JP2010145712A - Matrix type display device and method of inspecting matrix-type display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To avoid tracking back a mounting process for a wiring board by confirming whether a mounting miss is made in the mounting process. <P>SOLUTION: A matrix type display device includes a support substrate where a signal line 51 is formed; a video signal wiring board 50a disposed at a peripheral portion of the support substrate and having a signal connection line 53 formed corresponding to the signal line 51; and an electrical connection portion for electrically connecting the signal 51 and signal connection line 53 to each other, wherein the support substrate has a pair of free terminals 54a and 54b that does not correspond to the signal connection line 53, outside the signal line 51 at the electric connection portion, and the video signal wiring board 50a has a short-circuit interconnect 56a electrically connected to the free terminals 54a and 54b to short-circuit the free terminals 54a and 54b, when the electric connection portion electrically connects the signal line 51 and signal connection line 53 to each other. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a matrix-type display device and a matrix-type display device having a plurality of light-emitting elements arranged in a matrix, light-emitting wirings for causing each light-emitting element to emit light, and connection wirings corresponding to the light-emitting wirings This relates to the inspection method. More specifically, the present invention relates to a technique that allows easy confirmation of the presence / absence of electrical connection between a light-emitting wiring and a connection wiring.

  Currently, a liquid crystal display (LCD) dominates a flat panel display (FPD) which is a matrix display device. However, the liquid crystal display device is not a self-luminous device but requires a member such as a backlight or a polarizing plate. For this reason, not only the thickness of the liquid crystal display device is increased, but also the luminance is insufficient.

  Therefore, in recent years, interest in an organic EL display device using an organic electroluminescence element (hereinafter referred to as “organic EL element”) as a light emitting element is increasing. This organic EL display device is a self-luminous device in which organic EL elements are arranged in a matrix to form each pixel, and a driving device for driving the organic EL elements is provided. In addition, the organic EL display device has advantages in that other members such as a backlight are not necessary in principle as compared with the liquid crystal display device, can be reduced in thickness, and has high luminance. In particular, an active matrix type organic EL display device provided with a switching element (drive device) corresponding to each pixel has an advantage that current consumption can be suppressed low by lighting each pixel. In addition, a large screen and high definition can be achieved relatively easily. For this reason, development is progressing by each company, and it is expected to become the mainstream of next-generation flat panel displays.

  Here, the organic EL element used for the active matrix organic EL display device is a current light emitting element in which an organic hole transport layer or an organic light emitting layer (organic substance layer) is laminated between an anode electrode and a cathode electrode. is there. Therefore, light is emitted when electrons and holes are injected into the organic layer of the organic EL element. And the desired brightness | luminance can be obtained by controlling the electric current value which flows into an organic EL element with a drive device.

  In such an active matrix organic EL display device, a driving device such as a TFT (thin film transistor) is disposed on a support substrate, an insulating film is laminated on the TFT or the like, and an organic EL element is formed on the insulating film. It is arranged. In order to drive the organic EL element, for example, the anode electrode of the organic EL element and the source electrode of the TFT are electrically connected. Further, light emitting wiring (for example, a scanning line, a power supply control line, a signal line, etc.) connected to the TFT or the like is wired on the support substrate.

  In addition, a wiring board on which connection wiring corresponding to the light emission wiring is formed is disposed around the support substrate. Specifically, a scanning signal / power control signal wiring board, a video signal wiring board, and a power supply wiring board, which are flexible printed boards, are separately connected to the outside of the support board, and the organic EL element emits light. It is like that. Then, a driver IC (Integrated Circuit) is connected to the scanning signal / power control signal wiring board and the video signal wiring board to form a TCP (Tape Carrier Package). On the other hand, the power supply wiring board is connected to an external circuit by TAB (Tape Automated Bonding).

  However, when a foreign substance is mixed in the manufacturing process, a short circuit occurs in the light emitting wiring due to the foreign substance, and a point defect or a horizontal line or a vertical line of the organic EL element becomes a line defect. Further, in the manufacturing process, a point defect or a line defect also occurs when the light emitting wiring and the connection wiring are not electrically connected due to a mounting error of the flexible printed circuit board. As a result, the yield decreases.

