JP2012245764A - Thermal head and thermal printer including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To decrease the release of the wiring conductor connected to the electrode wiring of the head base body.SOLUTION: A thermal head X is prepared by combining: a head base body 3 which includes, a substrate 7, a plurality of exoergic parts 9 arranged on the substrate 7, and electrode wirings 17, 19 and 21 provided on the substrates 7 to apply the voltage to the plurality of exoergic parts 9; and a flexible printed circuit boards 5 that includes a wiring substrate 5a, a wiring conductor 5b arranged on the wiring substrate 5a, and electronic parts 32 connected with the wiring conductor 5b, wherein the flexible printed circuit board 5 is arranged on a reinforcing plate 33, a through-hole 36 provided on the flexible printed circuit board 5 and a hole part 38 provided on the reinforcing plate 33 are communicating, and a resin 34 that connects the electronic parts 32 and the flexible printed circuit board 5 are being filled in a through-hole 36 and the hole 38.

Description

  The present invention relates to a thermal head and a thermal printer including the same.

  Conventionally, various thermal heads have been proposed as printing devices such as facsimiles and video printers. For example, a thermal head is known in which a flexible printed circuit board is arranged on a reinforcing plate in a state where a head base body having a plurality of heat generating parts and a flexible printed circuit board having electronic components are connected. A thermal head in which an electronic component on a flexible printed board is sealed with a resin and fixed to the flexible printed board is known (for example, see Patent Document 1).

JP 09-232474 A

  However, when the electronic component is fixed on the flexible printed circuit board with resin, if the stress is applied to the electronic component due to deformation of the flexible printed circuit board, the electronic component is fixed even if the electronic component is fixed on the resin. May peel from the flexible printed circuit board.

  A thermal head of the present invention includes a substrate, a plurality of heat generating portions arranged on the substrate, a head base provided on the substrate and having electrode wiring for applying a voltage to the plurality of heat generating portions, a wiring substrate, A wiring conductor arranged on the wiring board and a flexible printed board including an electronic component connected to the wiring conductor are joined together, and the flexible printed board is arranged on the reinforcing plate. In addition, the through hole provided in the flexible printed circuit board communicates with the hole provided in the reinforcing plate, and the resin for joining the electronic component and the flexible printed circuit board is filled in the through hole and the hole. ing.

  ADVANTAGE OF THE INVENTION According to this invention, the joining of the electronic component provided on the flexible printed circuit board and a flexible printed circuit board can be strengthened.

It is a top view which shows 1st Embodiment of the thermal head of this invention. It is the II-II sectional view taken on the line of the thermal head of FIG. (A) is the III-III schematic sectional drawing of the thermal head of FIG. 1, (b) is a top view which expands and shows A shown in FIG. 1 is a diagram showing a schematic configuration of a first embodiment of a thermal printer of the present invention. It is a top view which shows 2nd Embodiment of the thermal head of this invention. (A) is the III-III schematic sectional drawing of the thermal head of FIG. 5, (b) is a top view which expands and shows A shown in FIG. (A) is a top view which shows the modification of the thermal head shown in FIG. 5, (b) is a top view which shows the modification of the thermal head shown in FIG.

  Hereinafter, a first embodiment of a thermal head of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 3, the thermal head X of the present embodiment includes a radiator 1, a head base 3 disposed on the radiator 1, and a flexible printed circuit board 5 (hereinafter referred to as the head base 3). And FPC5). In the first embodiment, the electronic components provided on the FPC 5 will be described using the determination IC 32.

The radiator 1 is formed in a plate shape and has a rectangular shape in plan view. The radiator 1 is made of, for example, a metal material such as copper or aluminum. In this embodiment, the thermal expansion coefficient is about 23.0 × 10 ⁻⁶ / ° C. As described later, it has a function of radiating a part of heat generated in the heat generating portion 9 of the head base 3 that does not contribute to printing. Further, the head base 3 is bonded to the upper surface of the radiator 1 by a double-sided tape, an adhesive or the like (not shown).

  The head base 3 has a rectangular substrate 7 in plan view, a plurality of (24 in the illustrated example) heating units 9 provided on the substrate 7 and arranged along the longitudinal direction of the substrate 7, and the heating unit 9. And a plurality (three in the illustrated example) of driving ICs 11 arranged side by side on the substrate 7 along the arrangement direction.

The substrate 7 can be formed of an electrically insulating material such as alumina ceramics or a semiconductor material such as single crystal silicon. In the present embodiment, the substrate 7 is made of alumina ceramic and has a thermal expansion coefficient of about 7.3 × 10 ⁻⁶ / ° C. The thickness of the substrate 7 can be set to 0.5 mm to 2 mm, for example.

