして、各第２通過部形成部１２ｃを第１通過部形成部１２ａの各円棒１２１ａに組み付ける。これにより、上部電極１２における下部電極１１との接合部位には、第１通過部形成部１２ａの各円棒１２１ａと各第２通過部形成部１２ｃとによって孔１２ｈが複数形成される。
Next, the operation of the present embodiment will be described while explaining the soldering process between the lower electrode 11 and the upper electrode 12 in the power module 10 of the present embodiment.
As shown in FIG. 2, first, a device in which a power element 10 a is bonded to the upper surface 11 a of the lower electrode 11 is prepared. Further, each second passage portion forming portion 12c is woven into each of the circular rods 121a while being bent so as to alternately pass above and below each of the circular rods 121a of the first passage portion forming portion 12a. The two passage portion forming portions 12c are assembled to the respective circular rods 121a of the first passage portion forming portion 12a. As a result, a plurality of holes 12h are formed in the joint portion of the upper electrode 12 with the lower electrode 11 by the respective rods 121a and the respective second passage forming portions 12c of the first passage forming portion 12a.
続いて、下部電極１１及び上部電極１２を、半田濡れを良くするために加熱するとともに、溶融した半田２０（溶融半田２０）を内蔵した半田注入装置２１を用いて、各孔１２ｈに向けて溶融半田２０を注入する。各孔１２ｈに向けて注入された溶融半田２０は、各孔１２ｈを通過する。ここで、各第２通過部形成部１２ｃは、半田付けし易い金属（半田２０の濡れ性の良い金属）である銅から形成されているため、各孔１２ｈを通過した溶融半田２０は、各第２通過部形成部１２ｃの周面（表面）に沿って流れ易い。よって、各孔１２ｈを通過した溶融半田２０の一部は、各第２通過部形成部１２ｃと下部電極１１との間に流れ込む。すると、図１（ｂ）及び（ｃ）に示すように、各第２通過部形成部１２ｃ及び上部電極１２が、各第２通過部形成部１２ｃと下部電極１１との間に流れ込んだ溶融半田２０により浮き上がる。 Subsequently, the lower electrode 11 and the upper electrode 12 are heated to improve solder wettability, and are melted toward each hole 12h by using a solder injection device 21 containing a melted solder 20 (molten solder 20). Solder 20 is injected. The molten solder 20 injected toward each hole 12h passes through each hole 12h. Here, since each second passage portion forming portion 12c is made of copper, which is a metal that is easy to solder (metal with good wettability of the solder 20), the molten solder 20 that has passed through each hole 12h It tends to flow along the peripheral surface (surface) of the second passage portion forming portion 12c. Therefore, a part of the molten solder 20 that has passed through each hole 12 h flows between each second passage portion forming portion 12 c and the lower electrode 11. Then, as shown in FIGS. 1B and 1C, the molten solder in which the second passage portion forming portions 12 c and the upper electrode 12 flow between the second passage portion forming portions 12 c and the lower electrode 11. 20 lifts up.
また、各孔１２ｈに向けて注入された溶融半田２０は、各孔１２ｈを通過する途中でその一部が第１通過部形成部１２ａの各円棒１２１ａと各第２通過部形成部１２ｃとの間に流れ込む。さらに、各孔１２ｈに向けて溶融半田２０が注入されると、溶融半田２０は、その一部が各孔１２ｈから第１通過部形成部１２ａ（上部電極１２）の上方へ漏れ出て、下部電極１１と上部電極１２との接合部位が溶融半田２０により覆われる。 Further, the molten solder 20 injected toward each hole 12h partially passes through each hole 12h, and a part of each of the rods 121a of the first passage portion forming portion 12a and each second passage portion forming portion 12c. Flows in between. Further, when the molten solder 20 is injected toward each hole 12h, a part of the molten solder 20 leaks out from each hole 12h to the upper side of the first passage portion forming portion 12a (upper electrode 12), A joint portion between the electrode 11 and the upper electrode 12 is covered with the molten solder 20.