Therefore, there is known a matrix type wiring board that can perform repair work when a short circuit occurs. Specifically, a pair of openings are formed in advance in the interlayer insulating film covering the drain lines intersecting on the gate lines so as to sandwich the intersection of both lines, and the drain lines are exposed in the openings. . When a short circuit occurs at the intersection of both lines due to a defect in the interlayer insulating film, and this is detected in the inspection process, the interlayer insulating film on the inner side (short side) of the pair of openings sandwiching the shorted portion is Destroy and cut the drain line below it. Thereafter, a bypass line is formed so as to bypass the short portion through a pair of openings, and the disconnected drain line is connected again (for example, refer to Patent Document 1).
JP 2000-241833 A

  However, the technique of Patent Document 1 described above is to repair a short portion by forming a bypass line. Therefore, it cannot cope with lighting failure of the organic EL element due to a mounting error of the flexible printed circuit board. And, since the lighting check of the organic EL element is performed in the inspection process after mounting the flexible printed circuit board, if there is a lighting failure due to a mounting error, return to the mounting process that should have been completed and try again. There must be. As a result, the flexible printed circuit board is mounted again, and extra man-hours for that are generated.

  Therefore, the problem to be solved by the present invention is that there is a mounting error in the mounting process of the wiring board (flexible printed circuit board) before going to the inspection process (whether there is an electrical connection between the light emitting wiring and the connecting wiring). ) Can be confirmed, and backtracking of the process can be avoided.

The present invention solves the above-described problems by the following means.
According to the first aspect of the present invention, there is provided a support substrate on which a plurality of light emitting elements arranged in a matrix, light emitting wirings for causing each of the light emitting elements to emit light, and a peripheral portion of the support substrate And a wiring board on which connection wiring corresponding to the light emission wiring is formed, and an electrical connection portion for electrically connecting the light emission wiring and the connection wiring, Has a pair of free terminals that do not correspond to the connection wiring outside the light emission wiring of the electrical connection portion, and the wiring board includes the light emission wiring and the connection wiring at the electrical connection portion. Is a matrix type display device having a short-circuit wiring that is electrically connected to each of the free terminals to short-circuit the free terminals.

  The invention according to claim 5 of the present invention is a light emitting element similar to that of the invention according to claim 1, a support substrate on which light emitting wiring is formed, a wiring substrate on which connection wiring is formed, The wiring board has a pair of free terminals that do not correspond to the light-emitting wiring outside the connection wiring of the electrical connection part, and the support substrate is the electrical connection part When the light-emitting wiring and the connection wiring are electrically connected, the matrix display device includes a short-circuit wiring that is electrically connected to the free terminals to short-circuit the free terminals.

(Function)
The invention described in claim 1 and claim 5 has a pair of free terminals on the outside of the light emission wiring or the connection wiring of the electrical connection portion. The wiring board or the support board is a short-circuit wiring that is electrically connected to each free terminal and short-circuits between the free terminals when the light-emitting wiring and the connection wiring are electrically connected at the electrical connection portion. have. Therefore, the conduction state of the free terminals can be confirmed between the outer sides of the light emission wiring or the connection wiring of the electrical connection portion.

  According to a sixth aspect of the present invention, there is provided a support substrate on which a plurality of light emitting elements arranged in a matrix, light emitting wirings for causing each of the light emitting elements to emit light, A wiring board disposed in a peripheral portion and provided with a connection wiring corresponding to the light emission wiring; and an electrical connection portion for electrically connecting the light emission wiring and the connection wiring, The support substrate has a pair of free terminals that do not correspond to the connection wiring outside the light emission wiring of the electrical connection portion, and the wiring substrate is connected to the light emission wiring and the connection at the electrical connection portion. When the wiring is electrically connected, it has a short-circuit wiring that is electrically connected to each free terminal to short-circuit the free terminals, and the light-emitting wiring and the connection wiring After electrical connection, between the free terminals An inspection method of a matrix type display device for measuring the anti-values.

(Function)
The invention described in claim 6 has a pair of free terminals on the outer side of the light emitting wiring of the electrical connecting portion. In addition, the wiring board has a short-circuit wiring that is electrically connected to each free terminal to short-circuit the free terminals when the light-emitting wiring and the connection wiring are electrically connected at the electrical connection portion. ing. And after electrically connecting the wiring for light emission and the wiring for connection, the resistance value between free terminals is measured. Therefore, the conduction state between the free terminals can be confirmed from the measured resistance value.

  According to said invention, the conduction | electrical_connection state of a pair of free terminals in the outer side of the light emission wiring (or connection wiring) of an electrical connection part can be confirmed. If the free terminals are electrically connected, it can be expected that the light emitting wiring (or connecting wiring) inside thereof is also electrically connected. On the other hand, if the free terminals are not conductive, it can be expected that the light emitting wiring (or the connecting wiring) inside thereof is not conductive. Therefore, it is possible to easily confirm whether or not there is an electrical connection between the light emission wiring and the connection wiring in the electrical connection portion without confirming the lighting of the light emitting element.

The best mode for carrying out the present invention (hereinafter referred to as an embodiment) will be described below with reference to the drawings.
Here, the matrix type display device according to the present invention is assumed to be the organic EL displays 10, 80, 90 in the following embodiments. The description will be given in the following order.

