JP2012251182A - Chemical treatment apparatus, plating apparatus, and plating method employing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chemical treatment apparatus that can efficiently be installed and has improved productivity.SOLUTION: The chemical treatment apparatus chemically treats a workpiece of a long-sheet shape by continuously feeding the same into a chemical treatment tank, and is provided with a workpiece feeder for continuously feeding the workpiece of a long-sheet shape wound on a reel and a workpiece winder for continuously winding the chemically treated workpiece onto the reel. The structure of the apparatus is characterized in that: the workpiece feeder and the workpiece winder are disposed on the side of one of a pair of endless belts each comprising a plurality of upper and lower end transfer clamps for clamping the upper end or the lower end of the workpiece respectively upon feeding the same into the chemical treatment tank; and a pretreatment tank and a post treatment tank in the plating process are disposed on the side of the same endless belt in a manner of sandwiching the workpiece feeder and the workpiece winder, and the chemical treatment tank is disposed on the side of the opposite endless belt.

Description

  The present invention relates to a chemical processing apparatus for continuously performing chemical processing such as plating on a long sheet like a flexible circuit board used for COF (Chip On Flexible) and the like, and a plating processing method using the apparatus. is there.

In recent years, so-called flexible circuit boards in which a wiring circuit is formed on a flexible insulating substrate are increasingly used in electronic devices such as liquid crystal televisions and mobile phones.
As a conventional plating apparatus used for manufacturing such a flexible circuit board, for example, an apparatus described in Patent Document 1 has been used.

  A conventional plating apparatus shown in FIG. 6 includes a workpiece supply device 1 for supplying a workpiece wound on a reel (long sheet-like material to be plated), and a workpiece for winding the workpiece 10 on a reel. A pretreatment tank 3, a plating tank 4, and a posttreatment tank 5 for plating the workpiece 10 between the winding device 2 and a linear arrangement of the pretreatment tank 3 and the plating tank 4. Then, the upper end of the work 10 is sandwiched between the upper parts of the post-treatment tanks 5 to supply power, and plating is performed while the work 10 is continuously conveyed from the work supply device 1 to the work take-up device 2 with the surface of the work 10 being the vertical direction. A plating apparatus 40 for performing the above is disclosed.

Conventionally, by using the plating apparatus 40 having the configuration shown in FIG. 6, the current density of the workpiece can be made uniform and high, so that the plating tank can be made into one tank and long without applying a large tension to the workpiece. The sheet can be plated.
However, even in such an apparatus, when the productivity is further improved, the current density is already high, so there is a limit to further increase the current density. It may be possible to cope with the increase in size. However, when each processing tank is arranged in a straight line and there is a restriction on the installation space of the apparatus, there is a limit to the increase in size, and in order to further improve the productivity, FIG. There was a problem with such an apparatus configuration.

In order to solve such problems, the present inventors have proposed a chemical processing apparatus disclosed in Patent Document 2.
The chemical processing apparatus disclosed in Patent Document 2 is a workpiece supply device that continuously supplies a long sheet-like workpiece with its width direction set to the vertical direction, and the workpiece is continuously set with the width direction of the workpiece set to the vertical direction. A work take-up device that is wound around a reel, and a work that is disposed between the work supply device and the work take-up device and that is conveyed by a clamp provided on an endless belt with the width direction set to the vertical direction. In contrast, the chemical treatment apparatus is configured to include chemical treatment tanks for performing chemical treatment on both sides of the endless belt, and the apparatus can be made smaller than the plating apparatus 40 described in Patent Document 1.

However, in a chemical processing apparatus such as a general plating apparatus, a pretreatment tank and a posttreatment tank are arranged before and after the chemical treatment tank, and therefore, an apparatus shown in Patent Document 2 including chemical treatment tanks on both sides of an endless belt. Even if it is a structure, since the pretreatment tank 3 or the post-treatment tank 5 will be installed together with the chemical treatment tank 4 on one side of the endless belt 8 as in the chemical treatment apparatus 30 shown in FIG. When the tank 4 is increased in size, there is a problem that the apparatus length becomes longer.
5 and 6, reference numerals 6 and 7 denote folding pulleys for the endless belt 8, which also serve as driving pulleys.

