JP2012256761A - Electronic apparatus and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus which improves heat radiation performance and reduces the cost, and to provide a manufacturing method of the electronic apparatus.SOLUTION: An electronic apparatus 10 includes: a substrate 11 in which wiring 21 is formed on an insulation base material 20 made of a synthetic resin and having lands 21a formed on one surface 20a of the insulation base material 20 as the wiring 21; an electronic component 12 electrically connecting with the lands 21a; and a housing 13 housing the substrate 11 and the electronic component 12. The electronic apparatus 10 has at least a case 30 formed as the housing 13 by using a metal material, and the insulation base material 20 forming the substrate 11 is molded having the case 30 as an insert molded component.

Description

  The present invention relates to an electronic device including a substrate in which a wiring is formed on an insulating base material made of a synthetic resin, an electronic component connected to a land of the substrate, and a housing that accommodates the substrate and the electronic component, and its manufacture. It is about the method.

  Conventionally, as disclosed in Patent Documents 1 and 2, for example, a substrate in which wiring is formed on an insulating base material made of synthetic resin, an electronic component connected to a land of the substrate, and a housing for housing the substrate and the electronic component 2. Description of the Related Art As an electronic device including a body, a device that considers heat dissipation is known.

  In Patent Literature 1, an electronic component mounted on a substrate (printed circuit board) and a protruding portion of a housing facing the electronic component, or a back surface portion of an electronic component mounting portion on the substrate and the back surface portion are opposed to each other. A heat conductive material having flexibility is disposed between the protruding portion of the housing to be operated.

  On the other hand, in Patent Document 2, a heat dissipating member having an adhesive action is disposed between a back surface portion of an electronic component mounting portion on a substrate (printed circuit board) and a housing facing the back surface portion. Bonded and fixed to the housing.

JP 2003-289191 A JP 2004-31495 A

  By the way, in the case of a structure in which the electronic component and the housing and the substrate and the housing are in contact to dissipate heat, there is a possibility that heat dissipation cannot be ensured due to non-contact state or uneven contact due to warping of the substrate. On the other hand, in Patent Documents 1 and 2, since a heat conductive material having flexibility is used, even if the substrate is warped, the heat conductive material reduces the influence of the warp even though the substrate is assembled to the housing. (Absorption) and high heat dissipation can be ensured. However, on the other hand, the number of parts increases and the number of assembly steps also increases. That is, it is difficult to reduce the cost of the electronic device.

  In addition, since a process of assembling the substrate to the housing is required, it is difficult to reduce the cost of the electronic device.

  In view of the above problems, an object of the present invention is to provide an electronic device capable of reducing heat while improving heat dissipation and a manufacturing method thereof.

In order to achieve the above object, an electronic device according to claim 1 is provided.
A wiring having a land formed on one surface of the insulating base material, wherein wiring is formed on an insulating base material made of a synthetic resin; and
Electronic components electrically connected to the land,
A housing for housing the substrate and the electronic component.

And as a housing | casing, it has at least the metal housing | casing formed using the metal material,
The insulating base material is formed in contact with the metal casing and is integrally formed with the metal casing.

  In the present invention, the insulating base is formed integrally with the metal casing. Accordingly, the step of forming the insulating base material using the synthetic resin also serves as the step of assembling the insulating base material, and thus the substrate, to the housing, so that it is not necessary to separately assemble the substrate to the housing. Thereby, the manufacturing cost of an electronic device can be reduced.

  In addition, since the insulating base material constituting the substrate is restrained by the integrally formed metal casing, the substrate and the casing are less likely to warp compared to the conventional configuration where the substrate and the casing are separate. . For this reason, even if it does not use a heat conductive material, the dispersion | variation in the contact state of an electronic component and a metal housing or a board | substrate and a metal housing can be suppressed.

  Thus, according to the present invention, it is possible to reduce the manufacturing cost while improving the heat dissipation.

As claimed in claim 2,
The insulating base is made of a thermoplastic resin,
For the wiring, it is preferable to adopt a configuration in which a metal foil is punched out and thermocompression-bonded to an insulating substrate by pressing.