  A heat storage layer 13 is formed on the upper surface of the substrate 7. The heat storage layer 13 includes a base portion 13a formed on the entire top surface of the substrate 7, and a raised portion 13b extending in a strip shape along the arrangement direction of the plurality of heat generating portions 9 and having a substantially semi-elliptical cross section. Yes. The raised portions 13b act so as to favorably press the recording medium to be printed against a first protective layer 25 described later formed on the heat generating portion 9.

  In addition, the heat storage layer 13 is made of, for example, glass having low thermal conductivity, and temporarily accumulates part of the heat generated in the heat generating part 9 to increase the temperature of the heat generating part 9. The time required is shortened and the thermal response characteristic of the thermal head X is enhanced. The heat storage layer 13 is formed, for example, by applying a predetermined glass paste obtained by mixing a glass powder with an appropriate organic solvent onto the upper surface of the substrate 7 by screen printing or the like, and baking it at a high temperature. Is done.

  As shown in FIGS. 1 and 2, an electrical resistance layer 15 is provided on the upper surface of the heat storage layer 13. The electrical resistance layer 15 is interposed between the heat storage layer 13 and a common electrode wiring 17, an individual electrode wiring 19, and a drive IC-FPC connection wiring 21 which will be described later, and in plan view, as shown in FIG. The common electrode wiring 17, the individual electrode wiring 19, and the drive IC-FPC connection wiring 21 have the same shape (hereinafter referred to as an intervening region) and a plurality (see FIG. 5) exposed between the common electrode wiring 17 and the individual electrode wiring 19. In the example shown, it has 24 areas (hereinafter referred to as exposed areas). In FIGS. 1 and 5, the intervening region of the electric resistance layer 15 is hidden by the common electrode wiring 17, the individual electrode wiring 19, and the drive IC-FPC connection wiring 21.

  Each exposed region of the electrical resistance layer 15 forms the heat generating portion 9 described above. The plurality of exposed regions (heat generating portions 9) are arranged in a row on the raised portions 13b of the heat storage layer 13, as shown in FIGS. For convenience of explanation, the plurality of heat generating portions 9 are illustrated in a simplified manner in FIG. 1, but are arranged at a density of, for example, 180 dpi to 2400 dpi (dot per inch).

  The electric resistance layer 15 is made of a material having a relatively high electric resistance, such as TaN, TaSiO, TaSiNO, TiSiO, TiSiCO, or NbSiO. Therefore, when a voltage is applied between the common electrode wiring 17 and the individual electrode wiring 19 which will be described later and a current is supplied to the heat generating portion 9, the heat generating portion 9 generates heat due to Joule heat generation.

  As shown in FIGS. 1 and 2, the common electrode wiring 17, the plurality of individual electrode wirings 19, and the plurality of driving IC-FPCs are provided on the upper surface of the electric resistance layer 15 (more specifically, the upper surface of the intervening region). Connection wiring 21 is provided. The common electrode wiring 17, the individual electrode wiring 19, and the drive IC-FPC connection wiring 21 are formed of a conductive material, and for example, any one of aluminum, gold, silver, and copper or These alloys are formed.

  The common electrode wiring 17 is for connecting the plurality of heat generating portions 9 and the FPC 5. As shown in FIG. 1, the common electrode wiring 17 includes a main wiring portion 17 a extending along one long side (the left long side in the illustrated example) of the substrate 7, and one and the other short sides of the substrate 7. Extending along each of the two sub-wiring portions 17b whose one end (the left-hand end in the illustrated example) is connected to the main wiring portion 17a, and individually extending from the main wiring portion 17a toward each heat generating portion 9, The front end portion (right end portion in the illustrated example) has a plurality of (24 in the illustrated example) lead portions 17 c connected to the heat generating portions 9. The common electrode wiring 17 is connected in common to the plurality of heat generating portions by connecting the plurality of lead portions 17c to the respective heat generating portions 9 in this way. Further, the other end portion (right end portion in the illustrated example) of each sub wiring portion 17b is not covered with a second protective film 27 described later as shown in FIG. 1, and this other end portion is an FPC 5 described later. The connecting portion 17bs is connected to the wiring conductor 5b. The common electrode wiring 17 is electrically connected between the FPC 5 and each heat generating portion 9 by connecting a connection portion 17bs formed in the sub wiring portion 17b to a wiring conductor 5b described later of the FPC 5. is doing.

