JP2012529011A - ジャイロスコープパッケージングアセンブリ - Google Patents
ジャイロスコープパッケージングアセンブリ Download PDFInfo
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- JP2012529011A JP2012529011A JP2012513095A JP2012513095A JP2012529011A JP 2012529011 A JP2012529011 A JP 2012529011A JP 2012513095 A JP2012513095 A JP 2012513095A JP 2012513095 A JP2012513095 A JP 2012513095A JP 2012529011 A JP2012529011 A JP 2012529011A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 claims abstract description 33
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 238000009429 electrical wiring Methods 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 14
- 238000001514 detection method Methods 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 230000033001 locomotion Effects 0.000 description 8
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
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- 235000012431 wafers Nutrition 0.000 description 3
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- 230000000712 assembly Effects 0.000 description 2
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- 238000005459 micromachining Methods 0.000 description 2
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- 230000035882 stress Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000015842 Hesperis Nutrition 0.000 description 1
- 235000012633 Iberis amara Nutrition 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- 229910052719 titanium Inorganic materials 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5642—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams
- G01C19/5663—Manufacturing; Trimming; Mounting; Housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/567—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode
- G01C19/5677—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially two-dimensional vibrators, e.g. ring-shaped vibrators
- G01C19/5684—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially two-dimensional vibrators, e.g. ring-shaped vibrators the devices involving a micromechanical structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Manufacturing & Machinery (AREA)
- Gyroscopes (AREA)
Abstract
Description
Howard H.Ge及びA. Dorian Challonerによる「Environmentally Robust Disc Resonator Gyroscope」と題する同時係属中の2009年4月1日出願の米国特許出願第12/416911号。
Howard H.Ge及びA. Dorian Challonerによる「Isolated Active Temperature Regulator for Vacuum Packaging of a Disk Resonator Gyroscope」と題する同時係属中の2009年5月27日出願の米国特許出願第12/473084号。
Kirill V. Shcheglovらによる「Method of Producing an Inertial Sensor」と題する2006年3月9日出願の米国特許第7401397号。
Kirill V. Shcheglovらによる「Integral Resonator Gyroscope」と題する2005年8月8日出願の米国特許第7347095号。
「Disk Resonator Gyroscope」と題する2006年7月20日出願の米国特許出願第11/458911号(米国特許出願公開第US2007/0017287A1号)。
「Planar Resonator Gyroscope with Central Die Attachment」と題する2007年6月4日出願の米国特許出願第11/757395号(米国特許出願公開第US2008/0295622A1号)。
「Vibratory Gyroscope with Parasitic Mode Dampening」と題する2006年12月22日出願の米国特許出願第11/615872号(米国特許出願公開第US2008/0148846A1号)。
「Disk Resonator Integral Inertial Measurement Unit」と題する2006年12月22日出願の米国特許出願第11/831822号(米国特許出願公開第US2010/0024546A1号)。
Claims (19)
- 支持材(140)と、
支持材に取り付けられた基板(130)と、
基板に接続されて基板との間に空洞(125)を画定するベースプレート(119)と、
ベースプレートに取り付けられており、かつ空洞内に吊り下げられている共振器(120、200)と
を備えた、パッケージングされた共振器ジャイロスコープ(100)。 - 基板が支持材に剛性支持マウント(135)により取り付けられている、請求項1に記載のパッケージングされた共振器ジャイロスコープ。
- 基板が少なくとも1つの半田ボール(134)を介して支持材に取り付けられている、請求項1に記載のパッケージングされた共振器ジャイロスコープ。
- 少なくとも1つの半田ボールがサーマルピラーバンプを含んでいる、請求項3に記載のパッケージングされた共振器ジャイロスコープ。
- 基板が少なくとも1つのピラーを介して支持材に取り付けられている、請求項1に記載のパッケージングされた共振器ジャイロスコープ。
- ベースプレートが少なくとも1つの第1電気配線を含み、
基板が少なくとも1つの第2電気配線を含み、
第1電気配線が第2電気配線に接続されている、
請求項1に記載のパッケージングされた共振器ジャイロスコープ。 - 少なくとも1つの第2電気配線が少なくとも1つのリードワイヤに接続されている、請求項6に記載のパッケージングされた共振器ジャイロスコープ。
- 基板の少なくとも一部が除去されることにより複数の片持ち梁状部分が画定されており、
ベースプレートが複数の片持ち梁状部分のうちの少なくとも1つに載せて基板に接続されている、
請求項1に記載のパッケージングされた共振器ジャイロスコープ。 - 更に、共振器パッケージを封止するキャップを備えている、請求項1に記載のパッケージングされた共振器ジャイロスコープ。
- 更に、キャップに接続されるゲッター層を備えている、請求項1に記載のパッケージングされた共振器ジャイロスコープ。
- 更に、熱電冷却モジュールを備えている、請求項1に記載のパッケージングされた共振器ジャイロスコープ。