  Further, in the plating apparatus shown in FIGS. 5 and 6, the current applied to the work in the plating tank is made uniform by performing plating while holding the work with the clamp connected to the power supply device. It became possible to form a plating by increasing the density and improving the plating speed, but when forming the plating by increasing the current density by the above configuration, a dimple-like fine recess was formed on the plating surface, It had the problem of impairing the smoothness of its surface.

Further, both the apparatuses shown in FIGS. 5 and 6 are the plating apparatus in which the work upper end (the lower end of the apparatus in FIG. 5 is also the lower end) is chucked (clamped) and conveyed so that the work is conveyed with low tension. However, since the workpiece is wound with the width direction set to the vertical direction, the workpiece after winding is increased when the processing amount increases (that is, the workpiece becomes longer). Due to its own weight, winding disturbance occurs, and defects such as scratches and wrinkles are generated on the plated surface and workpiece surface. Therefore, it was impossible to handle a 300 m long workpiece because of its limit.
Therefore, to increase the amount of treatment, the tension applied to the workpiece during the plating process was increased in order to prevent turbulence, but it is easy to cause plating defects due to the workpiece being in a stretched state. The result is a decrease in productivity.

  Further, when the apparatus of FIG. 5 is used, the apparatus 10 is reduced in size by folding the workpiece 10 with the folding pulley 7, but the clamp supported by the endless belt 8 wound around the folding-side transport pulley 7 is An arc is drawn along the outer periphery of the return conveying pulley 7 to move. At this time, since the linear distance between adjacent clamps is shortened, there is a problem that “wrinkles” are generated on the workpiece surface when the workpiece 10 held between the clamps 9 bends in a wavy state.

JP 2006-193794 A JP 2009-120889 A

  The present invention has been made to solve the above-described problems, and has an object to provide a chemical processing apparatus, a plating apparatus, and a plating processing method using the apparatus that are small in size and excellent in productivity. To do.

  The first invention of the present invention that solves such problems is a long sheet-like shape wound around a reel in a chemical processing apparatus for continuously carrying a long sheet-like workpiece into a chemical treatment tank and chemically treating it. A workpiece feeding device that continuously feeds workpieces and a workpiece winding device that continuously winds chemically treated workpieces on a reel, and an upper end conveying clamp group that clamps at least the upper end of the workpiece when the workpiece is loaded into the chemical treatment tank Are arranged on one side of a pair of endless belts, and a pretreatment tank and a posttreatment tank in chemical processing are arranged so as to sandwich both the workpiece supply device and the workpiece winding device, and the pretreatment vessel is located at the same endless belt side position. , A workpiece supply device, a workpiece winding device, and a post-treatment tank are disposed, and a chemical treatment tank is provided on the opposite endless belt side.

  According to a second aspect of the present invention, in a chemical processing apparatus for continuously carrying a long sheet-like work into a chemical treatment tank and performing chemical treatment, upper end conveyance for clamping at least the upper end of the work when the work is carried into the chemical treatment tank. A pair of endless belts having a clamp group is provided, a chemical treatment tank is arranged on one side of the endless belt, and a pretreatment tank for pretreatment of chemical treatment and a posttreatment tank for posttreatment are arranged on the opposite endless belt side. Then, the workpiece supply device arranged at a position where the workpiece is continuously carried into the pretreatment tank, and the workpiece winding arranged at a position where the workpiece carried out of the post-treatment tank is continuously wound around the reel It has the apparatus.

