JP2012253117A5 - - Google Patents

Download PDF

Info

Publication number
JP2012253117A5
JP2012253117A5 JP2011123179A JP2011123179A JP2012253117A5 JP 2012253117 A5 JP2012253117 A5 JP 2012253117A5 JP 2011123179 A JP2011123179 A JP 2011123179A JP 2011123179 A JP2011123179 A JP 2011123179A JP 2012253117 A5 JP2012253117 A5 JP 2012253117A5
Authority
JP
Japan
Prior art keywords
wall member
wiring board
height direction
protective
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011123179A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012253117A (ja
JP5921090B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011123179A priority Critical patent/JP5921090B2/ja
Priority claimed from JP2011123179A external-priority patent/JP5921090B2/ja
Priority to US14/116,791 priority patent/US9275949B2/en
Priority to PCT/JP2012/064348 priority patent/WO2012165647A1/en
Publication of JP2012253117A publication Critical patent/JP2012253117A/ja
Publication of JP2012253117A5 publication Critical patent/JP2012253117A5/ja
Application granted granted Critical
Publication of JP5921090B2 publication Critical patent/JP5921090B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011123179A 2011-06-01 2011-06-01 半導体装置 Expired - Fee Related JP5921090B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011123179A JP5921090B2 (ja) 2011-06-01 2011-06-01 半導体装置
US14/116,791 US9275949B2 (en) 2011-06-01 2012-05-29 Semiconductor device
PCT/JP2012/064348 WO2012165647A1 (en) 2011-06-01 2012-05-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011123179A JP5921090B2 (ja) 2011-06-01 2011-06-01 半導体装置

Publications (3)

Publication Number Publication Date
JP2012253117A JP2012253117A (ja) 2012-12-20
JP2012253117A5 true JP2012253117A5 (enExample) 2014-07-17
JP5921090B2 JP5921090B2 (ja) 2016-05-24

Family

ID=47525683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011123179A Expired - Fee Related JP5921090B2 (ja) 2011-06-01 2011-06-01 半導体装置

Country Status (1)

Country Link
JP (1) JP5921090B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI742603B (zh) * 2020-04-09 2021-10-11 伊諾司生技股份有限公司 一種具有空腔的感測器
WO2025173315A1 (ja) * 2024-02-14 2025-08-21 ソニーセミコンダクタソリューションズ株式会社 電子モジュール、電子モジュールの制御システムおよび撮像装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03169052A (ja) * 1989-11-29 1991-07-22 Hitachi Ltd パッケージ
JP2004119881A (ja) * 2002-09-27 2004-04-15 Sony Corp 半導体装置及びその製造方法
JP4148932B2 (ja) * 2004-08-31 2008-09-10 シャープ株式会社 半導体装置、半導体モジュール及び半導体装置の製造方法
JP2009043893A (ja) * 2007-08-08 2009-02-26 Fujikura Ltd 半導体パッケージ及びその製造方法

Similar Documents

Publication Publication Date Title
JP2013038399A5 (ja) 半導体装置
JP2012199534A5 (enExample)
JP2014082512A5 (ja) 半導体装置の作製方法
JP2014082388A5 (enExample)
JP2013235598A5 (enExample)
MX339775B (es) Dispositivo de resistencia termica variable para asientos de vehiculo.
JP2013008946A5 (enExample)
JP2012033913A5 (enExample)
JP2013080915A5 (enExample)
JP2014195041A5 (enExample)
JP2013214729A5 (enExample)
JP2013102134A5 (ja) 半導体装置
JP2012147013A5 (ja) 表示装置
BR112012014093A2 (pt) aparelho decodificador tendo microperfurações.
JP2014045175A5 (enExample)
JP2015111667A5 (ja) 半導体装置
JP2011512880A5 (enExample)
JP2014175446A5 (enExample)
JP2014533621A5 (enExample)
JP2013251536A5 (enExample)
JP2012253117A5 (enExample)
JP2014193067A5 (enExample)
BR112016028369A2 (pt) circuito integrado com dispositivo de refrigeração.
EP3866191A4 (en) ELECTRICALLY INSULATING, HEAT-DISSIPTING LAYER WITH SEPARATION LAYER
JP2018026231A5 (enExample)