JP2012502484A5 - - Google Patents

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JP2012502484A5
JP2012502484A5 JP2011526204A JP2011526204A JP2012502484A5 JP 2012502484 A5 JP2012502484 A5 JP 2012502484A5 JP 2011526204 A JP2011526204 A JP 2011526204A JP 2011526204 A JP2011526204 A JP 2011526204A JP 2012502484 A5 JP2012502484 A5 JP 2012502484A5
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sequence
spectrum
determining
spectra
current
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JP2011526204A
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JP2012502484A (ja
JP5675617B2 (ja
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Priority claimed from PCT/US2009/055935 external-priority patent/WO2010028180A2/en
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JP2011526204A 2008-09-04 2009-09-03 加工時における基板の分光モニタリングを使用した研磨速度の調整 Active JP5675617B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9437908P 2008-09-04 2008-09-04
US61/094,379 2008-09-04
PCT/US2009/055935 WO2010028180A2 (en) 2008-09-04 2009-09-03 Adjusting polishing rates by using spectrographic monitoring of a substrate during processing

Publications (3)

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JP2012502484A JP2012502484A (ja) 2012-01-26
JP2012502484A5 true JP2012502484A5 (enExample) 2014-05-01
JP5675617B2 JP5675617B2 (ja) 2015-02-25

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JP2011526204A Active JP5675617B2 (ja) 2008-09-04 2009-09-03 加工時における基板の分光モニタリングを使用した研磨速度の調整

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US (2) US8369978B2 (enExample)
JP (1) JP5675617B2 (enExample)
KR (3) KR101834944B1 (enExample)
WO (1) WO2010028180A2 (enExample)

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US11507824B2 (en) 2018-06-28 2022-11-22 Applied Materials, Inc. Training spectrum generation for machine learning system for spectrographic monitoring
KR102708233B1 (ko) * 2019-02-15 2024-09-23 주식회사 케이씨텍 기판 연마 시스템
DE102020100565A1 (de) 2020-01-13 2021-07-15 Aixtron Se Verfahren zum Abscheiden von Schichten
KR102757747B1 (ko) 2021-03-05 2025-01-21 어플라이드 머티어리얼스, 인코포레이티드 기판 연마 동안 비용 함수 또는 예상되는 장래 파라미터 변경들을 사용한 처리 파라미터들의 제어
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