  When the chemical processing tank of the chemical processing apparatus according to the first and second aspects of the present invention carries the workpiece and carries out the plating process, at least the upper end of the workpiece is gripped by the transport clamp group and is in a vertical state. It is a chemical treatment tank that performs chemical treatment on the workpiece surface of the workpiece, and when the workpiece winding device winds up the workpiece, it is a winding device that performs winding after the chemically treated workpiece is leveled. It is characterized by.

  According to a fourth aspect of the present invention, the clamp of the conveyance clamp group provided in the endless belt is detachably fitted to the folding pulley of the chemical processing apparatus according to the first to third aspects of the invention as the endless belt moves. A clamp removing / attaching portion is provided. Note that the “fitting” here is not only a close fitting, but a loose fitting with a large clamp attaching / detaching portion is better.

  According to a fifth aspect of the present invention, in the chemical treatment apparatus according to the first to fourth aspects, a low-tension heat treatment apparatus is provided between the post-treatment tank and the workpiece winding apparatus.

  According to a sixth aspect of the present invention, when a workpiece is carried into a chemical treatment tank and plated, the workpiece surface is plated with at least the upper end held by a conveying clamp group, and the workpiece surface is plated. The plating process is characterized in that before the work after the post-treatment is taken up, the work is subjected to a low-tension heat treatment, and the work subjected to the low-tension heat treatment is placed in a horizontal state and then taken up by a work take-up device. The method is performed using the plating apparatus according to the fifth invention.

  In a seventh aspect of the present invention, the low-tension heat treatment according to the sixth aspect is a heat treatment for recrystallizing the plated workpiece in a low-tensile state of 5 N or less. Is the method.

According to the present invention, a chemical processing apparatus having a production capacity equivalent to that of a conventional chemical processing apparatus used for chemical processing or the like that has a laying shape excellent in installation efficiency and can flexibly cope with an improvement in production capacity. Therefore, the present invention has a remarkable industrial effect.
Furthermore, according to the present invention, it is possible to prevent the occurrence of a work surface defect due to turbulence by winding the work with a horizontal winding shaft, and the low-tension heat treatment allows the progress of recrystallization of the plating film during winding. The generation of dimple-like dents on the plating surface caused by the above is prevented, and the generation of waves (wave pattern) due to the elongation of the workpiece being conveyed and the completion of recrystallization of the plating is prevented. Furthermore, the upper and lower clamps of the non-contact conveyance structure of the present invention can prevent the workpiece from loosening when folded, and can convey the workpiece without loosening.

It is an external appearance perspective view which shows one Example of the chemical processing apparatus of this invention. It is a figure for demonstrating the chemical processing apparatus of this invention, (a) is the arrangement | positioning schematic diagram of the chemical processing apparatus of FIG. 1, (b) is the arrangement | positioning schematic diagram in another Example. It is a schematic diagram explaining an example of the Example of the low tension heat processing apparatus of this invention. It is a figure which shows the structure of the folding pulley of this invention, (a) is an external appearance perspective view, (b) is an external appearance perspective view of a clamp removal | desorption site | part. It is the arrangement schematic diagram which shows the form of the conventional chemical processing apparatus. It is an arrangement schematic diagram showing the form of a conventional plating apparatus.

The chemical processing apparatus according to the present invention has the structure shown in FIGS.
FIG. 1 is an external perspective view showing a whole view of a chemical processing apparatus of the present invention, 20 represents a chemical processing apparatus, 1 represents a work supply device, 2 represents a work winding device, 3 represents a pretreatment tank, and 4 represents chemical treatment. Tanks, 5 are post-treatment tanks, 6 are endless belt folding pulleys, 8 are endless belts, 8a is an upper / lower end conveying clamp group, 9 is a plating stripping tank, 10 is a workpiece, 11 is a low-tension heat treatment apparatus, and 12 is conveyed. A direction change roller, 13 is a horizontal roller, and 20 is a chemical processing apparatus.

