JP2012231063A - Substrate bonding apparatus, substrate bonding method, and overlapped substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem that external vibrations are transmitted to a stage supporting a substrate through a driving part.SOLUTION: A substrate bonding apparatus includes: a first stage supporting a first substrate from among multiple substrates; a second stage disposed so as to face the first stage and supporting a second substrate from among the multiple substrate; a decompression unit having a decompression chamber enclosing at least the first substrate and the second substrate which are respectively supported by the first stage and the second stage; a frame preventing vibrations from being transmitted from the decompression unit and supporting the first stage and the second stage; a driving part having a movable element fixed to one of the first stage and the second stage and a stator fixed to the decompression unit and relatively moving the first stage and the second stage.

Description

  The present invention relates to a substrate bonding apparatus, a substrate bonding method, and an overlapping substrate.

There is known a substrate bonding apparatus and a substrate bonding method in which at least one of a plurality of substrates is moved and bonded by a driving unit (for example, see Patent Document 1).
[Prior art documents]
[Patent Literature]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2005-302858

  However, when the substrate is driven by the drive unit, there is a problem that external vibration is transmitted to the stage that supports the substrate via the drive unit.

  In the first aspect of the present invention, a first stage that supports a first substrate among a plurality of substrates, and a second stage that is disposed to face the first stage and supports a second substrate among the plurality of substrates. A second stage, a decompression unit having a decompression chamber surrounding the first substrate and the second substrate supported by at least the first stage and the second stage, and vibration isolation from the decompression unit, A frame that supports the first stage and the second stage; a mover fixed to one of the first stage and the second stage; and a stator fixed to the decompression unit; Provided is a substrate bonding apparatus including a drive unit that relatively moves a stage and the second stage.

  In the second aspect of the present invention, the first stage held by the frame that is isolated from the decompression chamber of the decompression unit supports the first substrate among the plurality of substrates, and is held by the frame. And a second stage disposed to face the first stage supports a second substrate of the plurality of substrates, and is supported by at least the first stage and the second stage. Depressurizing the decompression chamber surrounding the first substrate and the second substrate, a mover fixed to one of the first stage and the second stage, and a stator fixed to the decompression unit; And a driving unit that relatively moves the first stage and the second stage, and a step of bringing one of the first stage and the second stage close to each other.

  In the third aspect of the present invention, the first stage held by the frame that is isolated from the decompression chamber of the decompression unit supports the first substrate among the plurality of substrates and is held by the frame. And a second stage disposed to face the first stage supports a second substrate of the plurality of substrates, and is supported by at least the first stage and the second stage. The decompression chamber surrounding the substrate and the second substrate is decompressed, and a mover fixed to one of the first stage and the second stage and a stator fixed to the decompression unit are provided. A driving unit that relatively moves the first stage and the second stage provides an overlapped substrate manufactured by bringing one of the first stage and the second stage close to each other.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a whole block diagram of a board | substrate bonding apparatus. It is a whole block diagram of an alignment joining apparatus. It is an enlarged view of the upper part of an alignment joining apparatus. It is a schematic plan view explaining arrangement | positioning of a drive part. It is an enlarged side view near a lower heating part. It is the schematic explaining the bonding process in an alignment joining apparatus. It is the schematic explaining the bonding process in an alignment joining apparatus. It is the schematic explaining the bonding process in an alignment joining apparatus. It is a whole block diagram of the alignment joining apparatus of the state which the lower stage moved upwards. It is a whole block diagram of the alignment joining apparatus by embodiment which changed arrangement | positioning of a drive part.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is an overall configuration diagram of a substrate bonding apparatus. The substrate bonding apparatus 10 bonds the two substrates 90 and 90 and manufactures an overlapping substrate 92. Note that the substrate bonding apparatus 10 may be configured to bond the three or more substrates 90 to manufacture the superimposed substrate 92.

  As shown in FIG. 1, the substrate bonding apparatus 10 includes a housing 12, an atmospheric pressure unit 14, a decompression unit 16, and a control unit 18. The housing 12 forms a temperature adjusting chamber that surrounds the atmospheric pressure section 14 and the decompression section 16.

  The atmospheric pressure unit 14 includes a plurality of substrate cassettes 20, 20, 20, a robot arm 24, a robot arm 28, and a pre-aligner 30.

  The substrate cassettes 20, 20, and 20 accommodate substrates 90 that are bonded and bonded in the substrate bonding apparatus 10. Further, the substrate cassettes 20, 20, and 20 accommodate the overlapping substrates 92 that are bonded and bonded in the substrate bonding apparatus 10. The substrate cassettes 20, 20, 20 are detachably attached to the outer surface of the housing 12. Thereby, a plurality of substrates 90 can be loaded into the substrate bonding apparatus 10 at a time. In addition, a plurality of sets of overlapping substrates 92 can be collected at once. The substrate 90 to be bonded by the substrate bonding apparatus 10 may be formed with elements, circuits, terminals, and the like in addition to a single silicon wafer, a compound semiconductor wafer, a glass substrate, and the like. Further, the loaded substrate 90 may be an overlapping substrate 92 on which a plurality of wafers are already stacked.

  The robot arm 24 is disposed inside the housing 12 and in the vicinity of the substrate cassettes 20, 20, 20. The robot arm 24 vacuum-sucks the substrates 90 loaded in the substrate cassettes 20, 20, 20 and transports them to the installation stage 34 of the pre-aligner 30 described later. The robot arm 24 vacuum-sucks the superposed substrate 92 that is coupled and transported to the installation stage 34 and transports it to one of the substrate cassettes 20, 20, 20.

  The pre-aligner 30 is disposed between the robot arm 24 and the robot arm 28. The pre-aligner 30 includes a frame 32 that is a pre-alignment measuring device, an installation stage 34, and a pair of shutters 36 and a shutter 38. The shutter 36 and the shutter 38 may be omitted.

  The frame body 32 is formed so as to surround the installation stage 34. The surface of the frame 32 on the substrate cassette 20, 20, 20 side and the surface on the decompression unit 16 side are opened so that the substrate 90 and the overlapping substrate 92 can be carried in and out.

