JP2012510151A - エピタキシャル反応器の反応室 - Google Patents
エピタキシャル反応器の反応室 Download PDFInfo
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- JP2012510151A JP2012510151A JP2011536963A JP2011536963A JP2012510151A JP 2012510151 A JP2012510151 A JP 2012510151A JP 2011536963 A JP2011536963 A JP 2011536963A JP 2011536963 A JP2011536963 A JP 2011536963A JP 2012510151 A JP2012510151 A JP 2012510151A
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- Prior art keywords
- reaction chamber
- quartz
- reflective layer
- quartz piece
- susceptor
- Prior art date
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 87
- 239000010453 quartz Substances 0.000 claims abstract description 109
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 109
- 239000000463 material Substances 0.000 claims abstract description 16
- 230000008021 deposition Effects 0.000 claims abstract description 14
- 230000005855 radiation Effects 0.000 claims abstract description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 15
- 239000010931 gold Substances 0.000 claims description 15
- 229910052737 gold Inorganic materials 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 16
- 239000000758 substrate Substances 0.000 description 12
- 239000002002 slurry Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 4
- 230000006698 induction Effects 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
- C23C16/481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation by radiant heating of the substrate
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
エピタキシャル反応器の中のプロセスは、高温で、すなわち、セ氏数百度から数千度の間で、実行される。(例えば、多結晶シリコンの沈着は、概して、450℃から800℃の間の温度で行われる。シリコン基板への単結晶シリコンの沈着は、概して、850℃から1250℃の間の温度で行われる。シリコンカーバイド基板への単結晶シリコンカーバイドの沈着が、1500℃から1700℃の間の温度で行われると「エピタキシャル成長」と呼ばれ、1900℃から2400℃の間の温度で行われると「バルク成長」と呼ばれる。)そして、そのプロセスには、熱する為に多くのエネルギー(数十KW)が必要となる。したがって、発生した熱エネルギーの周りへの消散を防ぐことが重要である。
――高い濃度(例えば、80%を超え、95%未満)の石英粒子の分散アモルファス(dispersed amorphous)の半流動体のスラリー(slurry)(分散液は、例えば、水でもアルコールでも良い。)を、透明な石英の反応室に塗布する。
――塗布したスラリーを乾燥させる。そして、
――乾燥したスラリーを焼結(hot sinter)する。
――高い濃度の(例えば、80%を超え、95%未満の)石英粒子の分散アモルファスの反流動体のスラリー(分散液は、例えば、水でもアルコールでも良い。)を、透明な石英の反応室に塗布する。
――塗布されたスラリーを乾燥させる。そして、
――乾燥したスラリーを焼結する。そして、
――焼結されたスラリーの表面が、所定の深さまで、例えば、炎やレーザービームによって、ガラス化される。
2 軸が通る穴
3 反応沈着ゾーン
4 サセプター
5 反射層
6 反射層
7 フランジ
8 軸
11 第一の石英ピースの部分
12 穴
13 反応沈着ゾーン
14 サセプター
15 反射層
17 フランジ
19 第二の石英ピースの部分
Claims (10)
- 原則的に、中空の石英ピースからなるエピタキシャル反応器(epitaxial reactor)の反応室(reaction chamber)において、前記中空の石英ピースは、円柱型、角柱型、錐体型、あるいはピラミッド型の石英ピースの部分(1;11)と、前記石英ピースの部分(1;11)の中の軸が通る穴(2;12)とを備え、前記石英ピースの部分(1;11)は、三方向のうち二方向に準じて、反応沈着ゾーン(3;13)を定め、前記軸が通る穴(2;12)の中に、熱せられる少なくとも一つのサセプター(4;14)を収容し、前記反応室は、前記サセプター(4;14)によって放射される、1000nmと10000nmの間、好ましくは、1500nmと3000nmの間の波長を持つ赤外線放射を反射し返すように適合された反射層(5;15)を備えることを特徴とし、前記反射層(5;15)は、石英に基づく物質から作られており、前記石英ピースの部分(1;11)、及び/または、前記反応室の石英の構成要素に塗布されることを特徴とする、エピタキシャル反応器の反応室。
- 前記反射層(5;15)が、前記石英ピースの部分(1;11)の内側、及び/または、外側に位置する、請求項1に記載の反応室。
- 前記反射層(5;15)が、前記石英ピースの部分(1;11)を部分的に、または、完全に被覆する、請求項1又は2に記載の反応室。
