KR101944325B1 - 다중 스펙트럼들을 이용한 화학 기계적 연마에서의 종료점 검출 - Google Patents

다중 스펙트럼들을 이용한 화학 기계적 연마에서의 종료점 검출 Download PDF

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KR101944325B1
KR101944325B1 KR1020187005672A KR20187005672A KR101944325B1 KR 101944325 B1 KR101944325 B1 KR 101944325B1 KR 1020187005672 A KR1020187005672 A KR 1020187005672A KR 20187005672 A KR20187005672 A KR 20187005672A KR 101944325 B1 KR101944325 B1 KR 101944325B1
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spectra
spectrum
polishing
substrate
current
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KR20180030209A (ko
Inventor
준 킨
시바쿠말 단다파니
해리 큐. 리
토마스 에이치. 오스터헬드
자이즈 츄
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • H01L21/304—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020187005672A 2008-09-04 2009-09-03 다중 스펙트럼들을 이용한 화학 기계적 연마에서의 종료점 검출 Active KR101944325B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9437908P 2008-09-04 2008-09-04
US61/094,379 2008-09-04
PCT/US2009/055935 WO2010028180A2 (en) 2008-09-04 2009-09-03 Adjusting polishing rates by using spectrographic monitoring of a substrate during processing

Related Parent Applications (1)

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KR1020167028827A Division KR101834944B1 (ko) 2008-09-04 2009-09-03 프로세싱 동안 기판의 분광 모니터링의 이용에 의한 연마 속도들의 조정

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KR20180030209A KR20180030209A (ko) 2018-03-21
KR101944325B1 true KR101944325B1 (ko) 2019-01-31

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KR1020117007774A Active KR101668675B1 (ko) 2008-09-04 2009-09-03 프로세싱 동안 기판의 분광 모니터링의 이용에 의한 연마 속도들의 조정
KR1020167028827A Active KR101834944B1 (ko) 2008-09-04 2009-09-03 프로세싱 동안 기판의 분광 모니터링의 이용에 의한 연마 속도들의 조정

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KR1020167028827A Active KR101834944B1 (ko) 2008-09-04 2009-09-03 프로세싱 동안 기판의 분광 모니터링의 이용에 의한 연마 속도들의 조정

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US (2) US8369978B2 (enExample)
JP (1) JP5675617B2 (enExample)
KR (3) KR101944325B1 (enExample)
WO (1) WO2010028180A2 (enExample)

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US9375824B2 (en) 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
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US9573243B2 (en) * 2014-11-04 2017-02-21 Headway Technologies, Inc. Method for adaptive feedback controlled polishing
CN109844923B (zh) * 2016-10-10 2023-07-11 应用材料公司 用于化学机械抛光的实时轮廓控制
TWI807987B (zh) * 2016-11-30 2023-07-01 美商應用材料股份有限公司 使用神經網路的光譜監測
CN111587478B (zh) 2018-06-28 2025-02-21 应用材料公司 用于光谱监测的机器学习系统的训练光谱产生
KR102708233B1 (ko) * 2019-02-15 2024-09-23 주식회사 케이씨텍 기판 연마 시스템
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US20250041986A1 (en) * 2021-09-30 2025-02-06 Sanoh Industrial Co., Ltd. Polishing device, polishing method, and computer-readable storage medium
CN119704034A (zh) * 2024-12-10 2025-03-28 西安奕斯伟材料科技股份有限公司 一种抛光方法及抛光设备、装置及介质

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Also Published As

Publication number Publication date
US20100056023A1 (en) 2010-03-04
KR20180030209A (ko) 2018-03-21
KR20110065501A (ko) 2011-06-15
KR101668675B1 (ko) 2016-10-24
US8369978B2 (en) 2013-02-05
KR20160124915A (ko) 2016-10-28
WO2010028180A2 (en) 2010-03-11
US9346146B2 (en) 2016-05-24
JP5675617B2 (ja) 2015-02-25
KR101834944B1 (ko) 2018-03-06
JP2012502484A (ja) 2012-01-26
WO2010028180A3 (en) 2010-05-20
US20130204424A1 (en) 2013-08-08

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