  According to this, wiring can be formed in a dry process without using a liquid as much as etching, plating, and screen printing using a conductive paste.

As claimed in claim 3,
The metal housing has a protruding portion that protrudes from the contact surface of the insulating base,
The insulating base is shaped to cover at least a portion of the protrusion,
The electronic component is preferably arranged on the protruding portion and electrically connected to the land.

  According to this, the distance from the electronic component to the metal housing can be shortened as compared with the configuration having no protrusion. That is, heat dissipation can be further improved.

As claimed in claim 4,
A part of the protruding portion is exposed from one surface of the insulating base material,
It is preferable that the electronic component is in contact with the exposed portion of the protrusion.

  According to this, since an electronic component is made to contact the protrusion part of a metal housing | casing, heat dissipation can be improved further.

Specifically, for example, as described in claim 5,
The electronic component has a lead extending to the outside from a surface excluding the main body and a surface facing the substrate in the main body,
It is possible to adopt a configuration in which the surface of the main body portion facing the substrate is in contact with the exposed portion of the protruding portion and the lead is connected to the land.

Further, as described in claim 6,
The electronic component may be configured to contact the exposed portion of the protruding portion on the surface facing the substrate and be connected to the land via a bonding wire.

On the other hand, as described in claim 7,
The electronic component has a terminal on the surface facing the substrate,
The entire protrusion is embedded in the insulating substrate,
A land may be formed on one surface of the insulating base that covers the protruding portion, and a terminal of an electronic component may be connected to the land.

  According to this, it is possible to efficiently dissipate the heat of the electronic component to the metal casing while mounting the electronic component having a terminal on the surface facing the substrate, such as BGA and QFN, on the substrate.

  As described in claim 8, the case has a metal case in which an insulating base material is integrated and a case different from the metal case, and the metal case and the case are assembled. You may employ | adopt the structure which becomes. According to a ninth aspect of the present invention, the housing includes a metal housing in which the insulating base material is integrated, and a mold resin that integrally seals the entire surface of the insulating base material together with the electronic components. A configuration may be adopted.

Next, the invention according to claim 10 is:
A wiring having a land formed on one surface of the insulating base material, wherein wiring is formed on an insulating base material made of a synthetic resin; and
Electronic components electrically connected to the land,
A housing for housing a substrate and electronic components, and an electronic device manufacturing method comprising:
A metal casing formed using a metal material as a casing is used as an insert part, and a synthetic resin material is molded so as to contact the metal casing to form an insulating base material integrated with the metal casing. Molding process;
A wiring process for forming a wiring including a land on an insulating substrate;
A mounting step of electrically connecting the electronic component and the land.

  Since the operational effects of the present invention are the same as the operational effects of the invention described in claim 1, the description thereof is omitted.

As claimed in claim 11,
In the molding process, a thermoplastic resin as a synthetic resin material is injection molded to form an insulating base material integrated with a metal casing,
In the wiring process, it is preferable that the wiring is formed by thermocompression bonding to an insulating substrate while punching a metal foil by pressing.

  Since the effect of this invention is the same as the effect of the invention of Claim 2, the description is abbreviate | omitted.

As claimed in claim 12,
The metal housing has a protruding portion that protrudes from the contact surface of the insulating base,
In the molding process, the insulating base is formed so that a part of the protruding portion is exposed from one surface of the insulating base,
In the mounting process, it is preferable to connect the electronic component and the land in a state where the electronic component is in contact with the exposed portion of the protrusion.

  Since the operational effects of the present invention are the same as the operational effects of the third and fourth aspects of the invention, the description thereof is omitted.

Further, when using an electronic component having a terminal on the surface facing the substrate, as described in claim 13,
The metal housing has a protruding portion that protrudes from the contact surface of the insulating base,
In the molding process, an insulating substrate is formed so that the protruding portion is embedded,
In the wiring process, a land is formed on one surface of the portion covering the protruding portion in the insulating base material,
In the mounting process, it is preferable to connect the land located in the portion covering the protruding portion and the terminal of the electronic component.

  Since the operational effects of the present invention are the same as the operational effects of the inventions according to claims 3 and 7, the description thereof is omitted.