  The substrate 90 is transferred to the upper surface of the installation stage 34 by the robot arm 24. In the installation stage 34, the outer shape and orientation of the substrate 90 are provisionally aligned. When the substrates 90 are loaded in the alignment bonding apparatus 46, the position and orientation of the individual substrates 90 are temporarily set so that the respective substrates 90 are loaded in the narrow adjustment range of the alignment bonding apparatus 46 because of high accuracy. Match. Thereby, positioning of the board | substrate 90 in the alignment joining apparatus 46 of the pressure reduction part 16 mentioned later can be performed rapidly and correctly. In addition, the superimposed substrate 92 bonded in the decompression unit 16 is transported to the upper surface of the installation stage 34. The superimposed substrate 92 is transported to the substrate cassette 20 by the robot arm 24.

  The shutter 36 opens and closes the opening of the frame 32 on the substrate cassette 20 side. The shutter 38 opens and closes the opening on the decompression unit 16 side of the frame 32.

  The robot arm 28 is disposed inside the housing 12 and between the decompression unit 16 and the pre-aligner 30. The robot arm 28 vacuum-sucks the substrate 90 transported to the installation stage 34 by the robot arm 24 and transports it to the decompression unit 16. The robot arm 28 transports the superposed substrate 92 bonded and bonded in the decompression unit 16 from the decompression unit 16 to the installation stage 34.

  The decompression unit 16 is set in a decompressed state in the bonding process of the substrate bonding apparatus 10. The decompression unit 16 includes a load lock chamber 40, a transfer frame 41, a robot arm 42, two pretreatment chambers 44, and three alignment joining devices 46. The number of alignment bonding devices 46 is not limited to three, and may be changed as appropriate according to the throughput ratio.

  The load lock chamber 40 is disposed inside the decompression unit 16 and closest to the atmospheric pressure unit 14. The load lock chamber 40 connects or blocks the atmospheric pressure section 14 and the decompression section 16. The load lock chamber 40 includes a shielding frame 50, a temporary mounting table 52, a shutter 54, and a shutter 56.

  The shielding frame 50 is formed in a hollow shape surrounding the load lock chamber 40. The atmospheric pressure portion 14 side and the decompression portion 16 side of the shielding frame 50 are opened so that a single substrate 90 and an overlapping substrate 92 including the substrates 90 and 90 can be conveyed.

  The temporary mounting table 52 is installed at the approximate center of the shielding frame 50. A substrate 90 transported by the robot arm 28 is placed on the temporary placement table 52. Further, on the temporary mounting table 52, a laminated substrate 92 which is transported by the robot arm 42 is mounted.

  The shutter 54 opens and closes the opening on the atmospheric pressure portion 14 side of the load lock chamber 40. When the shutter 54 is opened, the load lock chamber 40 communicates with the atmospheric pressure unit 14. As a result, the load lock chamber 40 has substantially the same atmospheric pressure as the atmospheric pressure portion 14. In this state, the robot arm 28 conveys the overlapping substrate 92 between the load lock chamber 40 and the pre-aligner 30.

  The shutter 56 opens and closes the opening on the decompression unit 16 side of the load lock chamber 40. When the shutter 56 is opened, the load lock chamber 40 communicates with the decompression unit 16. As a result, the load lock chamber 40 has substantially the same atmospheric pressure as the decompression unit 16. In the bonding process, neither the shutter 54 nor the shutter 56 is opened.

  The conveyance frame 41 is disposed at the center of the decompression unit 16. The conveyance frame 41 is formed in a hollow hexagonal column shape. The six surfaces of the transfer frame 41 face one of the load lock chamber 40, the pretreatment chamber 44, and the three alignment joining devices 46, respectively. Each of the six surfaces of the transport frame 41 is open.

  The robot arm 42 is provided at the center of the transfer frame 41. The robot arm 42 transfers the substrate 90 carried into the load lock chamber 40 by the robot arm 42 to the pretreatment chamber 44 when the shutter 54 is open. The robot arm 42 carries the substrate 90 from the pretreatment chamber 44 to any alignment bonding apparatus 46. Note that the robot arm 42 is turned upside down once every two times and carried into one of the alignment bonding apparatuses 46. That is, the robot arm 42 carries the inverted substrate 90 and the non-inverted substrate 90 alternately into any of the alignment bonding apparatuses 46. The robot arm 42 transfers the substrate 90 from the alignment bonding apparatus 46 to the load lock chamber 40 when the shutter 54 is in the open state. Instead of the robot arm 42, any one of the alignment bonding devices 46 may be a reversing mechanism for the substrate 90, and the pretreatment chamber 44 or the pre-aligner 30 may be configured to reverse the substrate 90.

  The pretreatment chamber 44 is provided on two surfaces close to the load lock chamber 40 among the six surfaces of the transfer frame 41 via a shutter 45 that separates different indoor environments. The shutter 45 separates and connects the transfer frame 41 and the pretreatment chamber 44 having different indoor environments. The pretreatment chamber 44 cleans the surface of the substrate 90 by supplying an alternating plasma voltage while being filled with Ar gas. Next, the pretreatment chamber 44 plasma-treats the surface of the substrate 90 by supplying an alternating plasma voltage while being filled with oxygen gas. Thereafter, the pretreatment chamber 44 hydrophilizes the surface of the substrate 90 with a gas containing moisture.

  The three alignment bonding devices 46 are bonded to three surfaces of the six surfaces of the transfer frame 41 where the load lock chamber 40 and the pretreatment chamber 44 do not face each other. The alignment bonding apparatus 46 has a decompression unit 102 including a vibration isolation unit 104 and a decompression chamber 130. The decompression unit 102 is joined to the transport frame 41 via the shutter 138. The alignment bonding device 46 aligns the pair of substrates 90 and 90 carried by the robot arm 42. The alignment bonding device 46 pressurizes and bonds the pair of aligned substrates 90 and 90 to manufacture the superimposed substrate 92. In addition, you may heat as needed at the time of the pressurization of the board | substrate 90. FIG.

  The control unit 18 controls the overall operation of the substrate bonding apparatus 10. The control unit 18 includes an operation unit that is operated by the user from the outside when the substrate bonding apparatus 10 is turned on and various settings are made. Further, the control unit 18 includes a connection unit that connects the other device provided to the substrate bonding apparatus 10.

  Next, an outline of the bonding process will be described. In the bonding step, first, the robot arm 24 vacuum-sucks the substrate 90 from any of the substrate cassettes 20, 20, 20 and transports it to the installation stage 34 of the pre-aligner 30.

  Next, the shutter 54 is opened, and the load lock chamber 40 and the atmospheric pressure unit 14 are communicated with each other. Note that the shutter 56 is in a closed state. In this state, the robot arm 28 conveys the substrate 90 on the installation stage 34 to the temporary mounting table 52 in a state where the substrate 90 is vacuum-sucked. Thereafter, the shutter 54 is closed and the shutter 56 is opened, so that the load lock chamber 40 is disconnected from the atmospheric pressure section 14 and communicated with the decompression section 16. In this state, the robot arm 42 carries the substrate 90 from the installation stage 34 to the pretreatment chamber 44.