  The plurality of individual electrode wirings 19 are for connecting each heat generating part 9 and the drive IC 11. As shown in FIG. 1, each individual electrode wiring 19 has one end portion (left end portion in the illustrated example) connected to the heat generating portion 9 and the other end portion (right end portion in the illustrated example) is disposed on the drive IC 11. In order to be arranged in the region, each heating part 9 individually extends in a band shape toward the arrangement region of the drive IC 11. Then, the other end portion of each individual electrode wiring 19 is connected to the drive IC 11, whereby the heat generating portions 9 and the drive IC 11 are electrically connected. More specifically, the individual electrode wiring 19 divides a plurality of heat generating portions 9 into a plurality of groups (three in the illustrated example), and the heat generating portions 9 of each group are connected to a drive IC 11 provided corresponding to each group. Electrically connected.

  The plurality of drive IC-FPC connection wirings 21 are for connecting the drive IC 11 and the FPC 5. As shown in FIG. 1, each drive IC-FPC connection wiring 21 has one end portion (left end portion in the illustrated example) disposed in the region where the drive IC 11 is disposed, and the other end portion (right end portion in the illustrated example). Is extended in a strip shape so as to be arranged in the vicinity of the other long side of the substrate 7 (the long side on the right side in the illustrated example). As shown in FIGS. 1 and 2, the other end portion of the drive IC-FPC connection wiring 21 is covered with a second protective film 27 described later, like the connection portion 17bs of the sub wiring portion 17b of the common electrode wiring 17. In addition, the other end portion of the drive IC-FPC connection wiring 21 is a connection portion 21s connected to a wiring conductor 5b of the FPC 5 described later. The drive IC-FPC connection wiring 21 has one end connected to the drive IC 11 and the other end (connection portion 21 s) connected to a wiring conductor 5 b (described later) of the FPC 5. And FPC 5 are electrically connected.

More specifically, the plurality of driving IC-FPC connection wirings 21 connected to each driving IC 11 are configured by a plurality of wirings having different functions. Specifically, the plurality of drive IC-FPC connection wires 21 include, for example, an IC power supply wire for supplying a power supply current for operating the drive IC 11, a drive IC 11, and individual electrodes connected to the drive IC 11. A ground electrode wiring for holding the wiring 19 at a ground potential (for example, 0 V to 1 V) and an electric signal for operating the driving IC 11 so as to control an on / off state of a switching element in the driving IC 11 to be described later are supplied. IC control wiring for performing the above.

  As shown in FIG. 1, the drive IC 11 is disposed corresponding to each group of the plurality of heat generating portions 9, and the other end portion (right end portion in the illustrated example) of the individual electrode wiring 19 and the drive IC−. It is connected to one end of the FPC connection wiring 21 (the left end in the illustrated example). This drive IC 11 is for controlling the energization state of each heat generating part 9, and has a plurality of switching elements inside, and is energized when each switching element is in an on state. A well-known thing which becomes a non-energized state in an OFF state can be used.

  Each drive IC 11 is provided with a plurality of switching elements (not shown) therein so as to correspond to each individual electrode wiring 19 connected to each drive IC 11. As shown in FIG. 2, each drive IC 11 has one (left side in the illustrated example) connection terminal 11 a connected to each switching element (not shown) connected to the individual electrode wiring 19. The other connection terminal 11 b (right side in the illustrated example) connected to the switching element is connected to the ground electrode wiring of the driving IC-FPC connection wiring 21. Thereby, when each switching element of the driving IC 11 is in the ON state, the individual electrode wiring 19 connected to each switching element and the ground electrode wiring of the driving IC-FPC connection wiring 21 are electrically connected.

  The electrical resistance layer 15, common electrode wiring 17, individual electrode wiring 19, and drive IC-FPC connection wiring 21 are, for example, a conventionally well-known thin film such as a sputtering method, for example, by forming a material layer constituting each of them on the heat storage layer 13. After sequentially laminating by a molding technique, this laminate is formed by processing it into a predetermined pattern using a conventionally known photoetching or the like.

  As shown in FIGS. 1 and 2, a first protection covering the heat storage layer 13 formed on the upper surface of the substrate 7 covers the heat generating portion 9, a part of the common electrode wiring 17 and a part of the individual electrode wiring 19. Layer 25 is formed. In the example of illustration, this 1st protective layer 25 is provided so that the area | region on the left side of the upper surface of the thermal storage layer 13 may be covered. The first protective layer 25 is formed by corroding the area covered with the heat generating portion 9, the common electrode wiring 17 and the individual electrode wiring 19 due to adhesion of moisture or the like contained in the atmosphere, or contact with a recording medium to be printed. It is intended to protect against wear. The first protective layer 25 can be formed of a material such as SiC, SiN, SiO, and SiON, for example. The first protective layer 25 can be formed by using a conventionally well-known thin film forming technique such as a sputtering method or a vapor deposition method, or a thick film forming technique such as a screen printing method. The first protective layer 25 may be formed by laminating a plurality of material layers.

