JP2012527715A5

JP2012527715A5 -

Info

Publication number: JP2012527715A5
Application number: JP2012511122A
Authority: JP
Filing date: 2009-12-30
Publication date: 2015-02-26
Anticipated expiration: 2029-12-30

Description

〔発明を実施するための形態〕
本発明ではOLEDの基板から陰極への方向を縦方向とし、これに垂直となる方向を横方向とする。なお、表現の便宜上リード領域、ボンディング領域、リード延長領域を定義したが、これらの領域内のリードが互いに独立しているとは意味せず、それらは全体的なものであり、ホトリソグラフィ技術により一括に形成されるものである。発光領域とボンディング領域の間に位置する部分がリード領域となり、ボンディング領域と基板の下端の間に位置する部分がリード延長領域となる。 [Mode for Carrying Out the Invention]
In the present invention, the direction from the substrate to the cathode of the OLED is the vertical direction, and the direction perpendicular to the vertical direction is the horizontal direction . For convenience of expression, the lead area, bonding area, and lead extension area are defined, but it does not mean that the leads in these areas are independent from each other. It is formed in a lump. A portion located between the light emitting region and the bonding region becomes a lead region, and a portion located between the bonding region and the lower end of the substrate becomes a lead extension region.

発光領域から横方向に奇数行リード４０１［１］と偶数行リード４０１［２］を引き出し、縦方向に左列リード４０１［３］と右列リード４０１［４］を引き出す。リードの末端はリード延長領域３００に位置する。左列リード４０１［３］がチップピンとボンディングされた後、その末端は、チップピンを超えて、基板の下縁に垂直な垂直方向と３０°を成すように左側に伸びる。右列リード４０１［４］がチップピンとボンディングされた後、その末端はチップピンを超えて垂直方向と３０°を成すように右側に伸びる。奇数行リード４０１［１］がチップピンとボンディングされた後、その末端はチップピンを超えて垂直方向と３０°を成すように右側に伸びる。偶数行リード４０１［２］がチップピンとボンディングされた後、その末端はチップピンを超えて垂直方向と３０°を成すように左側に伸びる。リードのリード延長領域内における長さは０．４ｍｍとする。奇数行リード４０１［１］、偶数行リード４０１［２］、左列リード４０１［３］、右列リード４０１［４］は互いに交差しない。 The odd-numbered row lead 401 [1] and the even-numbered row lead 401 [2] are pulled out from the light emitting region in the horizontal direction , and the left column lead 401 [3] and the right column lead 401 [4] are pulled out in the vertical direction . The end of the lead is located in the lead extension region 300. After the left column lead 401 [3] is bonded to the chip pin, its end extends beyond the chip pin to the left so as to form 30 ° with the vertical direction perpendicular to the lower edge of the substrate . After the right column lead 401 [4] is bonded to the chip pin, the end of the right column lead 401 extends beyond the chip pin to the right so as to form 30 ° with the vertical direction. After the odd-numbered row lead 401 [1] is bonded to the chip pin, the end of the odd-numbered lead 401 [1] extends beyond the chip pin to the right side so as to form 30 ° with the vertical direction. After the even row lead 401 [2] is bonded to the chip pin, the end of the even row lead 401 [2] extends to the left so as to form 30 ° with the vertical direction beyond the chip pin. The length of the lead in the lead extension region is 0.4 mm. The odd row lead 401 [1], the even row lead 401 [2], the left column lead 401 [3], and the right column lead 401 [4] do not cross each other.

〔実施例２〕
図５に示すように、実施例２も同様に９６行×１６列の有機ELに関わる。発光領域から横方向に奇数行リード５０１［１］と偶数行リード５０１［２］を引き出し、縦方向に左列リード５０１［３］と右列リード５０１［４］を引き出す。リードの末端はリード延長領域５００に位置する。左列リード５０１［３］がチップピンとボンディングされた後、その末端はチップピンを超えて垂直方向と４５°を成すように左側に伸びる。右列リード５０１［４］がチップピンとボンディングされた後、その末端はチップピンを超えて垂直方向と４５°を成すように右側に伸びる。奇数行リード５０１［１］がチップピンとボンディングされた後、その末端はチップピンを超えて垂直方向と４５°を成すように左側に伸びる。偶数行リード５０１［２］がチップピンとボンディングされた後、その末端はチップピンを超えて垂直方向と４５°を成すように右側に伸びる。リードのリード延長領域内における長さは０．５ｍｍとする。奇数行リード５０１［１］、偶数行リード５０１［２］、左列リード５０１［３］、右列リード５０１［４］は互いに交差しない。 [Example 2]
As shown in FIG. 5, Example 2 similarly relates to an organic EL of 96 rows × 16 columns. The odd-numbered row lead 501 [1] and the even-numbered row lead 501 [2] are pulled out from the light emitting region in the horizontal direction , and the left column lead 501 [3] and the right column lead 501 [4] are pulled out in the vertical direction . The end of the lead is located in the lead extension region 500. After the left column lead 501 [3] is bonded to the chip pin, the end of the left column lead 501 [3] extends beyond the chip pin to the left so as to form 45 ° with the vertical direction. After the right column lead 501 [4] is bonded to the chip pin, the end of the right column lead 501 [4] extends beyond the chip pin to the right side so as to form 45 ° with the vertical direction. After the odd-numbered row lead 501 [1] is bonded to the chip pin, the end of the odd-numbered lead 501 [1] extends beyond the chip pin to the left so as to form 45 ° with the vertical direction. After the even-numbered row lead 501 [2] is bonded to the chip pin, the end of the even-numbered lead 501 [2] extends rightward so as to form 45 ° with the vertical direction beyond the chip pin. The length of the lead in the lead extension region is 0.5 mm. The odd row lead 501 [1], the even row lead 501 [2], the left column lead 501 [3], and the right column lead 501 [4] do not cross each other.