続いて、溶融半田２０は冷却されて固化される。すると、各第２通過部形成部１２ｃと下部電極１１との間で固化された半田２０により、各第２通過部形成部１２ｃと下部電極１１とが半田付けされる。また、第１通過部形成部１２ａの各円棒１２１ａと各第２通過部形成部１２ｃとの間で固化された半田２０により、第１通過部形成部１２ａの各円棒１２１ａと各第２通過部形成部１２ｃとが半田付けされる。その結果、下部電極１１と上部電極１２とが半田２０により半田付けされる。 Subsequently, the molten solder 20 is cooled and solidified. Then, each second passage portion forming portion 12c and the lower electrode 11 are soldered by the solder 20 solidified between each second passage portion forming portion 12c and the lower electrode 11. In addition, each of the rods 121a of the first passage portion forming portion 12a and each of the second portions of the second passage portion forming portion 12a is solidified by the solder 20 solidified between the respective rods 121a of the first passage portion forming portion 12a and the second passage portion forming portions 12c. The passage portion forming portion 12c is soldered. As a result, the lower electrode 11 and the upper electrode 12 are soldered by the solder 20.
さらに、各孔１２ｈから第１通過部形成部１２ａ（上部電極１２）の上方へ漏れ出た溶融半田２０が固化することで、第１通過部形成部１２ａの各円棒１２１ａと各第２通過部形成部１２ｃとが半田２０の内部に埋め込まれて、半田２０が各円棒１２１ａ及び各第２通過部形成部１２ｃに絡み付いた状態になる。これにより、上部電極１２が下部電極１１に対して外れ難くなっている。 Further, the molten solder 20 leaking from the holes 12h to the upper part of the first passage portion forming portion 12a (upper electrode 12) is solidified, so that each of the rods 121a and the second passages of the first passage portion forming portion 12a are solidified. The portion forming portion 12c is embedded in the solder 20, and the solder 20 is entangled with each of the rods 121a and each of the second passage portion forming portions 12c. Thereby, the upper electrode 12 is difficult to be detached from the lower electrode 11.
下部電極１１と上部電極１２とが半田付けされた状態において、例えば、上部電極１２に応力が加わったとしても、本体部１２ｂが撓んで応力が吸収され、下部電極１１と上部電極１２との接合部位に応力が加わり難くなっている。よって、本実施形態では、複数の孔１２１ｂが形成された本体部１２ｂが応力吸収部として機能している。 In a state where the lower electrode 11 and the upper electrode 12 are soldered, for example, even if stress is applied to the upper electrode 12, the main body portion 12 b is bent and the stress is absorbed, and the bonding between the lower electrode 11 and the upper electrode 12 is performed. Stress is difficult to be applied to the part. Therefore, in the present embodiment, the main body portion 12b in which the plurality of holes 121b are formed functions as a stress absorbing portion.
また、半田２０は、各孔１２ｈから上部電極１２の上方へはみ出しているため、上部電極１２の上方から目視により半田２０を容易に観察することができる。
上記実施形態では以下の効果を得ることができる。
Further, since the solder 20 protrudes from the holes 12h above the upper electrode 12, the solder 20 can be easily observed visually from above the upper electrode 12.
In the above embodiment, the following effects can be obtained.
（１）下部電極１１と上部電極１２との接合構造において、上部電極１２における下部電極１１との接合部位に、溶融半田２０が通過可能な孔１２ｈを複数形成した。そして、下部電極１１と上部電極１２とを、各孔１２ｈを通過した半田２０により接合させた。半田２０は、各孔１２ｈから上部電極１２の上方へはみ出すため、上部電極１２の上方から目視により半田２０を容易に観察することができる。その結果、一定量の半田２０を用いて、下部電極１１と上部電極１２との接合が行われたか否かを外観から確認することができ、半田２０の充填量についての良否判定を容易に行うことができる。 (1) In the joint structure of the lower electrode 11 and the upper electrode 12, a plurality of holes 12h through which the molten solder 20 can pass are formed in the joint portion of the upper electrode 12 with the lower electrode 11. And the lower electrode 11 and the upper electrode 12 were joined by the solder 20 which passed each hole 12h. Since the solder 20 protrudes above the upper electrode 12 from each hole 12h, the solder 20 can be easily observed visually from above the upper electrode 12. As a result, it is possible to confirm from the appearance whether or not the lower electrode 11 and the upper electrode 12 have been joined by using a certain amount of solder 20 and easily determine whether the solder 20 is filled. be able to.