  Further, as shown in FIG. 1, the second protection that partially covers the common electrode wiring 17, the individual electrode wiring 19, and the drive IC-FPC connection wiring 21 on the heat storage layer 13 formed on the upper surface of the substrate 7. A layer 27 is provided. In the example of illustration, this 2nd protective layer 27 is provided so that the area | region on the right side rather than the 1st protective layer 25 of the upper surface of the thermal storage layer 13 may be covered. The second protective layer 27 is formed by oxidizing the region covered with the common electrode wiring 17, the individual electrode wiring 19 and the drive IC-FPC connection wiring 21 by contact with the atmosphere or adhesion of moisture contained in the atmosphere. It is intended to protect against corrosion. The second protective layer 27 is formed so as to overlap the end portion of the first protective layer 25 as shown in FIG. 2 in order to more reliably protect the common electrode wiring 17 and the individual electrode wiring 19. . The 2nd protective layer 27 can be formed with resin materials, such as an epoxy resin and a polyimide resin, for example. The second protective layer 27 can be formed using a thick film forming technique such as a screen printing method.

Note that the end of the sub-wiring portion 17b of the common electrode wiring 17 that connects the FPC 5 (the connecting portion 17bs).
) And the end portion (connecting portion 21s) of the drive IC-FPC connection wiring 21 are exposed from the second protective layer 27 so that the FPC 5 is connected as will be described later.

  The second protective layer 27 is formed with openings (not shown) for exposing the end portions of the individual electrode wiring 19 and the driving IC-FPC connection wiring 21 that connect the driving IC 11. These wirings are connected to the drive IC 11 via the unit. Further, the drive IC 11 is connected to the individual electrode wiring 19 and the drive IC-FPC connection wiring 21 to protect the drive IC 11 itself and to protect the connection portion between the drive IC 11 and these wirings. It is sealed by being covered with a covering member 29 made of a resin such as silicon resin.

  As shown in FIG. 1, the FPC 5 extends along the edge of the substrate 7 of the head base 3, and is connected to the sub-wiring portion 17b of the common electrode wiring 17 and each driving IC-FPC connection wiring 21 as described above. ing. The FPC 5 is a well-known one in which a plurality of wiring conductors 5b are wired inside an insulating resin layer 5a, and each wiring conductor 5b is electrically connected to an external power supply device and control device (not shown) via a connector 31. Connected. Such a wiring conductor 5b is generally formed of, for example, a metal foil such as a copper foil, a conductive thin film formed by a thin film forming technique, or a conductive thick film formed by a thick film printing technique. In addition, the wiring conductor 5b formed of a metal foil, a conductive thin film, or the like is patterned by, for example, partially etching these by photoetching or the like.

More specifically, in the FPC 5, each wiring conductor 5b formed inside the insulating resin layer 5a is exposed at the end on the head base 3 side. In the present embodiment, the resin layer 5a is made of polyimide resin, and the wiring conductor 5b is made of copper. The thickness of the wiring conductor 5b can be set to 15 μm to 40 μm, for example. The thermal expansion coefficient of the FPC 5 as a whole is about 25 × 10 ⁻⁶ / ° C. Each wiring conductor 5b is formed of a conductive bonding material, for example, a bonding material (not shown) made of a solder material or an anisotropic conductive material (ACF) in which conductive particles are mixed in an electrically insulating resin. To the connection portion 17bs of the sub-wiring portion 17b of the common electrode wiring 17 and the connection portion 21s of each drive IC-FPC connection wiring 21.

  The wiring conductor 5b is connected to a connector 31 fixed to a surface opposite to the surface to which the FPC 5 is bonded in the reinforcing plate 33 described later by a connection terminal (not shown) penetrating the reinforcing plate 33 described later. Yes.

  When each wiring conductor 5b of the FPC 5 is electrically connected to an external power supply device and control device (not shown) via the connector 31, the common electrode wiring 17 is held at a positive potential (for example, 20V to 24V). The individual electrode wiring 19 is held at a ground potential (for example, 0 V to 1 V) via the ground electrode wiring of the driving IC 11 and the driving IC-FPC connection wiring 21. It is electrically connected to the negative terminal of the power supply device. For this reason, when the switching element of the driving IC 11 is in the on state, a voltage is applied to the heat generating portion 9 and the heat generating portion 9 generates heat.

Similarly, when each wiring conductor 5b of the FPC 5 is electrically connected to an external power supply device and control device (not shown) via the connector 31, the IC power supply wiring of the driving IC-FPC connection wiring 21 is As with the common electrode wiring 17, it is electrically connected to the positive terminal of the power supply device held at a positive potential. As a result, a power supply current for operating the drive IC 11 is supplied to the drive IC 11 by the potential difference between the IC power supply wiring and the ground electrode wiring of the drive IC-FPC connection wiring 21 to which the drive IC 11 is connected. Further, the IC control wiring of the driving IC-FPC connection wiring 21 is electrically connected to an external control device that controls the driving IC 11. As a result, the electrical signal transmitted from the control device is supplied to the drive IC 11. By operating the drive IC 11 so as to control the on / off state of each switching element in the drive IC 11 by this electric signal, each heat generating portion 9 can be selectively heated.