〔実施例３〕
図６、７に示すように、実施例３は６４行×１２８列の有機ELに関わる。発光領域から横方向に奇数行リード７０１［１］と偶数行リード７０１［２］を引き出し、縦方向に左列リード７０１［３］と右列リード７０１［４］を引き出す。リードの末端はリード延長領域７００に位置する。左列リード７０１［３］がチップピンとボンディングされた後、その末端はチップピンを超えて垂直方向と６０°を成すように右側に伸びる。右列リード７０１［４］がチップピンとボンディングされた後、その末端はチップピンを超えて垂直方向と６０°を成すように左側に伸びる。奇数行リード７０１［１］がチップピンとボンディングされた後、その末端はチップピンを超えて垂直方向と６０°を成すように右側に伸びる。偶数行リード７０１［２］がチップピンとボンディングされた後、その末端はチップピンを超えて垂直方向と６０°を成すように左側に伸びる。リードのリード延長領域内における長さは０．１ｍｍとする。奇数行リード７０１［１］、偶数行リード７０１［２］、左列リード７０１［３］、右列リード７０１［４］は互いに交差しない。 Example 3
As shown in FIGS. 6 and 7, Example 3 relates to an organic EL of 64 rows × 128 columns. The odd-numbered row lead 701 [1] and the even-numbered row lead 701 [2] are pulled out from the light emitting region in the horizontal direction , and the left column lead 701 [3] and the right column lead 701 [4] are pulled out in the vertical direction . The end of the lead is located in the lead extension region 700. After the left column lead 701 [3] is bonded to the chip pin, the end of the left column lead 701 [3] extends rightward so as to form 60 ° with the vertical direction beyond the chip pin. After the right column lead 701 [4] is bonded to the chip pin, the end of the right column lead 701 [4] extends to the left so as to form 60 ° with the vertical direction beyond the chip pin. After the odd-numbered row lead 701 [1] is bonded to the chip pin, the end of the odd-numbered lead 701 [1] extends rightward so as to form 60 ° with the vertical direction beyond the chip pin. After the even-numbered lead 701 [2] is bonded to the chip pin, the end of the even-numbered lead 701 [2] extends to the left so as to form 60 ° with the vertical direction beyond the chip pin. The length of the lead in the lead extension region is 0.1 mm. The odd row lead 701 [1], the even row lead 701 [2], the left column lead 701 [3], and the right column lead 701 [4] do not cross each other.

〔実施例４〕
図８に示すように、実施例４も同様に６４行×１２８列の有機ELに関わる。発光領域から横方向に奇数行リード８０１［１］と偶数行リード８０１［２］を引き出し、縦方向に左列リード８０１［３］と右列リード８０１［４］を引き出す。リードの末端はリード延長領域８００に位置する。左列リード８０１［３］がチップピンとボンディングされた後、その末端はチップピンを超えて垂直方向と７５°を成すように右側に伸びる。右列リード８０１［４］がチップピンとボンディングされた後、その末端はチップピンを超えて垂直方向と７５°を成すように左側に伸びる。奇数行リード８０１［１］がチップピンとボンディングされた後、その末端はチップピンを超えて垂直方向と７５°を成すように左側に伸びる。偶数行リード８０１［２］がチップピンとボンディングされた後、その末端はチップピンを超えて垂直方向と７５°を成すように右側に伸びる。リードのリード延長領域内における長さは０．２ｍｍとする。奇数行リード８０１［１］、偶数行リード８０１［２］、左列リード８０１［３］、右列リード８０１［４］は互いに交差しない。 Example 4
As shown in FIG. 8, Example 4 is similarly related to an organic EL of 64 rows × 128 columns. The odd-numbered row lead 801 [1] and the even-numbered row lead 801 [2] are pulled out from the light emitting region in the horizontal direction , and the left column lead 801 [3] and the right column lead 801 [4] are pulled out in the vertical direction . The end of the lead is located in the lead extension region 800. After the left column lead 801 [3] is bonded to the chip pin, the end of the left column lead 801 [3] extends rightward so as to form 75 ° with the vertical direction beyond the chip pin. After the right column lead 801 [4] is bonded to the chip pin, the end of the right column lead 801 [4] extends to the left so as to form 75 ° with the vertical direction beyond the chip pin. After the odd-numbered row lead 801 [1] is bonded to the chip pin, the end of the odd-numbered lead 801 [1] extends beyond the chip pin to the left so as to form 75 ° with the vertical direction. After the even-numbered lead 801 [2] is bonded to the chip pin, the end of the even-numbered lead 801 [2] extends rightward so as to form 75 ° with the vertical direction beyond the chip pin. The length of the lead in the lead extension region is 0.2 mm. The odd row lead 801 [1], the even row lead 801 [2], the left column lead 801 [3], and the right column lead 801 [4] do not cross each other.