1. First embodiment (organic EL display 10: an example in which a free terminal is provided on a support substrate)
2. Second embodiment (organic EL display 80: an example in which a free terminal is provided on a support substrate)
3. Third embodiment (organic EL display 90: an example in which a free terminal is provided on a wiring board)

<1. First Embodiment>
[Configuration example of matrix type display device]

FIG. 1 is a plan view showing an organic EL display 10 as one embodiment (first embodiment) of a matrix display device of the present invention.

  As shown in FIG. 1, the organic EL display 10 uses an insulating substrate that is appropriately selected from a transparent substrate such as glass or a silicon substrate as a supporting substrate 11. On the support substrate 11, a display region 10 a (an arrangement range of the organic EL elements 20) composed of a plurality of organic EL elements 20 (corresponding to the light emitting elements in the present invention) is formed. Specifically, in the display area 10a, the organic EL elements 20 are arranged as pixels in a matrix of M rows × N columns. The organic EL element 20 includes three types of an R pixel 20a that emits red in the three primary colors of light, a G pixel 20b that emits green, and a B pixel 20c that emits blue.

  On the support substrate 11 of the organic EL display 10, scanning lines 41, power supply control lines 42, and signal lines 51 are formed as light emission wirings for causing each organic EL element 20 to emit light. In addition, a wiring board on which connection wiring corresponding to the light emission wiring is formed is disposed around the support substrate 11. This wiring board is composed of a flexible printed circuit board, and the scanning signal / power control signal wiring board 40, the video signal wiring board 50, and the power supply wiring board 60 are separately connected to the support board 11, respectively.

  Here, a driver IC 43 (not shown) and a driver IC 52 (not shown) are connected to the scanning signal / power control signal wiring board 40 and the video signal wiring board 50, respectively, and TCP (Tape Carrier Package) and It has become. On the other hand, the power supply wiring board 60 is connected to an external circuit by TAB (Tape Automated Bonding). These and the support substrate 11 are connected by pressure bonding (ACF pressure bonding) using ACF (Anisotropic Conductive Film). If there is no mounting error in the scanning signal / power control signal wiring board 40, the video signal wiring board 50, and the power supply wiring board 60, each organic EL element 20 can emit light.

[Configuration example of light emitting element]
FIG. 2 is a plan view showing the organic EL elements 20 (R pixel 20a, G pixel 20b, and B pixel 20c) of the organic EL display 10 shown in FIG.
3 is a plan view and a cross-sectional view showing a surface layer portion of one organic EL element 20 of the organic EL display 10 shown in FIG.
FIG. 4 is a plan view showing the internal structure of one organic EL element 20 of the organic EL display 10 shown in FIG.
FIG. 5 is an equivalent circuit diagram of the organic EL display 10 shown in FIG.

  The organic EL element 20 includes an organic material layer, which is an organic light emitting layer, between a transparent cathode electrode 21 (see FIG. 3) as an upper electrode and an anode electrode 22 (see FIGS. 2 and 3) as a lower electrode. 23 (see FIG. 3) are stacked. Such an organic EL element 20 is formed in a matrix on the support substrate 11 (see FIG. 1), as shown in FIG. It is arranged. Further, as shown in FIGS. 4 and 5, the organic EL element 20 is driven by driving means including a thin film transistor (driving TFT 30a and writing TFT 30b) and a capacitive element (capacitor 34) provided for each organic EL element 20. The Therefore, the organic EL display 10 (see FIG. 1) of the first embodiment is an active matrix display device that is driven by a driving unit provided for each organic EL element 20.

  Here, as shown in FIG. 5, in the organic EL element 20, the cathode electrode 21 is connected to GND (ground), and the anode electrode 22 is connected to the source electrode 31a of the driving TFT 30a. The anode electrode 22 and the source electrode 31a are connected through a connection contact 24 (see FIGS. 2 to 4).

  Further, on the support substrate 11 (see FIG. 1), as shown in FIGS. 2, 4, and 5, scanning lines 41 and power control lines are provided as light emission wirings for causing the organic EL elements 20 to emit light. 42 and a signal line 51 are formed. The scanning line 41 is wired for each row (above each row) of the organic EL elements 20 arranged in a matrix, and the power supply control line 42 is wired for each row (below each row) of the organic EL elements 20, The signal line 51 is wired for each column of the organic EL elements 20. 4 and 5, the drain electrode 32a of the drive TFT 30a is connected to the power supply control line 42 having a positive potential (Vcc), and between the source electrode 31a of the drive TFT 30a and the source electrode 31b of the write TFT 30b. A capacitor 34 is connected to the capacitor. Furthermore, the gate electrode 33a of the driving TFT 30a is connected to the source electrode 31b of the writing TFT 30b, the drain electrode 32b of the writing TFT 30b is connected to the signal line 51, and the gate electrode 33b is connected to the scanning line 41.