  In the pretreatment chamber 44, the surface of the transferred substrate 90 is cleaned and processed. Next, the robot arm 42 transports the substrate 90 from the pretreatment chamber 44 to one of the alignment bonding apparatuses 46.

  Thereafter, the substrate 90 is transported to the same alignment bonding apparatus 46 through the same process. The robot arm 42 inverts one of the substrates 90 out of the pair of substrates 90 and 90 to be transferred to the same alignment bonding apparatus 46 and transfers the substrate 90 to the alignment bonding apparatus 46. A substrate reversing device may be provided in the middle of conveyance, and one of the two substrates 90 may be reversed by the device. Thereafter, the alignment bonding apparatus 46 moves one substrate 90 in the horizontal direction and aligns it with the other substrate 90.

  Next, the alignment bonding apparatus 46 moves one substrate 90 upward to bring it into contact with the other substrate 90. The alignment bonding device 46 pressurizes the substrate 90 from above and below. Further, the alignment bonding apparatus 46 maintains the bonding temperature after heating the substrates 90 and 90 to the bonding temperature, if necessary. Thus, an overlapping substrate 92 in which the substrates 90 and 90 are bonded and bonded together is formed. At this time, by providing a temperature difference between the upper substrate 90 and the lower substrate 90, the dimensional difference due to the expansion and contraction of the substrate 90 can be corrected.

  Next, the shutter 56 is opened and the shutter 54 is closed. As a result, the load lock chamber 40 is disconnected from the atmospheric pressure unit 14 and communicated with the decompression unit 16. The robot arm 42 conveys the overlapping substrate 92 from the alignment bonding apparatus 46 to the load lock chamber 40.

  Next, the shutter 56 is closed and the shutter 54 is opened. As a result, the load lock chamber 40 is disconnected from the decompression unit 16 and communicated with the atmospheric pressure unit 14. In this state, the robot arm 28 conveys the overlapping substrate 92 from the load lock chamber 40 to the installation stage 34. Thereafter, the robot arm 28 carries the superimposed substrate 92 to any one of the substrate cassettes 20, 20, 20. Thereby, the bonding process of the overlapping substrate 92 by the substrate bonding apparatus 10 is completed, and the overlapping substrate 92 is completed.

  FIG. 2 is an overall configuration diagram of the alignment bonding apparatus. FIG. 3 is an enlarged view of the upper part of the alignment bonding apparatus. FIG. 4 is a schematic plan view for explaining the arrangement of the drive units. XYZ indicated by an arrow in FIG. 2 is taken as an XYZ direction. The + X direction is a direction toward the front side of the drawing. Further, the + Z direction is the upward direction of the real space, and the −Z direction is the downward direction of the real space.

  As shown in FIGS. 2 to 4, the alignment bonding apparatus 46 includes a decompression unit 102, a vibration isolation unit 104, a lower stage 106, an upper stage 108, a self-weight canceller 110, a magnetic bearing unit 112, and an X drive. Unit 114, two Y drive units 116, three Z drive units 118, three microscopes 120, and position detection unit 122.

  The decompression unit 102 includes a decompression chamber 130, a base frame 132, an upper decompression sealing member 134, a lower decompression sealing member 136, a shutter 138, and an exhaust pipe 140.

  The decompression chamber 130 is formed in a hollow rectangular parallelepiped shape. The decompression chamber 130 covers the lower stage 106 and the upper stage 108. A plurality of, for example, three support openings 142 are formed on the outer peripheral portion of the upper surface of the decompression chamber 130. The support opening 142 passes through the peripheral wall of the decompression chamber 130. A part of the vibration isolation unit 104 is inserted into the plurality of support openings 142. The plurality of support openings 142 are arranged at equiangular intervals around the center of the upper surface of the decompression chamber 130. For example, when six support openings 142 are formed, the support openings 142 are arranged at 60 ° intervals around the center of the upper surface of the decompression chamber 130.

  In the central portion of the upper surface of the decompression chamber 130, the same number, for example, three observation windows 144 as the microscope 120 are formed. The observation window 144 is made of a material that can transmit light that can be observed by the microscope 120. Note that the number of observation windows 144 may be two or a plurality of four or more.

  An X holding hole 146 is formed in the central portion of the side surface on the −X side of the decompression chamber 130. The X holding hole 146 holds the X driving unit 114. A carry-in port 148 for carrying the substrates 90 and 90 is formed in the upper part of the side surface on the + Y side of the decompression chamber 130.

  Two Y holding holes 150 are formed in the central portion of the side surface on the + Y side of the decompression chamber 130. The Y holding hole 150 holds the Y driving unit 116. An exhaust port 152 is formed in the lower part of the side surface on the + Y side of the decompression chamber 130. A main position detection window 154 is formed on the side surface on the −Y side of the decompression chamber 130. The main position detection window 154 is made of a material that can transmit the position detection light detected by the position detection unit 122.

  Three Z holding holes 156 are formed on the outer peripheral portion of the lower surface of the decompression chamber 130. The three Z holding holes 156 are arranged at substantially equal angular intervals around the center of the lower surface of the decompression chamber 130. The Z holding hole 156 holds the Z drive unit 118. A sliding hole 158 is formed at the center of the lower surface of the decompression chamber 130. Part of the self-weight canceller 110 is inserted into the sliding hole 158. An auxiliary position detection window 160 is formed between the sliding hole 158 and the Z holding hole 156 on the lower surface of the decompression chamber 130. The auxiliary position detection window 160 is made of a material that can transmit the position detection light detected by the position detection unit 122.

  The base frame 132 has a plurality of, for example, four column members. The base frame 132 is fixed to the lower surface of the decompression chamber 130. The base frame 132 is fixed to the floor or the like. Thereby, the base frame 132 supports the decompression chamber 130.

  The upper decompression sealing member 134 is an example of a support sealing member, and seals a gap between the support opening 142 and the vibration isolation unit 104. The lower decompression sealing member 136 seals the gap between the sliding hole 158 and the self-weight canceller 110. For the upper decompression sealing member 134 and the lower decompression sealing member 136, an elastically deformable bellows, an O-ring, a resin plate ring, or the like is applied.