It is sectional drawing which shows schematic structure of the electronic device which concerns on 1st Embodiment. It is sectional drawing which shows the manufacturing method of the electronic device shown in FIG. 1, and shows the preparation process of a metal housing | casing. It is sectional drawing which shows the manufacturing method of the electronic device shown in FIG. 1, and shows an insert molding process. It is sectional drawing which shows the manufacturing method of the electronic device shown in FIG. 1, and shows a wiring process. It is sectional drawing which shows the manufacturing method of the electronic device shown in FIG. 1, and shows a mounting process. It is sectional drawing which shows the modification of the protrusion part of a metal housing | casing. It is sectional drawing which shows the modification of an electronic component. It is sectional drawing which shows the modification of a housing | casing. It is sectional drawing which shows schematic structure of the electronic device which concerns on 2nd Embodiment. It is sectional drawing which shows schematic structure of the electronic device which concerns on 3rd Embodiment. It is sectional drawing which shows the other modification of an electronic device. It is sectional drawing which shows the manufacturing method of the electronic device shown in FIG. 11, and shows the state in which the interlayer connection part was formed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings shown below, common or related elements are given the same reference numerals.

(First embodiment)
An electronic device 10 shown in FIG. 1 is configured as an electronic control unit (ECU) that controls a vehicle engine, for example. The electronic device 10 includes a substrate 11, an electronic component 12 electrically connected to a land 21 a of the substrate 11, and a housing 13 that accommodates the substrate 11 on which the electronic component 12 is mounted. The housing 13 includes a case 30 formed in a box shape with one surface opened using a metal material and a cover 31 formed in a box shape with one surface opened using a synthetic resin material. The case 30 and the cover 31 are assembled to form the housing 13. The case 30 corresponds to a metal casing described in the claims, and the cover 31 corresponds to a casing different from the metal casing.

  The substrate 11 is a printed circuit board having an insulating base material 20 formed by molding a synthetic resin and wiring 21 including lands 21a formed on one surface 20a on which the electronic component 12 in the insulating base material 20 is disposed.

  As a material constituting the insulating base material 20, either a thermoplastic resin or a thermosetting resin can be adopted, but a thermoplastic resin is more preferable in consideration of moldability. This insulating base material 20 is formed integrally with a case 30 constituting the housing 13. That is, the insulating base material 20 is in close contact with the case 30.

  In the present embodiment, the wiring 21 is formed on the insulating base material 20 by thermocompression bonding. For this reason, a thermoplastic resin is used as the synthetic resin material. As the thermoplastic resin, PBT, PPS, or the like can be used. Further, the insulating base material 20 is in close contact with the inner surface 32 of the case 30, specifically, the bottom surface 32a and the side surface 32b. Moreover, as shown in FIG. 1, the one surface 20a of the insulating base material 20 is flat.

  The wiring 21 including the land 21 a is formed on at least one surface 20 a of the insulating base material 20. Moreover, the constituent material of the wiring 21 should just be a conductive material, and the manufacturing method is not specifically limited. In the present embodiment, the wiring 21 is formed only on the one surface 20a of the insulating substrate 20. The wiring 21 is formed by patterning a metal foil, specifically a copper foil.

  The electronic component 12 is disposed on one surface 20 a of the insulating base material 20. And it is electrically connected with the above-mentioned land 21a. That is, the electronic component 12 is an electronic component having a surface mounting structure. Examples of the electronic component 12 include a microcomputer, a power transistor, a resistor, and a capacitor.

  An electronic component 12 shown in FIG. 1 includes a main body portion 22 in which a semiconductor chip die-mounted on an island is resin-sealed, and a surface 22a (a surface of the main body portion 22 facing the substrate 11 (which is electrically connected to the semiconductor chip). Hereinafter, the lead 23 extends from the surface different from the lower surface 22a), for example, from the side surface to the outside of the resin. QFP is known as such an electronic component 12. The lead 23 is electrically connected to the corresponding land 21a. In the present embodiment, the lead 23 is soldered to the land 21a.