As shown in FIGS. 2 and 3, a reinforcing plate 33 is provided between the FPC 5 and the radiator 1. The reinforcing plate 33 can be formed of an organic resin such as a polyimide resin or a glass epoxy resin, for example. Moreover, in this embodiment, the reinforcement board 33 is formed with the glass epoxy resin, and the thermal expansion coefficient is about 20 * 10 < ^-6 > / ^degreeC . The thickness of the reinforcing plate 33 is, for example, 0.6 mm to 1.6 mm. The reinforcing plate 33 acts to reinforce the FPC 5 by being adhered to the lower surface of the FPC 5 by an adhesive layer (not shown) such as a double-sided tape or an adhesive.

  Further, the reinforcing plate 33 has a surface (the lower surface in FIGS. 3 and 4) facing the radiator 1 adhered to the upper surface of the radiator 1 with a double-sided tape, an adhesive, or the like (not shown). Yes. Thereby, the FPC 5 is fixed on the heat radiating body 1 via the reinforcing plate 33.

  A discrimination IC 32 is fixed on the surface of the FPC 5 with a resin 34. As shown in FIG. 3, the FPC 5 has a through hole 36 closer to the head base 3 than the discrimination IC 32, and the through hole 36 is provided in communication with a hole 38 provided in the reinforcing plate 33. . The through hole 36 and the hole 38 are filled with a resin 34, and the discrimination IC 32 and the FPC 5 are joined by the resin 34.

  The discrimination IC 32 stores data peculiar to each head base 3 such as resistance value data of the head base 3 in the memory of the discrimination IC 32, and the thermal head X has when the thermal head X is activated or activated. It has a function of determining whether or not the head substrate 3 is a predetermined one.

  As shown in FIG. 3B, the through hole 36 is provided in the vicinity of the discrimination IC 32, and is provided at a position corresponding to the central portion of the discrimination IC 32. By providing the diameter of the through hole 36 smaller than the determination IC 32, it is possible to suppress the strength of the FPC 5 from being lowered.

  As shown in FIG. 3A, the hole 38 provided in the reinforcing plate 33 is provided with an opening 38a having the same size as the diameter of the through hole 36, and is provided so as to cut out the inside of the reinforcing plate 33. It has been. In other words, the reinforcing plate 33 has the hole 38 cut out in a cylindrical shape.

  Then, in plan view, the resin 34 is disposed at both ends of the discrimination IC 32 in the arrangement direction of the heat generating portions 9, the head base 3 side, and the space between the discrimination IC 32 and the FPC 5. And are joined. Since both ends of the heat generating portion 9 in the arrangement direction are joined by the resin 34, a terminal that electrically connects the determination IC 32 and the wiring conductor 5b of the FPC 5 can be sealed, and damage to the terminal is suppressed. be able to.

  Further, the resin 34 is filled in the through hole 36 of the FPC 5 and the hole 38 of the reinforcing plate 33, and the resin 34 filled in the through hole 36 of the FPC 5 and the hole 38 of the reinforcing plate 33 generates heat of the discrimination IC 32. It is integrally provided with a resin 34 that joins both ends of the portion 9 in the arrangement direction and the three sides on the head base 3 side.

The resin 34 can be formed of an organic resin material such as an epoxy resin or a urethane resin that forms the second protective layer 27 described above. Further, a resin that shrinks when cured by applying heat may be used. That is, by using a resin having a high curing shrinkage rate, the bonding strength of the discrimination IC 32 to the FPC 5 can be improved when cured. Examples of the resin having a high cure shrinkage include a two-component epoxy resin or a urethane resin.

  A method of joining the discrimination IC 32 using the resin 34 will be described. The through hole 36 is provided in the FPC 5 by, for example, laser irradiation, and the hole 38 is provided in the reinforcing plate 33 by, for example, cutting. And FPC5 is arrange | positioned on the reinforcement board 33 so that the through-hole 36 and the reinforcement board 38 may communicate, for example, FPC5 and the reinforcement board 33 are joined with a double-sided tape.

  Next, a resin is applied to the three sides of the discrimination IC 32 by a dispenser, for example. By applying from three directions, air can escape from the connector 31 side of the discrimination IC 32 in which the resin 32 is not provided, and bubbles are generated in the resin filled between the discrimination IC 32 and the resin 34. The possibility can be reduced. Thereby, the possibility that the discrimination IC 32 is damaged or the discrimination IC 32 is peeled off due to the expansion of the bubbles formed in the resin 34 due to the heat generated when the thermal head is operated can be reduced.