  The shutter 138 is provided outside the carry-in port 148. The shutter 138 moves up and down. Thereby, the shutter 138 opens the carry-in entrance 148 when carrying in the substrate 90. On the other hand, the shutter 138 is switched to a closed state when the interior of the decompression chamber 130 is in a decompressed state.

  The exhaust pipe 140 is connected to the exhaust port 152. The exhaust pipe 140 is connected to a decompression pump (not shown). Thereby, the gas inside the decompression chamber 130 is exhausted through the exhaust port 152 and the exhaust pipe 140, and the decompression chamber 130 is in a decompressed state.

  The vibration isolation unit 104 supports the lower stage 106 and the upper stage 108 in a state of vibration isolation from the decompression unit 102. The vibration isolation unit 104 includes a vibration isolation frame 162, a vibration isolation table 164, a plurality of upper stage support arms 166, and a weight sensor 168.

  The vibration isolation frame 162 is formed in a hollow rectangular parallelepiped shape. The vibration isolation frame 162 is provided so as to surround the decompression chamber 130. The vibration isolation frame 162 holds the lower stage 106 via the magnetic bearing unit 112 and the self-weight canceller 110. The vibration isolation frame 162 holds the upper stage 108 via the upper stage support arm 166. An exhaust pipe hole 170 is formed at the center of the side surface on the + Y side of the vibration isolation frame 162. The exhaust pipe 140 is passed through the exhaust pipe hole 170 in a non-contact manner. A plurality of connector holes 172 are formed in the upper part of the side surface on the + Y side of the vibration isolation frame 162. A plurality of base holes 174 are formed on the lower surface of the vibration isolation frame 162. The base frame 132 is inserted into the base hole 174 without contacting the base hole 174.

  The vibration isolation table 164 supports the vibration isolation frame 162. The vibration isolation table 164 is provided between the vibration isolation frame 162 and the base frame 132. The vibration isolation table 164 suppresses vibration transmission. As a result, the vibration isolation frame 162 is isolated from the decompression unit 102. As a result, even if the base frame 132, the decompression chamber 130, and the like vibrate, the vibration isolation table 164 suppresses transmission of vibration to the vibration isolation frame 162. The vibration isolation table 164 may be a passive type that absorbs vibration by an elastic body or the like, or may be an active type that cancels vibration by electrical control.

  The upper stage support arm 166 is an example of a support member, and is provided on the upper surface of the vibration isolation frame 162. The same number of upper stage support arms 166 as the support openings 142 are provided. The upper stage support arm 166 passes through the support opening 142 of the decompression chamber 130. Accordingly, the lower end portion of the upper stage support arm 166 reaches the inside of the decompression chamber 130. Further, a gap between the periphery of the upper stage support arm 166 and the support opening 142 is sealed with an upper decompression sealing member 134. As a result, the upper stage support arm 166 transmits the force generated by the contact between the pair of substrates 90 and 90 to the vibration isolation frame 162 via the upper decompression sealing member 134. The lower stage of the upper stage support arm 166 supports the upper stage 108 via the weight sensor 168.

  The weight sensor 168 is provided between the upper stage 108 and the upper stage support arm 166. The weight sensor 168 detects the pressure acting on the substrates 90 and 90 by the Z driving unit 118.

  The lower stage 106 includes a lower substrate chuck 96, a lower stage main body 176, three connecting members 178, and a lower heating unit 180 that is an example of a heating unit. The lower substrate chuck 96 is fixed to the upper surface of the lower stage 106. The lower substrate chuck 96 electrostatically attracts the substrate 90. Thereby, the upper surface of the lower stage main body 176 of the lower stage 106 supports the substrate 90 via the lower substrate chuck 96.

  The lower stage main body 176 is provided in the central portion of the decompression chamber 130. The lower stage main body 176 is supported so as to be movable within a gap range between permanent magnets and coils of each driving unit described later, for example, a range of about several mm. The upper surface of the lower stage main body 176 is formed in a plane parallel to the XY plane.

  The upper ends of the three connecting members 178 are integrally fixed to the lower surface of the lower stage main body 176. The lower ends of the three connecting members 178 are connected to one of the three Z driving units 118, respectively.

  The lower heating unit 180 is provided on the lower stage main body 176. The lower heating unit 180 heats the substrate 90 via the lower substrate chuck 96.

  The upper stage 108 is provided above the lower stage 106. The upper stage 108 includes an upper stage main body 182, an upper heating unit 184 that is an example of a heating unit, and an upper substrate chuck 94.

  The upper substrate chuck 94 is fixed to the lower surface of the upper stage main body 182. The upper substrate chuck 94 electrostatically attracts the substrate 90. As a result, the upper stage body 182 of the upper stage body 182 supports the substrate 90 via the upper substrate chuck 94. Three observation holes 97 are formed in the upper substrate chuck 94. The three observation holes 97 penetrate the upper substrate chuck 94 in the vertical direction. A member that transmits observation light is embedded in the observation hole 97 for the purpose of withstanding the pressure.

  The lower surface of the upper stage main body 182 is formed in a plane parallel to the XY plane. The lower surface of the upper stage body 182 of the upper stage body 182 is disposed to face the upper surface of the lower stage body 176. Three observation openings 186 are formed in the upper stage main body 182. The observation opening 186 penetrates the upper stage main body 182 in the vertical direction. The three observation openings 186 are formed below any of the three observation windows 144 of the decompression chamber 130. Further, the three observation openings 186 are located above the observation hole 97 of the upper substrate chuck 94 fixed to the upper stage main body 182. Accordingly, the observation window 144, the observation opening 186, and the observation hole 97 are arranged in a straight line, and the substrates 90 and 90 can be observed from outside the observation window 144.

  The upper heating unit 184 is provided below the upper stage main body 182. The upper heating unit 184 heats the substrate 90 via the upper substrate chuck 94.

  The dead weight canceller 110 cancels the dead weight of the lower stage 106. The main part of the self-weight canceller 110 is disposed outside the decompression chamber 130. The self-weight canceller 110 supports the lower stage 106 via the magnetic bearing portion 112. The self-weight canceller 110 is supported by the vibration isolation frame 162. The self-weight canceller 110 includes a cylinder 188, a piston 190, a Z guide member 192, a pipe 194, and a pressure sensor 196.

  The cylinder 188 is formed in a cylindrical shape. The upper part of the cylinder 188 is opened.

