JP2012525689A5 - - Google Patents
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- Publication number
- JP2012525689A5 JP2012525689A5 JP2012507627A JP2012507627A JP2012525689A5 JP 2012525689 A5 JP2012525689 A5 JP 2012525689A5 JP 2012507627 A JP2012507627 A JP 2012507627A JP 2012507627 A JP2012507627 A JP 2012507627A JP 2012525689 A5 JP2012525689 A5 JP 2012525689A5
- Authority
- JP
- Japan
- Prior art keywords
- reflective coating
- circuit board
- manufacturing
- layer
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000576 coating method Methods 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 26
- 239000010410 layer Substances 0.000 claims description 14
- 238000007641 inkjet printing Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 16
- 239000004020 conductor Substances 0.000 claims 4
- 238000000465 moulding Methods 0.000 claims 2
- MZZSDCJQCLYLLL-UHFFFAOYSA-N Secalonsaeure A Natural products COC(=O)C12OC3C(CC1=C(O)CC(C)C2O)C(=CC=C3c4ccc(O)c5C(=O)C6=C(O)CC(C)C(O)C6(Oc45)C(=O)OC)O MZZSDCJQCLYLLL-UHFFFAOYSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000005286 illumination Methods 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000003801 milling Methods 0.000 claims 1
- 229910000510 noble metal Inorganic materials 0.000 claims 1
- 239000011241 protective layer Substances 0.000 claims 1
- 238000007493 shaping process Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000003856 thermoforming Methods 0.000 claims 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009019412.6 | 2009-04-29 | ||
| DE102009019412A DE102009019412A1 (de) | 2009-04-29 | 2009-04-29 | Verfahren zur Herstellung einer Leiterplatte mit LEDs und gedruckter Reflektorfläche sowie Leiterplatte, hergestellt nach dem Verfahren |
| PCT/EP2010/002537 WO2010124825A1 (de) | 2009-04-29 | 2010-04-24 | Verfahren zur herstellung einer leiterplatte mit leds und gedruckter reflektorfläche sowie leiterplatte, hergestellt nach dem verfahren |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012525689A JP2012525689A (ja) | 2012-10-22 |
| JP2012525689A5 true JP2012525689A5 (enExample) | 2013-06-06 |
| JP5889781B2 JP5889781B2 (ja) | 2016-03-22 |
Family
ID=42396419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012507627A Active JP5889781B2 (ja) | 2009-04-29 | 2010-04-24 | Ｌｅｄ及び印刷されたリフレクタ面を有する回路基板の製造方法並びにその方法により製造される回路基板 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8887384B2 (enExample) |
| EP (1) | EP2425688A1 (enExample) |
| JP (1) | JP5889781B2 (enExample) |
| DE (1) | DE102009019412A1 (enExample) |
| WO (1) | WO2010124825A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8184230B2 (en) * | 2009-05-08 | 2012-05-22 | Honeywell International Inc. | High efficiency backlight assembly for flat panel display assembly and method for the manufacture thereof |
| AT12749U1 (de) * | 2011-04-01 | 2012-10-15 | Austria Tech & System Tech | Leiterplattenelement mit wenigstens einer led |
| WO2012155984A1 (de) * | 2011-05-19 | 2012-11-22 | Osram Opto Semiconductors Gmbh | Optoelektronische vorrichtung und verfahren zur herstellung von optoelektronischen vorrichtungen |
| TWI518278B (zh) * | 2012-10-11 | 2016-01-21 | 隆達電子股份有限公司 | 燈具 |
| KR102174819B1 (ko) * | 2014-06-25 | 2020-11-06 | 엘지디스플레이 주식회사 | 표시장치 |
| KR20170041809A (ko) | 2014-08-07 | 2017-04-17 | 사빅 글로벌 테크놀러지스 비.브이. | 열성형 어플리케이션용 도전성 다층 시트 |
| CN108025531A (zh) * | 2015-09-28 | 2018-05-11 | 沙特基础工业全球技术有限公司 | 用于热成型应用的集成透明导电膜 |
| DE102016103819A1 (de) * | 2016-03-03 | 2017-09-07 | Heraeus Deutschland GmbH & Co. KG | Anschlussträger, optoelektronisches Bauteil und Verfahren zur Herstellung eines Anschlussträgers oder eines optoelektronischen Bauteils |
| KR102435409B1 (ko) * | 2018-01-04 | 2022-08-24 | 엘지전자 주식회사 | 반도체 발광소자를 이용한 디스플레이 장치 |
| US20190312186A1 (en) * | 2018-04-09 | 2019-10-10 | Microsoft Technology Licensing, Llc | Side-Emitting LED with Increased Illumination |
| US20230243706A1 (en) * | 2022-01-31 | 2023-08-03 | Dwellwell Analytics, Inc. | Sensor Node Thermal Management and Illumination |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3801158B2 (ja) | 2002-11-19 | 2006-07-26 | セイコーエプソン株式会社 | 多層配線基板の製造方法、多層配線基板、電子デバイス及び電子機器 |
| WO2005088736A1 (ja) * | 2004-03-17 | 2005-09-22 | Japan Gore-Tex Inc. | 発光体用回路基板の製造方法、発光体用回路基板前駆体および発光体用回路基板、並びに発光体 |
| US7201497B2 (en) | 2004-07-15 | 2007-04-10 | Lumination, Llc | Led lighting system with reflective board |
| JP4659421B2 (ja) * | 2004-09-30 | 2011-03-30 | 株式会社トクヤマ | 発光素子収納用パッケージの製造方法 |
| KR101154801B1 (ko) * | 2004-12-03 | 2012-07-03 | 엔지케이 스파크 플러그 캄파니 리미티드 | 세라믹 기판 및 발광 소자 수납용 세라믹 패키지 |
| JP4379386B2 (ja) * | 2005-06-23 | 2009-12-09 | セイコーエプソン株式会社 | 多層構造形成方法 |
| JP2009507692A (ja) | 2005-09-12 | 2009-02-26 | エレクトロニクス、フォー、イメージング、インコーポレーテッド | グラフィック用途用金属インクジェット印刷システム |
| DE102005059524A1 (de) | 2005-09-30 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Gehäuse für ein elektromagnetische Strahlung emittierendes optoelektronisches Bauelement, Bauelement und Verfahren zum Herstellen eines Gehäuses oder eines Bauelements |
| JP4996096B2 (ja) * | 2006-01-06 | 2012-08-08 | 新光電気工業株式会社 | 発光装置及びその製造方法 |
| EP1996860A2 (en) | 2006-01-31 | 2008-12-03 | 3M Innovative Properties Company | Led illumination assembly with compliant foil construction |
| JP4828248B2 (ja) * | 2006-02-16 | 2011-11-30 | 新光電気工業株式会社 | 発光装置及びその製造方法 |
| JP5022795B2 (ja) * | 2007-07-09 | 2012-09-12 | 株式会社東芝 | 半導体受光素子およびその製造方法 |
| JP2009065219A (ja) * | 2008-12-22 | 2009-03-26 | Panasonic Electric Works Co Ltd | 発光装置及びその製造方法 |
-
2009
- 2009-04-29 DE DE102009019412A patent/DE102009019412A1/de not_active Withdrawn
-
2010
- 2010-04-24 US US13/266,144 patent/US8887384B2/en not_active Expired - Fee Related
- 2010-04-24 JP JP2012507627A patent/JP5889781B2/ja active Active
- 2010-04-24 WO PCT/EP2010/002537 patent/WO2010124825A1/de not_active Ceased
- 2010-04-24 EP EP10719587A patent/EP2425688A1/de not_active Withdrawn
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