FIG. 2A is a schematic arrangement diagram simplified for explaining the structure of the chemical treatment apparatus 20 of the present invention shown in FIG. The folding pulley 6 of the endless belt 8 in FIG. 1 is represented by a pair of folding pulleys 6 (also serving as driving pulleys).
FIG. 2B is an arrangement schematic diagram in another embodiment, and shows a case where the workpiece supply device 1 and the workpiece winding device 2 are arranged inside or above the endless belt 8.

  As shown in FIGS. 1 and 2, a workpiece supply device 1 that continuously supplies a long sheet-like workpiece 10 wound on a reel (not shown), and the elongated workpiece 10 is continuously reeled. The workpiece take-up device 2 to be wound around (not shown) grips at least the upper transfer clamp group 8a (in FIG. 1, the upper end clamp only) at the time of chemical treatment of the workpiece 10. However, one end of the endless belt 8 having a clamp on the lower end side and may be gripped by the upper and lower ends ([A side] in FIGS. 1 and 2), or in FIG. The endless belt 8 is concentrated inside or above the endless belt 8.

Further, as shown in FIGS. 1 and 2, the pretreatment tank 3 and the posttreatment tank 5 when performing the chemical treatment also sandwich both the workpiece supply device 1 and the workpiece winding device 2, that is, the workpiece supply device and the workpiece winding. It is arranged separately on both sides of the picking device.
On the other hand, the chemical treatment tank 4 faces the endless belt side ([A side side in FIGS. 1 and 2)] on which the workpiece supply apparatus 1, the pretreatment tank 3, the post-treatment tank 5, and the workpiece winding apparatus 2 are arranged. The structure is arranged on the endless belt side ([B side side in FIGS. 1 and 2)].
In addition, the plating peeling tank 9 removes “plating” adhering to the endless belt 8 and the vertical conveyance clamp group 8a.

As described with reference to FIGS. 1 and 2, the components of the chemical treatment apparatus are disposed between the folding pulleys 6 of the endless belt 8 (between the folding pulleys 6 and 7 in FIG. 2). The overall length of the chemical treatment apparatus can be shortened, and the aspect ratio (hereinafter referred to as the aspect ratio) of the laying shape (installation space of the apparatus) can be made close to 1.0. It increases the efficiency of the site area.
That is, in the conventional apparatus, since the aspect ratio is large and the laying shape (installation space) requires a rectangular site with a long side, the selection of the installation location is restricted. However, in the present invention, the aspect ratio is 1 Since it is close to 0.0, the installation space is a rectangle close to a square, which is less subject to installation location restrictions than conventional devices and can be said to have a high degree of freedom.

Next, the pretreatment tank 3, the chemical treatment tank 4, and the posttreatment tank 5 used in the present invention, when carrying the workpiece 10 and carrying out chemical treatment, hold at least the upper end by the vertical conveying clamp group 8a and are in a vertical state. The workpiece 10 is subjected to chemical treatment on the workpiece surface, and the workpiece 10 chemically treated by each treatment vessel is taken up by the workpiece winding device 2 after being unloaded from the post-treatment vessel 5. At the time of winding, the direction of conveyance is changed by the conveyance direction changing roller 12, and then the winding of a reel (not shown) for winding the workpiece 10 in the horizontal direction, that is, in the horizontal direction via the horizontal roller 13. The workpiece is wound around the workpiece winding device 2 having a set axis.
In this way, by winding the workpiece with a horizontal winding shaft, even if the amount of winding is increased, that is, even if the winding diameter is large and the coil weight of the workpiece increases, the surface of the workpiece will be defective due to winding disturbance. Can be prevented.

Further, before the workpiece 10 is wound around the workpiece winding device 2, heat treatment (hereinafter referred to as “low tension heat treatment”) under conditions where the plating is recrystallized under low tension is performed by the low tension heat treatment device 11 of FIG. 1.
This low-tension heat treatment prevents dimple-like dents on the plating surface due to the progress of recrystallization of the plating film during winding, and the wave (wave pattern) due to the elongation of the workpiece being transferred and the completion of recrystallization of the plating This is performed in order to prevent the occurrence, and is performed under conditions where the tension is 5 N or less and the plating is recrystallized.