  The piston 190 includes a disc part 200 and a cylindrical part 202. The disc part 200 is provided at the lower end part of the cylindrical part 202. The outer diameter of the disc part 200 is formed in a disc shape substantially equal to the inner diameter of the cylinder 188. The cylindrical portion 202 is formed in a cylindrical shape extending in the vertical direction. The upper part of the cylindrical part 202 is inserted into the sliding hole 158 and extends to the inside of the decompression chamber 130. A space between the periphery of the cylindrical portion 202 and the sliding hole 158 is sealed by a lower decompression sealing member 136. An upper end portion of the cylindrical portion 202 is connected to the magnetic bearing portion 112.

  The Z guide member 192 is fixed to the upper part inside the cylinder 188. The Z guide member 192 is formed in a cylindrical shape extending in the vertical direction. The cylindrical portion 202 of the piston 190 is inserted through the center portion of the Z guide member 192. The inner diameter of the Z guide member 192 is substantially equal to the outer diameter of the cylindrical portion 202 of the piston 190. Thereby, the Z guide member 192 guides the piston 190 in the Z-axis direction.

  The pipe 194 communicates with the inside of the cylinder 188. The pressure sensor 196 is provided in the middle of the pipe 194. The pressure sensor 196 detects the pressure in the cylinder 188. Thus, the high pressure and low pressure set by a pump (not shown) are controlled by the control valve, and the fluid is supplied into the cylinder 188 or discharged from the cylinder 188. As a result, the piston 190 moves up and down to cancel the weight of the lower stage 106.

  The magnetic bearing unit 112 connects the vibration isolation frame 162 and the lower stage 106 via the self-weight canceller 110. The magnetic bearing portion 112 includes a plane seat 204, a partial spherical seat 206, and a partial spherical member 208.

  The plane seat 204 is fixed to the upper surface of the piston 190 of the self-weight canceller 110. The upper surface of the plane seat 204 is formed in a planar shape parallel to the horizontal plane. The plane seat 204 includes a permanent magnet or an electromagnet and has a magnetic force.

  The partial spherical seat 206 is disposed above the plane seat 204. The lower surface of the partial spherical seat 206 is formed in a planar shape parallel to the horizontal plane. The central portion of the upper surface of the partial spherical seat 206 is formed as a concave partial spherical surface. The partial spherical seat 206 includes a permanent magnet or an electromagnet and has a magnetic force. Here, the magnetic force of the partial spherical seat 206 repels the magnetic force of the flat seat 204. Thereby, a magnetic bearing is formed between the lower surface of the partial spherical seat 206 and the upper surface of the flat seat 204, and the partial spherical seat 206 is held in a state of floating from the flat seat 204. Further, since the lower surface of the partial spherical seat 206 and the upper surface of the plane seat 204 are both parallel to the horizontal plane, the partial spherical seat 206 can move in the horizontal direction, that is, the XY plane with respect to the plane seat 204.

  The partial spherical member 208 is disposed above the partial spherical surface of the partial spherical seat 206. The lower surface of the partial spherical member 208 is formed into a convex partial spherical surface. As a result, the lower surface of the partial spherical member 208 is substantially parallel to the partial spherical surface of the partial spherical seat 206. The partial spherical member 208 includes a permanent magnet or an electromagnet and has a magnetic force. Here, the magnetic force of the partial spherical member 208 repels the magnetic force of the partial spherical surface seat 206. Thus, a magnetic bearing is formed between the lower surface of the partial spherical member 208 and the upper surface of the partial spherical seat 206, and the partial spherical member 208 is held in a state where it floats from the upper surface of the partial spherical seat 206. Further, since the lower surface of the partial spherical member 208 and the upper surface of the partial spherical seat 206 are both partial spherical surfaces, the partial spherical member 208 can be inclined with respect to the Z axis. The upper surface of the partial spherical member 208 is fixed to the lower surface of the lower stage 106. The bearing may use a rolling ball instead of magnetic levitation.

  As a result, the lower stage 106 is supported in a state where it floats at a distance from the self-weight canceller 110. As a result, the lower stage 106 is supported in a state where its own weight is canceled by the own weight canceller 110 so as to be movable in a horizontal plane and tiltable with respect to the Z axis.

  An example of the X drive unit 114 is a VCM (Voice Coil Motor), which includes an X permanent magnet 210, an X connector 212, and an X coil 214. The X permanent magnet 210 is provided on the −X side surface of the lower stage 106. The X connector 212 is embedded and fixed in the X holding hole 146 of the decompression chamber 130. The X connector 212 is connected to an external power source. The X coil 214 is fixed to the decompression chamber 130 side of the X connector 212. The X coil 214 is disposed at a position not in contact with the X permanent magnet 210. Power is supplied to the X coil 214 from the X connector 212. Thereby, a magnetic force in the X direction acts between the X coil 214 and the X permanent magnet 210 and receives a reaction force therebetween. As a result, the lower stage 106 is driven in the X direction. Note that the center of gravity of the lower stage 106 is preferably disposed on an extension line in the X direction of the magnetic force acting between the X coil 214 and the X permanent magnet 210.

  An example of the two Y driving units 116 is a VCM. The two Y drive units 116 are arranged at an interval in the Y direction. The Y drive unit 116 includes a Y permanent magnet 216, a Y connector 218, and a Y coil 220. The Y permanent magnet 216 is provided on the + Y side surface of the lower stage 106. The Y connector 218 is embedded and fixed in the Y holding hole 150 of the decompression chamber 130. Each Y connector 218 is individually connected to an external power source and can supply different power. The Y coil 220 is fixed to the decompression chamber 130 side of the Y connector 218. The Y coil 220 is disposed at a position not in contact with the Y permanent magnet 216. Electric power is supplied to the Y coil 220 from the Y connector 218. As a result, a magnetic force in the Y direction acts between the Y coil 220 and the Y permanent magnet 216 and receives a reaction force therebetween. As a result, the lower stage 106 is driven in the Y direction. Further, by supplying different values of power to the two Y coils 220, the lower stage 106 is rotated around the Z axis. Note that it is preferable to arrange the two Y driving units 116 in a planar shape including the center of gravity of the lower stage 106 so that a moment around the X axis does not occur.