  Reference numeral 24 shown in FIG. 1 is a connector mounted on the substrate 11. The terminals of the connector 24 are electrically connected to the lands 21 a of the substrate 11. In addition, the connector 24 has a fitting portion exposed to the outside of the electronic device 10 through an opening provided in the cover 31, thereby enabling electrical connection between the electronic device 10 and an external device. Yes.

  In the electronic device 10 configured as described above, in this embodiment, the case 30 further includes a protruding portion 33 protruding from the inner surface 32. And the electronic component 12 is arrange | positioned on the protrusion part 33. FIG. In the present embodiment, a protrusion 33 is provided on the bottom surface 32 a of the case 30 along the thickness direction of the substrate 11. Further, the protruding portion 33 has a columnar shape, and the tip end surface 33 a thereof is flush with the one surface 20 a of the insulating base material 20. In the electronic component 12, the lower surface 22 a of the main body portion 22 is in contact with the tip surface 33 a of the protruding portion 33. Further, the wiring 21 including the land 21 a is formed at a position where it does not contact the protruding portion 33.

  Next, a method for manufacturing the electronic device 10 will be described with reference to FIGS.

  First, as shown in FIG. 2, a case 30 having a protruding portion 33 is prepared. The case 30 can be formed by a die casting method or a pressing method. In this embodiment, the aluminum case 30 is formed by die casting.

  Next, the synthetic resin material is molded using the case 30 as an insert part, and the insulating base material 20 integrated with the case 30 is formed as shown in FIG. As this molding process, injection molding or transfer molding can be employed. In this way, the formation of the insulating base material 20 and the fixing of the insulating base material 20 (substrate 11) to the case 30 are performed in the same process.

  In the present embodiment, injection molding with a thermoplastic resin is performed in order to thermocompression-bond the metal foil in a subsequent process. In addition, the insulating base material 20 is molded so that the one surface 20a of the insulating base material 20 is flat and the tip surface 33a of the protrusion 33 is flush with the one surface 20a.

  Next, the wiring 21 including the land 21 a is formed on the insulating base material 20. In the present embodiment, as shown in FIG. 4, for example, a metal foil 103 (copper foil) having a thickness of 18 μm is disposed on one surface 20 a of the insulating base 20, and the upper mold is held with the lower mold 100 holding the case 30. 101 is lowered, and the metal foil 103 is punched by the convex portion 102 of the upper mold 101. At this time, at least one of the molds 100 and 101 (the upper mold 101 in the present embodiment) is heated by a heater (not shown) or the like, and the insulating base material 20 is softened by this heat. Therefore, the punched metal foil 103 is pressed into the insulating base material 20 and welded (thermocompression bonding). In this way, the metal foil 103 is punched out by the convex portion 102 and thermocompression-bonded to form the wiring 21. In addition, since parts other than the convex part 102 among metal foil 103 remain without being pushed in by the upper mold | type 101, they can be removed after mold opening. By this step, the substrate 11 is formed.

  Next, the electronic component 12 is mounted on the substrate 11. In the present embodiment, as shown in FIG. 5, the lower surface 22 a of the main body portion 22 of the electronic component 12 is disposed in contact with the tip surface 33 a of the protruding portion 33 exposed from the one surface 20 a of the insulating substrate 20. Then, reflow soldering is performed on the land 21 a corresponding to the lead 23. Thereby, the electronic component 12 is mounted on the substrate 11. In this step, the connector 24 is also reflow soldered to the substrate 11 together with the electronic component 12.

  And the electronic device 10 shown in FIG. 1 can be obtained by assembling the cover 31 prepared separately to the case 30.

  Next, the effects of the features of the electronic device 10 and the manufacturing method thereof will be described.

  In the present embodiment, the insulating base material 20 constituting the substrate 11 is molded integrally with the case 30 constituting the housing 13. That is, the step of forming the insulating base material 20 using the synthetic resin also serves as the step of assembling the insulating base material 20 and thus the substrate 11 to the housing 13, so that the substrate 11 does not have to be separately assembled to the housing 13. Thereby, the manufacturing cost of the electronic device 10 can be reduced.

