JP2012240099A5 - - Google Patents

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Publication number
JP2012240099A5
JP2012240099A5 JP2011114374A JP2011114374A JP2012240099A5 JP 2012240099 A5 JP2012240099 A5 JP 2012240099A5 JP 2011114374 A JP2011114374 A JP 2011114374A JP 2011114374 A JP2011114374 A JP 2011114374A JP 2012240099 A5 JP2012240099 A5 JP 2012240099A5
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JP
Japan
Prior art keywords
gas
containing liquid
liquid
processing
processed
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JP2011114374A
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English (en)
Japanese (ja)
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JP2012240099A (ja
JP5809445B2 (ja
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Priority claimed from JP2011114374A external-priority patent/JP5809445B2/ja
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Publication of JP2012240099A5 publication Critical patent/JP2012240099A5/ja
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Publication of JP5809445B2 publication Critical patent/JP5809445B2/ja
Expired - Fee Related legal-status Critical Current
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JP2011114374A 2011-05-23 2011-05-23 レーザ処理装置及び方法 Expired - Fee Related JP5809445B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011114374A JP5809445B2 (ja) 2011-05-23 2011-05-23 レーザ処理装置及び方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011114374A JP5809445B2 (ja) 2011-05-23 2011-05-23 レーザ処理装置及び方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015179649A Division JP5992081B2 (ja) 2015-09-11 2015-09-11 レーザ処理装置

Publications (3)

Publication Number Publication Date
JP2012240099A JP2012240099A (ja) 2012-12-10
JP2012240099A5 true JP2012240099A5 (https=) 2014-07-03
JP5809445B2 JP5809445B2 (ja) 2015-11-10

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Family Applications (1)

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JP2011114374A Expired - Fee Related JP5809445B2 (ja) 2011-05-23 2011-05-23 レーザ処理装置及び方法

Country Status (1)

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JP (1) JP5809445B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6125261B2 (ja) * 2013-02-12 2017-05-10 三菱重工業株式会社 ウォータジェットピーニング圧縮残留応力試験方法
JP5997804B1 (ja) * 2015-06-03 2016-09-28 株式会社Ihi 表面処理装置
JP6571711B2 (ja) 2017-04-03 2019-09-04 ファナック株式会社 レーザ装置
JP7165079B2 (ja) * 2019-03-12 2022-11-02 日本タングステン株式会社 加工用クーラント供給機構、および、加工用クーラントの供給方法
DE102024126478A1 (de) * 2024-09-13 2026-03-19 LIDROTEC GmbH Laserbearbeitungsvorrichtung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5057184A (en) * 1990-04-06 1991-10-15 International Business Machines Corporation Laser etching of materials in liquids
JPH06333910A (ja) * 1993-05-27 1994-12-02 Nippondenso Co Ltd レーザによるエッチング方法
JPH11145108A (ja) * 1997-11-05 1999-05-28 Denso Corp 微細加工方法および微細加工装置
JP2005324238A (ja) * 2004-05-17 2005-11-24 Toyota Motor Corp レーザ加工方法および装置
JP2011088799A (ja) * 2009-10-26 2011-05-06 Mitsubishi Electric Corp 半導体装置の製造方法およびレーザー加工装置

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