  In such an organic EL element 20, the driving TFT 30a is a driving transistor, and the writing TFT 30b is a switching transistor. When a signal is applied to the scanning line 41 and the potential of the gate electrode 33b of the writing TFT 30b is controlled, the voltage of the signal line 51 is applied to the gate electrode 33a of the driving TFT 30a. At this time, the potential of the gate electrode 33 a is stably held by the capacitor 34 until a signal is next applied to the scanning line 41. Therefore, during this time, a current corresponding to the voltage between the gate electrode 33a and the source electrode 31a of the driving TFT 30a flows through the organic EL element 20. As a result, the organic EL element 20 continues to emit light with a luminance corresponding to the current value.

  Thus, the organic EL display 10 (see FIG. 1) emits light by controlling the value of the current flowing through the organic EL element 20. Further, the organic EL element 20 is driven by driving the power supply control line 42 in a pulse manner (two pulses). Then, the threshold voltage, which is the characteristic variation of the driving TFT 30a, is corrected by the first pulse, and the signal application and the mobility correction are simultaneously performed by the second pulse. Therefore, the deterioration with time of the organic EL element 20 and the variation in the characteristics of the driving TFT 30a are suppressed.

  Further, light generated from the organic EL element 20 is extracted from the opening portion (opening portion shown in FIG. 2) from which the opening defining insulating film 25 shown in FIG. 3 is removed. Specifically, the opening regulating insulating film 25 covers the entire anode electrode 22 and the auxiliary wiring 26 in the same layer, and a part of the anode electrode 22 is partially removed to form a pixel (R pixel 20a, G shown in FIG. 2). The openings are for pixels 20b and B pixels 20c). Further, the organic layer 23 is deposited to be slightly larger than the anode electrode 22. Furthermore, the transparent cathode electrode 21 is entirely formed as a common electrode for all pixels, and sealing glass (not shown) is disposed on the cathode electrode 21 via a sealing material. ing. Therefore, the light generated by the organic EL element 20 exits through the cathode electrode 21 through the opening of the opening defining insulating film 25. The conductive material having a high light transmittance constituting the cathode electrode 21 has a high resistance value. Therefore, an auxiliary wiring 26 is connected to the cathode electrode 21 in order to adjust the electric resistance of the cathode electrode 21 and reduce the resistance of the cathode electrode 21. The auxiliary wiring 26 is wired around the anode electrode 22 and is grounded to GND, for example, at the same potential as the cathode electrode 21.

  However, if there is a mounting error in the scanning signal / power control signal wiring board 40 or the video signal wiring board 50 shown in FIG. 1, the organic EL element 20 does not emit light. Specifically, the scanning line 41 and the power supply control line 42 shown in FIGS. 2, 4, and 5 are connected to the scanning signal / power supply control signal wiring board 40 by ACF pressure bonding. However, if there is a scanning line 41 or a power supply control line 42 that is not connected due to a mounting error, the organic EL element 20 will be poorly lit. The signal line 51 is also connected to the video signal wiring board 50 by ACF crimping. However, if there is a signal line 51 that is not connected due to a mounting error, the organic EL element 20 is poorly lit.

[Configuration and mounting example of wiring board]

FIG. 6 is a plan view showing the scanning signal / power control signal wiring board 40 of the organic EL display 10 shown in FIG.
FIG. 7 is a plan view showing the video signal wiring board 50 of the organic EL display 10 shown in FIG.
FIG. 8 is a perspective view showing a mounting portion of the video signal wiring board 50 (50a, 50b) shown in FIG. In FIG. 8, for easy understanding, a part of the video signal wiring board 50a is turned over.

  As shown in FIG. 6, the scanning signal / power supply control signal wiring board 40 includes a driver IC 43 for control and a scanning / power supply control connection line 44 that is a connection wiring. The scanning / power control connection line 44 is connected to the scanning line 41 (41a, 41b,...) And the power control line 42 (42a, 42b,...) Wired on the support substrate 11 via the driver IC 43. ) To be electrically connected.

  Here, the scanning signal / power control signal wiring board 40 is a flexible film having a sandwich structure in which the scanning / power control connection line 44 is sandwiched from both sides by a flexible film-like insulator (for example, polyimide resin). It is a printed circuit board. The scanning / power supply control connection line 44 is formed by attaching a conductive foil (for example, copper foil) on a polyimide resin film and then etching it.