  Moreover, since the insulating base material 20 is restrained by the integrally molded case 30 (housing 13), the substrate 11 and the housing 13 are different from the conventional structure in that the substrate 11 and the housing 13 are separated. It is difficult for the substrate 11 to warp during the manufacturing process. In particular, in this embodiment, the insulating base material 20 is restrained by the bottom surface 32a and the side surface 32b of the case 30, and the substrate 11 is unlikely to warp. For this reason, even if it does not use a heat conductive material, the dispersion | variation in the contact state of the electronic component 12 and the case 30 or the board | substrate 11 and the case 30 can be suppressed. As described above, the manufacturing cost can be reduced while improving the heat dissipation.

  In the present embodiment, a thermoplastic resin is employed as a constituent material of the insulating base material 20, and the wiring 21 is formed by thermocompression bonding to the insulating base material 20 while punching out the metal foil 103 by pressing. For this reason, the wiring 21 can be formed by a dry process without using a liquid as much as the etching of the conductive foil, plating, and screen printing using a conductive paste.

  Moreover, in this embodiment, the case 30 has the protrusion part 33 which protrudes from the bottom face 32a among the inner surfaces 32 which the insulation base material 20 contacts, and the insulation base material 20 coat | covers at least one part of the protrusion part 33. It is shaped to And the electronic component 12 is arrange | positioned on the protrusion part 33, and is electrically connected with the land 21a. For this reason, the distance from the electronic component 12 to the case 30 can be shortened compared with the structure which does not have the protrusion part 33. FIG. That is, heat dissipation can be further improved.

  In the present embodiment, the leading end surface 33 a of the protruding portion 33 is exposed from the one surface 20 a of the insulating base material 20, and the electronic component 12 is in contact with the leading end surface 33 a of the protruding portion 33. For this reason, the heat generated by the electronic component 12 can be directly radiated to the case 30, thereby further improving the heat dissipation. The heat of the electronic component 12 is also transmitted to the case 30 via the electrically connected lands 21a and the insulating base material 20.

(Modification)
The formation method of the wiring 21 is not limited to the example shown in the said embodiment. For example, the conductive foil may be formed by etching, plating, screen printing using a conductive paste, or the like. In this case, the constituent material of the insulating substrate 20 is not limited to the thermoplastic resin, and a thermosetting resin can be employed. In the case of a thermosetting resin, the insulating substrate 20 may be formed integrally with the case 30 by transfer molding, for example.

  The portion of the protruding portion 33 exposed from the insulating base material 20 is not limited to the distal end surface 33a. For example, as shown in FIG. 6, it is good also as a structure which a predetermined range protrudes from the one surface 30a in the thickness direction of the board | substrate 11 from the front end surface 33a.

  The electronic component 12 disposed in contact with the protruding portion 33 is not limited to the example shown in the above embodiment. For example, in the example shown in FIG. 7, the facing surface 12 a (hereinafter, referred to as a lower surface 12 a) of the electronic component 12 facing the substrate 11 is in contact with the tip surface 33 a of the protruding portion 33. A bonding wire 25 is connected to a pad (not shown) formed on the surface opposite to the lower surface 12a of the electronic component 12, and the electronic component 12 is connected to the land 21a by the bonding wire 25.

  The configuration of the housing 13 is not limited to the example shown in the above embodiment. For example, as shown in FIG. 8, instead of the cover 31, a mold resin 34 that integrally seals the entire surface 20 a of the insulating base material 20 together with the electronic component 12 may be employed. In this case, the case 13 is constituted by the case 30 and the mold resin 34. In addition, the code | symbol 26 shown in FIG. 8 is a lead | read | reed as an input / output terminal, and is connected with the land 21a through the bonding wire.

(Second Embodiment)
In 1st Embodiment, a part of protrusion part 33 was exposed from the one surface 20a of the insulating base material 20, and the example in which the electronic component 12 (main-body part 22) contact-positioned to this exposed part was shown.

  On the other hand, in this embodiment, as shown in FIG. 9, the electronic component 12 has a terminal on the surface (lower surface 12 a) facing the substrate 11, and a land 21 a is formed in a region directly below the electronic component 12. Yes. The protruding portion 33 is entirely embedded in the insulating base material 20, and a land 21 a is formed on a portion (hereinafter, referred to as a covering portion 27) that covers the protruding portion 33 on one surface 20 a of the insulating base material 20. The terminal of the electronic component 12 is connected to 21a. Thus, the land 21a exists in the region immediately below the electronic component 12, and the covering portion 27 of the insulating base material 20 is interposed between the land 21a and the protruding portion 33 so as not to contact the land 21a.