  The Z drive unit 118 is an example of a proximity drive unit. An example of the three Z driving units 118 is a VCM. The three Z driving units 118 are arranged at substantially equal angular intervals around the center of gravity of the lower stage 106. The Z drive unit 118 includes a Z permanent magnet 222 that is an example of one drive element, a Z connector 224, and a Z coil 226 that is an example of the other drive element. The Z permanent magnet 222 is fixed to the −Z surface of the lower stage 106. The Z connector 224 is embedded and fixed in the Z holding hole 156 of the decompression chamber 130. Each Z connector 224 is individually connected to an external power source and can supply different power. The Z coil 226 is provided on the decompression chamber 130 side of the Z connector 224. As a result, the Z coil 226 is fixed to the decompression chamber 130 via the Z connector 224. The Z coil 226 is disposed at a position not in contact with the Z permanent magnet 222. Power is supplied to the Z coil 226 from the Z connector 224. Thereby, a magnetic force in the Z direction acts between the Z coil 226 and the Z permanent magnet 222 and receives a reaction force therebetween. The Z driving unit 118 moves the lower stage 106 in the Z direction. As a result, the Z driving unit 118 moves the lower stage 106 close to and away from the upper stage 108. Further, by supplying different values of power to the three Z coils 226, the lower stage 106 is rotated around the X axis or the Y axis. If the magnetic forces between the three sets of Z coils 226 and the Z permanent magnets 222 are equal, the three Z driving units 118 may be arranged so that moments about the X axis and the Y axis do not occur. preferable. Further, the Z drive unit 118 has a function of pressing the substrate 90 and the substrate 90 after contacting the substrate 90 held by the upper substrate chuck 94 and the substrate 90 held by the lower substrate chuck 96. .

  The three microscopes 120 are respectively disposed above any of the three observation windows 144 of the decompression chamber 130. The microscope 120 can simultaneously observe the mark given to the substrate 90 held by the upper substrate chuck 94 and the mark given to the substrate 90 held by the lower substrate chuck 96 by light that can pass through the substrate 90. preferable. Thereby, the shift | offset | difference of the relative position of the upper board | substrate 90 and the lower board | substrate 90 is easily detectable. Note that the number of microscopes 120 may be other than three. When there is one microscope 120, it is necessary to move the microscope between measurement points.

  An example of such a microscope 120 is a bifocal or confocal microscope. As a result, the microscope 120 can simultaneously observe the mark applied to the upper substrate 90 and the mark applied to the lower substrate 90.

  The position detection unit 122 includes an upper stage reflection unit 228, an upper stage Y interferometer 230, a lower stage reflection unit 232, two lower stage Y interferometers 234, a Z reflection unit 236, and a reflection mirror 238. And a Z interferometer 240.

  The upper stage reflecting portion 228 is provided at the end portion on the −Y side of the upper stage 108. The upper stage Y interferometer 230 irradiates the upper stage reflector 228 with laser light through the main position detection window 154 and measures the interference of the reflected laser light. Thereby, the position of the upper stage 108 in the Y direction is detected.

  The lower stage reflecting portion 232 is provided at the end portion on the −Y side of the lower stage 106. The lower stage Y interferometer 234 irradiates the lower stage reflector 232 with laser light, and measures the interference of the reflected laser light. Thereby, the position of the lower stage 106 in the Y direction is detected. Further, the two lower stage Y interferometers 234 detect the inclination of the lower stage 106 around the X axis by measuring the interference.

  The Z reflecting portion 236 is provided on the lower surface of the lower stage 106. The reflecting mirror 238 is provided on the −Y side surface of the cylinder 188 of the self-weight canceller 110. The Z interferometer 240 irradiates the Z reflecting portion 236 with laser light via the reflecting mirror 238 and measures interference of the reflected laser light. Thereby, the position of the lower stage 106 in the Z direction is detected.

  The position detection unit 122 includes an interferometer that detects the position of the lower stage 106 and the upper stage 108 in the X direction, the inclination around the Y axis, and the inclination around the Z axis, but is similar to the above-described interferometer in the Y direction. Description is omitted because of the configuration.

  FIG. 5 is an enlarged side view in the vicinity of the lower heating unit 180. As shown in FIG. 5, the lower heating unit 180 is divided into a plurality of parts. Each lower heating unit 180 is provided in the lower stage main body 176 via a heat insulating material 181. Thereby, the lower side of the lower heating unit 180 is insulated, and the lower heating unit 180 heats only the substrate 90 side. The lower heating unit 180 disposed at the center of the lower stage main body 176 is fixed, and the lower heating unit 180 disposed around moves in the radial direction. Thereby, distortion of the substrate 90 due to thermal expansion is suppressed. The upper heating unit 184 is similarly configured.

  Next, the operation of the alignment bonding apparatus 46 will be described. 6 to 8 are schematic views for explaining a bonding process in the alignment bonding apparatus. FIG. 9 is an overall configuration diagram of the alignment bonding apparatus in a state where the lower stage is moved upward.

  First, the shutter 138 is opened, and the lower stage 106 is disposed below the initial position shown in FIGS. In this state, after the robot arm 42 is turned upside down, the substrate 90 is carried into the decompression chamber 130. Next, the upper substrate chuck 94 fixed to the upper stage 108 supported by the vibration isolation frame 162 that has been isolated from the decompression unit 102 by the vibration isolation table 164 electrostatically adsorbs and holds the substrate 90 that has been carried in. . Accordingly, as shown in FIG. 6, the upper stage main body 182 of the upper stage 108 supports the substrate 90 via the upper substrate chuck 94. Thereafter, the robot arm 42 is retracted from the decompression chamber 130.

  Next, the robot arm 42 carries the substrate 90 into the decompression chamber 130. A lower substrate chuck 96 fixed to the lower stage 106 supported by the vibration isolation frame 162 via the self-weight canceller 110 electrostatically attracts the substrate 90. As a result, as shown in FIG. 7, the lower stage main body 176 of the lower stage 106 supports the substrate 90 via the lower substrate chuck 96. The lower stage 106 is also supported by the Z drive unit 118, but the Z permanent magnet 222 connected to the lower stage 106 is separated from the Z coil 226 fixed to the decompression chamber 130 with a gap. It is supported in the state that was done. Thereafter, the robot arm 42 is retracted from the decompression chamber 130.

  Next, the shutter 138 is closed, and the decompression chamber 130 is sealed. In this state, the gas inside the decompression chamber 130 is exhausted through the exhaust pipe 140. As a result, the decompression chamber 130 is in a decompressed state. Next, the Z drive unit 118 moves the lower stage 106 whose weight is canceled by the weight canceller 110 upward. The self-weight canceller 110 supplies the fluid in the cylinder 188 while detecting the pressure inside the cylinder 188 by the pressure sensor 196, and causes the piston 190 to follow the movement of the lower stage 106. As a result, the upper substrate 90 and the lower substrate 90 are close to each other. In this state, the marks provided on the substrate 90 and the substrate 90 are observed by the three microscopes 120. When the marks on the two substrates 90 and 90 are misaligned, the position detector 122 detects the position of the upper stage 108 and the position and inclination of the lower stage 106, so that the marks coincide with each other. The driving unit 114 and the Y driving unit 116 move the lower stage 106. Here, the partial spherical seat 206 and the partial spherical member 208 of the magnetic bearing unit 112 move on the XY plane together with the lower stage 106 in a state of floating from the plane seat 204.