  According to the thermal head according to the first embodiment of the present invention, the through hole 36 provided in the FPC 5 and the hole 38 provided in the reinforcing plate 33 communicate with each other, and the discrimination IC 32 and the FPC 5 are joined. Since the resin 34 to be filled is filled in the through hole 36 and the hole 38, the resin 34 and the reinforcing plate 33 are firmly bonded. As a result, the discrimination IC 32 disposed on the FPC 5 is firmly bonded to the thermal head. Therefore, the possibility that the discrimination IC 32 is peeled off can be reduced.

  Further, since the determination IC 32 is fixed by the both ends in the arrangement direction of the heat generating portions 9 and the three sides on the head base 3 side in a plan view, for example, an external force is applied to the determination IC 32 in the arrangement direction of the heat generating portions 9. However, it is possible to suppress the separation of the determination IC 32. Further, even if an external force is applied in a direction perpendicular to the arrangement direction of the heat generating portions 9, it is possible to prevent the determination IC 32 from peeling off. Thereby, since the bonding between the determination IC 32 and the FPC 5 is strong, the possibility of the determination IC 32 peeling off can be reduced.

  Since the through hole 36 and the hole 38 are provided on the head base 3 side of the discrimination IC 32, the resin 34 does not have to be arranged in the region of the discrimination IC 32 on the connector 31 side. Since the necessary area is eliminated, the thermal head X can be reduced in size.

  In the first embodiment, an example in which a flexible printed board made of an organic resin is used as the FPC 5 has been described. However, a board made of an inorganic material such as ceramics or glass may be used. 3 shows an example in which the hole 38 does not penetrate the radiator 33, the hole 38 may penetrate the reinforcing plate 33. By providing the hole 38 so as to penetrate the reinforcing plate 33, the resin 34 is arranged up to the surface of the radiator 1 located below the reinforcing plate 33. Thereby, the joint strength between the discrimination IC 32 and the FPC 5 can be further increased.

  In addition, although it is expressed that the hole 34 is filled with the resin 34, there may be a space where the hole 38 is not filled with the resin.

  In addition, in 1st Embodiment, although the hole part 38 showed about the example which has comprised the circular shape by planar view, it is not limited to this. For example, the hole 38 may have a triangular shape or a quadrangular shape in plan view, or may have an elliptical shape. From the viewpoint of easily filling the hole 34 with the resin 34 without a gap, a circular shape without corners is preferable.

Next, an embodiment of the thermal printer of the present invention will be described with reference to FIG.
FIG. 4 is a schematic configuration diagram of the thermal printer Z of the present embodiment.

  As shown in FIG. 4, the thermal printer Z of the present embodiment includes the thermal head X, the transport mechanism 40, the platen roller 50, the power supply device 60, and the control device 70 described above. The thermal head X is attached to an attachment surface 80a of an attachment member 80 provided in the casing of the thermal printer Z. In the thermal head X, the arrangement direction of the heat generating portions 9 is a direction perpendicular to the conveyance direction S of the recording medium P, which will be described later, in other words, the main scanning direction, and in FIG. Thus, it is attached to the attachment member 80.

  The transport mechanism 40 transports a recording medium P such as thermal paper or image receiving paper onto which ink is transferred in the direction of arrow S in FIG. 4, and more specifically on the plurality of heating portions 9 of the thermal head X, more specifically, the protective film 25. It is for carrying up, and has carrying rollers 43, 45, 47, and 49. The transport rollers 43, 45, 47, and 49 are formed by, for example, covering cylindrical shaft bodies 43a, 45a, 47a, and 49a made of metal such as stainless steel with elastic members 43b, 45b, 47b, and 49b made of butadiene rubber or the like. Can be configured. Although not shown, when the recording medium P is an image receiving paper to which ink is transferred, an ink film is transported together with the recording medium P between the recording medium P and the heat generating portion 9 of the thermal head X. Yes.

  The platen roller 50 is for pressing the recording medium P onto the heat generating portion 9 of the thermal head X, and is arranged so as to extend along a direction orthogonal to the conveyance direction S of the recording medium P. Both ends are supported so as to be rotatable while being pressed on the heat generating portion 9. The platen roller 50 can be configured by, for example, covering a cylindrical shaft body 50a made of metal such as stainless steel with an elastic member 50b made of butadiene rubber or the like.

  In the present embodiment, the width of the recording medium P is larger than the length of the raised portion 13b of the heat storage layer 13 in the thermal head X. In addition, the length of the platen roller 50, more specifically, the length of the elastic member 50b is longer than the length of the raised portion 13b of the heat storage layer 13 in the thermal head X.