  According to the above configuration, the heat of the electronic component 12 is efficiently transferred to the case 30 while the electronic component 12 having a terminal on the lower surface 12a such as BGA or QFN is mounted on the substrate 11 as compared with the configuration without the protruding portion 33. It can dissipate heat well.

  The electronic device 10 shown in the present embodiment can be formed by lowering the height of the protruding portion 33 when forming the case 30 in advance in the manufacturing method shown in the first embodiment.

  Moreover, the structure shown in this embodiment can also be combined with the structure shown in the modification (FIG. 8) of 1st Embodiment.

(Third embodiment)
In each said embodiment, the case 30 showed the example which has the protrusion part 33. FIG. However, as shown in FIG. 10, it is good also as a structure which does not have the protrusion part 33. FIG.

  Also in this embodiment, the insulating base material 20 constituting the substrate 11 is formed integrally with the case 30 constituting the housing 13. Thereby, the manufacturing cost of the electronic device 10 can be reduced.

  Moreover, since the insulating base material 20 is restrained by the integrally formed case 30 (housing 13), the electronic component 12 and the case 30 or the substrate 11 and the case 30 can be used without using a heat conductive material. Variation in contact state can be suppressed. As described above, the manufacturing cost can be reduced while improving the heat dissipation without having the protrusion 33.

  In FIG. 10, the thickness of the insulating base material 20 is as thin as, for example, about 0.5 mm. As described above, when the thickness of the insulating base material 20 is reduced, the thermal resistance of the heat dissipation path from the electronic component 12 to the case 30 is reduced. Therefore, a thinner thickness is preferable in terms of heat dissipation.

  Moreover, the structure shown in this embodiment can also be combined with the structure shown in the modification (FIG. 8) of 1st Embodiment.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  In each of the above-described embodiments and modifications thereof, the wiring 21 including the land 21a is disposed only on the one surface 20a of the insulating base material 20, that is, an example of the one-layer wiring 21 is shown. However, for example, as shown in FIG. 11, a multilayer substrate can be adopted as the substrate 11. In the example shown in FIG. 11, two layers of wirings 21 and 28 are arranged with respect to the insulating base material 20, and the wirings 21 and 28 are electrically connected by an interlayer connection portion 29 at an appropriate place. The other configuration is the same as the configuration shown in the first embodiment (FIG. 1).

  Note that the electronic device 10 shown in FIG. 11 can be formed through substantially the same steps as the manufacturing method shown in the first embodiment, for example. The difference is that the substrate 11 is a multilayer substrate. Hereinafter, the insert molding process and the wiring process will be described. As shown in FIG. 12, the synthetic resin material is molded using the case 30 as an insert part to form the first insulating layer 40 so that the prepared case 30 has a predetermined thickness suitable for the arrangement of the wirings 28. . Next, as shown in the wiring formation process of the first embodiment, the wiring 28 is formed on the surface of the first insulating layer 40 by thermocompression bonding to the first insulating layer 40 while punching a metal foil by pressing. Next, a synthetic resin material is molded using the case 30 as an insert component so as to have a predetermined thickness suitable for the arrangement of the wirings 21, and the second insulating layer 41 is formed on the first insulating layer 40. Insulating layers 40 and 41 are thus laminated to form insulating substrate 20. Next, a via hole having the wiring 28 as a bottom is formed in the second insulating layer 41 by laser irradiation or the like, and an interlayer connection portion 29 is formed by embedding a conductive member. Then, the wiring 28 may be formed on the surface of the second insulating layer 41, that is, the one surface 20 a of the insulating base material 20 by pressing and pressing the metal foil to the second insulating layer 41 by pressing. The subsequent steps are the same as those in the first embodiment.