  The scanning signal / power control signal wiring board 40 and the support board 11 are connected by ACF pressure bonding. The driver IC 43 is connected to the scanning lines (41a, 41b,...) And the power supply control lines 42 (42a, 42b,. Specifically, the first pin 43a of the driver IC 43 is connected to the scanning line 41a corresponding to the organic EL element 20 in the first row (see FIG. 1). Furthermore, the second pin 43b of the driver IC 43 is connected to the power supply control line 42a corresponding to the organic EL element 20 in the first row. Similarly, the third pin 43c is connected to the scanning line 41b corresponding to the second row organic EL element 20, and the fourth pin 43d and the power control line corresponding to the second row organic EL element 20 are connected. 42b is connected.

  On the other hand, as shown in FIG. 7, the video signal wiring board 50 includes a driver IC 52 for control and a signal connection line 53 that is a connection wiring. The video signal wiring board 50 is electrically connected to the signal lines 51 (51a, 51b, 51c, 51d,...) Wired on the support board 11 via the driver IC 52. Yes.

  Here, the video signal wiring board 50 is a flexible printed board having a sandwich structure in which the signal connection line 53 is sandwiched from both sides with a flexible film-like insulator (for example, polyimide resin). And the signal connection line 53 is formed by affixing a conductor foil (for example, copper foil) on a polyimide resin film and then etching.

  Further, the video signal wiring board 50 and the support board 11 are connected by ACF pressure bonding. Then, the driver IC 52 and the signal lines 51 (51a, 51b, 51c, 51d,...) Are connected by the electrical connection unit 12. Specifically, the first pin 52a of the driver IC 52 is connected to the signal line 51a corresponding to the organic EL element 20 in the first row (see FIG. 1). Furthermore, the second pin 52b of the driver IC 52 and the signal line 51b corresponding to the organic EL element 20 in the second row are connected. Similarly, the third pin 52c and the signal line 51c corresponding to the organic EL element 20 in the third row are connected, and the signal line 51d corresponding to the fourth pin 52d and the organic EL element 20 in the fourth row. And are connected.

  The scanning signal / power control signal wiring board 40 (see FIG. 6) and the video signal wiring board 50 (see FIG. 7) are separately arranged on the periphery of the support substrate 11 as shown in FIG. . Specifically, a plurality of scanning signal / power control signal wiring boards 40 are arranged in the column direction of the organic EL elements 20 arranged in a matrix, and a plurality of video signal wiring boards 50 are arranged in the row direction of the organic EL elements 20. Be placed.

  Here, as shown in FIG. 8, in order to mount the video signal wiring board 50 (50a, 50b,...) On the support board 11, the signal line 51 (51a, 51b,. 51c) and the signal connection line 53 (53a, 53b, 53c,..., 53n) are aligned. Then, an ACF connection is made with the tip of the signal connection line 53 facing the tip of the signal line 51 on a one-to-one basis. Further, the electrical connection between the scanning / power supply control connection line 44, the scanning line 41, and the power supply control line 42 shown in FIG. In FIG. 8, the driver IC 52 (see FIG. 7) is not shown for convenience of explanation.

  However, a connection failure of the electrical connection portion 12 may occur due to a mounting error of the video signal wiring board 50 (50a, 50b,...). In particular, since the video signal wiring board 50 is a flexible printed board, a connection failure is likely to occur outside the signal lines 51 (51a, 51b, 51c,..., 51n). For example, when a part of the circuit board is turned due to a mounting error like the video signal wiring board 50a, the connection between the signal lines 51a, 51b, 51c and the signal connection lines 53a, 53b, 53c becomes poor. Conversely, as long as there is no poor connection between the signal line 51n on the opposite side and the signal connection line 53n, the side closer to the signal line 51c and the signal connection line 53c than the signal line 51n and the signal connection line 53n is also connected. Expect no defects.

  Therefore, in the organic EL display 10 (see FIG. 1) of the first embodiment, the signal connection line 53 (53a, 53a, 53) is formed on the support substrate 11 on the outer side of the signal line 51a and the signal line 51n outside the electrical connection unit 12. 53b, 53c,..., 53n) has a pair of free terminals 54a and 54b. Moreover, the front-end | tip part of the free terminal 54a becomes the resistance measurement part 55a, and the front-end | tip part of the free terminal 54b becomes the resistance measurement part 55b. Furthermore, the video signal wiring board 50a has a short-circuit wiring 56a. The short-circuit wiring 56a electrically connects the signal line 51 (51a, 51b, 51c,..., 51n) and the signal connection line 53 (53a, 53b, 53c,. Are connected to the free terminal 54a and the free terminal 54b to short-circuit the free terminal 54a and the free terminal 54b. The video signal wiring board 50b has the same configuration, and the short circuit wiring 56b of the video signal wiring board 50b is electrically connected to a free terminal 54c disposed between the video signal wiring board 50a and the video signal wiring board 50b. Connected. And the front-end | tip part of the free terminal 54c becomes the resistance measurement part 55b common to the free terminal 54b.

