JP2012519938A5 - - Google Patents

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Publication number
JP2012519938A5
JP2012519938A5 JP2011552990A JP2011552990A JP2012519938A5 JP 2012519938 A5 JP2012519938 A5 JP 2012519938A5 JP 2011552990 A JP2011552990 A JP 2011552990A JP 2011552990 A JP2011552990 A JP 2011552990A JP 2012519938 A5 JP2012519938 A5 JP 2012519938A5
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JP
Japan
Prior art keywords
substrate
strip
cover
seal
sealing member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2011552990A
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English (en)
Japanese (ja)
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JP2012519938A (ja
JP5165800B2 (ja
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Publication date
Priority claimed from US12/397,418 external-priority patent/US7948178B2/en
Application filed filed Critical
Publication of JP2012519938A publication Critical patent/JP2012519938A/ja
Publication of JP2012519938A5 publication Critical patent/JP2012519938A5/ja
Application granted granted Critical
Publication of JP5165800B2 publication Critical patent/JP5165800B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011552990A 2009-03-04 2010-02-25 活性有機材料を含む電子デバイスのための気密シール Active JP5165800B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/397,418 2009-03-04
US12/397,418 US7948178B2 (en) 2009-03-04 2009-03-04 Hermetic seal
PCT/US2010/025364 WO2010101763A1 (en) 2009-03-04 2010-02-25 Hermetic seal for an electronic device comprising an active organic material

Publications (3)

Publication Number Publication Date
JP2012519938A JP2012519938A (ja) 2012-08-30
JP2012519938A5 true JP2012519938A5 (https=) 2012-12-20
JP5165800B2 JP5165800B2 (ja) 2013-03-21

Family

ID=42060448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011552990A Active JP5165800B2 (ja) 2009-03-04 2010-02-25 活性有機材料を含む電子デバイスのための気密シール

Country Status (7)

Country Link
US (1) US7948178B2 (https=)
EP (1) EP2404319B1 (https=)
JP (1) JP5165800B2 (https=)
KR (1) KR101278251B1 (https=)
CN (1) CN102414812B (https=)
TW (1) TWI397644B (https=)
WO (1) WO2010101763A1 (https=)

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KR20110064670A (ko) * 2009-12-08 2011-06-15 삼성모바일디스플레이주식회사 게터 조성물 및 상기 게터 조성물을 포함하는 유기 발광 장치
KR101663840B1 (ko) * 2010-03-01 2016-10-07 가부시키가이샤 제이올레드 유기 ｅｌ 장치 및 그 제조 방법
KR101127595B1 (ko) * 2010-05-04 2012-03-23 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조방법
KR20130065219A (ko) * 2011-12-09 2013-06-19 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
US9386714B2 (en) * 2012-12-05 2016-07-05 Nokia Technologies Oy Apparatus for housing an electronic component, a method
CN103383992B (zh) * 2013-08-13 2015-12-02 深圳市华星光电技术有限公司 Oled器件的封装方法及用该方法封装的oled器件
DE102013110174B4 (de) * 2013-09-16 2025-04-10 Pictiva Displays International Limited Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
CN103531718B (zh) * 2013-10-25 2015-12-09 上海大学 Oled封装结构
KR101931010B1 (ko) * 2014-08-11 2018-12-19 레이던 컴퍼니 응력 감소층을 갖는 기밀 밀봉된 패키지
US9334154B2 (en) 2014-08-11 2016-05-10 Raytheon Company Hermetically sealed package having stress reducing layer
JP2018084764A (ja) * 2016-11-25 2018-05-31 株式会社ブイ・テクノロジー フレキシブル表示装置及びフレキシブル表示装置の封止方法
US11544545B2 (en) 2017-04-04 2023-01-03 Hailo Technologies Ltd. Structured activation based sparsity in an artificial neural network
US10387298B2 (en) 2017-04-04 2019-08-20 Hailo Technologies Ltd Artificial neural network incorporating emphasis and focus techniques
US12430543B2 (en) 2017-04-04 2025-09-30 Hailo Technologies Ltd. Structured sparsity guided training in an artificial neural network
US11238334B2 (en) 2017-04-04 2022-02-01 Hailo Technologies Ltd. System and method of input alignment for efficient vector operations in an artificial neural network
US11615297B2 (en) 2017-04-04 2023-03-28 Hailo Technologies Ltd. Structured weight based sparsity in an artificial neural network compiler
US11551028B2 (en) 2017-04-04 2023-01-10 Hailo Technologies Ltd. Structured weight based sparsity in an artificial neural network
CN110429206B (zh) * 2019-08-07 2021-11-23 京东方科技集团股份有限公司 封装盖板、显示装置、显示面板及显示面板的封装方法
KR20220000440A (ko) * 2020-06-25 2022-01-04 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
US11591879B2 (en) * 2021-01-29 2023-02-28 Halliburton Energy Services, Inc. Thermoplastic with swellable metal for enhanced seal
CN115642131B (zh) * 2022-10-14 2025-10-31 南通大学 一种二维材料异质结器件

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US4769292A (en) * 1987-03-02 1988-09-06 Eastman Kodak Company Electroluminescent device with modified thin film luminescent zone
JPH09148066A (ja) * 1995-11-24 1997-06-06 Pioneer Electron Corp 有機ｅｌ素子
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TW515062B (en) * 2001-12-28 2002-12-21 Delta Optoelectronics Inc Package structure with multiple glue layers
US7202602B2 (en) * 2003-04-08 2007-04-10 Organic Lighting Technologies Llc Metal seal packaging for organic light emitting diode device
JP2005251407A (ja) * 2004-03-01 2005-09-15 Sanyo Electric Co Ltd 表示パネルの製造方法および表示パネル
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US8405193B2 (en) * 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
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JP5018820B2 (ja) * 2009-04-03 2012-09-05 株式会社デンソー Ｅｌ表示装置およびその製造方法

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