  As a low tension heat treatment apparatus to be used, a low tension heat treatment apparatus having a structure as shown in FIG. 3 is preferably used. When the low-tension heat treatment apparatus 11 is used to explain the low-tension heat treatment, the work 10 carried out from the final treatment tank such as the post-treatment tank (FIG. 1, reference numeral 5) is adsorbed to the suction roll 14 of the low-tension heat treatment apparatus 11. At the same time, it is heated by the hot air heating device 16 to recrystallize the plating surface, and at the same time, it is led to the air flow turn section 15 and brought into a non-contact state by air flow, and its tension is controlled to 5 N or less. The When the plating surface is recrystallized by the hot air heating device 16 in a state where the tension is 5 N or less, a work having a healthy smoothness is led out of the device and the processing is completed. In the low-tension heat treatment apparatus 11 shown in FIG. 1, the horizontal roller 13 also serves as an adsorption roll.

  If the tension is greater than 5N, the workpiece is likely to be waved during this heat treatment, causing a reduction in quality.

Further, according to the present invention, the folding pulley 6 is provided with a clamp attaching / detaching portion 6b in which the upper end clamp 8b and the lower end clamp 8c of the upper and lower conveying clamp group 8a provided on the endless belt are detachably fitted as the endless belt moves. (See FIGS. 4A and 4B).
An arc shape is formed between the clamp attachment / detachment portions 6b, and the workpiece is transported in a state where the upper end surface and the lower end surface of the workpiece are in contact with the arc-shaped portion.
With such a mechanism, the upper and lower clamps 8b and 8c are fitted into the clamp attachment / detachment portion 6b at the time of folding, so that the workpiece can be prevented from being loosened, and the workpiece can be conveyed without being loosened. In addition, as an example of the clamp attaching / detaching portion 6b, as shown in FIG. 4 (a), the clamp lead disk 6a may be provided between the upper and lower folding pulleys 6 and may be provided on the entire circumference thereof, between the clamps 8b and 8c. Alternatively, clamp attachment / detachment portions may be provided at the upper and lower ends of the cylindrical member that is continuous with the cylinder.
Further, by providing the clamp lead disks 6a between the upper and lower folding pulleys 6 respectively, the contact area between the workpiece 10 and the arc-shaped portion is reduced, and therefore, it is more preferable because the workpiece can be prevented from being scratched or soiled.

  Hereinafter, the present invention will be described using examples.

The design and manufacturing capacity was 90 km / month, and the “all-round type” chemical processing apparatus according to the present invention shown in FIG. .
Table 1 summarizes the laying shape and performance of the device.

(Comparative Example 1)
By providing a processing step only on one side of the apparatus, a “straight-line” chemical processing apparatus shown in FIG. The design and manufacturing capacity was 90 km / month as in the chemical processing apparatus of Example 1.
Table 1 shows the laying shape, performance, and the like together with Example 1.

  As can be seen from Table 1, superiority or inferiority is not seen in maintainability below the device cost, operability, difficulty of the transport mechanism, etc., but with respect to the installation area of one device, Example 1 (all-round type: figure 2 (a)) and Comparative Example 1 (linear type: see FIG. 5) are not much different, but the overall length is 2/3, and the aspect ratio of the laying shape of the apparatus is 1/2 or less compared to the linear type, It can be seen that the installation density per unit area (the number of installations in the 50 × 50 m site in Table 1) is excellent.