  Thereafter, when the marks on the substrates 90 and 90 match, the Z driving unit 118 moves the lower stage 106 upward. As a result, as shown in FIGS. 8 and 9, the lower surface of the substrate 90 held by the upper substrate chuck 94 and the upper surface of the substrate 90 held by the lower substrate chuck 96 come into contact with each other. From this state, the Z drive unit 118 further moves the lower stage 106 upward, whereby the substrate 90 and the substrate 90 are pressurized. While maintaining this state, if necessary, the substrates 90 and 90 are heated to a bonding temperature at which bonding can be performed by the lower heating unit 180 and the upper heating unit 184 and maintained. The heating by the lower heating unit 180 and the upper heating unit 184 may be omitted. Thereafter, when the substrate 90 and the substrate 90 are coupled, the upper substrate chuck 94 of the upper stage 108 ends the electrostatic adsorption of the substrate 90. Thereafter, when the Z driving unit 118 moves the lower stage 106 downward, the lower substrate chuck 96 holding the substrates 90 and 90 moves downward together with the lower stage 106.

  As described above, in the alignment bonding apparatus 46 of the substrate bonding apparatus 10 of the present embodiment, the X coil 214 of the X driving unit 114 is fixed to the decompression chamber 130 of the decompression unit 102 and the X permanent magnet 210 is coupled to the lower stage 106. It is fixed to. Thereby, even if the decompression chamber 130 to which the X coil 214 is fixed vibrates, the alignment bonding apparatus 46 can suppress transmission of vibration to the lower stage 106 held by the vibration isolation frame 162. As a result, even when the decompression chamber 130 is exhausted, the alignment accuracy between the substrate 90 held by the lower stage 106 and the substrate 90 held by the upper stage 108 can be improved. Furthermore, the X coil 214 and the X permanent magnet 210 are in a non-contact state. Therefore, it is possible to suppress vibration from being transmitted between the X coil 214 and the X permanent magnet 210. Further, since the X coil 214 and the X permanent magnet 210 are not in contact with each other, the reaction force received by the X coil 214 can be released to the base frame 132. Note that the Y drive unit 116 and the Z drive unit 118 have the same configuration, and transmission of vibration from the decompression chamber 130 to the lower stage 106 can be suppressed.

  In the alignment bonding apparatus 46, the upper stage 108 is fixed to the vibration isolation frame 162 and supported by the upper stage support arm 166 that penetrates the decompression chamber 130. Further, a space between the upper stage support arm 166 and the decompression chamber 130 is sealed by an upper decompression sealing member 134. Thereby, the pressure-reduced state of the decompression chamber 130 can be maintained while suppressing transmission of vibration to the upper stage 108. Furthermore, by configuring the upper decompression sealing member 134 with an elastically deformable bellows or the like, it is possible to further suppress the vibration of the decompression chamber 130 from being transmitted to the upper stage support arm 166.

  In the alignment bonding apparatus 46, the X coil 214 of the X drive unit 114 is fixed to the decompression chamber 130 via the X connector 212. Thereby, the X connector 212 can be easily connected to an external power source. The same applies to the Y drive unit 116 and the Z drive unit 118.

  In the alignment bonding apparatus 46, the lower stage 106 is held by the magnetic bearing portion 112. Here, in the magnetic bearing portion 112, spaces that function as magnetic bearings are formed between the plane seat 204, the partial spherical seat 206, and the partial spherical member 208. Thereby, the magnetic bearing part 112 can reduce the vibration transmitted to the lower stage 106.

  In the alignment bonding apparatus 46, the self-weight canceller 110 supports the lower stage 106. Accordingly, since the dead weight of the lower stage 106 is canceled by the dead weight canceller 110, the driving force required for the Z driving unit 118 can be reduced. Thereby, since the Z drive part 118 can be made small, the decompression chamber 130 can be made small.

  In the alignment bonding apparatus 46, the mark applied to the substrate 90 can be observed by the microscope 120 before and after the bonding and also during the bonding process. Therefore, the alignment bonding apparatus 46 can observe the positional deviation between the substrate 90 and the substrate 90 during the bonding process, and can confirm the bonding accuracy between the substrate 90 and the substrate 90 after bonding.

  FIG. 10 is an overall configuration diagram of an alignment bonding apparatus according to an embodiment in which the arrangement of the drive unit is changed. In addition, the same code | symbol is provided to the structure similar to embodiment mentioned above.

  As shown in FIG. 10, in the alignment bonding apparatus 346, the Z drive unit 118 is provided outside the decompression chamber 130. The Z drive unit 118 is held by a holding unit 356 protruding from the base frame 132. The lower end of the connecting member 378 of the lower stage 106 extends to the outside of the decompression chamber 130 through a through hole 366 formed in the lower surface of the decompression chamber 130. The lower end of the connecting member 378 is fixed to the Z permanent magnet 222 of the Z drive unit 118. A connection sealing member 336 is provided between the periphery of the connection member 378 and the decompression chamber 130.

  In the alignment bonding apparatus 46, the decompression chamber 130 can be downsized by providing the Z drive unit 118 outside the decompression chamber 130. Thereby, since the time for making the decompression chamber 130 into a decompression state can be reduced, the manufacturing time of the overlapping substrate 92 can be shortened. Note that the X driving unit 114 and the Y driving unit 116 may also be provided outside the decompression chamber 130.

  In each embodiment described above, the microscope 120 is fixed to the vibration isolation frame 162, but the microscope 120 may be configured to be movable in the XY plane. Further, the microscope 120 may be movable in the Z direction. In this case, the microscope 120 may move in the Z direction so that the mark on the upper substrate 90 and the mark on the lower substrate 90 are individually imaged.

  The microscope 120 may be movable back and forth between the upper substrate 90 and the lower substrate 90. Thereby, the mark can be observed from the bonding surface of the substrate 90. Further, the microscope 120 may be arranged so as to image the substrate 90 from the side surface.