- プレーナ共振器ジャイロスコープ(100)をパッケージングする方法であって、
プレーナ共振器及びベースプレートを含むプレーナ共振器チップを基板に取り付けて、基板とベースプレートとの間に空洞を画定し、空洞内に共振器を吊り下げる工程(410)と、
基板を支持材に取り付ける工程(415)と、
キャップを支持材に堅く固定する工程(425)と
を含む方法。 - プレーナ共振器及びベースプレートを含むプレーナ共振器チップを基板に取り付ける工程が、ベースプレートと基板との間に電気接続線を設ける工程(420)を含む、請求項12に記載の方法。
- 基板を支持材に取り付ける工程が、剛性支持マウントを取り付ける工程を含む、請求項12に記載の方法。
- 基板を支持材に取り付ける工程が、少なくとも1つの半田ボールを使用して基板を支持材に堅く固定する工程を含む、請求項12に記載の方法。
- 基板を支持材に取り付ける工程が、少なくとも1つのピラーを使用して基板を支持材に堅く固定する工程を含む、請求項12に記載の方法。
- 更に、基板と少なくとも1つのリードワイヤとの間に電気接続線を設ける工程を含む、請求項13に記載の方法。
- 基板の少なくとも一部を除去することにより複数の片持ち梁状部分を画定し、
複数の片持ち梁状部分のうちの少なくとも1つに載せて、ベースプレートを基板に接続する、
請求項12に記載の方法。 - 更に、ゲッター層をキャップに堅く固定する工程を含む、請求項12に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/475,963 US8418554B2 (en) | 2009-06-01 | 2009-06-01 | Gyroscope packaging assembly |
US12/475,963 | 2009-06-01 | ||
PCT/US2010/034669 WO2010141194A1 (en) | 2009-06-01 | 2010-05-13 | Gyroscope packaging assembly |
Publications (2)
Publication Number | Publication Date |
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JP2012529011A true JP2012529011A (ja) | 2012-11-15 |
JP5684244B2 JP5684244B2 (ja) | 2015-03-11 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012513095A Active JP5684244B2 (ja) | 2009-06-01 | 2010-05-13 | ジャイロスコープパッケージングアセンブリ |
Country Status (6)
Country | Link |
---|---|
US (1) | US8418554B2 (ja) |
EP (1) | EP2438399B1 (ja) |
JP (1) | JP5684244B2 (ja) |
CN (1) | CN102449434B (ja) |
CA (1) | CA2760961C (ja) |
WO (1) | WO2010141194A1 (ja) |
Families Citing this family (12)
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WO2010119573A1 (ja) * | 2009-04-17 | 2010-10-21 | 株式会社日立製作所 | 慣性センサおよびその製造方法 |
CN103780221B (zh) * | 2014-01-02 | 2017-03-22 | 东南大学 | 一种具有低热弹性阻尼结构的扭转式微机电谐振器件 |
CN104976995B (zh) * | 2015-08-07 | 2018-05-25 | 中国人民解放军国防科学技术大学 | 变谐振环壁厚的嵌套环式mems振动陀螺 |
US10352960B1 (en) * | 2015-10-30 | 2019-07-16 | Garmin International, Inc. | Free mass MEMS accelerometer |
US10794700B1 (en) * | 2015-10-30 | 2020-10-06 | Garmin International, Inc. | Stress isolation of resonating gyroscopes |
CN105466405B (zh) * | 2016-01-07 | 2018-02-02 | 东南大学 | 一种混合式半球谐振微陀螺仪及其加工工艺 |
CN105628013B (zh) * | 2016-01-07 | 2018-06-19 | 东南大学 | 一种组装式半球谐振微陀螺仪及其加工工艺 |
CN106556386B (zh) * | 2016-11-15 | 2019-11-08 | 东南大学 | 硅基微壳体谐振器及其制备方法 |
CN114174777A (zh) * | 2019-07-30 | 2022-03-11 | 京瓷株式会社 | 振动计及振动的检测方法 |
US11981560B2 (en) | 2020-06-09 | 2024-05-14 | Analog Devices, Inc. | Stress-isolated MEMS device comprising substrate having cavity and method of manufacture |
WO2023147502A1 (en) * | 2022-01-31 | 2023-08-03 | Adeia Semiconductor Bonding Technologies Inc. | Heat dissipating system for electronic devices |
JP2023128270A (ja) * | 2022-03-03 | 2023-09-14 | 株式会社東芝 | センサ |
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-
2009
- 2009-06-01 US US12/475,963 patent/US8418554B2/en active Active
-
2010
- 2010-05-13 EP EP10722229.1A patent/EP2438399B1/en active Active
- 2010-05-13 JP JP2012513095A patent/JP5684244B2/ja active Active
- 2010-05-13 CN CN201080024156.3A patent/CN102449434B/zh active Active
- 2010-05-13 WO PCT/US2010/034669 patent/WO2010141194A1/en active Application Filing
- 2010-05-13 CA CA2760961A patent/CA2760961C/en active Active
Patent Citations (3)
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JP2002181550A (ja) * | 2000-10-02 | 2002-06-26 | Ngk Insulators Ltd | 角速度測定装置 |
JP2008039576A (ja) * | 2006-08-07 | 2008-02-21 | Sony Corp | 振動型ジャイロセンサ |
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Also Published As
Publication number | Publication date |
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JP5684244B2 (ja) | 2015-03-11 |
US8418554B2 (en) | 2013-04-16 |
EP2438399B1 (en) | 2015-07-08 |
US20100300202A1 (en) | 2010-12-02 |
CA2760961C (en) | 2014-10-21 |
WO2010141194A1 (en) | 2010-12-09 |
EP2438399A1 (en) | 2012-04-11 |
CN102449434A (zh) | 2012-05-09 |
CA2760961A1 (en) | 2010-12-09 |
CN102449434B (zh) | 2016-01-20 |
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