（２）本体部１２ｂに複数の孔１２１ｂを形成することで、上部電極１２における下部電極１１との接合部位とは異なる部位である本体部１２ｂを応力吸収部として機能させた。よって、下部電極１１と上部電極１２とが半田付けされた状態で、例えば、上部電極１２に応力が加わったとしても、本体部１２ｂが撓むことで応力が吸収され、下部電極１１と上部電極１２との接合部位に応力が加わり難くすることができる。その結果として、下部電極１１と上部電極１２との接合部位に割れ目が生じてしまうことを回避することができる。 (2) By forming a plurality of holes 121b in the main body part 12b, the main body part 12b, which is a part different from the joint part of the upper electrode 12 with the lower electrode 11, was caused to function as a stress absorbing part. Therefore, in the state where the lower electrode 11 and the upper electrode 12 are soldered, for example, even if a stress is applied to the upper electrode 12, the stress is absorbed by the deflection of the main body 12b, and the lower electrode 11 and the upper electrode are absorbed. Therefore, it is possible to make it difficult to apply a stress to the joint portion with Twelve. As a result, it is possible to avoid the occurrence of a crack at the joint portion between the lower electrode 11 and the upper electrode 12.
（３）上部電極１２における下部電極１１との接合部位に形成された複数の孔１２ｈを、上部電極１２の一部である第１通過部形成部１２ａを形成する複数本の円棒１２１ａと、上部電極１２の一部であるとともに第１通過部形成部１２ａと下部電極１１との間に一部が配置された複数本の第２通過部形成部１２ｃとを組み合わせて形成した。そして、第１通過部形成部１２ａをアルミニウムより形成し、各第２通過部形成部１２ｃを銅より形成した。銅は半田付けし易い金属であり、アルミニウムは半田付けし難い金属である。よって、各孔１２ｈを通過した半田２０は、各第２通過部形成部１２ｃの周面に沿って流れ易い。したがって、各第２通過部形成部１２ｃと下部電極１１との間に半田２０が流れ込み、各第２通過部形成部１２ｃと下部電極１１とが半田付けされる。さらに、半田２０が各孔１２ｈを通過する途中で、第１通過部形成部１２ａの各円棒１２１ａと各第２通過部形成部１２ｃとの間に流れ込み、第１通過部形成部１２ａの各円棒１２１ａと各第２通過部形成部１２ｃとが半田付けされる。その結果、半田付けし難い金属であるアルミニウムより形成された第１通過部形成部１２ａを、下部電極１１に対して容易に半田付けすることができる。 (3) The plurality of holes 121h formed in the joint portion of the upper electrode 12 with the lower electrode 11 are replaced with a plurality of circular rods 121a that form the first passage portion forming portion 12a that is a part of the upper electrode 12. A plurality of second passage portion forming portions 12c, which are part of the upper electrode 12 and partially disposed between the first passage portion forming portion 12a and the lower electrode 11, are formed in combination. And the 1st passage part formation part 12a was formed from aluminum, and each 2nd passage part formation part 12c was formed from copper. Copper is a metal that is easy to solder, and aluminum is a metal that is difficult to solder. Therefore, the solder 20 that has passed through each hole 12h tends to flow along the peripheral surface of each second passage portion forming portion 12c. Accordingly, the solder 20 flows between each second passage portion forming portion 12c and the lower electrode 11, and each second passage portion forming portion 12c and the lower electrode 11 are soldered. Further, while the solder 20 passes through each hole 12h, the solder 20 flows between each of the rods 121a of the first passage portion forming portion 12a and each of the second passage portion forming portions 12c, and each of the first passage portion forming portions 12a. The circular rod 121a and each second passage portion forming portion 12c are soldered. As a result, the first passage portion forming portion 12a formed from aluminum, which is a metal that is difficult to solder, can be easily soldered to the lower electrode 11.
（４）下部電極１１と上部電極１２とを半田２０により接合した。よって、例えば、導電性接着剤により下部電極１１と上部電極１２とを接続する場合に比べると、下部電極１１と上部電極１２との間の導電性を良好なものとすることができる。 (4) The lower electrode 11 and the upper electrode 12 were joined with the solder 20. Therefore, for example, the conductivity between the lower electrode 11 and the upper electrode 12 can be improved as compared with the case where the lower electrode 11 and the upper electrode 12 are connected by a conductive adhesive.
（５）本実施形態によれば、半田付けし難い金属であるアルミニウムからなる第１通過部形成部１２ａと、半田付けし易い金属である銅からなる下部電極１１とを、半田２０により接合し易くするために、第１通過部形成部１２ａ又は下部電極１１にニッケルメッキを施す必要が無い。よって、第１通過部形成部１２ａ又は下部電極１１にニッケルメッキを施す工程が不要になり、工程を削減することができる。 (5) According to the present embodiment, the first passage portion forming portion 12a made of aluminum, which is difficult to solder, and the lower electrode 11 made of copper, which is easy to solder, are joined together by the solder 20. In order to facilitate, it is not necessary to apply nickel plating to the first passage portion forming portion 12a or the lower electrode 11. Therefore, the step of applying nickel plating to the first passage portion forming portion 12a or the lower electrode 11 becomes unnecessary, and the number of steps can be reduced.