  The resistance measuring unit 55a and the resistance measuring unit 55b are for measuring the resistance value between the free terminal 54a and the free terminal 54b. Specifically, the video signal wiring board 50 (50a, 50b,...) Is mounted, the signal line 51 (51a, 51b, 51c,..., 51n) and the signal connection line 53 (53a, 53b, 53c). ,..., 53n) are electrically connected, and then the resistance value between the free terminal 54a and the free terminal 54b is measured. And a mounting state is test | inspected by the resistance value measured in the mounting process before going to an inspection process.

[Example of inspection of wiring board mounting state]

FIG. 9 is a plan view showing an inspection method of the organic EL display 10 as an embodiment of the inspection method of the matrix type display device of the present invention.
As shown in FIG. 9, a video signal wiring board 50 a and a video signal wiring board 50 b are mounted on the organic EL display 10. The signal connection line 53 and the signal line 51 are electrically connected via the driver IC 52.

  In addition, there are free terminals 54 a, 54 b, 54 c, 54 d that do not correspond to the signal connection line 53 outside the signal line 51. The distal end portion of the free terminal 54a has a resistance measurement portion 55a, the resistance measurement portion 55b is provided between the free terminal 54b and the free terminal 54c, and the distal end portion of the free terminal 54d is the resistance measurement portion 55c. have. Furthermore, the video signal wiring board 50a has a short-circuit wiring 56a for short-circuiting the free terminal 54a and the free terminal 54b. Further, the video signal wiring board 50b has a short-circuit wiring 56b for short-circuiting the free terminal 54c and the free terminal 54d.

  In such an organic EL display 10, in order to inspect the mounting state of the video signal wiring board 50a, the test leads of the tester 70 are brought into contact with the resistance measuring unit 55a and the resistance measuring unit 55b as shown in FIG. Then, the resistance value between the free terminal 54a and the free terminal 54b is measured. As a result, if the resistance value is about 0 ohms to several ohms, the free terminal 54a and the free terminal 54b are short-circuited by the short-circuit wiring 56a and are conductive. The reason why it may be several ohms is due to the wiring resistance in the video signal wiring board 50a.

  Therefore, since the free terminal 54a and the free terminal 54b outside the signal line 51 are electrically connected, the signal line 51 inside the free terminal 54a and the free terminal 54b is also electrically connected (no mounting error). Can be expected. Conversely, when the measured resistance value is large and it is determined that the free terminal 54a and the free terminal 54b are not conducting, the signal line 51 inside thereof is not conducting (there is a mounting error). ). Therefore, the presence / absence of electrical connection between the signal line 51 and the signal connection line 53 can be easily confirmed without checking the lighting of the organic EL element 20 (see FIG. 1).

  Further, in order to inspect the mounting state of the video signal wiring board 50b, the test lead of the tester 70 is brought into contact with the resistance measuring unit 55b and the resistance measuring unit 55c, and the resistance value between the free terminal 54c and the free terminal 54d is measured. To do. If the free terminal 54c and the free terminal 54d are short-circuited by the short-circuit wiring 56b and are conductive, the signal line 51 and the signal connection line 53 in the video signal wiring board 50b are electrically connected. Can be confirmed. Similarly, the presence / absence of mounting error of the scanning signal / power control signal wiring board 40 (see FIG. 1) (the electrical connection between the scanning / power control connection line 44, the scanning line 41, and the power control line 42 shown in FIG. 6). Can be confirmed).

  As described above, if the mounting state is inspected in the mounting process of the video signal wiring board 50a and the video signal wiring board 50b, the inspection is performed in the next inspection process, and if there is a mounting error, the process is returned to the mounting process. Productivity is greatly improved compared to re-implementation. Further, if the inspection is performed every time one video signal wiring board 50a or one video signal wiring board 50b is mounted, the productivity is improved as compared with the case where the inspection is performed after all of them are mounted.

<2. Second Embodiment>
[Configuration example of matrix type display device]

FIG. 10 is a plan view showing an organic EL display 80 as one embodiment (second embodiment) of the matrix type display device of the present invention.
The organic EL display 80 according to the second embodiment shown in FIG. 10 has the same scanning signal / power control signal wiring substrate as the organic EL display 10 according to the first embodiment shown in FIG. 40 and a plurality of video signal wiring boards 50 are arranged.