  The power supply device 60 is for supplying a current for causing the heat generating part 9 of the thermal head X to generate heat and a current for operating the drive IC 11 as described above. The control device 70 is for supplying the drive IC 11 with a control signal for controlling the operation of the drive IC 11 in order to selectively heat the heat generating portion 9 of the thermal head X as described above.

  As shown in FIG. 4, the thermal printer Z of the present embodiment conveys the recording medium P onto the heat generating portion 9 by the conveying mechanism 40 while pressing the recording medium onto the heat generating portion 9 of the thermal head X by the platen roller 50. However, it is possible to perform predetermined printing on the recording medium P by selectively causing the heat generating unit 9 to generate heat by the power supply device 60 and the control device 70. In the case where the recording medium P is an image receiving paper or the like, although not shown, printing on the recording medium P can be performed by thermally transferring the ink of the ink film conveyed together with the recording medium P to the recording medium P.

  A second embodiment of the present invention will be described with reference to FIGS. In the thermal head X according to the second embodiment, the connector 31 is joined at two positions on both ends of the FPC 5, and the discrimination IC 32 is arranged at the center in the arrangement direction of the heat generating portions 9 of the FPC 5. In addition, a through hole 36 and a hole 38 are provided below the determination IC 32.

  As shown in FIG. 6, the diameter of the hole 38 increases as it goes toward the inside of the reinforcing plate 33 in plan view. In other words, the hole 38 has a trapezoidal shape when viewed in cross section. Thereby, the bonding of the discrimination IC 32 can be strengthened by the resin 34 in the region outside the opening 38 a of the hole 38.

  Moreover, in 2nd Embodiment, the protrusion part 1b which made the heat radiator 1 protrude is used as the reinforcement board 33. FIG. Thereby, the heat radiator 1 and the reinforcing plate 33 can be provided integrally, and the number of parts constituting the thermal head X can be reduced.

  As shown in FIG. 6B, the resin 34 is disposed at both end portions in the arrangement direction of the heat generating portions 9. The through hole 36 and the hole 38 provided below the discrimination IC 32 are filled with the resin 34, and the discrimination IC 32 and the FPC 5 are joined.

  According to the second embodiment, since the discrimination IC 32 is provided at the center in the arrangement direction of the heat generating parts 9 of the FPC 5 by the through hole 36 and the hole 38, the FPC 5 due to the heat when the thermal head X is operated. This deformation is fixed at the central portion in the arrangement direction of the heat generating portions 9 of the FPC 5. Therefore, it is possible to reduce stress generated at both ends of the FPC 5 having a particularly large deformation amount.

  Further, in plan view, the diameter of the hole portion 38 increases as it goes toward the inside of the reinforcing plate 33, so that the resin 34 is peeled off from the reinforcing plate 33 by the resin 34 positioned outside the opening 28 a of the hole portion 38. It becomes difficult. Therefore, it can suppress that discrimination | determination IC32 peels from FPC5.

  In addition, when the diameter of the hole portion 38 is increased toward the inside of the reinforcing plate 33 and the diameter of the opening 28a of the hole portion 38 is larger than the diameter of the through hole 26, the bonding strength between the resin 34 and the FPC 5 is further increased. be able to.

  Moreover, although the example which provided the heat radiator 1 and the reinforcement board 33 integrally was shown, you may provide the heat radiator 1 and the reinforcement board 33 as a different body. In that case, the hole 38 may be provided in the heat radiating body 1 so as to communicate with the hole 38 by providing the hole 38 penetrating the reinforcing plate 33. That is, the hole 38 may be provided through the reinforcing plate 33 and extending to the radiator 1. By providing the hole 38 up to the radiator 1, the bonding strength of the discrimination IC 32 can be further increased, and peeling of the discrimination IC 32 can be suppressed.

  When the hole 38 is provided in the reinforcing plate 33 and the radiator 1, the opening 28 a of the hole 38 provided in the radiator 1 is made larger than the opening 28 a of the hole 38 provided in the reinforcing plate 33. The bonding strength of the resin 34 can be increased. Further, the shape of the hole 38 provided in the reinforcing plate 33 may be a columnar shape, and the shape of the hole 38 provided in the radiator 1 may be trapezoidal when viewed in cross section. Even in this case, the bonding strength of the resin 34 can be increased.

  As mentioned above, although one Embodiment of this invention was described, this invention is not limited to the said embodiment, A various change is possible unless it deviates from the meaning.