（６）下部電極１１と上部電極１２との接合部位が、各孔１２ｈから上部電極１２の上方へ漏れ出た半田２０により覆われている。よって、第１通過部形成部１２ａの各円棒１２１ａと各第２通過部形成部１２ｃとが半田２０の内部に埋め込まれて、半田２０が各円棒１２１ａ及び各第２通過部形成部１２ｃに絡み付いた状態になるため、上部電極１２が下部電極１１に対して外れ難くすることができる。 (6) The joint portion between the lower electrode 11 and the upper electrode 12 is covered with the solder 20 leaking upward from the holes 12 h to the upper electrode 12. Therefore, each circular rod 121a and each second passing portion forming portion 12c of the first passing portion forming portion 12a are embedded in the solder 20, and the solder 20 is inserted into each circular rod 121a and each second passing portion forming portion 12c. Therefore, the upper electrode 12 can be made difficult to come off from the lower electrode 11.
なお、上記実施形態は以下のように変更してもよい。
○ 実施形態では、上部電極１２における下部電極１１との接続部位に形成された複数の孔１２ｈを、第１通過部形成部１２ａを形成する複数本の円棒１２１ａと、銅から形成された複数本の第２通過部形成部１２ｃとから形成したが、これに限らない。例えば、図３及び図４に示すように、上部電極３１全体を網目状に形成することで、上部電極３１全体に亘って孔３１ｈを複数形成し、これら各孔３１ｈを利用して、半田２０により下部電極１１と上部電極３１とを接合してもよい。
In addition, you may change the said embodiment as follows.
In the embodiment, the plurality of holes 12h formed in the connection portion of the upper electrode 12 with the lower electrode 11 are replaced with the plurality of circular rods 121a forming the first passage portion forming portion 12a and the plurality of holes formed from copper. Although it formed from the 2nd passage part formation part 12c of a book, it is not restricted to this. For example, as shown in FIGS. 3 and 4, the entire upper electrode 31 is formed in a mesh shape so that a plurality of holes 31 h are formed over the entire upper electrode 31. Thus, the lower electrode 11 and the upper electrode 31 may be joined together.
具体的には、図４（ａ）及び（ｂ）に示すように、上部電極３１の一部を下部電極１１の上に配置する。そして、下部電極１１と重なっている各孔３１ｈに向けて溶融半田２０を注入する。すると、図３（ａ）及び（ｂ）に示すように、上部電極３１と下部電極１１との間に溶融半田２０が流れ込み、さらに、溶融半田２０はその一部が各孔３１ｈから上部電極３１の上方へ漏れ出て、下部電極１１と上部電極３１との接合部位が溶融半田２０により覆われる。そして、溶融半田２０が冷却されて固化することで、上部電極３１と下部電極１１との間で固化された半田２０により、上部電極３１と下部電極１１とが半田付けされる。また、この接合状態では、上部電極３１における下部電極１１との接合部位が半田２０の内部に埋め込まれて、半田２０が上部電極３１における下部電極１１との接合部位に絡み付いた状態になっている。これにより、半田付けし難いアルミニウムから形成された上部電極３１を、下部電極１１に対して外れ難くすることができる。 Specifically, as shown in FIGS. 4A and 4B, a part of the upper electrode 31 is disposed on the lower electrode 11. Then, the molten solder 20 is injected toward each hole 31 h overlapping the lower electrode 11. Then, as shown in FIGS. 3A and 3B, the molten solder 20 flows between the upper electrode 31 and the lower electrode 11, and a part of the molten solder 20 passes from the holes 31 h to the upper electrode 31. Leaking upward, the joint portion between the lower electrode 11 and the upper electrode 31 is covered with the molten solder 20. When the molten solder 20 is cooled and solidified, the upper electrode 31 and the lower electrode 11 are soldered by the solder 20 solidified between the upper electrode 31 and the lower electrode 11. Further, in this joined state, the joint portion of the upper electrode 31 with the lower electrode 11 is embedded in the solder 20, and the solder 20 is entangled with the joint portion of the upper electrode 31 with the lower electrode 11. . Thereby, the upper electrode 31 formed of aluminum which is difficult to solder can be prevented from coming off from the lower electrode 11.