  However, in the organic EL display 80 of the second embodiment shown in FIG. 10, a pair of free terminals are arranged only outside the scanning signal / power control signal wiring board 40 at both ends, and each free terminal of the support board 81 is arranged. The tip portions are a resistance measurement unit 81a and a resistance measurement unit 81b. For this reason, the test leads of the tester 70 (see FIG. 9) are brought into contact with the resistance measuring unit 81a and the resistance measuring unit 81b, and the resistance values are measured, thereby mounting the plurality of scanning signal / power control signal wiring boards 40 (mounting). The presence or absence of mistakes can be inspected at a time.

  Further, in the organic EL display 80 of the second embodiment shown in FIG. 10, a pair of free terminals is arranged only outside the video signal wiring board 50 at both ends, and the tip of each free terminal of the support board 81 is a resistor. The measurement unit 82a and the resistance measurement unit 82b are used. Therefore, the test leads of the tester 70 (see FIG. 9) are brought into contact with the resistance measuring unit 82a and the resistance measuring unit 82b, and the resistance values are measured, thereby mounting the plurality of video signal wiring boards 50 (presence of mounting errors). Can be tested at once.

<3. Third Embodiment>
[Configuration and mounting example of wiring board]

FIG. 11 is a plan view showing a part of an organic EL display 90 as an embodiment (third embodiment) of a matrix display device of the present invention.
As shown in FIG. 11, a video signal wiring substrate 92 is disposed around the support substrate 91 of the organic EL display 90. Then, on the support substrate 91, signal lines 51 similar to those of the organic EL display 10 of the first embodiment shown in FIG. 9 are formed. On the other hand, the video signal wiring board 92 has a driver IC 52 similar to that of the organic EL display 10 of the first embodiment shown in FIG. 9, and a signal connection line 53 is connected thereto.

  Here, the signal line 51 and the signal connection line 53 are electrically connected by the electrical connection unit 12, but the organic EL display 90 of the third embodiment shown in FIG. 11 is connected to the video signal wiring board 92. A pair of free terminals 93a and 93b are provided. Moreover, the front-end | tip part of the free terminal 93a becomes the resistance measurement part 94a, and the front-end | tip part of the free terminal 93b becomes the resistance measurement part 94b. And the support substrate 91 has the short circuit wiring 95 for short-circuiting between the free terminal 93a and the free terminal 93b.

  In the organic EL display 90 of the third embodiment, in order to inspect the mounting state of the video signal wiring board 92, the test leads of the tester 70 (see FIG. 9) are connected to the resistance measuring unit 94a and the resistance measuring unit 94b. Contact. Then, the resistance value between the free terminal 93a and the free terminal 93b is measured. As a result, if the resistance value is about 0 ohm to several ohms, the short-circuit wiring 95 short-circuits between the free terminal 93a and the free terminal 93b, thereby conducting.

  Therefore, since the free terminal 93a and the free terminal 93b outside the signal connection line 53 are conductive, the signal connection line 53 inside the free terminal 93a and the free terminal 93b is also conductive (a mounting error). None). Conversely, when the measured resistance value is large and it is determined that the free terminal 93a and the free terminal 93b are not conducting, the signal connection line 53 inside thereof is not conducting (mounting error). Yes). Therefore, the presence / absence of electrical connection between the signal line 51 and the signal connection line 53 can be easily confirmed without checking the lighting of the organic EL element 20 (see FIG. 1).

As mentioned above, although embodiment of this invention was described, this invention is not limited to embodiment mentioned above, For example, the following various deformation | transformation are possible.
(1) In the embodiment, the active matrix type organic EL display 10 is provided in which the driving TFT 30a is provided for each of the plurality of organic EL elements 20. However, it can also be applied to a passive matrix type.
(2) In the embodiment, the top emission type organic EL display 10 in which light emitted from the organic EL element 20 is extracted from the side opposite to the support substrate 11 is used. However, the present invention can also be applied to a bottom emission method in which light emitted from the organic EL element 20 is extracted from the same side as the support substrate 11.
(3) In the embodiment, the organic EL element 20 (organic electroluminescence element) is used as the light emitting element. However, an inorganic electroluminescent element, a light emitting diode, etc. may be sufficient. Further, the display device is not limited to the organic EL display, and may be a matrix display device including a self-luminous element such as a plasma display.