A material having a width of 524 mm, a thickness of 75 μm, and a length of 1500 m, on which a conductive metal is formed on a polyimide film, is attached to the workpiece supply apparatus 1 shown in FIG. The upper and lower ends of the workpiece are gripped using a chemical processing apparatus, and a plating treatment is performed at a current density of 3 A / cm ² in the chemical treatment tank 4 while conveying the workpiece at a conveyance tension of 50 N and a conveyance speed, and post-processing As a result of changing the conveyance direction of the workpiece by the conveyance direction changing roller 12 (shown in FIG. 1) after the cleaning process in the tank 5 and winding the workpiece with the workpiece winding device 2 through the horizontal roller, the workpiece is disturbed. It was possible to perform plating of long workpieces without the occurrence of wrinkles.

(Comparative Example 2)
The workpiece was plated under the same conditions as in Example 2 except that a “straight-line” chemical treatment device shown in FIG. 5 equipped with a workpiece winding device for winding the workpiece vertically was used. When the workpiece processing length exceeded 300 m, winding disturbance began to occur. Thereafter, the workpiece conveyance tension was increased to 100 N, and a plating treatment of 1500 m was performed.

Two types of workpieces 10 having a width of 524 mm, a length of 300 m, and a thickness of 125 μm, 100 μm, 75 μm, 50 μm, 38 μm, 25 μm, and 12.5 μm formed by forming a conductive metal layer on a polyimide film are shown in FIG. Attached to the apparatus 1 and grips the upper and lower ends of the workpiece using the chemical treatment apparatus according to the present invention, while conveying the workpiece at a conveyance tension of 50 N and a conveyance speed of 0.5 m / min, Plating was performed at a density of 3 A / cm ² .

  The clamp lead disc 6a used is a disc-shaped member having a diameter of 70 cm and a plate thickness of 12 mm as shown in FIG. 4, and is formed with clamp attachment / detachment portions 6b so as to support a width of 10 mm at both ends of the vertical surface of the workpiece. Adjusted. The clamp was adjusted so as to hold a width of 15 mm at both ends of the workpiece vertical surface. As a result, it was possible to perform good plating without wrinkles on the workpiece after plating.

The plating treatment was performed under the same conditions as in Example 1 except that the clamp lead disc used was a cylindrical member having a diameter of 70 cm and a height of 550 mm, in which clamp position regulating recesses were formed on the upper and lower ends.
As a result, wrinkles did not occur on the workpiece after plating, but scratched defects occurred on the plating surface in some places, but they could be used as products by removing the defective portions.

(Comparative Example 3)
Plating treatment was performed under the same conditions as in Example 1 except that the conventional chemical treatment apparatus described in FIG. 6 was used.
As a result, the thinner the workpiece was, the more wrinkles were formed on the workpiece after plating. When the workpiece thickness was 50 μm or less, many wrinkles were generated on the entire workpiece, and could not be used as a product.

A workpiece 10 having a width of 524 mm, a length of 300 m, and a thickness of 25 μm, on which a conductive metal layer is formed on a polyimide film, is attached to the workpiece supply apparatus 1 shown in FIG. 1, and conveyed using the plating apparatus according to the present invention. Plating was performed at a current density of 6 A / cm ² in the chemical treatment tank 4 while conveying the workpiece at a tension of 50 N and a conveyance speed of 0.5 m / min.

  After 8 μm Cu plating is formed on both sides, the heat treatment time is fixed at 36 seconds and the heat treatment temperature is 25 ° C., 50 ° C., 75 ° C., 100 ° C., 120 ° C., 140 ° C., 150 ° C. Members were created and the dimple-like dents after the creation were observed.

  As a result, the dimple-like dents decreased when the heat treatment temperature exceeded 50 ° C., and at 140 ° C. or higher, no dimple-like dents could be observed in the plated member, and a plated member having excellent smoothness could be obtained.

  The heat treatment temperature after the plating treatment is fixed at 150 ° C. and 36 seconds, and the conveyance tension of the workpiece 10 during heat treatment (heating) is set to 0N, 5N, 10N, 15N, 20N using the low tension heat treatment apparatus 11 shown in FIG. A plated member was prepared under the same conditions as in Example 1 except that heat treatment was performed at 25N and 50N, and the dimple-like dents and the wave of the workpiece after observation were observed.

