JP2012238799A - 高周波回路モジュール - Google Patents
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Abstract
【解決手段】アンテナ素子2で送受信される無線通信用の高周波信号を処理するIC素子4、アンテナ素子2とのインピーダンスマッチング用のRF回路3、IC素子4に電源を供給するための電源回路5を含み、RF回路3および電源回路5はいずれも表面実装部品32,561を備えているとともに、RF回路は磁性体基板を素体としてその内部にコイル素子を含むインダクタ基板31を備え、これらがいずれもコア基板6の表面に搭載され、かつ、インダクタ基板31がRF回路3を構成する表面実装部品32と電源回路5を構成する表面実装部品51との間に設けられた構成とする。
【選択図】図2
Description
なお、無線通信用のIC素子は、リーダライタとしての機能をつかさどるもので、信号処理回路、メモリ回路、制御回路などを有している。
また、RF回路ではマッチング用のコンデンサやインダクタが用いられており、電源回路では主にバイパスコンデンサが用いられている。
そのため、高周波回路モジュールを構成する電源回路やRF回路も互いに近接配置された状態となる傾向にある。
アンテナ素子を介して送受信される無線通信用の高周波信号を処理するIC素子、前記アンテナ素子とのインピーダンスマッチングのためのインピーダンスマッチング回路を含むRF回路、このIC素子に電源を供給するための電源回路がコア基板に一体化して設けられた高周波回路モジュールであって、
前記RF回路および前記電源回路はいずれも表面実装部品を備えているとともに、前記RF回路は磁性体基板を素体としてその内部にコイル素子を含むインダクタ基板を備え、
前記RF回路を構成する前記インダクタ基板と前記表面実装部品、および前記電源回路を構成する前記表面実装部品がいずれも前記コア基板の表面に搭載され、かつ、
前記インダクタ基板は、前記RF回路を構成する表面実装部品と前記電源回路を構成する表面実装部品との間に配設されていることを特徴としている。
なお、この場合の整合回路素子としては、例えばLC並列共振回路やLC直列共振回路、π型回路、T型回路などが適用される。
そして、このインダクタ基板31によって左右に隔てられた2つの領域のうち、一方の領域には、RF回路3におけるキャパシタンス素子C11〜C14、および抵抗素子R2,R3などを構成する表面実装部品32が搭載され、他方の領域には、電源回路5におけるキャパシタンス素子C1〜C10、および抵抗素子R1などを構成する表面実装部品51が搭載されている。
そして、これらの表面実装部品32,51は、コア基板6に設けられた表面電極61にハンダなどの導電性接合材を介して電気的に接続されている。
また、コア基板6の下面には、このコア基板6を図示しないプリント配線板などのマザーボードに搭載する際に電気的接続を行うための裏面電極62が設けられている。
2 アンテナ素子
3 RF回路
4 IC素子
5 電源回路
6 コア基板
31 インダクタ基板
32 RF回路を構成する表面実装部品
41 IC素子の端子面
51 電源回路を構成する表面実装部品
61 コア基板に設けられた表面電極
62 コア基板に設けられた裏面電極
63,64 配線導体
65 グランド導体
66 凹部(キャビティ)
311 磁性体層
312 導電性パターン
L1,L2 コイル素子
P11 コイルL1の入力端子
P12 コイルL1の出力端子
P21 コイルL2の入力端子
P22 コイルL2の出力端子
Z 巻回軸
a インダクタ基板の一対の対向辺間の距離(寸法)
b インダクタ基板の他の一対の対向辺間の距離(寸法)
Claims (5)
- アンテナ素子を介して送受信される無線通信用の高周波信号を処理するIC素子、前記アンテナ素子とのインピーダンスマッチングのためのインピーダンスマッチング回路を含むRF回路、このIC素子に電源を供給するための電源回路がコア基板に一体化して設けられた高周波回路モジュールであって、
前記RF回路および前記電源回路はいずれも表面実装部品を備えているとともに、前記RF回路は磁性体基板を素体としてその内部にコイル素子を含むインダクタ基板を備え、
前記RF回路を構成する前記インダクタ基板と前記表面実装部品、および前記電源回路を構成する前記表面実装部品がいずれも前記コア基板の表面に搭載され、かつ、
前記インダクタ基板は、前記RF回路を構成する表面実装部品と前記電源回路を構成する表面実装部品との間に配設されていることを特徴とする高周波回路モジュール。 - 前記インダクタ基板は、前記コア基板の表面に、前記コア基板の互いに対向する一方端部から他方端部に至るように配設されており、かつ、