なお、孔３１ｈは、上部電極３１における下部電極１１との接合部位のみに形成してもよい。さらには、孔３１ｈは、上部電極３１における下部電極１１との接合部位において、点在しておらず、一定の範囲に密集した状態で上部電極３１に形成されていてもよい。 Note that the hole 31h may be formed only in a portion where the upper electrode 31 is joined to the lower electrode 11. Furthermore, the holes 31h may be formed in the upper electrode 31 in a state where the holes 31h are not scattered at the joint portion of the upper electrode 31 with the lower electrode 11 and are densely packed in a certain range.
○ 図５及び図６に示すように、より線状に形成された上部金属としての上部電極４１と、下部電極１１とを半田２０により接合させてもよい。上部電極４１は、アルミニウムよりなる複数の線材４１ａが束になって形成されている。図６（ａ）及び（ｂ）に示すように、線材４１ａの束を若干ほぐして、通過部としての隙間４１ｂを上部電極４１全体に亘って複数形成した状態で、上部電極４１の一部を下部電極１１の上に配置する。そして、下部電極１１と重なっている各隙間４１ｂに向けて溶融半田２０を注入する。すると、図５（ａ）及び（ｂ）に示すように、上部電極４１と下部電極１１との間に溶融半田２０が流れ込み、溶融半田２０はその一部が各隙間４１ｂから上部電極４１の上方へ漏れ出て、下部電極１１と上部電極４１との接合部位が溶融半田２０により覆われる。そして、溶融半田２０が冷却されて固化することで、上部電極４１と下部電極１１との間で固化された半田２０により、上部電極４１と下部電極１１とが半田付けされる。また、この接合状態では、上部電極４１における下部電極１１との接合部位が半田２０の内部に埋め込まれて、半田２０が上部電極４１における下部電極１１との接合部位に絡み付いた状態になっている。これにより、半田付けし難いアルミニウムから形成された上部電極４１を、下部電極１１に対して外れ難くすることができる。なお、隙間４１ｂは、上部電極４１における下部電極１１との接合部位のみに形成してもよい。 As shown in FIGS. 5 and 6, the upper electrode 41 as the upper metal formed in a more linear shape and the lower electrode 11 may be joined by solder 20. The upper electrode 41 is formed by bundling a plurality of wires 41a made of aluminum. As shown in FIGS. 6A and 6B, a part of the upper electrode 41 is formed in a state where a bundle of the wire rods 41 a is slightly loosened and a plurality of gaps 41 b as a passing portion are formed over the entire upper electrode 41. Arranged on the lower electrode 11. Then, the molten solder 20 is injected toward each gap 41 b overlapping with the lower electrode 11. Then, as shown in FIGS. 5A and 5B, the molten solder 20 flows between the upper electrode 41 and the lower electrode 11, and a part of the molten solder 20 is above the upper electrode 41 from each gap 41 b. And the joint portion between the lower electrode 11 and the upper electrode 41 is covered with the molten solder 20. When the molten solder 20 is cooled and solidified, the upper electrode 41 and the lower electrode 11 are soldered by the solder 20 solidified between the upper electrode 41 and the lower electrode 11. Further, in this joined state, the joint portion of the upper electrode 41 with the lower electrode 11 is embedded in the solder 20, and the solder 20 is entangled with the joint portion of the upper electrode 41 with the lower electrode 11. . As a result, the upper electrode 41 formed of aluminum that is difficult to solder can be prevented from coming off from the lower electrode 11. Note that the gap 41b may be formed only in the joint portion of the upper electrode 41 with the lower electrode 11.
○ 図７に示す実施形態では、板状の上部電極５１に通過部としての円孔５１ａが上部電極５１全体に亘って複数形成されている。そして、上部電極５１の一部を下部電極１１の上に配置し、下部電極１１と重なっている各円孔５１ａに半田２０を通過させることで、上部電極５１と下部電極１１とを半田２０により接合させてもよい。なお、円孔５１ａは、上部電極５１における下部電極１１との接合部位のみに形成してもよい。さらには、円孔５１ａは、上部電極５１における下部電極１１との接合部位において、点在しておらず、一定の範囲に密集した状態で上部電極５１に形成されていてもよい。 In the embodiment shown in FIG. 7, a plurality of circular holes 51 a as passage portions are formed in the plate-like upper electrode 51 over the entire upper electrode 51. Then, a part of the upper electrode 51 is disposed on the lower electrode 11, and the solder 20 is passed through each circular hole 51 a overlapping the lower electrode 11, so that the upper electrode 51 and the lower electrode 11 are connected to each other by the solder 20. You may make it join. Note that the circular hole 51a may be formed only in the joint portion of the upper electrode 51 with the lower electrode 11. Furthermore, the circular holes 51a may be formed in the upper electrode 51 in a state where the circular holes 51a are not scattered at the joint portion of the upper electrode 51 with the lower electrode 11 and are densely packed in a certain range.