DESCRIPTION OF SYMBOLS 10 ... Electronic device 11 ... Board | substrate 12 ... Electronic component 13 ... Case 20 ... Insulating base material 20a ... One side 21 ... Wiring 21a ... Land 22 ... Main body Portion 23 ... Lead 24 ... Connector 25 ... Bonding wire 26 ... Lead 27 ... Covering portion 28 ... Internal wiring 29 ... Interlayer connection 30 ... Case (metal casing) )
31 ... Cover (case different from metal case)
32 ... Inner surface 32a ... Bottom surface 32b ... Side surface 33 ... Projection 33a ... End surface 34 ... Mold resin

Claims (13)

A wiring having a land formed on one surface of the insulating base material, wherein wiring is formed on an insulating base material made of synthetic resin; and
An electronic component electrically connected to the land;
An electronic device comprising: a housing for housing the substrate and the electronic component;
As the case, at least a metal case formed using a metal material,
The electronic device according to claim 1, wherein the insulating base is formed integrally with the metal casing in contact with the metal casing. The insulating substrate is made of a thermoplastic resin,
The electronic device according to claim 1, wherein the wiring is formed by thermocompression bonding to the insulating base material while punching a metal foil by pressing. The metal casing has a protruding portion protruding from a contact surface of the insulating base material,
The said insulating base material is shape | molded so that at least one part of the said protrusion part may be coat | covered, The said electronic component is arrange | positioned on the said protrusion part and is electrically connected with the said land. The electronic device according to claim 1 or 2. A part of the protruding portion is exposed from one surface of the insulating base material,
The electronic device according to claim 3, wherein the electronic component is in contact with an exposed portion of the protrusion. The electronic component has a main body part and a lead extending outside from a surface excluding a surface facing the substrate in the main body part,
The electronic device according to claim 4, wherein a surface of the main body portion facing the substrate is in contact with an exposed portion of the protruding portion, and the lead is connected to the land.   5. The electronic device according to claim 4, wherein the electronic component is in contact with an exposed portion of the protruding portion on a surface facing the substrate, and is connected to the land through a bonding wire. The electronic component has a terminal on a surface facing the substrate,
The entire protrusion is embedded in the insulating base material,
The electronic device according to claim 3, wherein the land is formed on one surface of a portion of the insulating base material that covers the protruding portion, and a terminal of the electronic component is connected to the land.   The case has a metal case in which the insulating base material is integrated, and a case different from the metal case, and the metal case and the case are assembled. The electronic device according to claim 1.   The said housing | casing has the metal housing | casing with which the said insulating base material was integrated, and the mold resin which seals the whole surface of the said insulating base material with the said electronic component integrally. The electronic device according to any one of 1 to 7. A wiring having a land formed on one surface of the insulating base material, wherein wiring is formed on an insulating base material made of synthetic resin; and
An electronic component electrically connected to the land;
A housing for housing the substrate and the electronic component, and an electronic device manufacturing method comprising:
An insulating base material integrated with the metal casing by forming a synthetic resin material so as to be in contact with the metal casing as a metal casing formed using the metal material as the casing Forming process to form,
A wiring process for forming a wiring including the land on the insulating base;
And a mounting step of electrically connecting the electronic component and the land. In the molding step, a thermoplastic resin as the synthetic resin material is injection molded to form an insulating base material integrated with the metal casing,
The method of manufacturing an electronic device according to claim 10, wherein in the wiring step, the wiring is formed by thermocompression bonding to the insulating base material while punching a metal foil by pressing. The metal casing has a protruding portion protruding from a contact surface of the insulating base material,
In the molding step, the insulating base is formed so that a part of the protrusion is exposed from one surface of the insulating base,
12. The electronic device according to claim 10, wherein in the mounting step, the electronic component and the land are connected in a state where the electronic component is in contact with an exposed portion of the protruding portion. Production method. The metal casing has a protruding portion protruding from a contact surface of the insulating base material,
In the molding step, the insulating base material is formed so that the protruding portion is embedded,
In the wiring step, the land is formed on one surface of the portion covering the protruding portion in the insulating base material,
In the mounting step, an electronic component having a terminal on a surface facing the substrate is used, and a land located at a portion covering the protruding portion and the terminal are connected to each other. The manufacturing method of the electronic device of description.

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