It is a top view which shows the organic electroluminescent display as one Embodiment (1st Embodiment) of the matrix type display apparatus of this invention. It is a top view which shows the organic EL element of the organic EL display shown in FIG. It is a top view which shows the surface layer part of one organic EL element of the organic EL display shown in FIG. It is a top view which shows the internal structure of one organic EL element of the organic EL display shown in FIG. FIG. 2 is an equivalent circuit diagram of the organic EL display shown in FIG. 1. FIG. 2 is a plan view showing a scanning signal / power control signal wiring board of the organic EL display shown in FIG. 1. It is a top view which shows the video signal wiring board of the organic electroluminescent display shown in FIG. It is a perspective view which shows the mounting part of the video signal wiring board shown in FIG. It is a top view which shows the inspection method of an organic electroluminescent display as one Embodiment of the inspection method of the matrix type display apparatus of this invention. It is a top view which shows the organic electroluminescent display as one Embodiment (2nd Embodiment) of the matrix type display apparatus of this invention. It is a top view which shows a part of organic electroluminescent display as one Embodiment (3rd Embodiment) of the matrix type display apparatus of this invention.

Explanation of symbols

10 Organic EL display (matrix display)
DESCRIPTION OF SYMBOLS 11 Support substrate 12 Electrical connection part 20 Organic EL element (light emitting element)
40 Scanning signal / power control signal wiring board (wiring board)
41, 41a, 41b Scanning line (light emission wiring)
42, 42a, 42b Power supply control line (light emission wiring)
44 Scanning / power control connection line (connection wiring)
50, 50a, 50b Video signal wiring board (wiring board)
51, 51a, 51b, 51c, 51n Signal line (light emission wiring)
53a, 53b, 53c, 53d, 53n Signal connection line (connection wiring)
54a, 54b, 54c, 54d Free terminals 55a, 55b, 55c Resistance measurement units 56a, 56b Short-circuit wiring 80 Organic EL display (matrix type display device)
81 Support substrate 81a, 81b Resistance measurement unit 82a, 82b Resistance measurement unit 90 Organic EL display (matrix type display device)
91 Support board 92 Video signal wiring board (wiring board)
93a, 93b Free terminals 94a, 94b Resistance measurement unit 95 Short-circuit wiring

Claims (6)

A plurality of light emitting elements arranged in a matrix,
A support substrate on which a light-emitting wiring for causing each of the light-emitting elements to emit light is formed;
A wiring board disposed in a peripheral portion of the support substrate and having a connection wiring corresponding to the light emission wiring; and
An electrical connection portion for electrically connecting the light emission wiring and the connection wiring;
The support substrate has a pair of free terminals that do not correspond to the connection wiring outside the light emission wiring of the electrical connection portion,
When the wiring board is electrically connected to the light-emitting wiring and the connection wiring at the electrical connection portion, the wiring board is electrically connected to the free terminals to short-circuit the free terminals. Matrix type display device having wiring. The matrix type display device according to claim 1,
Each said free terminal has a resistance measurement part for measuring the resistance value between the said free terminals. The matrix type display apparatus. The matrix type display device according to claim 1,
The said wiring board is a flexible printed circuit board which formed the said connection wiring and the said short circuit wiring with the conductor foil on the flexible film-form insulator. The matrix type display apparatus. The matrix type display device according to claim 1,
A plurality of the wiring boards are arranged in the column direction or row direction of the light emitting elements arranged in a matrix,
Each said free terminal is respectively arrange | positioned on the outer side of the said wiring board of both ends, and between each said wiring board, The matrix type display apparatus. A plurality of light emitting elements arranged in a matrix,
A support substrate on which a light-emitting wiring for causing each of the light-emitting elements to emit light is formed;
A wiring board disposed in a peripheral portion of the support substrate and having a connection wiring corresponding to the light emission wiring; and
An electrical connection portion for electrically connecting the light emission wiring and the connection wiring;
The wiring board has a pair of free terminals that do not correspond to the light emitting wiring on the outside of the connecting wiring of the electrical connection portion,
The support substrate is short-circuited to be electrically connected to the free terminals and to short-circuit the free terminals when the light-emitting wiring and the connection wiring are electrically connected at the electrical connection portion. Matrix type display device having wiring. A plurality of light emitting elements arranged in a matrix,
A support substrate on which a light-emitting wiring for causing each of the light-emitting elements to emit light is formed;
A wiring board disposed in a peripheral portion of the support substrate and having a connection wiring corresponding to the light emission wiring; and
An electrical connection portion for electrically connecting the light emission wiring and the connection wiring;
The support substrate has a pair of free terminals that do not correspond to the connection wiring outside the light emission wiring of the electrical connection portion,
When the wiring board is electrically connected to the light-emitting wiring and the connection wiring at the electrical connection portion, the wiring board is electrically connected to the free terminals to short-circuit the free terminals. Have wiring,
An inspection method for a matrix type display device, wherein the light emitting wiring and the connection wiring are electrically connected and then a resistance value between the free terminals is measured.

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