○ 実施形態において、上部電極１２の本体部１２ｂと下部電極１１とを半田付けしてもよい。この場合、本体部１２ｂの一部を下部電極１１の上に配置し、下部電極１１と重なっている各孔１２１ｂに半田２０を通過させることで、本体部１２ｂと下部電極１１とを半田付けする。よって、各孔１２１ｂは、半田２０が通過する通過部として機能する。 In the embodiment, the main body portion 12b of the upper electrode 12 and the lower electrode 11 may be soldered. In this case, a part of the main body 12b is disposed on the lower electrode 11, and the solder 20 is passed through each hole 121b overlapping the lower electrode 11, thereby soldering the main body 12b and the lower electrode 11. . Therefore, each hole 121b functions as a passing portion through which the solder 20 passes.
○ 実施形態では、本体部１２ｂ全体に亘って孔１２１ｂを複数形成したが、これに限らず、本体部１２ｂの一部の領域に孔１２１ｂを形成してもよい。この場合であっても、本体部１２ｂにおける孔１２１ｂが形成された一部の領域が撓み易くなり、この孔１２１ｂが形成された本体部１２ｂにおける一部の領域を応力吸収部として機能させることができる。 In the embodiment, a plurality of holes 121b are formed over the entire body portion 12b. However, the present invention is not limited thereto, and the holes 121b may be formed in a partial region of the body portion 12b. Even in this case, a part of the body part 12b in which the hole 121b is formed is easily bent, and a part of the body part 12b in which the hole 121b is formed can function as a stress absorbing part. it can.
○ 実施形態において、上部電極１２が複数層積層されていてもよい。これによれば、上部電極１２が単層である場合に比べると、電気を流し易くすることができる。
○ 実施形態において、下部電極１１を網目状にしてもよい。
In the embodiment, the upper electrode 12 may be laminated in a plurality of layers. According to this, compared with the case where the upper electrode 12 is a single layer, electricity can be made to flow easily.
In the embodiment, the lower electrode 11 may be meshed.
○ 実施形態において、上部電極１２の第１通過部形成部１２ａ及び本体部１２ｂが、アルミニウム以外の半田付けし難い他の金属（例えばチタン、ステンレス等）より形成されていてもよい。 In the embodiment, the first passage portion forming portion 12a and the main body portion 12b of the upper electrode 12 may be formed of other metals (for example, titanium, stainless steel, etc.) that are difficult to solder other than aluminum.
○ 実施形態において、上部電極１２の第１通過部形成部１２ａ及び本体部１２ｂが銅、銀、金等の半田付けし易い金属より形成されていてもよい。
○ 実施形態において、下部電極１１は網目状に形成されており、アルミニウム、チタン、ステンレス等の半田付けし難い金属で形成されていてもよい。
In the embodiment, the first passage portion forming portion 12a and the main body portion 12b of the upper electrode 12 may be formed of a metal that is easy to solder, such as copper, silver, or gold.
In the embodiment, the lower electrode 11 is formed in a mesh shape, and may be formed of a metal that is difficult to solder, such as aluminum, titanium, and stainless steel.
○ 実施形態において、第１通過部形成部１２ａ及び第２通過部形成部１２ｃが同じ材料（例えばアルミニウム）で形成され、第１通過部形成部１２ａ及び第２通過部形成部１２ｃによって、上部電極１２における下部電極１１との接合部位に複数の孔１２ｈが形成されていてもよい。例えば、第１通過部形成部１２ａ及び第２通過部形成部１２ｃがアルミニウムで形成されている場合を考える。この場合、複数の孔１２ｈを通過した半田２０は、半田付けし易い銅から形成された下部電極１１に対して接合され、さらに、複数の孔１２ｈを通過した半田２０が、第１通過部形成部１２ａ及び第２通過部形成部１２ｃに絡み付いた状態になる。このため、第１通過部形成部１２ａ、第２通過部形成部１２ｃ及び下部電極１１を半田付けすることができる。 In the embodiment, the first passage portion forming portion 12a and the second passage portion forming portion 12c are formed of the same material (for example, aluminum), and the upper electrode is formed by the first passage portion forming portion 12a and the second passage portion forming portion 12c. A plurality of holes 12 h may be formed at a joint portion with the lower electrode 11. For example, consider a case where the first passage portion forming portion 12a and the second passage portion forming portion 12c are formed of aluminum. In this case, the solder 20 that has passed through the plurality of holes 12h is joined to the lower electrode 11 formed of copper that is easy to solder, and the solder 20 that has passed through the plurality of holes 12h forms the first passage portion. It will be in the state entangled in the part 12a and the 2nd passage part formation part 12c. For this reason, the 1st passage part formation part 12a, the 2nd passage part formation part 12c, and the lower electrode 11 can be soldered.