  For example, as shown in FIG. 7A, a housing part 38 b may be provided in the reinforcing plate 33 so as to communicate with the hole part 38. In plan view, by placing the accommodating portion 38 b outside the hole portion 38 and filling the resin 34, the bonding strength between the reinforcing plate 33 and the resin 34 can be increased. It becomes difficult to peel. Thereby, the joint strength between the discrimination IC 32 and the FPC 5 can be increased. Further, by providing the accommodating portion 38 b on the back surface of the reinforcing plate 33, the accommodating portion 38 b can be easily provided on the reinforcing plate 33.

Further, when the reinforcing plate 33 and the radiator 1 are provided integrally, the accommodating portion 38 b may be provided inside the radiator 1. Thereby, the joint strength between the heat radiator 1 and the resin 34 can be increased. Further, when the reinforcing plate 33 and the heat radiating body 1 are provided separately, the accommodating portion 38 b may be provided on the upper surface of the heat radiating body 1. Even in that case, the bonding strength between the reinforcing plate 33 and the resin 34 can be increased.

  The accommodating part 38b should just be provided in the outer side rather than the hole 38 in planar view, The shape is not limited. For example, it may be circular or rectangular in plan view.

  Further, as shown in FIG. 7B, the head base 3 and the reinforcing plate 33 are juxtaposed with a predetermined space 39, and the reinforcing plate 33 has a communication portion 38 c that communicates with the space 39. The communication portion 38c and the space 39 may be filled with the resin 34. Even in this case, since the communication portion 38c increases the bonding strength between the resin 34 and the reinforcing plate 33, the bonding strength between the determination IC 32 and the FPC 5 can be increased. Further, since the space 39 is filled with the resin 34, the bonding strength between the reinforcing plate 33 and the substrate 7 can be increased. For this reason, the reinforcing plate 33 is firmly fixed to the substrate 7, whereby the FPC 5 and the substrate 7 are fixed. As a result, the determination IC 32 is firmly bonded to the thermal head X.

  7B shows an example in which the space 39 and the hole 38 communicate with each other through one communication portion 38c. However, the space 39 and the hole 38 communicate with each other by a plurality of communication portions 38c. It may be. Even in that case, since the reinforcing plate 33 and the resin 4 are joined by the plurality of communication portions 38c, the joining strength between the discrimination IC 32 and the reinforcing plate 33 can be improved.

  In the thermal head X shown in FIG. 5, one reinforcing plate 33 is bonded to one FPC 5. However, the present invention is not limited to this, and the number of reinforcing plates 33 bonded to one FPC 5 is arbitrary. Can be a number of.

  In addition, although it demonstrated using discrimination | determination IC32 as an example of the electronic component provided on FPC5, it is not limited to this. Examples of the electronic component include a drive IC, a resistor, and a capacitor. Also in these electronic components, the through hole 36 provided in the FPC 5 and the hole 38 provided in the reinforcing plate 33 communicate with each other, and the resin 34 that joins the electronic component and the FPC 5 includes the through hole 36 and By providing the hole 38 so as to be filled, it is possible to reduce the possibility that the FPC 5 and the electronic component are separated.

X Thermal Head 1 Heat Dissipator 3 Head Base 5 Flexible Printed Circuit Board 5a Resin Layer 5b Wiring Conductor 7 Substrate 9 Heating Section 11 Drive IC
17 Common electrode wiring 19 Individual electrode wiring 21 Drive IC-FPC connection wiring 32 Discrimination IC
33 Reinforcing plate 34 Resin 36 Through hole 38 Hole portion 38b Housing portion 38c Communication portion 39 Space

Claims (6)

A head base having a substrate, a plurality of heat generating portions arranged on the substrate, and an electrode wiring provided on the substrate for applying a voltage to the plurality of heat generating portions;
In a thermal head in which a wiring board, a wiring conductor arranged on the wiring board, and a flexible printed board including an electronic component connected to the wiring conductor are joined, and the flexible printed board is arranged on a reinforcing plate ,
A through hole provided in the flexible printed circuit board communicates with a hole provided in the reinforcing plate, and a resin that joins the electronic component and the flexible printed circuit board includes the through hole and the hole. A thermal head characterized in that the part is filled.   The thermal head according to claim 1, wherein the electronic component is disposed at a central portion in the arrangement direction of the heat generating portions.   3. The thermal head according to claim 1, wherein a diameter of the hole portion in a plan view increases as it goes toward the inside of the reinforcing plate. The reinforcing plate has an accommodating portion communicating with the hole portion;
The thermal head according to any one of claims 1 to 3, wherein the housing portion is positioned outside the hole portion in plan view and is filled with the resin. The head base and the reinforcing plate are juxtaposed via a predetermined space,
The thermal head according to any one of claims 1 to 4, wherein the reinforcing plate includes a communication portion that communicates with the space, and the communication portion and the space are filled with the resin. A thermal printer comprising: the thermal head according to claim 1; and a transport mechanism that transports a recording medium to the plurality of heat generating units.

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