前記コア基板の表面の、前記インダクタ基板により隔てられ、前記インダクタ基板を介して対向する2つの領域のうち、一方の領域に前記RF回路を構成する表面実装部品が搭載され、他方の領域に前記電源回路を構成する表面実装部品が搭載されていることを特徴とする請求項1に記載の高周波回路モジュール。 - 前記IC素子は、前記コア基板に内蔵されていることを特徴とする請求項1または2記載の高周波回路モジュール。
- 前記コア基板は、熱可塑性樹脂からなる複数の誘電体層を積層してなる多層基板であることを特徴とする請求項1〜3のいずれかに記載の高周波回路モジュール。
- 前記コア基板を構成する複数の前記誘電体層のうち、少なくとも一層の誘電体層には前記RF回路を構成する配線導体、前記電源回路を構成する配線導体、および接地用のグランド導体がそれぞれ設けられており、かつ、前記グランド導体により隔てられた2つの領域のうち、一方の領域に前記RF回路を構成する配線導体が配設され、他方の領域に前記電源回路を構成する配線導体が配設されていることを特徴とする請求項4に記載の高周波回路モジュール。
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US10608682B2 (en) | 2017-03-14 | 2020-03-31 | Murata Manufacturing Co., Ltd. | Radio frequency module |
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JP2009246266A (ja) * | 2008-03-31 | 2009-10-22 | Shindengen Electric Mfg Co Ltd | インダクタおよび表面実装型デバイス |
JP2010177559A (ja) * | 2009-01-30 | 2010-08-12 | Taiyo Yuden Co Ltd | 電子部品、およびその製造方法 |
JP2010238925A (ja) * | 2009-03-31 | 2010-10-21 | Tdk Corp | 電子部品内蔵モジュール |
JP2010238951A (ja) * | 2009-03-31 | 2010-10-21 | Tdk Corp | 電子部品モジュール |
JP2011054585A (ja) * | 2009-08-31 | 2011-03-17 | Murata Mfg Co Ltd | インダクタおよびdc−dcコンバータ |
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JP2009246266A (ja) * | 2008-03-31 | 2009-10-22 | Shindengen Electric Mfg Co Ltd | インダクタおよび表面実装型デバイス |
JP2010177559A (ja) * | 2009-01-30 | 2010-08-12 | Taiyo Yuden Co Ltd | 電子部品、およびその製造方法 |
JP2010238925A (ja) * | 2009-03-31 | 2010-10-21 | Tdk Corp | 電子部品内蔵モジュール |
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JP2011054585A (ja) * | 2009-08-31 | 2011-03-17 | Murata Mfg Co Ltd | インダクタおよびdc−dcコンバータ |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US10608682B2 (en) | 2017-03-14 | 2020-03-31 | Murata Manufacturing Co., Ltd. | Radio frequency module |
US10911080B2 (en) | 2017-03-14 | 2021-02-02 | Murata Manufacturing Co., Ltd. | Radio frequency module |
US11201633B2 (en) | 2017-03-14 | 2021-12-14 | Murata Manufacturing Co., Ltd. | Radio frequency module |
US11476878B2 (en) | 2017-03-14 | 2022-10-18 | Murata Manufacturing Co., Ltd. | Radio frequency module |
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