  The substrate 90 may be carried into the alignment bonding apparatus 46 while being held by the substrate holder. In this case, the substrate holder has substantially the same configuration as the upper substrate chuck 94 and the lower substrate chuck 96. In this case, the upper stage main body 182 and the lower stage main body 176 electrostatically attract the substrate holder.

  The decompression chamber 130 may surround only the substrate 90 and each stage and each drive unit may be provided outside the decompression chamber 130.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

  DESCRIPTION OF SYMBOLS 10 Board | substrate bonding apparatus, 12 Housing | casing, 14 Atmospheric pressure part, 16 Depressurization part, 18 Control part, 20 Substrate cassette, 24 Robot arm, 28 Robot arm, 30 Pre-aligner, 32 Frame, 34 Installation stage, 36 Shutter, 38 Shutter, 40 Load lock chamber, 41 Transfer frame, 42 Robot arm, 44 Pre-processing chamber, 45 Shutter, 46 Alignment bonding device, 50 Shielding frame, 52 Temporary mounting table, 54 Shutter, 56 Shutter, 90 Substrate, 92 Overlaid substrate 94 Upper substrate chuck, 96 Lower substrate chuck, 97 Observation hole, 102 Decompression unit, 104 Vibration isolation unit, 106 Lower stage, 108 Upper stage, 110 Self-weight canceller, 112 Magnetic bearing part, 114 X drive part, 116 Y drive part, 118 Z drive part, 120 Microscope, 122 Position detection part, 130 Decompression chamber, 132 Base frame, 134 Upper decompression sealing member 136 Lower decompression sealing member, 138 Shutter, 140 Exhaust pipe, 142 Support opening, 144 Observation window, 146 X holding hole, 148 Carriage inlet, 150 Y holding hole, 152 Exhaust port, 154 Main position detection window, 156 Z holding Hole, 158 sliding hole, 160 auxiliary position detection window, 162 anti-vibration frame, 164 anti-vibration table, 166 upper stage support arm, 168 weight sensor, 170 exhaust pipe hole, 172 Connector hole, 174 Base hole, 176 Lower stage body, 178 Connecting member, 180 Lower heating part, 181 Thermal insulation, 182 Upper stage body, 184 Upper heating part, 186 Observation opening, 188 Cylinder, 190 Piston, 192 Z guide member , 194 piping, 196 pressure sensor, 200 disc portion, 202 cylindrical portion, 204 plane seat, 206 partial spherical seat, 208 partial spherical member, 210 X permanent magnet, 212 X connector, 214 X coil, 216 Y permanent magnet, 218 Y connector, 220 Y coil, 222 Z permanent magnet, 224 Z connector, 226 Z coil, 228 Upper stage reflector, 230 Upper stage Y interferometer, 232 Lower stage reflector, 234 Lower stage Y interferometer, 236 Z reflector, 238 reflector, 240 Z interferometer, 336 connecting sealing member, 346 alignment joining device, 356 holder, 366 Through hole, 378 connecting member

Claims (14)

A first stage that supports a first substrate of the plurality of substrates;
A second stage disposed opposite to the first stage and supporting a second substrate of the plurality of substrates;
A decompression unit having a decompression chamber surrounding at least the first substrate and the second substrate supported by the first stage and the second stage;
A frame that is isolated from the decompression unit and supports the first stage and the second stage;
A drive unit having a mover fixed to one of the first stage and the second stage and a stator fixed to the decompression unit, and relatively moving the first stage and the second stage; A substrate bonding apparatus comprising: A support member that penetrates the peripheral wall of the decompression chamber and supports the other of the first stage and the second stage;
The substrate bonding apparatus according to claim 1, further comprising a support sealing member that seals between the support member and the decompression chamber. The drive unit includes a proximity drive unit that brings the first stage and the second stage close to each other so as to bring the first substrate and the second substrate into contact with each other.
The substrate bonding apparatus according to claim 2, wherein the support member transmits a force generated by contact between the first substrate and the second substrate by the proximity driving unit to the frame. The stator has a coil fixed to the decompression chamber;
The substrate bonding apparatus according to claim 1, wherein the mover includes a permanent magnet. The decompression unit has a base frame that supports the decompression chamber;
The stator is provided outside the decompression chamber, and has a coil fixed to the base frame,
The substrate bonding apparatus according to claim 1, wherein the mover includes a permanent magnet provided outside the decompression chamber. The one of the first stage and the second stage has a connecting member that penetrates the decompression chamber and is connected to the permanent magnet,
The board | substrate bonding apparatus of Claim 4 further provided with the connection sealing member which seals between the circumference | surroundings of the said connection member, and the said decompression chamber. 5. The substrate bonding apparatus according to claim 1, further comprising a magnetic bearing portion that connects the frame and the one of the first stage and the second stage. 6. The substrate bonding apparatus according to claim 1, further comprising a self-weight canceller that is provided outside the decompression chamber and cancels the weight of the one of the first stage and the second stage. A magnetic bearing portion connecting the decompression chamber and the one of the first stage and the second stage;
A self-weight canceller provided outside the decompression chamber and canceling the weight of the one of the first stage and the second stage;
5. The substrate bonding apparatus according to claim 1, wherein the self-weight canceller supports the one of the first stage and the second stage via the magnetic bearing portion.   The substrate bonding apparatus according to claim 1, wherein the first stage and the second stage support the substrate via a substrate holder.   The board | substrate bonding apparatus of any one of Claim 1 to 8 which has a heating part which heats the said board | substrate.   The substrate bonding apparatus according to claim 1, wherein the decompression chamber surrounds the first stage and the second stage. A first stage held by a frame isolated from the decompression chamber of the decompression unit supports the first substrate among the plurality of substrates;
A second stage held by the frame and arranged to face the first stage supports a second substrate of the plurality of substrates;
Depressurizing the decompression chamber surrounding at least the first substrate and the second substrate supported by the first stage and the second stage;
A drive unit that includes a mover fixed to one of the first stage and the second stage and a stator fixed to the decompression unit, and that relatively moves the first stage and the second stage; And a step of bringing one of the first stage and the second stage close to each other. The first stage held by the frame that is isolated from the decompression chamber of the decompression unit supports the first substrate among the plurality of substrates,
A second stage held by the frame and arranged to face the first stage supports a second substrate among the plurality of substrates,
Depressurizing the decompression chamber surrounding at least the first substrate and the second substrate supported by the first stage and the second stage,
A drive unit that includes a mover fixed to one of the first stage and the second stage and a stator fixed to the decompression unit, and that relatively moves the first stage and the second stage; A superposed substrate manufactured by bringing one of the first stage and the second stage close to each other.

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