Claims

An organic EL including a light emitting region, a lead region, and a bonding region arranged in order from the upper edge to the lower edge of the substrate ,
The light emitting region includes an anode, an organic functional layer, and a cathode,
The lead area consists of leads that connect the anode and cathode to the driver chip or circuit board,
The bonding area is the area where the lead and driver chip or circuit board are connected,
And further including a lead extension region, the lead extension region located on the opposite side of the lead region to the bonding region,
The end of the lead is located in the lead extension region beyond the bonding region;
Lead and the lead of the extension region, organic EL, wherein the vertical angle and the vertical direction is formed on the lower edge of said substrate is less than 0 ° larger than 90 °.

Read the angle and to form leads and the vertical extension region, organic EL according to claim 1, characterized in that the less than 80 ° greater than 20 °.

The lead and the angle between the vertical direction is formed of the lead extension regions, 30 °, 45 °, organic EL according to claim 1, characterized in that the 60 ° or 75 °.

Adopting single-side bonding for the leads, the leads are odd row leads, even row leads, left column leads and right column leads, the column leads are located in the center, and the odd row leads and even row leads are respectively columns The organic EL according to claim 1, wherein the organic EL is located on both sides of the lead.

The organic EL according to claim 4, wherein the left column lead (401 [3]) and the right column lead (401 [4]) in the lead extension region extend in directions away from each other and do not intersect each other.

The odd row lead (401 [1]) and the even row lead (401 [2]) in the lead extension region extend in opposite directions, and the left column lead (401 [3]) and right column lead (401 [4]). The organic EL according to claim 5, wherein the odd-numbered row lead (401 [1]) and the even-numbered row lead (401 [2]) do not cross each other.

The odd row lead (501 [1]) and the even row lead (501 [2]) in the lead extension region extend away from each other, and the left column lead (501 [3]) and right column lead (501 [4]). The organic EL according to claim 5, wherein the odd row lead (501 [1]) and the even row lead (501 [2]) do not cross each other.

The organic EL according to claim 4, wherein the left column lead (701 [3]) and the right column lead (701 [4]) in the lead extension region extend in opposite directions and do not cross each other.

The odd-numbered row lead (701 [1]) and the even-numbered row lead (701 [2]) in the lead extension region extend in opposite directions, and the left column lead (701 [3]) and right column lead (701 [4]). 9. The organic EL according to claim 8, wherein the odd row lead (701 [1]) and the even row lead (701 [2]) do not intersect each other.

The odd row lead (801 [1]) and the even row lead (801 [2]) in the lead extension region extend away from each other, and the left column lead (801 [3]) and right column lead (801 [4]). 9) The odd-numbered row lead (801 [1]) and the even-numbered row lead (801 [2]) do not cross each other.

4. The organic EL according to claim 1, wherein the number of leads in the lead extension region is smaller than the number of leads in the lead region.

The organic EL according to any one of claims 1 to 3, wherein a length of the lead in the lead extension region is 0.1 mm to 0.5 mm.

A test method used for the organic EL according to any one of claims 1 to 12,
a) A conductive material that is installed in each of the lead extension regions of the organic EL and whose distance from each other is larger than the minimum alignment accuracy of the test apparatus, shorts the row lead for lighting standby, Shorting the column leads;
b) applying a lighting voltage to the row or column lead shorted in step a);
and c) a step of outputting a test result based on the state of the test.

14. The organic EL test method according to claim 13, wherein in step a), all odd row leads are shorted, all even row leads are shorted, and all column leads are shorted.

14. The organic EL test method according to claim 13, wherein in step a), all row leads are short-circuited and all column leads are short-circuited.

The organic EL test method according to claim 13, wherein the conductive material is a metal film or a conductive tape.