○ 実施形態では、下部電極１１と上部電極１２との接合部位が、各孔１２ｈから上部電極１２の上方へ漏れ出た半田２０により覆われていたが、これに限らず、半田２０が各孔１２ｈから上部電極１２の上方へ漏れずに、各孔１２ｈ内に入り込んでいてもよい。この場合であっても、各孔１２ｈに入り込んだ半田２０が各孔１２ｈを介して外部へ臨むため、半田２０を外部から容易に観察することができる。 In the embodiment, the joint portion between the lower electrode 11 and the upper electrode 12 was covered with the solder 20 leaking upward from the respective holes 12h to the upper electrode 12. However, the present invention is not limited to this, and the solder 20 It may enter into each hole 12h without leaking from 12h above the upper electrode 12. Even in this case, since the solder 20 that has entered the holes 12h faces the outside through the holes 12h, the solder 20 can be easily observed from the outside.
○ 実施形態では、下部電極１１と上部電極１２とを接合させるために接続材として半田２０を用いたが、これに限らず、例えば、下部電極１１と上部電極１２とを接続させるために接続材として導電性接着剤を用いてもよい。また、各孔１２ｈに溶融半田２０ではなく、接続材として半田ペーストを注入してもよい。 In the embodiment, the solder 20 is used as the connecting material to join the lower electrode 11 and the upper electrode 12. However, the present invention is not limited to this, and for example, the connecting material is used to connect the lower electrode 11 and the upper electrode 12. A conductive adhesive may be used. Further, instead of the molten solder 20, solder paste may be injected into each hole 12 h as a connecting material.
○ 実施形態では、目視により半田２０を観察したが、これに限らず、例えば、カメラ等の機械を用いて半田２０を観察してもよい。
次に、上記実施形態及び別例から把握できる技術的思想について以下に追記する。
In the embodiment, the solder 20 is visually observed. However, the present invention is not limited to this. For example, the solder 20 may be observed using a machine such as a camera.
Next, the technical idea that can be grasped from the above embodiment and other examples will be described below.
（イ）前記第２通過部形成部は銅からなることを特徴とする請求項３に記載の下部金属と上部金属との接続構造。
（ロ）前記下部金属は銅からなるとともに、前記上部金属はアルミニウムからなることを特徴とする請求項１〜請求項３及び前記技術的思想（イ）のいずれか一項に記載の下部金属と上部金属との接続構造。
(B) The connection structure between the lower metal and the upper metal according to claim 3, wherein the second passage portion forming portion is made of copper.
(B) The lower metal is made of copper, and the upper metal is made of aluminum. The lower metal according to any one of claims 1 to 3 and the technical idea (a), Connection structure with upper metal.
１１…下部金属としての下部電極、１２，３１，４１，５１…上部金属としての上部電極、１２ａ…第１通過部形成部、１２ｂ…応力吸収部として機能する本体部、１２ｃ…第２通過部形成部、１２ｈ，３１ｈ…通過部としての孔、２０…接続材としての半田（溶融半田）、４１ｂ…通過部としての隙間、５１ａ…通過部としての円孔、１２１ｂ…通過部としての孔。 DESCRIPTION OF SYMBOLS 11 ... Lower electrode as lower metal, 12, 31, 41, 51 ... Upper electrode as upper metal, 12a ... 1st passage part formation part, 12b ... Main part which functions as a stress absorption part, 12c ... 2nd passage part Forming part, 12h, 31h ... holes as passing parts, 20 ... solder as a connecting material (molten solder), 41b ... gaps as passing parts, 51a ... circular holes as passing parts, 121b ... holes as passing parts.