- 前記反射層が、ガラス化した(vitrified)石英の層に、部分的に、または、完全に被覆されている請求項1乃至3のいずれか一項に記載の反応室。
- 前記石英ピースの部分(1)に、前記サセプター(4)によって放射される赤外線放射を反射し返すように適合された、他の反射層(6)を備え、前記他の反射層(6)は、金に基づく物質から出来ていることを特徴とする請求項1乃至4のいずれか一項に記載の反応室。
- 前記反射層(5、6)が、前記石英ピースの部分(1)の別個の領域を被覆していることを特徴とする、請求項5に記載の反応室。
- 前記石英ピースの部分(1;11)が、透明な石英(transparent quarts)から作られていることを特徴とする、請求項1乃至6のいずれか一項に記載の反応室。
- 前記中空の石英ピースの端部にフランジ(flange)(7;17)を備え、前記フランジ(7;17)は、不透明な石英(opaque quarts)から作られていることを特徴とする、請求項1乃至7のいずれか一項に記載の反応室。
- 少なくとも一つのガスフロー(gas flow)、あるいは液流(liquid flow)によって冷却されるよう適合されていることを特徴とする、請求項1乃至8のいずれか一項に記載の反応室。
- 請求項1乃至9のいずれか一項に記載の反応室を備えることを特徴とする、エピタキシャル反応器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI2008A002092A IT1392068B1 (it) | 2008-11-24 | 2008-11-24 | Camera di reazione di un reattore epitassiale |
ITMI2008A002092 | 2008-11-24 | ||
PCT/IB2009/007505 WO2010058269A1 (en) | 2008-11-24 | 2009-11-20 | Reaction chamber of an epitaxial reactor |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012510151A true JP2012510151A (ja) | 2012-04-26 |
JP2012510151A5 JP2012510151A5 (ja) | 2012-12-13 |
JP5600324B2 JP5600324B2 (ja) | 2014-10-01 |
Family
ID=41112787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011536963A Active JP5600324B2 (ja) | 2008-11-24 | 2009-11-20 | エピタキシャル反応器の反応室 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110229378A1 (ja) |
EP (1) | EP2367964B1 (ja) |
JP (1) | JP5600324B2 (ja) |
CN (1) | CN102224277B (ja) |
IT (1) | IT1392068B1 (ja) |
WO (1) | WO2010058269A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108411362B (zh) * | 2017-02-09 | 2020-03-31 | 北京北方华创微电子装备有限公司 | 腔室及外延生长设备 |
IT201900000223A1 (it) * | 2019-01-09 | 2020-07-09 | Lpe Spa | Camera di reazione con elemento rotante e reattore per deposizione di materiale semiconduttore |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6136924A (ja) * | 1984-07-19 | 1986-02-21 | エルピーイー・ソチエタ・ペル・アチオニ | エピタキシー反応器 |
JP2002173393A (ja) * | 2000-09-01 | 2002-06-21 | Ngk Insulators Ltd | Iii−v族窒化物膜の製造装置及び製造方法 |
WO2006038228A1 (en) * | 2004-10-01 | 2006-04-13 | Lpe Spa | Epitaxial reactor cooling method and reactor cooled thereby |
WO2007006525A1 (en) * | 2005-07-11 | 2007-01-18 | Politecnico Di Milano | Method and reactor for growing crystals |
Family Cites Families (19)
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JPS6097622A (ja) * | 1983-11-01 | 1985-05-31 | Toshiba Mach Co Ltd | エピタキシヤル装置 |
EP0147967B1 (en) * | 1983-12-09 | 1992-08-26 | Applied Materials, Inc. | Induction heated reactor system for chemical vapor deposition |
US4579080A (en) * | 1983-12-09 | 1986-04-01 | Applied Materials, Inc. | Induction heated reactor system for chemical vapor deposition |
US5259883A (en) * | 1988-02-16 | 1993-11-09 | Kabushiki Kaisha Toshiba | Method of thermally processing semiconductor wafers and an apparatus therefor |
WO1991017839A1 (en) * | 1990-05-18 | 1991-11-28 | Bp Chemicals (Hitco) Inc. | Materials for chemical vapor deposition processes |
