JP2013019010A5 - - Google Patents
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- Publication number
- JP2013019010A5 JP2013019010A5 JP2011152275A JP2011152275A JP2013019010A5 JP 2013019010 A5 JP2013019010 A5 JP 2013019010A5 JP 2011152275 A JP2011152275 A JP 2011152275A JP 2011152275 A JP2011152275 A JP 2011152275A JP 2013019010 A5 JP2013019010 A5 JP 2013019010A5
- Authority
- JP
- Japan
- Prior art keywords
- sputtering
- copper material
- hot
- producing
- hot working
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 11
- 238000005477 sputtering target Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000004544 sputter deposition Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 4
- 230000007547 defect Effects 0.000 claims description 4
- 238000005098 hot rolling Methods 0.000 claims description 3
- 238000005097 cold rolling Methods 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011152275A JP5787647B2 (ja) | 2011-07-08 | 2011-07-08 | スパッタリングターゲット用銅材料の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011152275A JP5787647B2 (ja) | 2011-07-08 | 2011-07-08 | スパッタリングターゲット用銅材料の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013019010A JP2013019010A (ja) | 2013-01-31 |
| JP2013019010A5 true JP2013019010A5 (enrdf_load_stackoverflow) | 2014-04-03 |
| JP5787647B2 JP5787647B2 (ja) | 2015-09-30 |
Family
ID=47690724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011152275A Active JP5787647B2 (ja) | 2011-07-08 | 2011-07-08 | スパッタリングターゲット用銅材料の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5787647B2 (enrdf_load_stackoverflow) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5882248B2 (ja) * | 2013-03-21 | 2016-03-09 | Ｊｘ金属株式会社 | Ｃｕ−Ｇａ合金スパッタリングターゲット、同スパッタリングターゲット用鋳造品及びこれらの製造方法 |
| TW201529877A (zh) * | 2013-12-27 | 2015-08-01 | Jx Nippon Mining & Metals Corp | 高純度銅或銅合金濺鍍靶及其製造方法 |
| JP6067927B2 (ja) * | 2014-03-31 | 2017-01-25 | Ｊｘ金属株式会社 | 銅又は銅合金スパッタリングターゲット |
| WO2017115648A1 (ja) | 2015-12-28 | 2017-07-06 | Ｊｘ金属株式会社 | スパッタリングターゲットの製造方法 |
| TWI663274B (zh) * | 2017-03-30 | 2019-06-21 | 日商Ｊｘ金屬股份有限公司 | Sputtering target and manufacturing method thereof |
| JP7131376B2 (ja) * | 2018-12-27 | 2022-09-06 | 三菱マテリアル株式会社 | スパッタリングターゲット用銅素材 |
| KR102249087B1 (ko) * | 2019-11-13 | 2021-05-07 | (주)하나금속 | 판형 구리 스퍼터링 타겟 및 그 제조 방법 |
| KR102476165B1 (ko) * | 2020-08-10 | 2022-12-08 | 오리엔탈 카퍼 씨오., 엘티디. | 열간 압출 공정을 통해 스퍼터링에 의한 박막 코팅 기술용 구리 타겟을 제조하는 방법 |
| JP2022042859A (ja) * | 2020-09-03 | 2022-03-15 | オリエンタル コッパー シーオー．エルティーディー． | 熱間押出プロセスからのスパッタリング法による薄膜コーティング技術のための銅ターゲットの製造 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10195609A (ja) * | 1996-12-27 | 1998-07-28 | Dowa Mining Co Ltd | 結晶方位の制御されたｆｃｃ金属及びその製造方法 |
| JP2000239836A (ja) * | 1999-02-23 | 2000-09-05 | Japan Energy Corp | 高純度銅または銅合金スパッタリングターゲットおよびその製造方法 |
| US6946039B1 (en) * | 2000-11-02 | 2005-09-20 | Honeywell International Inc. | Physical vapor deposition targets, and methods of fabricating metallic materials |
| KR101515341B1 (ko) * | 2009-09-18 | 2015-04-24 | 후루카와 덴키 고교 가부시키가이샤 | 스퍼터링 타겟에 사용되는 구리재료의 제조방법 |
-
2011
- 2011-07-08 JP JP2011152275A patent/JP5787647B2/ja active Active
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