Claims (3)
前記下部金属及び前記上部金属の少なくとも一方において、少なくとも前記下部金属と前記上部金属との接続部位には、前記接続材が通過可能な通過部が複数設けられており、
前記下部金属と前記上部金属とは、各通過部を通過した前記接続材により接続されていることを特徴とする下部金属と上部金属との接続構造。 A connection structure between a lower metal and an upper metal in which a lower metal and an upper metal disposed on the lower metal are connected by a conductive connecting material,
In at least one of the lower metal and the upper metal, a connecting portion between at least the lower metal and the upper metal is provided with a plurality of passing portions through which the connecting material can pass,
The lower metal and the upper metal are connected by the connecting material that has passed through each passing portion, and the lower metal and the upper metal are connected.
前記通過部は前記上部金属に設けられており、
前記通過部は、前記上部金属の一部であるとともに半田付けし難い金属からなる第１通過部形成部と、前記上部金属の一部であるとともに半田付けし易い金属からなる第２通過部形成部とを組み合わせて形成され、
前記第２通過部形成部の少なくとも一部は、前記第１通過部形成部と前記下部金属との間に配置されていることを特徴とする請求項１又は請求項２に記載の下部金属と上部金属との接続構造。 The connecting material is solder;
The passage is provided in the upper metal;
The passage portion is a first passage portion forming portion made of a metal that is a part of the upper metal and difficult to solder, and a second passage portion formation made of a metal that is a part of the upper metal and is easy to solder. Formed in combination with parts,
3. The lower metal according to claim 1, wherein at least a part of the second passage portion forming portion is disposed between the first passage portion forming portion and the lower metal. Connection structure with upper metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011159969A JP2013026445A (en) | 2011-07-21 | 2011-07-21 | Connection structure between lower metal and upper metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011159969A JP2013026445A (en) | 2011-07-21 | 2011-07-21 | Connection structure between lower metal and upper metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2013026445A true JP2013026445A (en) | 2013-02-04 |
Family
ID=47784427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011159969A Withdrawn JP2013026445A (en) | 2011-07-21 | 2011-07-21 | Connection structure between lower metal and upper metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013026445A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015151285A1 (en) * | 2014-04-04 | 2015-10-08 | 三菱電機株式会社 | Semiconductor module |
-
2011
- 2011-07-21 JP JP2011159969A patent/JP2013026445A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015151285A1 (en) * | 2014-04-04 | 2015-10-08 | 三菱電機株式会社 | Semiconductor module |
| JPWO2015151285A1 (en) * | 2014-04-04 | 2017-04-13 | 三菱電機株式会社 | Semiconductor module |
| US9853009B2 (en) | 2014-04-04 | 2017-12-26 | Mitsubishi Electric Corporation | Semiconductor module having a conductor member for reducing thermal stress |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6544021B2 (en) | Power converter | |
| JP7006686B2 (en) | Semiconductor devices and methods for manufacturing semiconductor devices | |
| JP2012028076A (en) | Terminal metal fitting with electric wire, and method of manufacturing the same | |
| JP2007324604A (en) | Bonding junction and method of bonding two contact surfaces | |
| CN108352215A (en) | The manufacturing method of conductive component and conductive component | |
| JP5702963B2 (en) | Power converter | |
| JP2014064004A (en) | Light-emitting diode package and method for manufacturing the same | |
| JP2014232626A (en) | Terminal-equipped electrical wire | |
| TWI567762B (en) | Ptc device | |
| JP5452345B2 (en) | Insulated circuit board and manufacturing method thereof, power module base and manufacturing method thereof | |
| JP2013026445A (en) | Connection structure between lower metal and upper metal | |
| JP2012174484A5 (en) | ||
| JP2011198492A (en) | Electronic component terminal joining method, and joining structure and inverter device equipped therewith | |
| JP5353825B2 (en) | Semiconductor module | |
| JP2017191824A (en) | Metallized film capacitor and method of manufacturing the same | |
| JP5724738B2 (en) | Circuit structure and electrical junction box | |
| WO2015037112A1 (en) | Rail bond | |
| JP2012243465A5 (en) | ||
| JP2016067078A (en) | Electric power converting system | |
| CN109980827A (en) | Conductive terminal, the manufacturing device of conductive terminal and the rotating electric machine containing conductive terminal | |
| JP2013214423A (en) | Rail-bond | |
| JP2017228648A (en) | Composite board and method of manufacturing composite board | |
| JP2013196989A (en) | Bonding structure for electric wires | |
| JP6029237B2 (en) | Lead frame, semiconductor device, and method of manufacturing semiconductor device | |
| JP4952555B2 (en) | Manufacturing method of semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20141007 |