  As a result, there was no change in the number of dimple-shaped dents at any conveyance tension, but it was found that the workpiece 10 was remarkably wave-shaped when the conveyance tension exceeded 5N.

DESCRIPTION OF SYMBOLS 1 Work supply apparatus 2 Work winding apparatus 3 Pretreatment tank 4 Plating tank (chemical treatment tank)
5 Post-treatment tanks 6 and 7 Endless belt folding pulley 6a Clamp lead disk 6b Clamp detachment part 8 Endless belt 8a Upper and lower end conveyance clamp group 8b Upper end clamp 8c Lower end clamp 9 Plating peeling tank 10 Workpiece 11 Low tension heat treatment apparatus 12 Direction changing roller 13 Horizontal roller 14 Adsorption roll 15 Air flow turn unit 16 Hot air heating device 20 Chemical processing device 30 of the present invention Conventional plating device 40 Conventional chemical processing device (plating device)

Claims (7)

In a chemical processing apparatus that continuously carries long sheets of workpieces into a chemical processing tank for chemical processing,
A workpiece supply device for continuously supplying a long sheet-shaped workpiece wound on a reel and a workpiece winding device for continuously winding a chemically-treated workpiece on a reel at least when the workpiece is loaded into a chemical treatment tank. It has a conveyance clamp group that clamps the upper end, and is arranged on one side of an endless belt that comprises a pair of folding pulleys to form an endless loop
The pretreatment tank, the work supply apparatus, and the work take-up apparatus are disposed at a position where both the work supply apparatus and the work take-up apparatus are sandwiched between the pretreatment tank and the post-treatment tank in the plating process and on the same endless belt side. Arrange the equipment and post-treatment tank,
A chemical processing apparatus characterized in that a chemical processing tank is provided on the opposite endless belt side. In a chemical processing apparatus that continuously carries long sheets of workpieces into a chemical processing tank for chemical processing,
A pair of endless belts having a conveying clamp group that clamps at least the upper end of the workpiece when the workpiece is brought into the chemical treatment tank;
A chemical treatment tank is arranged on one side of the endless belt, a pretreatment tank for performing a pretreatment for chemical treatment and a posttreatment tank for performing a posttreatment are arranged on the opposite endless belt side,
A workpiece supply device disposed at a position where the workpiece is continuously carried into a pretreatment tank; and a workpiece winding device disposed at a position where the workpiece unloaded from the posttreatment tank is continuously wound around a reel. A chemical processing apparatus comprising: The chemical treatment tank is a chemical treatment tank for performing chemical treatment on a workpiece surface of a workpiece which is brought into a vertical state by gripping at least the upper end by the transport clamp group when carrying the workpiece and plating.
3. The chemical treatment apparatus according to claim 1, wherein the workpiece winding device is a winding device that winds the workpiece after setting the workpiece in a horizontal state when winding the workpiece. 4.   The clamp | pulling removal | desorption site | part with which the clamp of the conveyance clamp group with which the said endless belt was equipped was attached to the said folding pulley removably with the movement of an endless belt is provided. A chemical processing apparatus according to 1.   5. A plating apparatus comprising a low-tension heat treatment apparatus between the post-treatment tank and the work winding apparatus of the chemical treatment apparatus according to claim 1. When the workpiece is carried into the chemical treatment tank and plated, at least the upper end is gripped by the end conveyance clamp group and the workpiece surface is plated in a vertical state,
Before winding the work that has been post-treated in the post-treatment tank, the work is subjected to low-tension heat treatment,
The plating method using the plating apparatus according to claim 5, wherein the workpiece subjected to the low-tension heat treatment is wound by a workpiece winding device after the workpiece is leveled.   The plating treatment method according to claim 6, wherein the low-tension heat treatment is a heat treatment in which the plating is recrystallized in a low-tensile state of 5 N or less on a workpiece subjected to plating.

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