JP2012514857A5 - - Google Patents
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- Publication number
- JP2012514857A5 JP2012514857A5 JP2011544649A JP2011544649A JP2012514857A5 JP 2012514857 A5 JP2012514857 A5 JP 2012514857A5 JP 2011544649 A JP2011544649 A JP 2011544649A JP 2011544649 A JP2011544649 A JP 2011544649A JP 2012514857 A5 JP2012514857 A5 JP 2012514857A5
- Authority
- JP
- Japan
- Prior art keywords
- water
- component
- soluble
- composition
- insoluble
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14254409P | 2009-01-05 | 2009-01-05 | |
| US61/142,544 | 2009-01-05 | ||
| PCT/US2010/020081 WO2010078566A1 (en) | 2009-01-05 | 2010-01-05 | Multi-layered chemical-mechanical planarization pad |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012514857A JP2012514857A (ja) | 2012-06-28 |
| JP2012514857A5 true JP2012514857A5 (cg-RX-API-DMAC10.html) | 2013-02-21 |
| JP5587337B2 JP5587337B2 (ja) | 2014-09-10 |
Family
ID=42310236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011544649A Active JP5587337B2 (ja) | 2009-01-05 | 2010-01-05 | 複数層化学機械平坦化パッド |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8790165B2 (cg-RX-API-DMAC10.html) |
| EP (1) | EP2389275A1 (cg-RX-API-DMAC10.html) |
| JP (1) | JP5587337B2 (cg-RX-API-DMAC10.html) |
| KR (1) | KR101674564B1 (cg-RX-API-DMAC10.html) |
| CN (1) | CN102271867B (cg-RX-API-DMAC10.html) |
| SG (1) | SG172850A1 (cg-RX-API-DMAC10.html) |
| TW (1) | TWI520812B (cg-RX-API-DMAC10.html) |
| WO (1) | WO2010078566A1 (cg-RX-API-DMAC10.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012138705A2 (en) * | 2011-04-05 | 2012-10-11 | Universal Photonics, Inc. | A self-conditioning polishing pad and a method of making the same |
| JP6078631B2 (ja) * | 2012-03-20 | 2017-02-08 | ジェイエイチ ローデス カンパニー， インコーポレイテッド | セルフコンディショニング研磨パッドおよびその作製方法 |
| WO2014039575A1 (en) * | 2012-09-06 | 2014-03-13 | Hydration Systems, Llc | Phase inversion membrane and method for manufacturing same using soluble fibers |
| JP6408410B2 (ja) * | 2015-03-30 | 2018-10-17 | 日本碍子株式会社 | 成形体の製造方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4257687B2 (ja) | 1999-01-11 | 2009-04-22 | 株式会社トクヤマ | 研磨剤および研磨方法 |
| US6533645B2 (en) | 2000-01-18 | 2003-03-18 | Applied Materials, Inc. | Substrate polishing article |
| US6656019B1 (en) * | 2000-06-29 | 2003-12-02 | International Business Machines Corporation | Grooved polishing pads and methods of use |
| US6964604B2 (en) | 2000-06-23 | 2005-11-15 | International Business Machines Corporation | Fiber embedded polishing pad |
| US6709981B2 (en) * | 2000-08-16 | 2004-03-23 | Memc Electronic Materials, Inc. | Method and apparatus for processing a semiconductor wafer using novel final polishing method |
| JP2002154040A (ja) | 2000-11-20 | 2002-05-28 | Ikegami Kanagata Kogyo Kk | 回転工具 |
| US7267607B2 (en) | 2002-10-28 | 2007-09-11 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
| JP4039214B2 (ja) | 2002-11-05 | 2008-01-30 | Ｊｓｒ株式会社 | 研磨パッド |
| JP2004343090A (ja) | 2003-04-22 | 2004-12-02 | Jsr Corp | 研磨パッドおよび半導体ウェハの研磨方法 |
| US7086932B2 (en) * | 2004-05-11 | 2006-08-08 | Freudenberg Nonwovens | Polishing pad |
| TWI292730B (en) | 2003-07-01 | 2008-01-21 | Applied Materials Inc | Method and apparatus for electrochemical mechanical processing |
| US7384871B2 (en) * | 2004-07-01 | 2008-06-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
| US8075372B2 (en) | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
| JP5289787B2 (ja) * | 2007-02-01 | 2013-09-11 | 株式会社クラレ | 研磨パッド及び研磨パッドの製造方法 |
| TWI432285B (zh) * | 2007-02-01 | 2014-04-01 | 可樂麗股份有限公司 | 研磨墊及研磨墊之製法 |
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2010
- 2010-01-05 SG SG2011048949A patent/SG172850A1/en unknown
- 2010-01-05 US US12/652,143 patent/US8790165B2/en active Active
- 2010-01-05 EP EP10726832A patent/EP2389275A1/en not_active Withdrawn
- 2010-01-05 WO PCT/US2010/020081 patent/WO2010078566A1/en not_active Ceased
- 2010-01-05 CN CN201080004238.1A patent/CN102271867B/zh active Active
- 2010-01-05 JP JP2011544649A patent/JP5587337B2/ja active Active
- 2010-01-05 KR KR1020117018035A patent/KR101674564B1/ko active Active
- 2010-01-05 TW TW099100071A patent/TWI520812B/zh active
-
2014
- 2014-06-30 US US14/318,894 patent/US9796063B2/en active Active