DE4338807C1 (de) | 1993-11-12 | 1995-01-26 | Heraeus Quarzglas | Formkörper mit hohem Gehalt an Siliziumdioxid und Verfahren zur Herstellung solcher Formkörper |
CN1188823A (zh) * | 1996-11-04 | 1998-07-29 | 通用电气公司 | 半导体圆片的热处理器 |
CN1067446C (zh) * | 1998-12-25 | 2001-06-20 | 清华大学 | 超高真空化学气相淀积外延系统 |
US6342691B1 (en) * | 1999-11-12 | 2002-01-29 | Mattson Technology, Inc. | Apparatus and method for thermal processing of semiconductor substrates |
US6666924B1 (en) * | 2000-03-28 | 2003-12-23 | Asm America | Reaction chamber with decreased wall deposition |
KR100799253B1 (ko) * | 2001-03-08 | 2008-01-29 | 신에쯔 한도타이 가부시키가이샤 | 열선반사 재료 및 그것을 사용한 가열장치 |
KR20020080954A (ko) * | 2001-04-18 | 2002-10-26 | 주성엔지니어링(주) | 냉벽 화학기상증착 방법 및 장치 |
US7563512B2 (en) * | 2004-08-23 | 2009-07-21 | Heraeus Quarzglas Gmbh & Co. Kg | Component with a reflector layer and method for producing the same |
ITMI20041677A1 (it) * | 2004-08-30 | 2004-11-30 | E T C Epitaxial Technology Ct | Processo di pulitura e processo operativo per un reattore cvd. |
WO2007018016A1 (ja) * | 2005-08-05 | 2007-02-15 | Hitachi Kokusai Electric Inc. | 基板処理装置、冷却ガス供給ノズルおよび半導体装置の製造方法 |
JP4994724B2 (ja) * | 2006-07-07 | 2012-08-08 | 株式会社東芝 | 成膜装置及び成膜方法 |
DE102006046619A1 (de) * | 2006-09-29 | 2008-04-03 | Heraeus Quarzglas Gmbh & Co. Kg | Streichfähiger SiO2-Schlicker für die Herstellung von Quarzglas, Verfahren zur Herstellung von Quarzglas unter Einsatz des Schlickers |
DE102006052512A1 (de) * | 2006-11-06 | 2008-05-08 | Heraeus Quarzglas Gmbh & Co. Kg | Verfahren zur Herstellung von opakem Quarzglas, nach dem Verfahren erhaltenes Halbzeug sowie daraus hergestelltes Bauteil |
JP5043776B2 (ja) * | 2008-08-08 | 2012-10-10 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法 |
-
2008
- 2008-11-24 IT ITMI2008A002092A patent/IT1392068B1/it active
-
2009
- 2009-11-20 WO PCT/IB2009/007505 patent/WO2010058269A1/en active Application Filing
- 2009-11-20 JP JP2011536963A patent/JP5600324B2/ja active Active
- 2009-11-20 EP EP09798951.1A patent/EP2367964B1/en not_active Revoked
- 2009-11-20 CN CN200980146751.1A patent/CN102224277B/zh active Active
- 2009-11-20 US US13/131,011 patent/US20110229378A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6136924A (ja) * | 1984-07-19 | 1986-02-21 | エルピーイー・ソチエタ・ペル・アチオニ | エピタキシー反応器 |
JP2002173393A (ja) * | 2000-09-01 | 2002-06-21 | Ngk Insulators Ltd | Iii−v族窒化物膜の製造装置及び製造方法 |
WO2006038228A1 (en) * | 2004-10-01 | 2006-04-13 | Lpe Spa | Epitaxial reactor cooling method and reactor cooled thereby |
WO2007006525A1 (en) * | 2005-07-11 | 2007-01-18 | Politecnico Di Milano | Method and reactor for growing crystals |
Also Published As
Publication number | Publication date |
---|---|
EP2367964A1 (en) | 2011-09-28 |
WO2010058269A1 (en) | 2010-05-27 |
CN102224277A (zh) | 2011-10-19 |
ITMI20082092A1 (it) | 2010-05-25 |
EP2367964B1 (en) | 2014-04-30 |
US20110229378A1 (en) | 2011-09-22 |
CN102224277B (zh) | 2014-03-12 |
IT1392068B1 (it) | 2012-02-09 |
JP5600324B2 (ja) | 2014-10-01 |
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